JPH0517874Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention is a device for holding an exposed member of an exposure apparatus that exposes a predetermined pattern on the exposure surface of an exposed member such as a wafer or a shadow mask, and in particular a suction device for the exposed member. The present invention relates to an exposed member holding device whose height can be changed.

[Conventional technology]

2. Description of the Related Art In the manufacturing process of semiconductor integrated circuits and shadow masks, an exposure apparatus is used to expose and print a predetermined pattern on a member to be exposed, such as a wafer coated with photoresist. With the increasing density of semiconductor integrated circuits and shadow masks, exposure apparatuses are increasingly required to perform highly accurate positioning on the order of 0.1 micron.

It is difficult to perform such highly accurate positioning with a conventionally known moving table device in which the mounting table is simply moved by a feed screw. For this reason, a table moved by a feed screw is used as a coarse movement table, a fine movement table supported so as to be able to move minutely is provided on this coarse movement table, and the absolute position of this fine movement table is measured using a laser length measuring device. The error in the movement of the coarse movement table is corrected by slightly displacing the fine movement table.
It has been proposed to perform precise positioning.

As the exposure apparatus, a reduction projection type exposure apparatus is generally employed. This reduction projection type exposure apparatus is a so-called step-and-repeat type that prints small patterns one by one on a member to be exposed such as a wafer, so the parallelism of the light-receiving surface of the member to be exposed such as a wafer can be adjusted. It is necessary to maintain high precision, and accordingly, it is necessary to maintain high precision in the parallelism of the upper surface of the mounting table on which a member to be exposed such as a wafer is mounted.

Furthermore, since it is necessary to suction and hold exposed members such as wafers and shadow masks without damaging their surfaces, vacuum suction chucks are employed as these holding devices.

Incidentally, a reduction projection exposure apparatus is generally incorporated into a production line for wafers, shadow masks, etc., and usually one size of wafer, shadow mask, etc. is continuously produced, so the exposure target of a conventional reduction projection exposure apparatus is In reality, the vacuum suction area of the member holding device is fixed because there is no need to vary the vacuum suction area.

[Problem that the invention attempts to solve]

However, while there is no problem with the above-mentioned conventional exposed member holding device as a dedicated exposed member holding device for suctioning and holding an exposed member of one size, when using a reduction projection exposure apparatus as a multi-purpose machine for prototype experiments, in order to expose exposed members of various sizes (e.g., 2 to 8 inches for wafers, and 17×17 inches and 20×18 inches for shadow masks) and different thicknesses, it is necessary to prepare a plurality of vacuum suction chucks having suction areas corresponding to exposed members of these different sizes and thicknesses,
These had to be selected appropriately according to the size of the workpiece to be exposed and placed on the mounting table of the reduction projection exposure apparatus, which resulted in problems such as the time-consuming task of attaching and detaching the vacuum suction chuck, the need for storage space for the vacuum suction chuck, and the troublesome management of the same.

Therefore, this invention was made by focusing on the problems of the conventional method described above, and it is possible to maintain the same exposed surface even when exposed members have different thicknesses, and it is also possible to arbitrarily change the vacuum suction area. It is an object of the present invention to provide a device for holding an exposed member in an exposure apparatus that can be used to hold an exposed member.

[Means for solving problems]

In order to achieve the above object, this invention provides a mounting table with a chuck that is connected to a gas suction means and that sucks and holds a member to be exposed such as a wafer.
In the exposure apparatus that exposes a predetermined pattern on the exposure surface of the exposed member, a plurality of suction holes communicating with the gas suction means are bored at predetermined intervals on the mounting surface side of the mounting table, and the chucks are connected to the gas suction means. The chuck main body includes a guide recess communicating with the suction hole, stepped portions of different heights at upper and lower positions of the outer peripheral edge into which the guide recess is fitted, and adsorption portions communicating with each other on the upper and lower surfaces. It is characterized by having the following. Here, the guide recess and the outer circumferential surface of the chuck body that fits into the guide recess may have any shape such as circular or rectangular. In addition, suction holes outside the suction range that do not attract the exposed member are closed with a closing tool. This closing device includes not only one that directly closes the suction hole but also one that indirectly closes the suction hole by closing the opening of the guide plate.

