JPH05200967A - Thick film printing screen mask and production thereof - Google Patents

Abstract

PURPOSE:To provide a thick film printing screen mask reduced in the deformation due to its elongation and capable of simply forming a printing pattern of high accuracy. CONSTITUTION:An emulsifier film 3 having resistance against an etching agent is formed on the surface opposite to a screen mesh 1 of a metal foil 2 and patterned according to a predetermined pattern to form a printing pattern 4 and, thereafter, the metal foil 2 is etched using the emulsifier film 3 as a resist to form a printing pattern 5. Since the printing patterns 4, 5 perfectly coinciding with the metal foil 2 and the emulsifier film 3 and the effect of the side etching of the metal foil 2 can be excluded by making the metal foil 2 thin, the printing patterns 4, 5 of high accuracy can be formed. Further, since the relative thickness of the printing patterns 4, 5 is obtained by the metal foil 2 and the emulsifier film 3, a printing film having a required thickness can be formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film printing screen mask used for printing a circuit pattern on a circuit board using a conductive paste and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a print mask used for thick film printing, as shown in FIG. 2, a screen mesh 1 such as a stainless mesh is coated with an emulsion 7 and the emulsion 7 is exposed according to a predetermined plate pattern. , A so-called mesh mask on which the print pattern 8 is formed,
As shown in FIG. 3, the thin metal plate 10 is etched according to a predetermined plate pattern to form a printing pattern 11,
So-called metal masks and the like were generally used. Further, as a modification of the mesh mask, as shown in FIG. 4, one having a nickel foil 2 attached to one surface of a screen mesh 1 and the nickel foil etched to form a print pattern 13 is also used.

[0003]

In the mesh mask shown in FIG. 2, since the screen mesh 1 forming the skeleton of the mask is easily stretched, the printing pattern 8 is gradually deformed and the printing accuracy is lowered. It was In addition, the screen mesh 1 along the edges of the print pattern 8
In the case where the strands forming the line pass through, the boundary line of the actual print pattern 8 is determined by the strands of the screen mesh 1. Therefore, there is a problem that the contour of the print pattern 8 is displaced and the accuracy cannot be obtained. It was. On the other hand, in the metal mask shown in FIG. 3, the printing accuracy does not deteriorate due to stretching or the like, but when the printing pattern 11 is formed, the metal plate
Since 0 must be etched, it is troublesome to align the printing plate. Moreover, so-called side etching occurs along the edges on both sides of the print pattern 11, and the edge portion 12
Becomes rounded. Since the side etching increases the thickness of the printed film, the thicker the metal plate 10, the more prominent the side etching becomes, and the accuracy of the printed pattern 11 becomes lower.

Further, in the mesh mask with a nickel foil stretched as shown in FIG. 4, the elongation of the mesh is suppressed, the printing accuracy is not deteriorated, and when the metal foil 2 is thin, there is no problem of so-called side etching and it is high. Printing accuracy is obtained. However, the printing pattern 3 formed on the thin metal foil 2
In addition, since a large amount of printing paste cannot be held, the film thickness of the printing film becomes extremely thin, and so-called faint printing occurs. In order to increase the thickness of the printed film, it is necessary to increase the thickness of the metal foil 2. However, in order to form such a thick metal foil 2, a long plating process time is required and the unit price of the mask is high. turn into. Further, double-sided etching as in the metal mask is required, and the printing pattern 11
It also takes time to form. Moreover, there is a problem in that the problem of side etching occurs in the metal mask, and high accuracy of the printed pattern 13 cannot be obtained. The present invention, in view of the problems of such a conventional printing screen mask, there is little deformation due to stretching of the mask,
An object of the present invention is to provide a thick film printing screen mask that can easily form a highly accurate printed pattern and a method for manufacturing the same.

[0005]

[Means for Solving the Problems] That is, in order to achieve the above object, the present invention provides a thick film printing screen mask having a screen mesh 1 and a metal foil 2 stretched on one side thereof, wherein the metal foil is used. 2, an emulsion film 3 formed on the surface opposite to the screen mesh 1 side and having resistance to an etching agent for etching the metal foil 2;
Provided is a screen mask for thick film printing, which has print patterns 4 and 5 formed on the metal foil 2 and the emulsion film 3. Furthermore, in the method for manufacturing a thick film printing screen mask by laying the metal foil 2 on one surface of the screen mesh 1, the step of forming the metal foil 2 and the resistance to the etching agent for etching the metal foil 2 are improved. A step of forming an emulsion film 3 by coating the emulsion having the same on the surface of the metal foil 2 opposite to the screen mesh 1 side, a step of forming a print pattern 4 on the emulsion film 3, and a step of resisting the emulsion film 3 And a step of forming the printing pattern 5 thereon by etching the metal foil 2 as described above, to provide a method for manufacturing a screen mask for thick film printing.

