JPH05200519A - Method for controlling temperature of die - Google Patents

Method for controlling temperature of die

Info

Publication number
JPH05200519A
JPH05200519A JP3454592A JP3454592A JPH05200519A JP H05200519 A JPH05200519 A JP H05200519A JP 3454592 A JP3454592 A JP 3454592A JP 3454592 A JP3454592 A JP 3454592A JP H05200519 A JPH05200519 A JP H05200519A
Authority
JP
Japan
Prior art keywords
temp
mold
signal
sensor
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3454592A
Other languages
Japanese (ja)
Inventor
Masatoshi Watanuki
雅敏 綿貫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAMAMATSU HIITO TEC KK
Original Assignee
HAMAMATSU HIITO TEC KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAMAMATSU HIITO TEC KK filed Critical HAMAMATSU HIITO TEC KK
Priority to JP3454592A priority Critical patent/JPH05200519A/en
Publication of JPH05200519A publication Critical patent/JPH05200519A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To provide a formed product having high quality by inputting the detected value of die temp. to a CPU as a digital signal, executing a prescribed calculation, transmitting an alarm signal, operating a heating device and a cooling device and controlling the die temp. to a prescribed temp. CONSTITUTION:To an interface 24, the detected value of a temp. sensor 9 for detecting the die 1 temp. is inputted as the digital signal and further, the detected values of a flow rate meter 11, water pressure sensor 12 and water temp. sensor 13 for detecting the flow rate, water pressure and temp. of the cooling water flowing in a supplying pipe 8 are inputted as the digital signals. Basic control values are previously stored into a memory 23 and the prescribed calculations are executed according to the signals of the temp. sensor 9, flow rate meter 11, water pressure sensor 12 and water temp. sensor 13 by the CPU 22, and an on-off signal to an electrical heater 6a and solenoid valves 10a, 10b or an alarm signal to an alarm 25 are transmitted from the interface 24. By this method, the die is controlled to the prescribed temp. and the formed product having high quality can be provided.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金型の温度を所定値に
保持する金型の温度制御装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold temperature control device for maintaining a mold temperature at a predetermined value.

【0002】[0002]

【従来の技術】従来は、まず鋳造開始前に金型を次の如
くして予熱する。即ち常温の金型のキャビティ内に溶融
もしくは加熱された高温の被成形物質を注入、いわゆる
捨て打ちするか、あるいはバーナ、電熱ヒータ等の予熱
器具を使用して金型を予熱する。次に鋳造中には金型内
に冷却水を流通させて該金型を冷却するようにしてい
た。
2. Description of the Related Art Conventionally, a mold is preheated as follows before casting is started. That is, the molten or heated high-temperature molding target material is injected into the cavity of the mold at room temperature, so-called throwing out, or the mold is preheated by using a preheating device such as a burner or an electric heater. Next, during casting, cooling water was circulated in the mold to cool the mold.

【発明が解決しようとする課題】[Problems to be Solved by the Invention]

【0003】上記従来のものは、金型の温度を検知しな
いで該金型を予熱および冷却していたので、金型の温度
が不安定となり、予熱時にキャビティ面が熱損傷した
り、鋳造時に成形品の精度にバラツキが発生したりする
欠点があった。本発明は上記欠点を解消した新規な金型
の温度制御装置を得ることを目的とする。
In the above-mentioned conventional ones, the mold is preheated and cooled without detecting the temperature of the mold, so that the temperature of the mold becomes unstable, the cavity surface is thermally damaged during preheating, and the mold is cast. There was a defect that the precision of the molded product varied. It is an object of the present invention to obtain a novel mold temperature control device that solves the above drawbacks.