[Effect]

In this device, a guide recess is formed in the mounting surface of the mounting table on which the exposed member such as a wafer or shadow mask is placed, and the guide recess is connected to a plurality of suction holes that are connected to an air suction means. The chuck body is fitted into this guide recess. Steps of different heights are formed at the top and bottom of the outer periphery of the chuck body, so that the height at which the exposed member is sucked and held can be changed by turning the chuck body upside down.
The thickness of the exposed member can be adjusted in stages, and when exposed members of different thicknesses are sucked and held, the exposed surfaces of the exposed members can be kept in the same plane. Also, the suction region can be freely changed by fitting the chuck body into the guide recess only in the suction region that sucks the exposed member and closing the guide recess or suction hole in the other regions with a closing device.

〔Example〕

Hereinafter, embodiments of this invention will be described based on the drawings.

First, an outline of a reduction projection exposure apparatus to which this invention can be applied will be explained with reference to FIG.

In the figure, 101 is a reduction projection exposure apparatus, which includes a stage 103 on which a member to be exposed 102 such as a wafer or a shadow mask is placed, a reduction lens 104 fixedly arranged opposite to the upper surface of the stage 103, and a reduction lens 104 arranged above the stage 103. The reticle mounting table 106 has a reticle mounting table 106 on which a reticle 105 is placed, and a light source section 107 disposed above the reticle mounting table 106, and the exposure light from the light source section 107 passes through the reticle 105 and the reduction lens 104 to the moving table. A member to be exposed 102 on an XYZ stage 103 serving as an apparatus is irradiated, and a circuit pattern formed on a reticle 105 is exposed by reduction projection onto the member to be exposed 102 .

The XYZ stage 103 is configured to be movable in the three axial directions of the XYZ axes, and performs focus adjustment by being moved in the Z-axis direction.

At the lower end of the cylinder 108 that holds the reduction lens 104 facing the member to be exposed 102, there is a through hole 109 through which the exposure light passes, and four holes are formed at equal angular intervals around the through hole 109.
Two air blowing nozzles 110 are formed. Each nozzle 110 has a common air supply source 111
112 through a throttle 112, and to one input side of a common differential pressure converter 113. The other input side of the differential pressure converter 113 is connected to the air supply source 111 via a restriction 114 and communicated with the atmosphere.
These nozzles 110, air supply source 111, aperture 1
12, 114 and the differential pressure converter 113 constitute an air micrometer 115.

Then, the detection signal of the differential pressure converter 113 is supplied to the focus adjustment control device 116, and this control device 11
6, the target value setter 116a compares the target value with a predetermined target value, and a difference signal, which is the difference value, is supplied to the drive circuit 116b, which includes an amplifier or the like.
This forms a drive output that operates an actuator 117 such as a motor, and supplies this to the Z-axis drive mechanism of the XYZ stage 103 to drive it, thereby adjusting the distance between the nozzle 110 and the member to be exposed 102 appropriately. Adjust to value.

A specific example of the XYZ stage 103 is constructed as shown in FIGS. 1 to 8.

That is, reference numeral 1 denotes a rectangular base, which is fixed to a coarse movement table 2 that is moved at high speed in the XY directions by a feed mechanism such as a feed screw.

In the center of the base 1, there are shown figures 4, 5 and 7.
As shown in the figure, a cylindrical body 3 whose upper end surface is closed is fixed, and the upper surface of this cylindrical body 3 is a flat vibration damping surface 3a.
It is said that

Further, inclined guide rails 4L and 4R as inclined guide portions are fixed in parallel on both left and right sides of the base 1 with the cylindrical body 3 interposed therebetween. These inclined guide rails 4L,
Each of the 4Rs is sloped upward toward the rear so that the height thereof increases from the front end toward the rear end.

A rectangular frame-shaped slope slider 5 is engaged with each of the slope guide rails 4L, 4R so as to be slidable in the front-rear direction. As shown in FIGS. 5 and 6, the slope slider 5 has slope mounting surfaces 6 that are parallel to the slope guide rails 4L and 4R formed on the lower surfaces of the four corners and intermediate portions of these in the front and back direction, respectively. Linear ball bearings 7a to 7f that engage with the inclined guide rails 4L and 4R are fixed to the inclined mounting surface 6 by inserting and fastening bolts 9 into bolt holes 8 formed on the upper surface side. Here, the linear ball bearings 7a to 7f are shown in the upper surface plate portion 1 as shown in an enlarged view in FIG. 9, although detailed explanation thereof will be omitted.
0 and sleeve portions 11 extending downward from both sides thereof;
Rolling grooves 12 are formed extending in the axial direction on the left and right side walls of the inclined guide rails 4L and 4R of these sleeve portions 11.
A rolling groove 13 formed at a position facing the rolling grooves 13 and a circulation path 14 formed in the sleeve part 11 in communication with these rolling grooves 13, and a rolling groove formed by the rolling grooves 12 and 13. A large number of balls in the path and circulation path 14,
A rolling element 15 such as a roller is held by a retainer 16 and inserted so as to be freely rolling.

