JPH05198717A - IC lead forming apparatus and method thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] The lead can be molded into a J shape without peeling or scratching the solder plating on the surface, and the quality of the J-shaped product can be improved. A J-shaped recess 11a for molding the lead 2 of the IC1 into a J-shape is formed on the upper part of the forming die 11, and J
A forming belt that rotates in a predetermined direction along the shaped recess 11a is provided. Then, the leads 2 of the IC 1 that have undergone the first bending process to the third bending process are lowered toward the forming die 11 by the upper holder 4, and the leads 2 and the J-shaped recess 11a of the forming die 11 are brought into contact with each other to form the forming belt 12. The lead 2 is rotated to rotate the J-shaped recess 11a.
Mold into a shape that conforms to.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-molded IC lead forming apparatus and method, and more particularly to PLCC and SO.
The present invention relates to a lead forming apparatus for an IC having a J-shaped lead called J and its method.

[0002]

2. Description of the Related Art J generally called PLCC or SOJ
In the case of lead molding of an IC having a shaped lead, the IC, which is resin-sealed and the unnecessary portion of the lead frame is cut, is fed into the forming die having various functions one pitch at a time, and the first bending to the fourth It is performed by bending the lead into a J shape stepwise until bending.

5 (a) to 5 (e) show this molding step in order, in which 1 is a resin-sealed IC, 2
Is a lead of a lead frame whose unnecessary portion is cut. When the lead 2 of the IC 1 is formed into a J shape, the IC 1 is first placed on the placing portion 5a formed on the upper part of the first forming die 5 as shown in FIG. The mounting portion 5a has a shape that is substantially fitted to the lower side of the IC 1, and the surface of the first forming die 5 corresponding to the tip end side of the lead 2 has a downward taper 5b. ..

Then, as shown in FIG. 5B, the upper holder 4 is lowered from above the IC 1 to hold the upper portion of the IC 1, and subsequently, the upper holder 4 has a shape substantially fitted with the taper 5b of the first forming die 5. The forming punch 3 is lowered from above the lead 2. As a result, the tip side of the lead 2 is bent in a shape along the taper 5b (first bending).

After that, the IC1 is fed at a constant pitch, and as shown in FIG.
As shown in (c), the IC 1 is held by the upper holder 4 and placed on the placing portion 7 a formed on the upper part of the second forming die 7. The mounting portion 7a has a shape that substantially fits the lower side of the IC 1, and the surface of the second forming die 7 corresponding to the lead 2 is substantially perpendicular to the upper surface of the IC 1. And thus, the upper holder 4 and the second
The forming roller 6 is lowered from above the lead 2 of the IC 1 fixed by the forming die 7 along the substantially vertical surface of the second forming die 7. As a result, the root of the lead 2 is bent downward along the second forming die 7 (second bending).

Then, the IC1 is fed at a constant pitch, and
The lead 2 is placed on the lower holder 8 as shown in (d).
The forming roller 6 is lowered from above. As a result, the entire lead 2 is further bent downward and substantially perpendicular to the upper surface of the IC 1 (third bending).

The IC 1 is fed again at a constant pitch, and the upper holder 4 lowers the IC 1 onto the third forming die 9. A J-shaped recess 9a having a J shape is formed at a position corresponding to the lead 2 on the upper part of the third forming die 9.
As the IC 1 descends, the board connecting surface 2a of the lead 2 slides on the J-shaped recess 9a, whereby the lead 2 is bent into a J-shape (fourth bending). Through the above steps, the lead 2 of the IC 1 is formed into a J shape.

[0008]

However, the conventional I
In the lead forming apparatus and method for C1, as described above, during the fourth bending, the substrate connecting surface 2a of the lead 2 and the J-shaped recess 9a of the third forming die 9 rub against each other as the IC 1 descends. In some cases, the solder plating applied to the board connecting surface 2a was peeled off. Further, the scraps of the peeled solder plating are J-shaped concave portions 9a of the third forming die 9.
And the like, which further promotes the peeling of the plating, which adversely affects the molding of the lead 2 and causes poor solder connection. In addition, the solder plating scraps may lead to lead 2 during molding.
It also had a bad influence on the appearance of the obtained product, such as being adhered to the surface of and causing a dent. Then, in order to prevent these adverse effects, a complicated work by the operator such as visually inspecting the peeling of the plating and frequently removing the scraps of the solder plating adhering to the J-shaped recess 9a of the third forming die 9 and the like. Was needed.

