JPH0519948Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention relates to an exposed member holding device that holds a member to be exposed, such as a wafer or a reticle, which is exposed with a predetermined pattern using an exposure device, and in particular, The present invention relates to a rotating device for an exposed member holding device that can easily perform alignment.

[Conventional technology]

2. Description of the Related Art In the manufacturing process of semiconductor integrated circuits, an exposure apparatus is used to expose and print a circuit pattern on a wafer coated with photoresist. In this exposure apparatus, high precision positioning on the order of 0.1 micron is increasingly required as semiconductor integrated circuits become highly integrated. For this positioning, it is necessary not only to position the exposed member in the horizontal direction (XY direction) with respect to the exposed portion by reading an alignment mark formed in advance on the exposed member, but also to position the exposed member against angular deviation in the horizontal direction.

Therefore, as an exposed member holding device that holds the exposed member, it is necessary to rotatably hold the chuck that holds the exposed member on a movable member that is moved in the horizontal direction.

A conventional exposure target member holding device is disclosed in Japanese Utility Model Application Publication No. 158824/1989 (hereinafter referred to as
(hereinafter referred to as the 1st conventional example), Japanese Patent Application Laid-Open No. 128734/1983 (hereinafter referred to as the 2nd conventional example), and Utility Model Application No. 61-9226
There is one described in Japanese Patent Publication No. 3 (hereinafter referred to as the third conventional example).

In the first conventional example, a chuck for adsorbing an exposed member is placed on a chuck holding member, and the chuck is held by suction on the chuck holding member so that the chuck can be easily attached and detached.

Further, in the second conventional example, a base on which a wafer chuck of a rotary stage is rotatably placed via a ball placed at the center of rotation of the wafer chuck, and a base that is attached to the center and near the outer periphery of the wafer chuck, respectively. A V whose link end is supported via an elastic fulcrum by a member that is attached to the wafer
a letter-shaped link, a transmission means that is attached to the base side and moves the apex portion of the V-shaped link in the rotating direction of the wafer chuck, and an elastic fulcrum at an intermediate portion of the V-shaped link. It has a configuration including an electrostrictive element supported through the electrostrictive element.

Further, in a third conventional example, in a rotary table position fixing device that is rotatably supported almost horizontally around a rotating part provided on a rotating table, a mechanism for fixing the rotary table around the rotating part is provided. It has a configuration with a possible vacuum chuck.

[The problem that the idea aims to solve]

However, although the first conventional example described above is suitable for removably adsorbing and holding a member to be exposed such as a wafer, it requires high-precision chuck rotation required when aligning the member to be exposed, etc. There was an unresolved issue of not being able to meet dynamic demands.

In addition, in the second conventional example, it is possible to rotate the wafer chuck that holds the exposed member using a conduction means and an electrostrictive element, but as the number of parts of the rotation mechanism increases, , there was an unresolved issue of increasing complexity and size.

Furthermore, in the third conventional example, a rotary table rotatably supported on a rotary table by a feed screw is fixed by a vacuum chuck, and is used to store wafers, etc. in an exposure apparatus. There is an unresolved problem that this method cannot be applied to an exposed member holding device that requires high precision such as alignment between an exposed member and a mask.

Therefore, this invention was devised by focusing on the unresolved problems of the above-mentioned conventional examples, and is a rotating device for an exposed member holding device that can perform highly accurate rotational positioning with a simple configuration. is intended to provide.

[Means to solve the problem]

In order to achieve the above object, this invention provides an exposed member holding device which is connected to a gas suction means and which suction holds a member to be exposed such as a wafer on which a predetermined pattern is exposed. a chuck holding member, a chuck that attracts and holds the exposed member rotatably placed on the chuck holding member, and a sealed space formed between the chuck holding member and the sliding contact portion of the chuck. A suction recess provided in the chuck holding member and the chuck are selected by selecting whether the suction recess is communicated with a gas suction means to be in a suction state or at least a portion thereof is exposed to the atmosphere. and a fine movement feeding device having a coupling means for releasing the coupling means, an engagement piece formed on one of the chuck and the chuck holding member, and an actuator that engages with the engagement piece disposed on the other; The present invention is characterized in that it includes a rotating device comprising a biasing means disposed between the chuck and the chuck holding member and biasing the chuck in a direction in which the engaging piece and the actuator come into contact with each other.