On the other hand, mounting plates 17a to 17 are placed on the upper surface of the four corners of the slope slider 5 so that the upper surfaces are in the same horizontal plane.
d is fixed by fixing means such as bolting,
An oblong flat surface 18 extending in the front-back direction is formed on the upper surface of these mounting plates 17a to 17d, and a large number of balls 20 as rolling elements held in alignment by a retainer 19 are mounted on these flat surfaces 18. It is placed. As shown in an enlarged view in FIG. 10, the retainer 19 has a U-shaped cross section, consisting of a flat plate portion 19b having a large number of through holes 19a through which the balls 20 are inserted, and a peripheral flange 19c formed on the outer peripheral surface of the lower surface of the flat plate portion 19b. Four balls 19d are arranged at equal intervals on the lower surface of the circumferential flange 19c, thereby reducing the frictional resistance between the retainer 19 and the flat surface 18.
This prevents jamming between 9c and the flat surface 18.

Then, the slope slider 5 is tilted by the linear drive mechanism 20 along the guide rails 4L, 4R. As shown in FIG. 7, this linear drive mechanism 20 consists of a stepping motor 21 fixed to the base 1 with its rotating shaft 21a tilted parallel to the guide rails 4L and 4R, and its rotating shaft 21a. A ball screw 23 connected via a coupling ring 22 to
and a ball nut 24 which is screwed into the ball screw 23 and attached to the central lower surface of the rear end side of the slope slider 5.

On the other hand, a mounting table 26 that holds the exposed member 102 by suction is placed on the upper surface side of the ball 20 of the slope slider 5.
is placed. This mounting table 26 is shown in FIG.
As shown in FIG. 4, an exposed member holding device 27 for suctioning and holding the exposed member 102 is formed on the upper surface, and a ball 2 of the sloped slider 5 on the lower surface.
Projections 28a to 28d are formed at four locations facing 0, and spacers 29a to 29d, each of which has a flat bottom surface as shown in FIGS. These spacers 29a to 29d are fixed by a fixing means to the slope slider 5.
The ball 20 is placed between the balls 20 and 20.

As shown in FIG.
a ₀ is bored, and parallel to the rectangular frame lines l ₁ to l ₃ and both left and right sides of the rectangular frame line l ₃ according to the size of the exposed member 102 to be placed, centered on the mounting center O. The required number of suction holes 27a ₁ to 27a ₃ and 2 on the line l ₄
7a ₄ is drilled, and each suction hole 27a ₀ , 27a ₁ to 27
a ₄ are communicated with each other via a suction passage 27b bored from the end side of the mounting table 26, and the suction passage 27b
is connected to air suction means 27d such as a vacuum pump via a three-way electromagnetic switching valve 27c.

Further, on the upper surface of the mounting table 26, a relatively large diameter circular through hole _27e0 is formed as a guide recess at a position corresponding to the suction hole _27a0 , and a circular through hole 27e0 with a relatively large diameter is formed as a guide recess at a position corresponding to the suction holes _27a1 to _27a4 . A guide plate 2 in which circular through holes 27e ₁ to 27e ₄ of relatively small diameter are bored respectively.
7e is fixed with a set screw.

Then, the circular through hole 27 of the guide plate 27e
Chuck bodies 27f ₀ and 27f ₁ , which are circular in plan view, are engaged in e ₀ and 27e ₁ to 27e ₄ , respectively.