The present invention has been made in view of the above-mentioned problems, and the lead can be molded into a J-shape without peeling or damaging the solder plating on the surface, and the quality of the J-molded product is improved. It is an object of the present invention to provide an IC lead forming apparatus and method capable of achieving the above.

[0010]

In order to solve the above problems, the present invention provides an upper holder for holding an IC and a forming for forming a lead of the IC held by the upper holder into a J shape from below the IC. In an IC lead forming apparatus including a die, a J-shaped recess provided in an upper portion of the forming die and a forming belt that rotates in a predetermined direction along the J-shaped recess are provided in the J-shaped recess. The arranged leads are formed into a J shape by rotating the forming belt.

Further, in the IC lead forming method of the present invention, the first bending, the second bending, and the third bending steps of the leads of the IC are sequentially performed, and thereafter, a J-shaped concave portion is provided and a forming belt is provided. A forming die is disposed on the lead, and the forming belt is rotated inwardly of the lower surface of the IC while bringing the lead and the J-shaped recess of the forming die into contact with each other.
The shape is formed along the concave portion.

[0012]

According to the present invention, the first bending, the second bending, and the third bending steps are sequentially performed, and the IC having the lead bent downward in advance is lowered by the upper holder toward the forming die. The forming belt on the forming die rotates inwardly of the lower surface of the IC along the J-shaped recess of the forming die. When the IC is further lowered, the leads of the IC come into contact with the forming belt of the J-shaped recess while the solder plating on the surface is peeled off,
It is molded into a shape along the J-shaped recess by the rotation of the forming belt without being damaged.

[0013]

Embodiments of an IC lead forming apparatus and method according to the present invention will be described below with reference to the drawings. In addition,
In the figure, the same components as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted. FIG. 1 is a schematic sectional view of an IC lead forming apparatus of the present invention, which is used for the fourth bending. In the figure, 11 is a J-shaped concave portion 11 having a shape along the J-shape at the top.
It is a forming die in which a is formed, and for example, two pieces are arranged below the upper holder 4 corresponding to the side of the IC 1 on which the leads 2 are provided. A forming belt 12 made of a polished stainless material is provided on the J-shaped recess 11a of each forming die 11, and the forming belt 12 has a thickness of, for example, about 0.1 to 0.2 mm and is at least on the IC1 side. It has a width approximately equal to the side. The forming belt 12 is rotated by, for example, four sprockets 13 arranged around the forming die 11 along the J-shaped recess 11a in the direction shown by the arrow in the figure, that is, toward the inside of the lower surface of the IC1. It is like this.

FIG. 4 is a schematic perspective view of the sprocket 13 portion.
Shown in. As shown in FIG. 4, feed holes 12a are formed at predetermined intervals at both ends of the forming belt 12 in the longitudinal direction, and each sprocket 13 is rotatable around a bearing 14 on the forming die 11. It is supported. When the sprocket 13 is driven, the teeth of the sprocket 13 are fitted into the holes 12a of the forming belt 12 in accordance with this driving, and the forming belt 12 is
It rotates in the above-mentioned direction along the shaped recess 11a. Here, the driving of the sprocket 13 is started in synchronization with the lowering of the IC 1 by the upper holder 4 at the time of the J-forming type described later,
The forming belt 12 is rotated at the same time when the driving of the sprocket 13 is started. That is, as the upper holder 4 moves down, the sprocket 13 is driven by the protrusion (not shown) provided on the upper holder 4 coming into contact with the crank portion of the drive unit (not shown) connected to the sprocket 13, and the sprocket 13 is driven. 12 rotates. Further, the rotational speed of the forming belt 12 is controlled by the drive unit so as to follow the molding speed of the leads 2 of the IC 1 described later.

On the other hand, J is formed at a position corresponding to both ends in the longitudinal direction of the forming belt 12 of the forming die 11.
In order to prevent the forming belt 12 from being lifted up in the shaped recess 11a, a holding plate (not shown) is provided with some space.

