JPH05198907A - Prepreg for multilayer printed circuit board and manufacture of multilayer printed circuit board using the sane prepreg - Google Patents

Abstract

PURPOSE:To reduce glass fiber scraps and resin powder generated from prepreg when a multilayer printed circuit board is manufactured and to reduce the steps of combining the prepregs and a material cost. CONSTITUTION:When constituent materials of a multilayer printed circuit board are superposed through prepreg, heated, and pressurized to be integrated, glass cloth having a thickness of 0.13-0.16mm and a weight of 145-175g/m<2> is used as a base material, one prepreg having 55-65% of resin component is interposed between the materials, heated and pressurized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg for a multilayer printed wiring board and a method for manufacturing a multilayer printed wiring board using the prepreg.

[0002]

2. Description of the Related Art A multilayer printed wiring board is constructed by stacking components through an adhesive prepreg, heating and pressing the multilayer board to form a through hole, plating an inner wall of the through hole, and forming an outer layer circuit. Is processed and a solder resist is applied. The constituent materials are an inner layer plate and an outer layer material which are circuit-processed in advance. Examples of the outer layer material include a copper foil, a single-sided copper-clad laminate, and a double-sided copper-clad laminate with a circuit processed on one side on the inner layer side. Conventionally, the thickness of the prepreg layer between the constituent materials is 0.2 mm, and the thickness is 0.90 to 0.12 mm,
A glass cloth having a weight of 95 to 115 g / m ² was used as a base material, and two prepregs each having a resin content of 50 to 55% were sandwiched between the respective constituent members and heated and pressed to be integrated.

[0003]

With the miniaturization and multi-functionalization of electronic equipment such as office automation equipment and communication equipment, multi-layer printed wiring boards have become more and more multi-layered and have higher density. Through hole reliability, heat resistance, and dimensions. It is necessary to improve stability, make the appearance flawless, and lower the price.

When the constituent material and the prepreg are pre-laminated, when two prepregs are assembled and prepared, glass fiber dust and resin powder may be scattered from the end portion of the prepreg to contaminate the constituent chamber. If the glass fiber scraps and resin powder adhere to the surface of the outer layer material, they will be struck or foreign matter after lamination, which will be a cause of poor appearance. In addition, when manufacturing a multilayer printed wiring board having many constituent materials, the work of combining prepregs increases, and the cost increases. In order to eliminate the work of combining prepregs, the thickness is 0.18 ~
When 0.20 mm glass cloth is used as a base material, the specification of thickness between constituent materials (generally 0.190 to 0.205 mm)
In order to satisfy the above condition, the resin content must be 45 to 50%, and heat resistance failure is likely to occur due to insufficient resin. According to the present invention, the components are bonded together with one prepreg,
It is an object of the present invention to eliminate the work of combining prepregs, eliminate the appearance defects caused by the work of combining prepregs, and reduce the manufacturing cost.

[0005]

The present invention has a thickness of 0.13.
It is a prepreg for a multilayer printed wiring board, which is made of a glass cloth having a weight of 145 to 175 g / m ² and a resin content of 55 to 65%. And
In the method for producing a multilayer printed board, wherein the constituent materials of the multilayer printed wiring board are superposed via a prepreg, and heated and pressed to be integrated, the prepreg has a thickness of 0.13 to 0.
It is characterized by using a glass cloth of 16 mm and a weight of 145 to 175 g / m ² as a base material, having a resin content of 55 to 65%, and sandwiching only one prepreg between each constituent material.

[0006]

[Function] By using only one prepreg sandwiched between the constituent materials, the work of combining the prepregs is eliminated, the generation of glass fiber scraps and resin powder due to the combination work is eliminated, the combination process is also unnecessary, and the material cost is low. Become. The thickness between the constituent materials can be maintained by setting the resin content to 55 to 65%.

[0007]

Example Production of prepreg A glass cloth (WZA15, manufactured by Nitto Boseki Co., Ltd.) having a thickness of 0.140 mm and a weight of 165 g / m ² was used, and was manufactured by a conventional method so that the resin content was 59 to 61%. . Inner layer board A copper foil with a thickness of 70 μm and a double-sided copper-clad laminated board with a substrate thickness of 1.0 mm were subjected to general power ground circuit processing. Structure The product size was set to 500 × 500 mm, and one prepreg was provided on each side of the inner layer plate, and a copper foil having a thickness of 18 μm was arranged on the outside thereof. Charge 10 sets of components between 1.0mm end plates,
A 5 mm jig plate and a cushion were arranged, and pressure was applied for 80 minutes at a pressure of 3 MPa. The maximum temperature was set to 175 ° C., and after the heating, it was cooled for 30 minutes in a pressurized state.