These chuck bodies 27f ₀ and 27f ₁ have the same shape except that their outer diameters are different.
As shown in Figures a and b, circular through holes 27e ₀ and 27e ₁ of the guide plate 27e are formed on the upper and lower sides of the guide plate 27e.
~27e Small diameter part 2 having an outer diameter approximately equal to the inner diameter of ₄
7g ₁ and 27g ₂ are formed, and these small diameter parts 27g ₁
A large diameter portion 27h having a larger diameter than these and 27g ₂ is formed to form two stepped portions 27i, and a mark 27j formed of an annular groove is formed on the outer peripheral surface of the small diameter portion 27g ₁ side of the large diameter portion 27h. It is formed. Here, the heights h ₁ and h ₂ of the small diameter portions 27g ₁ and 27g ₂ are as follows: h ₁ <h ₂ ≦H ₁ where H ₁ is the thickness of the guide plate 27e.
has been selected. Further, suction recesses 27k ₁ and 27k ₂ are formed on the upper surface of the small diameter portion 27g ₁ and the lower surface of the small diameter portion 27g ₂ , respectively, inside the outer peripheral edge, and these suction recesses 27k ₁ and 27k ₂ are formed by the through hole 27l. It is communicated.

Furthermore, it is necessary to close the suction holes 27a ₁ to 27a ₄ that are not used depending on the size of the shadow mask SM, and for this purpose, a closure tool 27m is provided. As shown in FIG. 12, this obturator 27m has circular through holes 27e ₁ -
A cylindrical portion 27n having an outer diameter equal to or slightly smaller than the inner diameter of the cylindrical portion _27e4 , and a flange portion 27o that closes the upper surface of the cylindrical portion 27n and protrudes outward.
It is constituted by a blind lid having a thin upper surface plate portion 27p.

In addition, as shown in FIGS. 5 and 8, the base 1
Support stands 31a to 31d are fixed to the four corners of the support stand 31a and 31b, and leaf springs 32a and 32b
The convex X-direction fine movement body 33L is connected to the support base 3 via
A convex X-direction movable body 33R is bridged between 1c and 31d via leaf springs 32c and 32d, allowing fine movement in the X direction, and between these X-direction fine movable bodies 33L and 33R via leaf springs 34a to 34d. XY
A direction fine movement body 35 is bridged so as to be finely movable in the Y direction. Here, as shown in FIGS. 7 and 8, the XY direction fine movement body 35 has a through hole 36 in the center thereof through which the cylindrical body 3 is inserted.
6 is closed by an upper disk 37 as shown in FIG. A damping surface 39 is fixed to the vibration damping surface 3a of the body 3 so as to closely face it, and a damping surface 39 having a high viscosity such as silicone oil is interposed between the vibration damping surfaces 3a and 38a to form a vibration damping surface 40. .

Then, electromagnets 41L and 41 are placed on the outside of the X-direction fine movement bodies 33L and 33R, close to and facing them.
R is on the outside of the front and rear ends of the XY direction fine movement body 35,
Electromagnets 42F and 42R are fixedly arranged on the substrate 1, respectively, in close opposition to these electromagnets 41
By controlling the amount of current applied to L, 41R, 42F and 42R, the X direction fine movement bodies 33L, 3
The 3R and XY direction fine movement body 35 is finely moved in the X direction and the Y direction in submicron units.

These electromagnets 41L, 41R and 42F, 42
Fine adjustment of the X-direction fine movement bodies 33L, 33R and the XY-direction fine movement body 35 by means of R is carried out at the positive direction end of the Y-axis and the positive direction end of the X-axis shown in FIG. Installed length measuring mirrors 44 and 45
By projecting a laser beam from a laser length measuring machine (not shown) placed at a position facing these, and letting the reflected light enter the laser length measuring machine, interference of the laser beams can be detected. The absolute distance of the mounting table 26 is measured, and based on the measurement result, the electromagnet 41
Highly accurate positioning is performed by controlling the amount of excitation current with the control circuits L, 41R and 42F, 42R.

Plate springs 47a to 47d as elastic coupling bodies are interposed between the XY direction fine movement body 35 and the spacers 29a to 29d of the mounting table 26. As shown in FIG. 8, each of these leaf springs 47a to 47d is formed into a substantially E-shape, with both sides 48 screwed into the spacers 29a to 29d, and the center portion 49 screwed into the XY direction fine movement body 35. It is fixed by. Therefore, the displacement of the XY direction fine movement body 35 in the XY direction is transmitted to the mounting table 26 by the leaf springs 47a to 47d, and the mounting table 26 is urged downward.

Furthermore, as shown in FIGS. 1 and 2, a support piece 51 hanging downward is provided on the lower surface of the mounting table 26.
is fixed, and a permanent magnet 52 is fixed to the tip of this support piece 51. On the other hand, a support piece 53 facing the support piece 51 is installed on the base 1, and a proximity switch 54 such as a Hall element facing the permanent magnet 52 is attached to the upper end of this support piece 53. The origin position of the mounting table 26 in the Z-axis direction is detected by the switch 54 and the permanent magnet 52, and based on this origin detection signal, a control circuit (not shown) for the stepping motor 21 of the linear drive mechanism 20 is activated.
By controlling the rotation of the stepping motor 21, positioning in the Z-axis direction can be performed with high precision.

Next, the operation of the above embodiment will be explained. First, the wafer on which the suction area of the exposed member holding device 27 on the mounting table 26 is placed, the CRT shadow mask
It is set according to the size of the exposed member 102 such as a liquid crystal mask. For example, when suctioning and holding a 22-inch x 28-inch shadow mask SM shown by the solid line in FIG. Chuck body 2 in circular through hole 27e ₀
At the same time, the chuck main body 27f ₁ is fitted into the circular through holes 27e ₁ and 27e _{2 covered} by the shadow mask SM. At this time, when the thickness of the shadow mask SM is thin, the small diameter portion 27g ₂ with a small height is inserted into the circular through holes 27e ₀ , 27e ₁ and 27e _{2 .}
and set so that when the member to be exposed 102 is placed, its exposed surface will be near the exposure reference surface. As for the other circular through holes 27e ₃ and 27e ₄ , there is no need to hold them by suction, so the obturator 2
The cylindrical portion 27o of 7n is fitted and closed.

In this state, the 22 inch x 28 inch shadow mask SM is positioned and loaded onto the chuck bodies 27f ₀ and 27f ₁ using, for example, a loading device (not shown), and when the loading is completed, the 3-way electromagnetic switching valve 27c is Suction means 27
Switch to d side. As a result, each chuck body 2
The suction recess 27k ₁ on the upper surface side of 7f ₀ and 27f ₁ is the through hole 27l, and the suction recess 27k ₁ on the lower surface is the suction hole 27
a ₀ , 27a ₁ and 27a ₂ , the suction passage 27b, and the three-way electromagnetic switching valve 27c to communicate with the air suction means 27d, so that the chuck bodies 27f ₀ and 27f ₁ are placed on the mounting surface of the mounting table 26. At the same time, air is sucked from the suction grooves _27k1 completely covered by the shadow masks SM of each chuck body _27f0 and _27f1 , and the shadow masks SM are vacuum suctioned and held. It is held on the main bodies 27f ₀ and 27f ₁ .

When the shadow mask SM is held in the exposed member holding device 27 in this way, the shadow mask SM
Focus adjustment for SM is performed. This focus adjustment is performed by squeezing pressurized air from the air supply source 111.
2 to the nozzle 110 to activate the air micrometer 115, and in this state to activate the focus adjustment control device 116.

When the focus adjustment control device 116 is activated in this way, the difference value between the focus adjustment target value preset by the target value setting device 116a and the differential pressure detection signal output from the differential pressure converter 113 is set. The deviation signal is supplied to the drive circuit 116b, and the pulse signal output from the drive circuit 116b is directly supplied to the stepping motor 21 of the drive mechanism 20. For this reason,
As shown in FIGS. 4 to 7, when the slope slider 5 is sliding forward, the differential pressure detection signal is smaller than the target value, and the distance between the nozzle 110 and the shadow mask SM is at the reference value. Since it is wider, for example, the stepping motor 21 is rotated in the forward direction. When the stepping motor 21 rotates in the forward direction in this way, this rotational force is transmitted to the slope slider 5 via the ball screw 23 and the ball nut 24, so that the rotation force is transmitted from the slope slider 5 to the guide rails 4L and 4R that constitute the linear guide. retreat along. As the slope slider 5 retreats, the mounting plates 17a to 17d of the slope slider 5 rise, and the mounting table 26 placed thereon via the balls 20 moves upward against the leaf springs 47a to 27d. and move. At this time, the backward movement of the slope slider 5 is ensured by the linear ball bearing rings 7a to 7f that engage with the guide rails 4L and 4R, and the retainer 19 is Since smooth movement is ensured by the large number of balls 20 held by the mounting plates 17a to 17d of the slope slider 5.
The parallelism of the flat surface 18 of the mounting table 26 is not disturbed, and therefore the mounting table 26 is raised without the parallelism of the mounting table 26 also being disturbed. Moreover, the frictional resistance of the slope slider 5 is small, and the slope slider 5 bears only the load of the mounting table 26, and the X-direction fine movement body 33
Since it does not bear the load of L, 33R and the XY direction fine movement body 35, the rotational torque of the stepping motor 21 that drives them can be small.
Furthermore, since the slope slider 5 itself is formed into a rectangular frame shape and has an extremely small inertial mass, the inertial force when moving the mounting table 26 at high speed in the Z-axis direction by the stepping motor 21 can be reduced. Accurate positioning can be performed.

In this way, by raising the mounting table 26, the distance between the shadow mask SM and the nozzle 110 narrows, and when this becomes equal to the reference value, the raising of the mounting table 26 is stopped and focus adjustment is completed.

Conversely, when the value of the differential pressure detection signal is larger than the target value, the control device 116 controls the stepping motor 2.
1 is output in the reverse direction, the stepping motor 21 is reversed, the slope slider 5 is advanced, the mounting table 26 is lowered and spread to the distance between the shadow mask SM and the nozzle 110, and this is moved to the reference position. When reached, its descent is stopped and focus adjustment is completed.

To adjust the position of the shadow mask SM in the YX direction after completing this focus adjustment, if the moving distance of the shadow mask SM in the XY direction is large, the coarse movement table 2 must be moved at high speed by the drive mechanism. Then, the excitation coils of the electromagnets 41L, 41R and 42F, 42R are energized to move the XY direction fine movement body 35 in the XY direction, and the displacement of the XY direction fine movement body 35 is controlled by the leaf spring 4.
By transmitting the signal to the mounting table 26 via 7a to 47d, the mounting table 26 is slightly moved in the XY direction. The absolute value of this slight movement of the mounting table 26 is accurately measured using a laser length measuring machine (not shown), and the amount of current applied to the excitation coils of the electromagnets 41L, 41R and 42F, 42R is controlled based on the length measurement results. By doing so, positioning on the submicron order can be performed.

In this way, by using an electromagnet as the drive mechanism for making small movements in the XY directions, there is no vibration that occurs when using a motor.
When the mounting table 26 is moved in the X and Y directions, it is possible to prevent displacement in the Z-axis direction.

Furthermore, when the coarse movement table 2 is moved at high speed by the drive mechanism, the inertia of the mounting table 26, the XY direction fine movement bodies 33L, 33R, the XY direction fine movement body 35, etc. may cause them to vibrate within the XY plane. However, since the high-viscosity damping material 39 is interposed between the XY direction fine movement body 35 and the cylindrical body 3 fixed to the base 1, a large damping effect can be exerted. In this case, the vibration damping part 40 is formed at the center of the compound moving table, and the opposing area between the XY direction fine movement body 35 and the cylindrical body 3 can be widened.
without increasing the size of the entire moving table.
A great vibration damping effect can be achieved.

When the exposure process for the shadow mask SM is completed and the shadow mask SM is to be replaced with a new one, the three-way electromagnetic switching valve 27c is switched to the atmosphere side, so that the shadow mask SM is brought into a vacuum suction state by the exposed member holding device 27. After releasing the exposed shadow mask SM, for example, use an unloading device (not shown) to unload the chuck body 27f.
Take it out from above and place a new shadow mask SM on the chuck body 27f. At this time, if the size of the shadow mask SM is changed to, for example, 16 inches x 20 inches, as indicated by the _two -dot chain line in FIG _. Therefore, the chuck main body 27f ₁ is removed and the cylindrical portion 27n of the obturator 27m is fitted into the circular through hole 27e ₂ of the guide plate 27e to close it, thereby fitting into the circular through hole 27e ₁ . Shadow mask 27f ₁ is 16 inches x 20 inches.
It will face the outer peripheral edge of the SM. Change the suction area in this way and then apply the shadow mask.
Place the SM on the chuck bodies 27f ₀ and 27f ₁ ,
By switching the three-way electromagnetic switching valve 27c to the air suction means 27d side in the same manner as described above, the shadow mask SM can be vacuum suctioned.

Further, when the exposed member 102 to be held by suction is thick, as shown in FIG. 13, the circular through holes 27e ₀ and 27e ₁ to 27
The fitting direction of the chuck bodies 27f ₀ and 27f ₁ to e ₄ is on the opposite side, that is, the small diameter portion 27g ₁ side is the circular through hole 27e ₀
and 27e ₁ to 27e ₄ , the upper surface of the guide plate 27e and the chuck body 27f ₀
The distance t to the upper surface of the member to be exposed 102 placed on 27f ₁ can be made to match that of the member to be exposed 102 which is thin, and the exposure reference plane does not change, so it is easy to adjust the focus when adjusting the focus. It is possible to perform quick focus adjustment by reducing the amount of movement.

In addition, in the above embodiment, the member to be exposed 10
2 is 22 inches x 28 inches and 16 inches x 20 inches, but the circular through holes 27e ₁ to 27e ₄ of the guide plate can be selected as appropriate depending on the size of the member to be exposed. and attach the chuck body 27f ₁ or obturator 27m to these
By fitting them together, it is possible to suction and hold the exposed members in the same manner as the two sizes of exposed members described above.

Further, in the above embodiment, the chuck body 2
Although the case where 7f is circular when viewed from the plane has been described, the present invention is not limited to this, and may be formed into a rectangular shape, an oval shape, or the like.

Furthermore, in the above embodiment, the case where the outer diameter of the small diameter portions 27g ₁ and 27g 2 of the chuck bodies _{27f 0 and} 27f ₁ is made equal to the inner diameter of the circular through holes 27e ₀ and 27e ₁ to 27e ₄ of the guide plate 27e will be described. However, the present invention is not limited to this, and if airtightness can be ensured between the lower surface of the large diameter portion 27h and the upper surface of the guide plate 27e, the outer diameters of the small diameter portions 27g ₁ and 27g ₂ can be made small. As shown, when reducing the outer diameter of the small diameter portions 27g ₁ and 27g ₂ ,
Outer diameter of small diameter portions 27g ₁ and 27g ₂ and through holes 27e ₁ to 2
By selecting a large outer diameter of the large diameter _portion 27h according to the difference from the inner diameter of the guide plate 27
It becomes possible to slide the chuck main body 27f ₁ in any direction with respect to the circular through holes 27e ₁ to 27e ₄ of e, and the suction area can be adjusted more finely.

Furthermore, in the above embodiment, a case has been described in which the lower surfaces of the large diameter portions 27h of the chuck bodies 27f ₀ and 27f ₁ come into contact with the upper surface of the guide plate 27e, but the invention is not limited to this.
As shown in FIG. 14, the through holes 27e ₀ and 27e ₁ to 27e ₄ of the guide plate 27e are formed in a stepped shape having a small diameter portion 27e _S , a medium diameter portion 27e _M , and a large diameter portion 27e _L. The height H ₂ of the diameter portion 27e _M is selected in relation to the heights _{h 1 and h 2 of the small diameter portions 27g 1 and} 27g ₂ of the chuck bodies 27f ₀ and 27f ₁ so that h ₂ ≦H ₂ <h ₁ . Even in this case, the same effects as in the above embodiment can be obtained.

Furthermore, in the above embodiment, the case where the suction recesses 27k ₁ and 27k ₂ are formed on the upper and lower surfaces of the chuck bodies 27f ₀ and 27f 1 has been described, but _the present invention is not limited to this. As shown, the chuck bodies 27f ₀ and 27f ₁ may be formed hollow, and a plurality of suction holes 27r communicating between the hollow portion and the outside and suction grooves 27s communicating therewith may be formed on the upper and lower surfaces thereof. good.

Furthermore, in the above embodiment, the chuck body 27f becomes unused depending on the size of the exposed member 102.
Although the case where the obturator 27m is provided to close the through hole of the guide plate 27e in the case where the obturator 27m is provided is not limited to _{this, as shown in FIG .} Small diameter shaft part 27t
The suction holes 27a ₁ to 27a ₄ may be closed by a stopper 27w having a large-diameter shaft portion 27u having a larger diameter.

Furthermore, the shape of the exposed member 102 is not limited to a rectangular shape, but any arbitrary shape such as a square or a substantially circular shape can be attracted and held.

Further, in the above embodiment, a case has been described in which the guide plate 27e is placed on the mounting table 26, but the guide plate 27e may be formed integrally with the mounting table 26.

Furthermore, the XYZ stage on which the mounting table 26 is placed is not limited to the above configuration,
Any other configuration of XYZ stage may be applied.

Further, in the above embodiment, the case where the base 1 is placed on the coarse movement table 2 which can be moved at high speed has been described, but this invention is not limited to this, and can also be applied when the base 1 is fixedly arranged on a fixed part. can be applied.

Furthermore, in the above embodiment, the case where this invention is applied to a reduction projection exposure apparatus has been explained, but the invention is not limited to this, and it is of course possible to apply this invention to other exposure apparatuses. be.

[Effect of idea]

As explained above, according to this invention, a plurality of suction holes are formed on the mounting surface side of the mounting table so that the chuck that suction-holds the exposed member such as a wafer or a shadow mask can be placed within the desired suction area. A chuck body is fitted into the suction hole in which suction portions communicating with each other are formed on both upper and lower surfaces, and step portions with different heights are formed at upper and lower positions on the outer circumferential surface, and an obturator is inserted into the suction hole outside the suction area. Since the chucks are designed to fit together, it is possible to select an adsorption area of any size according to the exposed member, and even if the exposed member is of a different size, the chuck itself can be replaced. By reversing the surface that fits into the suction hole of the chuck body, the top surface of the loading table and the chuck body are The distance to the top surface can be changed in two steps, making it possible to approximate the exposure surface of objects to be exposed with different thicknesses to the reference exposure surface. Effects such as focus adjustment can be obtained.

[Brief explanation of drawings]

Fig. 1 is a plan view showing an embodiment of this invention, Figs. 2 and 3 are a front view and a right side view of Fig. 1,
Figure 4 is a sectional view taken along the - line in Figure 1, Figures 5 and 6.
The figure and FIG. 7 are respectively sectional views taken along the - line in FIG.
- line sectional view and - line sectional view, Figure 8 is the first
Fig. 9 is an enlarged sectional view showing the relationship between the linear ball bearing ring and the guide rail, Fig. 10 is an enlarged sectional view of the ball retainer,
1A and 1B are enlarged sectional views of the chuck body constituting the exposed member holding device, FIG. 12 is an enlarged sectional view of the obturator, FIG. 13 is an enlarged sectional view of the chuck body in a reversed state, and FIG. FIG. 14 is a sectional view showing another example of the guide plate, FIGS. 15 and 16 are enlarged plan views and sectional views showing another example of the chuck body, and FIG. 17 is a sectional view showing another example of the obturator. The sectional view shown in FIG. 18 is a schematic configuration diagram showing an example of a reduction projection exposure apparatus to which this invention can be applied. In the figure, 1 is the base, 2 is the coarse movement table, 4L, 4
R is a guide rail, 5 is a slope slider, 7a to 7f
21 is a linear ball bearing, 21 is a linear drive mechanism, 22 is a stepping motor, 24 is a ball screw, 25 is a ball nut, 26 is a mounting table, 27 is an exposed member holding device, 27a ₀ , 27a ₁ to 27a ₂ are suction holes , 27b is a communication path, 27c is a three-way electromagnetic switching valve, 27d is an air suction means, 27e is a guide plate, 27e ₀ , 27e ₁ to 27e ₄ are circular through holes, 27
f ₀ , 27f ₁ is the chuck body, 27i is the stepped part, 27
k ₁ and 27k ₂ are suction recesses, 27l is a through hole, 27m
is an obturator, 27w is a stopper, 35 is an XY direction fine movement body, 41L, 41R, 42F, 42R are electromagnets,
47a to 47d are leaf springs.

Claims (1)

[Claims for Utility Model Registration] (1) A chuck connected to a gas suction means for sucking and holding a member to be exposed such as a wafer is disposed on the mounting table, and a predetermined pattern is formed on the exposed surface of the member to be exposed. In an exposure apparatus that performs exposure, a plurality of suction holes communicating with the gas suction means are bored at predetermined intervals on the placement surface side of the placement table,
The chuck has a chuck main body that has a guide recess that communicates with the suction hole, steps that have different heights at upper and lower positions on the outer peripheral edge that fits into the guide recess, and suction parts that communicate with each other on the upper and lower surfaces. An exposed member holding device in an exposure apparatus, comprising: (2) The exposed member holding device in the exposure apparatus according to claim 1, wherein the chuck is provided with a closing device for closing the suction hole.