Here, it is preferable that the chuck holding member is provided with a pressure adjusting means capable of adjusting the pressure of the gas suction means for adsorbing the chuck.

[Effect]

In this invention, a member to be exposed, such as a wafer or reticle, is suctioned and held on the chuck by a gas suction means such as a vacuum source. When aligning the exposed member, the chuck is made rotatable on the chuck holding member by opening the suction recess to the atmosphere using the coupling means, and in this state the fine movement feeder is operated. By using the actuator to press the engagement piece against the biasing means or by releasing the pressure on the engagement piece, the chuck is slightly rotated and the exposed member can be aligned with high precision. After the alignment is completed, the chuck itself is suction-held on the chuck holding member by connecting the suction recess to the gas suction means using the coupling means. At this time, by adjusting only the suction force for suctioning and holding the chuck using the pressure adjustment means provided on the chuck holding member, it is possible to easily rotate the exposed member while the chuck is suctioning and holding the chuck. .

〔Example〕

Hereinafter, embodiments of this invention will be described based on the drawings.

First, an outline of a reduction projection exposure apparatus to which this invention can be applied will be explained with reference to FIG.

In the figure, 101 is a reduction projection exposure apparatus, which includes a stage 103 on which a wafer 102 is placed, and a reduction lens 104 fixedly arranged opposite to the upper surface of the stage 103.
, a reticle mounting table 106 on which the reticle 105 is placed, and an exposure light source section 107 arranged above the reticle mounting table 106 .
05 and a reduction lens 104 onto a wafer 102 on an XYZ stage 103 as a compound moving table device, and the circuit pattern formed on a reticle 105 is imaged onto the wafer 102 and reduced in size and projected.

The XYZ stage 103 is driven by the drive mechanism 2.
The exposure position of the wafer 102 is selected by moving in the XY-axis directions, and focus adjustment is performed by moving in the Z-axis direction.

The specific configuration of this XYZ stage 103 is as shown in FIGS. 1 to 5.

That is, in FIG. 1, 1 is a base,
This base 1 includes an X-axis drive mechanism 2a and a Y-axis drive mechanism 2.
It is placed on a coarse movement table 3 that is moved in the X-axis and Y-axis directions in a horizontal plane by the arrow b.

A guide stand 4 is attached to the center of the base 1, as shown in FIGS. 2 and 3. The guide stand 4 has a wide concave portion 5 on the upper surface side that slopes downward toward the front, and is formed into a U-shaped cross section.

As shown in FIG. 3, the slope slider 7 in the recess 5 of the guide stand 4 is supported and guided by the cross roller guide 8 inclined with respect to the horizontal plane, and can slide along the bottom surface of the recess 5. It is arranged like this. The slope slider 7 has a lower surface 7a parallel to the slope of the recess 5, and an upper surface 7a.
It is formed into a trapezoidal shape with b being a horizontal plane. As shown in FIG. 3, the slope slider 7 is
A ball nut 6 is fixed to the rear end, and a feed screw shaft 11 is screwed into the ball nut 6.
The feed screw shaft 11 is connected to the rotating shaft of a DC motor 10 constituting a drive mechanism, and an encoder 9 is attached to the motor 10 to detect the amount of rotation of the motor. When the DC motor 10 is driven to rotate, the inclined slope slider 7 is moved in the direction in which the bottom surface of the recess 5 in the guide table 4 extends.

A retainer 1 is mounted on the horizontal upper surface 7b of the slope slider 7.
Steel balls 1 as rolling elements separated from each other by 3b
A moving table block 14 is mounted via 3a so as to be movable in a horizontal plane. Here, the retainer 13b is configured to rotatably hold a large number of highly precisely finished balls 13a, each having a disc shape. Note that 13c is a topper that prevents the retainer 13b from being pulled out.

On the other hand, as shown in FIG. 2, on the base 1, U-shaped support bases 16a, 16b are fixed on both the left and right sides. On receiving surfaces 16c, 16d formed on the support bases 16a, 16b, as shown in FIG.
A moving table 17 as a fine adjustment table movable in the XY-axis directions is supported on the base 1 so as to be movable in the XY-axis directions with a high viscosity silicon grease 16e (viscosity of about ¹⁰⁵ centistokes) interposed therebetween as a vibration damping fluid.

As shown in FIGS. 1 and 2, the movable table 17 includes a square portion 17a and a support portion 17 extending outward by forming stepped portions 17b from the left and right sides of the square portion 17a.
c, 17d are integrally constructed, and the square portion 17a
A substantially square through hole 17e is provided in the center of the support 17.
Rectangular through-holes 17f and 17g are formed in c and 17d, respectively, and vibration-damping surfaces 18 are provided in the through-holes 17f and 17g, respectively, facing the upper surfaces of the supports 16a and 16b through a slight gap. A member 19 is inserted and fixed to the movable table 17,
Further, the moving table block 14 is inserted into the through hole 17e. And moving table 1
As shown in FIG. 4, a leaf spring 20 is bridged between the upper surface of the moving table block 17 and the upper surface of the moving table block 14, and the moving table block 14 is prevented from moving in the X and Y directions relative to the moving table 17. In this state, slight movement is possible in the Z-axis direction by the bending of the leaf spring 20.

Further, U-shaped support stands 21a and 21b are fixed to the ends of the base 1 in the front and rear directions, respectively, and the legs of these support stands 21a and 21b are provided with leaf springs 22 so as to be movable in the X direction. U-shaped block 23a, 2
3b are connected. These blocks 23a,
The struts 24f and 24r on both sides of the movable table 17 extend upward to the vicinity of the step 17b of the movable table 17, and the front end of the strut 24f and the rear end of the strut 24r are connected to the square 17a of the movable table 17. They are connected by a leaf spring 25.

Electromagnets 26a each having an excitation coil wound around a U-shaped core are mounted on the support stands 21a and 21b, respectively.
26b is arranged, and these electromagnets 26a, 26b
both ends of which face the magnetic plates 27a, 27b fixed to the front and rear edges of the moving table 17 with a predetermined distance therebetween, and support stands 16a, 1 of the coarse moving table 1.
Similarly, electromagnets 28a and 28b, each having an excitation coil wound around a U-shaped core, are disposed below 6b, and both ends of these electromagnets 28a and 28b are connected to blocks 23a and 6b.
Magnetic plates 29a, 29 fixed to the center of 23b
b and are opposed to each other with a predetermined distance therebetween. Therefore, the amount of excitation current applied to the excitation coils of the electromagnets 28a and 28b is increased so that one of the magnetic forces of the opposing electromagnets is increased from the reference value, and the other is decreased.
By adjusting the spring force to balance the displacement of the leaf spring, the blocks 23a, 23
b is slightly moved in the X direction against the leaf spring 22, thereby moving the movable table 17 connected to the leaf spring 25.
Move slightly in the X direction. In addition, electromagnets 26a, 2
By adjusting the amount of excitation current applied to the excitation coil 6b so as to increase the magnetic force of the opposing electromagnets from the reference value on one side and decrease the other so as to balance the spring force with respect to the displacement of the leaf spring, The moving table 17 is slightly moved in the Y direction against the leaf spring 25.

Moreover, on the top surface of the movable table block 14,
As shown in FIGS. 2 and 3, a wide chuck mounting plate 30 is fixed to the upper surface, and a jig chuck 31 as a disc-shaped chuck holding member is fixed onto this chuck mounting plate 30. As shown in FIG. 5, this jig chuck 31 has a positioning annular frame 32 fixed to its outer periphery, and is connected to a vacuum source (not shown) inside, extending from the left edge to the center. a through hole 33a that reaches the top surface and opens from here on to the top surface;
A through hole 33b is formed in a U-shape to surround this through hole 33a, and the through hole 33b is opened at an upper surface position corresponding to a suction recess 37 of a wafer chuck 36, which will be described later. As shown in FIG. 1, a part of the through hole 33a is connected to a gas suction means 34c such as a compressor via a three-way switching valve 34a. Also, one end of the through hole 33b communicating with the suction recess 37 is similarly connected to a gas suction means 34c via a three-way switching valve 34b, and the other end is a manual pressure adjusting means with one end open to the atmosphere. The other end of a pressure regulating valve 35 having a variable throttle that can be adjusted by a knob 35a is connected, and by adjusting the manual knob 35a of the pressure regulating valve 35, the pressure in a suction recess 37 of a wafer chuck 37, which will be described later, is adjusted. can be adjusted. Here, the three-way switching valve 34
b and the pressure regulating valve 35 constitute a coupling means. In addition, the three-way switching valves 34a and 34b
has one port communicating with the through holes 33a and 33b, one port communicating with the gas suction means 34c, and one port open to the atmosphere.

Then, the guide frame 32 is placed on the jig chuck 31.
A wafer chuck 36 on which a wafer as an exposed member is placed is rotatably guided by the wafer chuck 36 . This wafer chuck 36 has six fan-shaped suction recesses 37 communicating with the through holes 33b of the jig chuck 31 formed at equal intervals in the circumferential direction on its lower surface. As shown in the figure, a through hole 38 communicates with the through hole 33a of the jig chuck 31 and extends upward from the center of the lower surface, and a cross-shaped suction groove 3 extends radially from the center of the upper surface.
9a, and an outer circumferential suction groove 39b connecting the ends of the cross-shaped groove 39a. Here, as the wafer chuck 36, a plurality of types of chucks having mounting surfaces depending on the size of the exposed member to be used are prepared. In addition, 40 is a wafer jacket 36
This is a jig for positioning the exposed member fixed to the upper surface of the .

An engaging piece 41 projecting outward is fixed to the upper surface of the wafer chuck 36, and an engaging element 41a is fixed to the protruding end of the engaging piece 41. On the other hand, in the guide frame 32 of the jig chuck 31, a micrometer 42 as a fine movement feeder connects a spindle 42a as an actuator to an engagement piece 4.
The bracket 4
3, and a tension spring 44 as a biasing means is mounted between the tip of the engagement piece 41 and the bracket 43. Therefore, by rotating the thimble 42b of the micrometer 42, its spindle 42a advances or retreats, the engagement piece 41 moves accordingly, and the wafer chuck 36 is slightly rotated.

The chuck mounting plate 30 also has a reflecting mirror 51 formed in an L-shape, having a mirror portion 51a parallel to the Y-axis and a mirror portion 51b parallel to the X-axis on its outer periphery as shown in FIG. is fixed. Then, an X-axis laser length measuring device 52a is placed opposite the mirror portion 51a of the reflection mirror 51, and the mirror portion 51b is
A Y-axis laser length measuring device 52b is fixed to the main body of the apparatus, respectively, and position detection signals representing the absolute position of the moving table 17 in the X-axis and Y-axis directions are transmitted from these laser length measuring devices 52a, 52b, respectively. Output. The position of the moving table 17 is accurately detected using these position detection signals, and based on this, the amount of current applied to the electromagnets 26a, 26b, 28a, and 28b is controlled, and the wafer chuck 36 is positioned in the X and Y directions.

Next, the operation of the above embodiment will be explained. First, the jig chuck 31 is opened by the three-way switching valves 34a and 34b.
With the through holes 33a and 33b open to the atmosphere,
A wafer chuck 36 corresponding to the size of the wafer 102 to be exposed is selected, and the wafer chuck 36 is moved to the jig chuck 3 so as to be guided by the guide frame 32.
The engaging element 41a of the engaging piece 41, which is rotatably mounted on the wafer chuck 36 and is fixed to the wafer chuck 36, is opposed to the spindle 42a of the micrometer 42, and a tension spring 44 is installed between the engaging piece 41 and the bracket 43.
Interpose.

In this state, the pressure regulating valve 35 is fully closed and the three-way switching valve 34b is switched to communicate the through hole 33b of the jig chuck 31 with the gas suction means 34c. As a result, the recess 3 of the wafer chuck 36
Since the inside of 7 is in a vacuum state, the wafer chuck 36
is attracted and fixed to the jig chuck 31. Then, since the air passage 33a of the jig chuck 31 and the air passage 38 formed in the chuck 36 are in communication, the wafer 102 is placed on the placement surface of the chuck 36 using a loading device (not shown). At this time, the three-way switching valve 34a is switched to connect the air passage 33a of the jig chuck 31 to the gas suction means 34.
By communicating with c, the wafer 102 can be held by vacuum suction.

In this holding state of the wafer 102, the wafer 102
When performing the position adjustment, if the moving distance of the wafer 102 is large, the coarse movement table 3 is moved at high speed by the XY drive mechanisms 2a and 2b to move it to the vicinity of the target position.

In this state, the laser length measuring device 52a,
When finely adjusting the position of the wafer 102 based on the measured value of the laser length measuring device 52a, 52b,
Based on the detected value of b, the electromagnets 26a, 26b and/or
Alternatively, the moving table 17 can be moved by controlling the amount of current applied to the excitation coils of the electromagnets 28a and 28b.
Submicron order positioning can be performed by making slight movements in the X and Y directions.

In addition, in order to slightly rotate the wafer chuck 37 in order to align the reticle 105 and the wafer 102, first rotate the manual knob 35a of the pressure regulating valve 35 to open the through hole 3 of the jig chuck 31.
By opening a part of the wafer 3b to the atmosphere, the reduced pressure in the recess 37 of the wafer chuck 36 is relaxed, and the wafer chuck 36 is allowed to rotate.In this state, the thimble 4 of the micrometer 42
By rotating the spindle 2b and moving the spindle 42a forward and backward, the wafer chuck 36 is rotated against the tension spring 44 or by the elasticity of the tension spring 44.

At this time, for example, 1 of the micrometer 42
Assuming that the scale is 10 microns and the distance between the center line of the spindle 42a of the micrometer 42 and the center of rotation of the wafer chuck 36 is L, the micrometer 42 is operated by one scale to adjust the spindle 42a to 10 microns. When moved, the rotation angle θ of the wafer chuck 36 can be expressed by the following equation.

θ=tan ^-1 (10×10 ^-3 /L) ...(1) Therefore, the larger the distance L is, the smaller the rotation angle θ of the wafer chuck 36 can be. For example, if the distance L is 66 mm, When set, the rotation angle θ is
The rotation angle is 31.3 seconds, which is 10 times more than the rotation angle of 412.5 seconds when, for example, the minimum accuracy required for alignment, that is, the distance L is 5 mm and the amount of movement is 10 microns.

Moreover, when the wafer chuck 36 is rotated, the elasticity of the tension spring 44 causes the engagement element 41a of the engagement piece 41 to move against the spindle 4 of the micrometer 42.
Since it is biased toward 2a side, micrometer 4
It is possible to eliminate the influence of the second backlash, and it is possible to further improve positioning accuracy.

Further, when adjusting the focus of the exposure apparatus 101, a focal length detector (not shown) detects the distance between the lower surface of the cylinder 109 holding the reduction lens 104 and the wafer 102, and By driving the DC motor 10 based on the detection signal, the slope slider 7 is moved back and forth, and the movable table block 14 is moved up and down to adjust the focus.

Furthermore, when mounting a wafer 102 of a different size, the three-way switching valves 34a and 34b are returned to the state shown in FIG. After the connection is cut off and the through holes 33a and 33b are opened to the atmosphere, the wafer chuck 36 is removed, and another selected wafer chuck 36 is vacuum-adsorbed onto the jig chuck 31 in the same manner as above.

In addition, in the above embodiment, the jig chuck 3
Although the case has been described in which the guide frame 32 is provided on the peripheral edge of the upper surface of the guide frame 1, the present invention is not limited to this, and three or more positioning pins may be provided.

Further, in the above embodiment, the jig chuck 31 and the moving table 17 are used as chuck holding members.
Although the case has been described in which the jig chuck 31 and the jig chuck 31 are constructed separately, the present invention is not limited to this, and the jig chuck 31 may be constructed integrally on the movable table 17.

Further, the movable table on which the jig chuck 31 is placed is not limited to the above-mentioned configuration, and it goes without saying that a movable table having any other configuration may be applied.

Furthermore, in the above embodiment, a case has been described in which the micrometer 42 is provided on the jig chuck 31 and the engagement piece 41 is provided on the wafer chuck 36, but the invention is not limited to this, and the two are provided in an inverse relationship. Even in this case, the same effects as in the above embodiment can be obtained.

In addition, the biasing means is not limited to the tension spring 44, but other elastic bodies such as rubber can be used.
Also, its installation position is between the engaging piece 41 and the bracket 43.
The engaging piece 41 may be biased in the direction in which it comes into contact with the micrometer 42 by providing it not only in between but also at any other arbitrary position on the jig chuck 31 and the wafer chuck 36.

Further, in the above embodiment, the case where the recess is formed in the wafer chuck 36 has been described, but the recess may be formed on the jig chuck 31 side.

Furthermore, in the above embodiments, the case where the member to be exposed is a wafer has been described, but a square or rectangular mask or the like may be applied, and there is no particular restriction on the shape of the member to be exposed.

Furthermore, in the above embodiment, the case where this invention is applied to a reduction projection exposure apparatus has been described, but the present invention is not limited to this, and can be applied to other exposure apparatuses such as a same-magnification exposure apparatus. Of course.

[Effect of idea]

As explained above, according to this invention, in an exposed member holding device which is connected to a gas suction means and is configured to suck and hold a member to be exposed such as a wafer to which a predetermined pattern is exposed, the device is mounted on a movable table. a chuck holding member, a chuck that attracts and holds the exposed member rotatably placed on the chuck holding member, and a sealed space formed between the chuck holding member and the sliding contact portion of the chuck. An adsorption recess provided in the adsorption recess and a gas suction means interposed between the adsorption recess and the gas suction means, and selecting whether the adsorption recess is connected to the gas suction means or opened to the atmosphere. A coupling means for attracting and releasing the chuck between the chuck holding member and the chuck, engaging with an engaging piece formed on either one of the chuck and the chuck holding member and the engaging piece disposed on the other. A rotation device comprising a fine movement feeder having an actuator, and a biasing means disposed between the chuck and the chuck holding member for urging the chuck in a direction in which the engaging piece and the actuator come into contact with each other. With this extremely simple configuration, it is possible to achieve the effect of highly accurate rotational positioning of the chuck holding the member to be exposed by suction. Furthermore, since the fine movement feeder and the engagement piece are brought into contact with each other by the urging means, it is possible to prevent the fine movement feeder from collapsing.

In addition, the chuck can be easily rotated by adjusting the adsorption force between the chuck and the chuck holding member by adjusting it with a pressure regulating valve in a recess that communicates with the chuck holding member or the gas suction means formed in the chuck. I can do it.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an embodiment of this invention, Fig. 2 is a sectional view taken along the - line in Fig. 1, Fig. 3 is a sectional view taken along the - line in Fig. 1, and Fig. 4 is a sectional view taken along the - line in Fig. 1.
FIG. 5 is a perspective view with a portion of the XYZ stage omitted, FIG. 5 is a plan view showing an example of a jig chuck, and FIG. 6 is a schematic configuration diagram showing an example of a reduction projection exposure apparatus to which this invention is applied. In the figure, 1 is the base, 2 is the XY drive mechanism, and 2a is the X
An axis drive mechanism, 2b is a Y-axis drive mechanism, 3 is a coarse movement table, 7 is a slope slider, 14 is a moving table block, 17 is a moving table, 26a, 26b,
28a and 28b are electromagnets, 31 is a jig chuck (chuck holding member), 32 is a guide frame, 33a,
33b is a through hole, 34a, 34b are 3-way switching valves, 3
4c is a gas suction means, 35 is a pressure regulating valve, 36 is a wafer chuck, 37 is a recess, 41 is an engaging piece, 4
2 is a micrometer, 44 is a tension spring, 101 is a reduction projection exposure device, 102 is a wafer, and 103 is a
An XYZ stage, 104 a reduction lens, and 107 an exposure light source section.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) In an exposed member holding device which is connected to a gas suction means and is adapted to suction and hold an exposed member such as a wafer on which a predetermined pattern is exposed, A chuck holding member, a chuck that adsorbs and holds the exposed member rotatably placed on the chuck holding member, and a sealed space is formed between the chuck holding member and a sliding contact portion of the chuck. Adsorption between the chuck holding member and the chuck is performed by selecting the provided suction recess and whether the suction recess is communicated with a gas suction means to be in a suction state or at least a portion thereof is opened to the atmosphere. a fine movement feeder having a coupling means for releasing the coupling means, an engagement piece formed on one of the chuck and the chuck holding member, and an actuator that engages with the engagement piece disposed on the other; An exposed device characterized by comprising a rotating device comprising a chuck and a biasing means disposed between the chuck and a chuck holding member for biasing the chuck in a direction in which the engaging piece and the actuator come into contact with each other. Component holding device. (2) The exposed member holding device according to claim (1), wherein the coupling means includes pressure adjustment means for adjusting the pressure of the gas suction means.