【0004】[0004]

【課題を解決するための手段】本発明は上記目的を達成
するために、以下の如く構成したものである。即ち、図
1に示すように、金型1を加熱する加熱装置6および該
金型1を冷却する冷却装置7を設け、金型1の温度を検
出する温度検出手段15と、温度検出手段15の出力が
所定値未満のときに第1信号17を、前記出力が所定値
以上のときに第2信号18を発する判定手段16と、判
定手段16の第1信号17を入力して前記加熱装置6に
加熱指令を発する加熱指令手段19と、判定手段16の
第2信号18を入力して前記冷却装置7に冷却指令を発
する冷却指令手段20とを設ける構成にしたものであ
る。
In order to achieve the above object, the present invention is configured as follows. That is, as shown in FIG. 1, a heating device 6 for heating the die 1 and a cooling device 7 for cooling the die 1 are provided, and a temperature detecting means 15 for detecting the temperature of the die 1 and a temperature detecting means 15 are provided. When the output is less than a predetermined value, a first signal 17 is output, and when the output is a predetermined value or more, a second signal 18 is output. 6, a heating instruction means 19 for issuing a heating instruction, and a cooling instruction means 20 for inputting the second signal 18 of the determination means 16 to issue a cooling instruction to the cooling device 7 are provided.

【0005】[0005]

【作用】本発明は上記構成にしたものであるから、金型
1の温度低下により温度検出手段15の出力が所定値未
満のときには、判定手段16が第1信号17を発し、加
熱指令手段19が上記第1信号17を入力して加熱装置
6に加熱指令を発し、該加熱装置6が作動して上記金型
1を加熱する。また、上記金型1の温度上昇により温度
検出手段15の出力が所定値以上になると、判定手段1
6が第2信号18を発し、冷却指令手段20が上記第2
信号18を入力して冷却装置7に冷却指令を発し、該冷
却装置7が作動して上記金型1を冷却する。これにより
上記金型1は所定の温度に保持されることになる。
Since the present invention is configured as described above, when the output of the temperature detecting means 15 is less than the predetermined value due to the temperature drop of the mold 1, the judging means 16 issues the first signal 17 and the heating command means 19. Inputs the first signal 17 to issue a heating command to the heating device 6, and the heating device 6 operates to heat the mold 1. Further, when the output of the temperature detecting means 15 exceeds a predetermined value due to the temperature rise of the mold 1, the judging means 1
6 issues a second signal 18, and the cooling command means 20 causes the second signal
A signal 18 is input to issue a cooling command to the cooling device 7, and the cooling device 7 operates to cool the mold 1. As a result, the mold 1 is maintained at a predetermined temperature.

【0006】[0006]

【実施例】以下本発明の実施例を図面に基いて説明す
る。図面において、図2は本発明の実施例を示すブロッ
ク図、図3はそのフローチャート、図4は金型の温度特
性図である。図2において、1は上下割形の金型であ
り、ベースに固定される固定金型2と該固定金型2に対
して上下方向に着脱される可動金型3とを有し、固定金
型2および可動金型3の合い面部にキャビティ4を形成
し、可動金型3側にキャビティ4に通ずる注湯口5を形
成する。
Embodiments of the present invention will now be described with reference to the drawings. 2 is a block diagram showing an embodiment of the present invention, FIG. 3 is a flowchart thereof, and FIG. 4 is a temperature characteristic diagram of a mold. In FIG. 2, reference numeral 1 denotes a vertically split mold, which has a fixed mold 2 fixed to a base and a movable mold 3 vertically attached to and detached from the fixed mold 2. A cavity 4 is formed on the mating surface portion of the mold 2 and the movable mold 3, and a pouring port 5 communicating with the cavity 4 is formed on the movable mold 3 side.

【0007】上記金型1に電熱式の加熱装置6および水
例式の冷却装置7を設ける。加熱装置6は固定金型2の
下部に電熱ヒータ6aを埋め込んでなり、また冷却装置
7は固定金型2の下部および可動金型3の上部に流路7
a,7bを左右方向に貫通形成し、各流路7a,7bの
右端に冷却水を供給する供給管8の分岐管8a,8bを
着脱可能に接続してなる。上記固定金型2および可動金
型3内には複数個の温度センサ(熱伝対)9を取付け、
また上記分岐管8a,8bは電磁弁10a,10bによ
って開閉され、その上流側の供給管8に流量計11、水
圧センサ12および水温センサ13を取り付ける。
The mold 1 is provided with an electric heating type heating device 6 and a water type cooling device 7. The heating device 6 has an electric heater 6a embedded in the lower part of the fixed mold 2, and the cooling device 7 has a flow path 7 in the lower part of the fixed mold 2 and in the upper part of the movable mold 3.
A and 7b are formed so as to penetrate in the left-right direction, and branch pipes 8a and 8b of a supply pipe 8 for supplying cooling water are detachably connected to the right ends of the flow paths 7a and 7b. A plurality of temperature sensors (thermocouples) 9 are mounted in the fixed mold 2 and the movable mold 3,
The branch pipes 8a and 8b are opened and closed by solenoid valves 10a and 10b, and a flow meter 11, a water pressure sensor 12 and a water temperature sensor 13 are attached to the supply pipe 8 on the upstream side thereof.

【0008】上記電熱ヒータ6aおよび電磁弁10a,
10bは、マイクロコンピュータ21によって制御され
る。このマイクロコンピュータ21は主にCPU(演算
部)22と、メモリ(記憶部)23と、インターフェー
ス(入出力信号処理部)24とから構成されている。上
記インターフェース24には、金型1の温度を検出する
温度センサ9の検出値がデジタル信号として入力され、
また供給管8内を流通する冷却水の流量、水圧、温度を
検出する流量計11、水圧センサ12、水温センサ13
の検出値がデジタル信号として入力される。そして、上
記メモリ23に基本制御値を予め記憶させておき、CP
U22で温度センサ9の信号、流量計11、水圧センサ
12、水温センサ13の信号に応じて所定の演算を行な
い、インターフェース24から電熱ヒータ6aおよび電
磁弁10a,10bにオン・オフ信号、あるいは警報器
25に警報信号を送出する。
The electric heater 6a and the solenoid valve 10a,
10 b is controlled by the microcomputer 21. The microcomputer 21 is mainly composed of a CPU (arithmetic unit) 22, a memory (storage unit) 23, and an interface (input / output signal processing unit) 24. The detection value of the temperature sensor 9 that detects the temperature of the mold 1 is input to the interface 24 as a digital signal,
A flow meter 11, a water pressure sensor 12, and a water temperature sensor 13 that detect the flow rate, water pressure, and temperature of the cooling water flowing through the supply pipe 8.
The detected value of is input as a digital signal. Then, the basic control value is stored in advance in the memory 23, and the CP
U22 performs a predetermined calculation according to the signal from the temperature sensor 9, the flow meter 11, the water pressure sensor 12, and the water temperature sensor 13, and outputs an ON / OFF signal or an alarm from the interface 24 to the electric heater 6a and the solenoid valves 10a and 10b. An alarm signal is sent to the container 25.

【0009】上記制御を実行するフローチャートを図3
に示す。なお、図3中のP1〜P15はフローチャート
の各ステップを示す。電源スイッチがオン作動されると
P1でスタートし、P2,P3で水圧センサ12、水温
センサ13の信号を入力して供給管8内の冷却水の水圧
および水温が正常か否かを判断する。正常の場合にはP
4で温度センサ9により金型1の温度を入力し、P5で
金型1の温度が280℃以下か否かを判断する。280
℃以下の場合にはP6,P7で電磁弁10a,10bが
閉、ヒータ6aのスイッチがオンされ、P8で金型1が
300℃になるまで金型1が加熱(予熱)され、またP
5で金型1の温度が280℃以上の場合にはP8に進行
する。
FIG. 3 is a flowchart for executing the above control.
Shown in. Note that P1 to P15 in FIG. 3 indicate steps of the flowchart. When the power switch is turned on, it starts at P1, and at P2 and P3, the signals of the water pressure sensor 12 and the water temperature sensor 13 are input to judge whether the water pressure and the water temperature of the cooling water in the supply pipe 8 are normal. If normal, P
In 4, the temperature of the mold 1 is input by the temperature sensor 9, and in P5, it is determined whether the temperature of the mold 1 is 280 ° C. or lower. 280
When the temperature is lower than ℃, the solenoid valves 10a and 10b are closed by P6 and P7, the switch of the heater 6a is turned on, and the mold 1 is heated (preheated) until the mold 1 reaches 300 ° C. at P8.
When the temperature of the mold 1 is 280 ° C. or higher in 5, the process proceeds to P8.

