JPH0519972Y2 - - Google Patents
Info
- Publication number
- JPH0519972Y2 JPH0519972Y2 JP8458087U JP8458087U JPH0519972Y2 JP H0519972 Y2 JPH0519972 Y2 JP H0519972Y2 JP 8458087 U JP8458087 U JP 8458087U JP 8458087 U JP8458087 U JP 8458087U JP H0519972 Y2 JPH0519972 Y2 JP H0519972Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive ink
- flexible circuit
- aluminum vapor
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007646 gravure printing Methods 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920006267 polyester film Polymers 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229960002050 hydrofluoric acid Drugs 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、導電インキ層、アルミ蒸着層、基材
層の三層構成をとつている可撓性回路基板に係
る。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a flexible circuit board having a three-layer structure including a conductive ink layer, an aluminum vapor deposition layer, and a base material layer.
（従来の技術）
本考案に一番近いと思われる従来例は、特許公
開昭和59年第106175号公報である。そこに述べら
れている物の内、本考案に一番近い構成の物は、
ポリエステルフイルムよりなる基材層上にアルミ
蒸着層を設け、この上より導電インキ層であるカ
ーボンペースト層をスクリーン印刷によりパター
ン状に設け、更にエツチングする事によりアルミ
蒸着層をパターン化した物である。(Prior Art) The conventional example that is considered to be closest to the present invention is Patent Publication No. 106175 of 1982. Of the things described there, the one with the structure closest to the present invention is:
An aluminum vapor-deposited layer is provided on a base material layer made of polyester film, a carbon paste layer, which is a conductive ink layer, is formed in a pattern by screen printing on top of this, and the aluminum vapor-deposited layer is patterned by further etching. .
（考案が解決しようとする問題点）
然しながら、この様な可撓性回路基板は、導電
インキ層の材料がカーボンペーストであつた為
に、スクリーン印刷により導電インキ層を形成し
なければ成らなかつた。しかし、この方法をとる
限り、巻き取り方式の様に、流れ作業で順次導電
インキ層を設ける事が困難で、特に可撓性回路基
板の場合には、事実上困難である。具体的には、
ポリエステルフイルムとアルミ蒸着層が何れも巻
き取り状で形成される為、その工程終了時に枚葉
に変更し、スクリーン印刷及びエツチングする必
要がある。従つて、量産性が悪く、又、其に従つ
て層形成費用も高価と成つていた。(Problem that the invention aims to solve) However, since the material of the conductive ink layer was carbon paste, such flexible circuit boards had to be formed by screen printing. . However, as long as this method is used, it is difficult to sequentially apply conductive ink layers in an assembly line, as in the case of the winding method, and it is practically difficult, especially in the case of flexible circuit boards. in particular,
Since both the polyester film and the aluminum vapor deposition layer are formed in a rolled form, it is necessary to convert them into sheets at the end of the process, and then perform screen printing and etching. Therefore, mass production is poor, and layer formation costs are accordingly high.
（問題を解決する為の手段）
上述の問題点を解決する為、導電インキ層が、
防蝕性グラビアインキに粒径10μm以下のニツケ
ル粉が５乃至30重量％分散しいてる膜厚5μm以下
の層である様に、可撓性回路基板をする。(Means for solving the problem) In order to solve the above problems, a conductive ink layer is
A flexible circuit board is formed in a layer with a thickness of 5 μm or less in which 5 to 30% by weight of nickel powder with a particle size of 10 μm or less is dispersed in corrosion-resistant gravure ink.
尚、その内でも特に、防蝕性グラビアインキが
塩化ビニル樹脂からなつている前項記載の可撓性
回路基板は、特に効果が優れている。 Among these, the flexible circuit board described in the previous section, in which the anticorrosive gravure ink is made of vinyl chloride resin, is particularly effective.
なお、この様なものの内、特にニツケル粉が10
乃至20重量％のものは、性能がいい。 Of these, nickel powder is particularly
Those with a content of 20 to 20% by weight have good performance.