Comparative Example 1 Production of prepreg A glass cloth (WEA18W, manufactured by Nitto Boseki Co., Ltd.) having a thickness of 0.18 mm and a weight of 210 g / m ² was used, and the resin content was adjusted to 44 to 46% by a conventional method. Manufactured. Except for that, the material composition and lamination were performed in exactly the same manner as in the example.

Comparative Example 2 Preparation of prepreg A glass cloth (WEA116E manufactured by Nitto Boseki Co., Ltd.) having a thickness of 0.10 mm and a weight of 105 g / m ² was used, and the resin content was adjusted to 53 to 55% by a conventional method. Manufactured. This prepreg was laminated in exactly the same manner as in the example except that two prepregs were sandwiched between the constituent materials.

After the outer layer copper foil of the obtained multilayer printed wiring board was etched, it was boiled for a predetermined period of time and then dipped in a solder bath at 260 ° C. to examine its heat resistance. The results are shown in Table 1.

[0011]

[Table 1] Note) Heat resistance ○: No abnormality, △: Measling occurs,
X: Blistering occurrence In the case of the example, the heat resistance is equivalent to the level of the comparative example 2. However, in Comparative Example 1, the heat resistance level was poor because the resin content of the prepreg was small.

When the adhesive film was placed around the jig plate at the time of material construction and 5 sets were made up of 10 sets, the weight of the adhesive film before and after the construction work was measured. As a result of observing the pressure-sensitive adhesive film after construction with a magnifying glass, the deposits were glass fibers and resin powder from the prepreg. Therefore, the increase in weight of the adhesive film is the amount of foreign matter generated from the prepreg. As a result, the amount of foreign matter generated was 520 mg / 5 set in the case of Example and 805 m in the case of Comparative Example 1.
In the case of Comparative Example 2, it was 1950 mg / 5 set. In the case of the example, the generation of foreign matter is less than half that of the comparative example 2 in which two prepregs are used between the layers.

Further, the total thickness of the multilayer board and the thickness between the constituent materials were measured. As a result, in the case of the examples, the total thickness was 1.52 mm (1.46 to 1.57) on average, and the thickness between the constituent materials was 0.203 mm (0.196 to 0.208) on average. On the other hand, in the case of Comparative Example 1, the total thickness is 1.55 m on average.
m (1.48 to 1.61), and the average thickness of the constituent materials is 0.
203 mm (0.201 to 0.209), in the case of Comparative Example 2, the total thickness is 1.53 mm (1.47 to 1.58) on average.
The thickness between the components is 0.202 mm on average (0.195-
It was 0.207). The target value for the total thickness of this component is 1.
52 ± 0.07 mm, target value of thickness between components is 0.19
It is 0 to 0.210 mm. In the case of the example and the comparative example 2, both the total thickness and the thickness between constituent materials satisfy the targets,
In the case of Comparative Example 1, the target value of the total thickness is not satisfied.

[0014]

According to the present invention, by using one prepreg having an appropriate base material thickness and resin content between the constituent materials of a multilayer printed wiring board, the amount of foreign matter generated during material construction can be reduced. It is possible to obtain a multilayer printed wiring board having good thickness and heat resistance. Further, since the number of prepregs used is halved, material costs and man-hours for combination can be reduced.

Claims (2)

[Claims] 1. A thickness of 0.13 to 0.16 mm and a weight of 14
Using a glass cloth of 5 to 175 g / m ² as a base material, resin content 55
A prepreg for a multilayer printed wiring board, characterized in that it is ˜65%. 2. A method for manufacturing a multilayer printed board, comprising: stacking components of a multilayer printed wiring board via prepregs; heating and pressing to integrate the prepregs, wherein the prepregs have a thickness of 0.13 to 0.16 mm and a weight. 145-175g / m
² glass cloth as a base material, resin content is 55-65%,
A method for manufacturing a multilayer printed wiring board, wherein one prepreg is sandwiched between each component.