【0010】上記金型1が予熱された時点でキャビティ
4内に溶融された被成形物質、本例ではアルミニューム
合金を注入する。この被成形物質の注入により金型1が
300℃に加熱されると、P9でヒータ6aのスイッチ
がオフされるとともにP10で電磁弁10a,10bが
開かれ、冷却水が供給管8、分岐管8a,8bを介して
流路7a,7b内を流通して金型1を冷却し、P11で
流量計11の信号を入力して上記供給管8内の流通状態
が正常か否かを判断し、正常の場合にはP12で電源ス
イッチのオン・オフを確認する。電源スイッチがオンの
場合にはP2にジャンプして制御プログラムを続行し、
これにより金型1を図4に示すように約280℃〜30
0℃に保持する。また電源スイッチがオフの場合にはP
13で電磁弁10a,10bを閉じた後、P14で制御
プログラムを終了する。またP2,P3、P11で異常
と判断された際にはP15で警報を発する。
When the mold 1 is preheated, the material to be molded, which is a molten material, is injected into the cavity 4 in this example. When the mold 1 is heated to 300 ° C. by the injection of the material to be molded, the heater 6a is turned off at P9, the solenoid valves 10a and 10b are opened at P10, and the cooling water is supplied to the supply pipe 8 and the branch pipe. The mold 1 is cooled by flowing through the flow paths 7a and 7b through 8a and 8b, and the signal of the flow meter 11 is input at P11 to determine whether the flow condition inside the supply pipe 8 is normal. If it is normal, check on / off of the power switch on P12. If the power switch is on, jump to P2 to continue the control program,
As a result, the mold 1 is heated to about 280 ° C. to 30 ° C. as shown in FIG.
Hold at 0 ° C. When the power switch is off, P
After closing the solenoid valves 10a and 10b at 13, the control program ends at P14. When it is determined that there is an abnormality in P2, P3 and P11, an alarm is issued in P15.

【0011】[0011]

【発明の効果】以上の説明から明らかな如く、本発明
は、金型の温度を検出しながら加熱装置および冷却装置
を作動させ、該金型を所定の温度に制御するようにした
ので、高品質の成形品を得ることができる効果を奏す
る。
As is apparent from the above description, according to the present invention, the heating device and the cooling device are operated while detecting the temperature of the mold to control the mold at a predetermined temperature. It is possible to obtain a quality molded product.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明を示す全体構成図である。FIG. 1 is an overall configuration diagram showing the present invention.

【図2】本発明の実施例を示すブロック図である。FIG. 2 is a block diagram showing an embodiment of the present invention.

【図3】加熱装置および冷却装置を制御するためのソフ
トウエアを説明するフローチャートである。
FIG. 3 is a flowchart illustrating software for controlling a heating device and a cooling device.

【図4】加熱装置および冷却装置を用いて温度制御され
る金型の温度特性図である。
FIG. 4 is a temperature characteristic diagram of a mold whose temperature is controlled using a heating device and a cooling device.

【符号の説明】[Explanation of symbols]

1 金型 2 固定金型 3 可動金型 4 キャビティ 5 注湯口 6 加熱装置 6a ヒータ 7 冷却装置 7a 流路 7b 流路 8 供給管 8a 分岐管 8b 分岐管 9 温度センサ 10a 電磁弁 10b 電磁弁 11 流量計 12 水圧センサ 13 水温センサ 15 温度検出手段 16 判定手段 17 第1信号 18 第2信号 19 加熱指令手段 20 冷却指令手段 1 mold 2 fixed mold 3 movable mold 4 cavity 5 pouring port 6 heating device 6a heater 7 cooling device 7a flow path 7b flow path 8 supply pipe 8a branch pipe 8b branch pipe 9 temperature sensor 10a solenoid valve 10b solenoid valve 11 flow rate Total 12 Water pressure sensor 13 Water temperature sensor 15 Temperature detecting means 16 Judging means 17 First signal 18 Second signal 19 Heating instruction means 20 Cooling instruction means