また、ニツケル粉の粒径が３乃至5μmのもの
は、性能が良い。 Also, nickel powder with a particle size of 3 to 5 μm has good performance.
このうち可撓性回路基板は、下から順に基材
層、アルミ蒸着層、導電インキ層という構成を採
つているものを指す。 Among these, flexible circuit boards refer to those that have a structure consisting of a base material layer, an aluminum vapor deposition layer, and a conductive ink layer in order from the bottom.
なお、ここで言うところの防蝕性グラビアイン
キとは、アルミ腐食の際に、腐食が全くされない
か、若しくは腐食されても少しでもこの防蝕性グ
ラビアインキが残存する性質がある物であれば、
導電性が有ると無いとに関わらず、いかなる材質
の物でも良い。しかし一般に導電性の有る防蝕性
グラビアインキは、条件が厳しかつたり、高価で
あつたりする為、導電性の無い材質が使い易い。 Furthermore, the term "corrosion-resistant gravure ink" as used herein refers to a material that does not corrode at all when aluminum is corroded, or if it has the property that even a little bit of this corrosion-resistant gravure ink remains even if it is corroded.
It may be made of any material, whether or not it has conductivity. However, since corrosion-resistant gravure inks that are electrically conductive generally require strict conditions and are expensive, it is easier to use materials that are not electrically conductive.
また、ここで言うところのアルミ蒸着層は、普
通の蒸着で作成されたものの他、スパツタ蒸着で
なした層でも良い。 Furthermore, the aluminum evaporation layer referred to here may be a layer formed by sputter evaporation, as well as one formed by ordinary evaporation.
また、ここで言うところの基材層は、撓む事の
出来る材料で、しかもアルミ蒸着特性の在るもの
であれば、いかなる物でも良い。 Furthermore, the base material layer referred to here may be any material as long as it is flexible and has aluminum vapor deposition properties.
なお、上に述べた条件では、含まれるニツケル
が粒径10μmの、インキの厚みが5μm以下という
ことも含まれる。この場合は、ニツケルの粒は等
方に同じ粒径ではなく、一般的に偏平した形状を
有する。 Note that the above-mentioned conditions also include that the included nickel has a particle size of 10 μm and the ink thickness is 5 μm or less. In this case, the nickel grains are not isotropically of the same grain size, but generally have a flattened shape.
（作用）
上述の様に導電インキ層が、防蝕性グラビアイ
ンキに粒径10μm以下のニツケル粉が５乃至３重
量％分散しいてる膜厚5μm以下の層である為、導
電インキ層を製造する場合、グラビア印刷法で製
造する事が可能に成つた。(Function) As mentioned above, when manufacturing a conductive ink layer, since the conductive ink layer is a layer with a thickness of 5 μm or less in which 5 to 3% by weight of nickel powder with a particle size of 10 μm or less is dispersed in corrosion-resistant gravure ink. It became possible to manufacture it using the gravure printing method.
従つて、サイズの大きな物まで巻き取り方式で
製造する事が可能になり、基材層とアルミ蒸着層
と統一した製造方法が可能になつた。 Therefore, it has become possible to manufacture even large objects by the winding method, and it has become possible to use a unified manufacturing method for the base material layer and the aluminum vapor deposited layer.
（実施例）
本考案の実施例を図面を用いながら詳細に説明
を行う。(Example) An example of the present invention will be described in detail using the drawings.
第１図は、本考案の一実施例を示す平面図であ
る。 FIG. 1 is a plan view showing an embodiment of the present invention.
基板として、25μm厚ポリエステルフイルム１
１を用いる。その上よりアルミニウムを500Å〜
700Å蒸着し、アルミ蒸着層１２を設け、その上
より導電インキ層（東洋インキ(株)製：LpVM導
電インキ〔顔料10％、樹脂｛塩化酢酸ビニル｝20
％、溶剤70％〕にニツケル粉〔インキに対し20重
量％〕と溶剤〔インキに対し30重量％〕を加えた
もの〕１３を、70ラインで版深度30μmのヘリオ
版でグラビア印刷した。なお、この後で５％弗素
酸で、上に導電インキ層の無いアルミ蒸着層を、
腐食する。 As a substrate, 25 μm thick polyester film 1
1 is used. On top of that, aluminum is applied to 500Å~
A conductive ink layer (manufactured by Toyo Ink Co., Ltd.: LpVM conductive ink [pigment 10%, resin {vinyl chloride acetate} 20
%, solvent 70%] with nickel powder [20% by weight relative to the ink] and solvent [30% by weight relative to the ink]]13 was gravure printed using a Helio plate with a plate depth of 30 μm in 70 lines. In addition, after this, an aluminum vapor deposition layer without a conductive ink layer was coated with 5% fluoric acid.
Corrode.
尚、この実施例では、アルミ蒸着層の腐食に５
％弗素酸を用いた為、インキとして塩化ビニル樹
脂が適切であるが、腐食液が変われば、適性イン
キも、当然変化する事になる。 In addition, in this example, the corrosion of the aluminum vapor deposited layer was
Since % fluoric acid was used, vinyl chloride resin is appropriate as the ink, but if the corrosive liquid changes, the appropriate ink will naturally change as well.
（考案の効果）
可撓性回路基板をこの様な構成にする事によ
り、全ての製造工程を、巻き取りのままで製造す
ることが可能になり、又、製造速度の他、製造コ
ストでも、安価な物にする事が可能になつた。(Effects of the invention) By configuring the flexible circuit board in this way, it becomes possible to perform all the manufacturing processes as it is rolled up, and also reduces the manufacturing speed and manufacturing cost. It became possible to make it cheaper.
第１図は、本考案の一実施例を示す断面図であ
る。
１１……ポリエステルフイルム、１２……アル
ミ蒸着層、１３……導電インキ層。
FIG. 1 is a sectional view showing an embodiment of the present invention. 11... Polyester film, 12... Aluminum vapor deposited layer, 13... Conductive ink layer.
Claims (1)
キ層を順次積層してなる三層構成の可撓性回路
基板に於いて、前記導電インキ層が、防蝕性グ
ラビアインキに粒径10μm以下のニツケル粉が
５乃至30重量％分散している膜厚5μm以下の層
であると共に、前記導電インキ層をグラビア印
刷法によつて回路パターン状に形成後、前記導
電インキ層の無い部分のアルミ蒸着層を除去し
て回路パターンを形成している事を特徴とする
可撓性回路基板。 (2) 防蝕性グラビアインキが塩化ビニル樹脂から
なつている事を特徴とする実用新案登録請求の
範囲第１項記載の可撓性回路基板。[Claims for Utility Model Registration] (1) In a flexible circuit board having a three-layer structure in which an aluminum vapor-deposited layer and a conductive ink layer are successively laminated on a flexible base material layer, said conductive ink layer is a layer with a thickness of 5 μm or less in which 5 to 30% by weight of nickel powder with a particle size of 10 μm or less is dispersed in corrosion-resistant gravure ink, and the conductive ink layer is formed into a circuit pattern by a gravure printing method. A flexible circuit board characterized in that a circuit pattern is formed by removing the aluminum vapor deposition layer in the portion where the conductive ink layer is not present. (2) The flexible circuit board according to claim 1, wherein the corrosion-resistant gravure ink is made of vinyl chloride resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8458087U JPH0519972Y2 (en) | 1987-05-30 | 1987-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8458087U JPH0519972Y2 (en) | 1987-05-30 | 1987-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63193876U JPS63193876U (en) | 1988-12-14 |
| JPH0519972Y2 true JPH0519972Y2 (en) | 1993-05-25 |
Family
ID=30939210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8458087U Expired - Lifetime JPH0519972Y2 (en) | 1987-05-30 | 1987-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519972Y2 (en) |
-
1987
- 1987-05-30 JP JP8458087U patent/JPH0519972Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63193876U (en) | 1988-12-14 |
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