Next, using the apparatus constructed as described above, I
A method of molding the lead 2 of C1 into a J shape will be described. Figure 2
Is a schematic diagram showing a state at the time of starting the molding of the leads 2 of the IC 1, and FIG. 3 is a schematic diagram showing a state at the time of finishing the molding. First, in the same manner as in the prior art, the lead 2 is bent downward and substantially perpendicular to the upper surface of the IC 1, that is, the third IC 3.
The IC 1 which has been bent is sent at a constant pitch and placed on the above device. Next, the IC 1 is lowered toward the forming die 11 by the upper holder 4.

When the IC 1 is lowered to a predetermined position, the sprocket 13 is driven and the forming belt 12 on the forming die 11 is moved in the direction indicated by the arrow in the figure to form a J-shaped concave portion 11.
Rotate along a. When IC1 further drops,
As shown in FIG. 3, while the lead 2 of the IC 1 is in contact with the forming belt 12 on the J-shaped recess 11a, the forming belt 12 is rotated to move the J-shaped recess 1 as shown in FIG.
It is molded into a shape along 1a. As mentioned above,
At this time, the rotational speed of the forming belt 12 is controlled so as to follow the molding speed of the lead 2.

As described above, according to the present embodiment, the forming belt 12 which rotates in the predetermined direction along the J-shaped recess 11a is provided on the J-shaped recess 11a of the forming die 11, and the leads 2 of the IC 1 have this shape. Forming belt 12
Is formed into a J shape while abutting against. For this reason, unlike the conventional case, the solder plating on the surface of the lead 2 is not rubbed by the forming die 11 at the time of molding, so that the lead 2 is not peeled off or damaged.
Can be molded into a J shape. In addition, when solder residue or the like adheres to the forming belt 12, the J-shaped recess 1
It is possible to always maintain a clean surface by bringing a rotating brush or the like into contact with the forming belt 12 in a portion other than 1a. Therefore, it is possible to remove complicated work such as removing solder plating scraps attached to the device,
A J-shaped product with improved quality can be manufactured with a good yield.

In the apparatus of this embodiment, the case where the forming dies 11 are arranged below the upper holder 4 by the number of the sides on which the leads 2 of the IC 1 are provided, for example, two are described. Is not limited to
The J-shaped recess 1 corresponding to the side where the lead 2 of C1 is provided
It is also possible to provide one forming die in which a plurality of 1a are formed.

[0020]

As described above, according to the IC lead forming apparatus and method of the present invention, the forming belt is provided which rotates in the predetermined direction along the J-shaped recess formed in the upper portion of the forming die. Then, the leads of the IC are formed into a J shape while contacting the forming belt.
Therefore, the solder plating on the surface of the lead is not rubbed by the forming die at the time of molding, and the lead can be molded into a J shape without peeling or scratching the solder plating on the surface. Therefore, it is possible to prevent defective connection, defective appearance of the product, and the like, and it is possible to manufacture high quality J-shaped products with high yield.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of an IC lead forming apparatus of the present invention.

FIG. 2 is a schematic diagram showing a state at the start of lead molding by the method of the present invention.

FIG. 3 is a schematic view showing a state at the end of the J-shaped forming of the lead according to the method of the present invention.

FIG. 4 is a schematic perspective view of a sprocket portion.

FIG. 5 is a process diagram showing a state of lead molding of a conventional IC.

[Explanation of symbols]

1 IC 2 Lead 4 Upper Holder 11 Forming Die 11a J-Shaped Recess 12 Forming Belt

Claims (2)

[Claims] 1. An IC lead forming apparatus comprising: an upper holder for holding an IC; and a forming die for forming an IC lead held by the upper holder into a J shape from below the IC. And a forming belt that rotates in a predetermined direction along the J-shaped recess. The lead arranged in the J-shaped recess is rotated by the forming belt to form a J-shape. An IC lead forming apparatus, characterized in that 2. A method of molding a lead of an IC into a J-shape, which comprises sequentially performing a first bending step, a second bending step and a third bending step of the lead of the IC, and then forming a J-shaped concave portion on an upper portion. A forming die provided with a forming belt is arranged with respect to the lead, and the forming belt is attached to the J-shaped recess of the forming die while abutting the lead and the J-shaped recess.
An IC characterized in that the lead is formed into a shape along the J-shaped recess by rotating the lead C inwardly.
Lead molding method.