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 金型を加熱する加熱装置および該金型を
冷却する冷却装置を設け、金型の温度を検出する温度検
出手段と、温度検出手段の出力が所定値未満のときに第
1信号を、前記出力が所定値以上のときに第2信号を発
する判定手段と、判定手段の第1信号を入力して前記加
熱装置に加熱指令を発する加熱指令手段と、判定手段の
第2信号を入力して前記冷却装置に冷却指令を発する冷
却指令手段とを設けたことを特徴とする金型の温度制御
装置。
1. A heating device for heating a mold and a cooling device for cooling the mold are provided, the temperature detecting means for detecting the temperature of the mold, and the first when the output of the temperature detecting means is less than a predetermined value. As a signal, a judging means for issuing a second signal when the output is equal to or more than a predetermined value, a heating command means for inputting the first signal of the judging means and issuing a heating command to the heating device, and a second signal for the judging means. And a cooling command means for issuing a cooling command to the cooling device.
JP3454592A 1992-01-23 1992-01-23 Method for controlling temperature of die Pending JPH05200519A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3454592A JPH05200519A (en) 1992-01-23 1992-01-23 Method for controlling temperature of die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3454592A JPH05200519A (en) 1992-01-23 1992-01-23 Method for controlling temperature of die

Publications (1)

Publication Number Publication Date
JPH05200519A true JPH05200519A (en) 1993-08-10

Family

ID=12417281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3454592A Pending JPH05200519A (en) 1992-01-23 1992-01-23 Method for controlling temperature of die

Country Status (1)

Country Link
JP (1) JPH05200519A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010044754A (en) * 2000-03-22 2001-06-05 송호봉 Apparatus and method for controlling film coating temperature in membrane press
JP2006341290A (en) * 2005-06-09 2006-12-21 Ngk Insulators Ltd Die casting equipment
JP2006341289A (en) * 2005-06-09 2006-12-21 Ngk Insulators Ltd Die casting apparatus and die casting method
JP2011056584A (en) * 2010-12-24 2011-03-24 Ngk Insulators Ltd Die casting device and die casting method
JP2011056585A (en) * 2010-12-24 2011-03-24 Ngk Insulators Ltd Die casting device and die casting method
CN110497583A (en) * 2019-08-12 2019-11-26 广东科龙模具有限公司 A kind of mold 3D printing part and mold, mold temperature monitoring method
CN110605836A (en) * 2019-10-28 2019-12-24 广东星联精密机械有限公司 Device and method for testing cooling performance of bottle blank injection mold

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212727U (en) * 1975-07-15 1977-01-28
JPS6013519A (en) * 1983-07-01 1985-01-24 M L Eng Kk Temperature regulating device for mold in molding machine and roll and the like

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212727U (en) * 1975-07-15 1977-01-28
JPS6013519A (en) * 1983-07-01 1985-01-24 M L Eng Kk Temperature regulating device for mold in molding machine and roll and the like

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010044754A (en) * 2000-03-22 2001-06-05 송호봉 Apparatus and method for controlling film coating temperature in membrane press
JP2006341290A (en) * 2005-06-09 2006-12-21 Ngk Insulators Ltd Die casting equipment
JP2006341289A (en) * 2005-06-09 2006-12-21 Ngk Insulators Ltd Die casting apparatus and die casting method
JP2011056584A (en) * 2010-12-24 2011-03-24 Ngk Insulators Ltd Die casting device and die casting method
JP2011056585A (en) * 2010-12-24 2011-03-24 Ngk Insulators Ltd Die casting device and die casting method
CN110497583A (en) * 2019-08-12 2019-11-26 广东科龙模具有限公司 A kind of mold 3D printing part and mold, mold temperature monitoring method
CN110605836A (en) * 2019-10-28 2019-12-24 广东星联精密机械有限公司 Device and method for testing cooling performance of bottle blank injection mold
CN110605836B (en) * 2019-10-28 2024-04-02 广东星联精密机械有限公司 Bottle blank injection mold cooling performance test method

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