[0006]

In the thick film printing screen mask, first, as shown in FIG. 1C, the emulsion film 3 is patterned according to a predetermined pattern to form a printing pattern 4, and then the emulsion film 3 is used as a resist. Since the metal foil 2 is etched and the printing pattern 5 is formed thereon,
The printed patterns 4 and 5 perfectly matching the metal foil 2 and the emulsion film 3 can be easily formed. When a circuit pattern or the like is printed on a circuit board using this thick film printing screen mask, the total thickness of the printed patterns 4 and 5 is produced by the emulsion film 3 even if the metal foil 2 is thin, A printed film having a required thickness can be formed. Moreover, as described above,
Print patterns 4 and 5 that completely match each other can be formed on the emulsion film 3 and the metal foil 2, and the influence of side etching of the metal foil 2 can be eliminated by making the metal foil 2 thin, so that high precision is achieved. The printing patterns 4 and 5 can be formed.

[0007]

Next, this embodiment will be described with reference to the drawings. Referring to FIG. 1, the structure of the screen mask for thick film printing according to the present invention will be described according to the manufacturing procedure thereof. First, as shown in FIG. 1A, one surface of the stainless screen mesh 1 has a thickness of about 5 to 10 μm. A metal foil 2 made of nickel or the like is contacted and plated, and the nickel metal foil 2 is fixed to one surface of the stainless screen mesh 1. Further, as shown in FIG. 1B, an emulsion film 3 (for example, manufactured by Murakami Screen Co., Ltd.) that exhibits acid resistance, water resistance, and solvent resistance when photopolymerized on the surface of the metal foil 2 opposite to the screen mesh 1 Emulsion such as MSP-10) is applied to a thickness of about 20 μm. After this is dried, as shown in FIG. 1 (c), a separately prepared exposure mask (not shown) is applied to the emulsion to irradiate it with ultraviolet rays to selectively photopolymerize the emulsion. After that, the alkali is washed to remove the emulsion in the portion which does not undergo photopolymerization, and a print pattern 4 is formed on the emulsion. Then, as shown in FIG. 1 (d), another commercially available photoresist (not shown) is applied to the screen mesh 1 side, and after the entire surface is photopolymerized, for example, it is immersed in a ferric chloride solution,
The nickel foil is etched to form a printed pattern 5 on the nickel foil. Then, the photoresist applied on the screen mesh 1 side is washed with an alkali to complete a screen mask having print patterns 4 and 5 at the same position.

Next, a method for forming a print pattern on a screen mask according to the present invention will be described. First, emulsion film 3
Is exposed according to a predetermined pattern, and a positive pattern is printed on the emulsion film 3. Next, the printed portion of the emulsion film 3 is removed to form a printed pattern 4 on the emulsion film 3 as shown in FIG. Next, using the emulsion film 3 as a resist, the metal foil 2 is etched to form a print pattern 5 on the metal foil 2 in exactly the same pattern as the print pattern 4. As a result, the screen mask having the print pattern 4 is completed.

As described above, in the thick film printing screen mask, even if the metal foil 2 is thin, the emulsion film 3 provides the total thickness of the printing patterns 4 and 5, so that the printing film having a required thickness can be formed. Can be formed. Moreover, as described above, the print patterns 4 and 5 that are completely the same can be formed on the emulsion film 3 and the metal foil 2, and the influence of side etching can be eliminated by making the metal foil 2 thin. For,
High-precision printing patterns 4 and 5 can be formed. of course,
Since the metal foil 2 is provided, it is difficult for the precision of the screen mesh 1 to decrease due to the elongation of the screen mesh 1.

[0010]

As described above, according to the present invention, it is possible to provide a screen printing mask for printing, which is capable of easily forming a highly accurate printing pattern with less deformation caused by stretching of the mask.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts of a screen mask showing an embodiment of the present invention in a state from semi-finished to completed.

FIG. 2 is a cross-sectional view of a main part showing a conventional screen mask.

FIG. 3 is a cross-sectional view of essential parts showing another conventional screen mask.

FIG. 4 is a cross-sectional view of essential parts showing a screen mask of still another conventional example.

[Explanation of symbols]

 1 Screen mesh 2 Metal foil 3 Emulsion film 4 Printing pattern 5 Printing pattern

Claims (2)

[Reference No.] 0030898-01 [Claims] 1. A screen mask for thick film printing comprising a screen mesh (1) and a metal foil (2) stretched on one side thereof, wherein the metal foil (2) is opposite to the screen mesh (1) side. Formed on the surface of the same metal foil (2)
An emulsion film (3) having resistance to an etching agent for etching the metal foil, and printed patterns (4) and (5) formed over the metal foil (2) and the emulsion film (3). Characteristic screen mask for thick film printing. 2. A method for producing a screen mask for thick film printing by applying a metal foil (2) on one surface of a screen mesh (1), the step of forming the metal foil (2),
A step of forming an emulsion film (3) by coating an emulsion having resistance to an etching agent for etching the metal foil (2) on the surface of the metal foil (2) opposite to the screen mesh (1) side. And a step of forming a print pattern (4) on the emulsion film (3), and a step of etching the metal foil (2) using the emulsion film (3) as a resist to form a print pattern (5) thereon. A method for manufacturing a screen mask for thick film printing, comprising: