JPH0520343U - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Object] To provide a semiconductor device which is smaller than conventional semiconductor devices by improving the efficiency of arrangement of electronic components. In a semiconductor device in which a circuit board 1 having an electronic component 4 mounted on the bottom surface of an outer frame 2 is mounted and a sealing resin 3 is injected into the outer frame 2, a conductor 8 is provided on an inner wall surface of the outer frame 2. Is formed, and a part of the electronic component 4 (electronic component 9) is mounted on the circuit.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device, and more particularly to a semiconductor device in which a circuit board is mounted on the bottom surface of an outer frame and a sealing resin is injected into the outer frame.

[0002]

[Prior Art]

 A conventional technique will be described with reference to FIG.

FIG. 3 is a sectional view of a conventional semiconductor device. As shown in FIG. 3, in a conventional semiconductor device, a component electronic component 4 and an input / output terminal 5 are mounted on a circuit board 1, and an outer frame 2 made of an insulating resin is provided around the circuit board 1. The adhesive 6 fixes the sealing resin 3, and the sealing resin 3 is injected and cured therein. Reference numeral 7 is a wire for connecting the semiconductor element and a predetermined circuit pattern.

Here, all the electronic components 4 or input / output terminals 5 required for the configuration are mounted on the surface of the circuit board 1.

[0005]

[Problems to be solved by the device]

 However, in the semiconductor device formed in this manner, the component mounting area is limited to one plane on the circuit board, and the area is limited. Therefore, there is a limit to miniaturization of the semiconductor device.

Therefore, an object of the present invention is to provide a semiconductor device in which parts can be mounted more efficiently than in the past and the size can be reduced.

[0007]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention provides a semiconductor device in which a circuit board having electronic components mounted on a bottom surface of an outer frame is mounted, and a sealing resin is injected into the outer frame. A circuit is formed on the wall surface, and a part of the electronic component is mounted on the circuit.

[0008]

[Action]

 In a semiconductor device in which a circuit board having electronic components mounted on the bottom surface of the outer frame is mounted and a sealing resin is injected into the outer frame, a circuit is formed on the inner wall surface of the outer frame, and the circuit described above is formed. Since a part of the electronic parts is mounted on the electronic circuit board, the electronic part mounting area, which was conventionally limited to only the bottom surface of the circuit board, extends to the inner wall of the outer frame. Can be miniaturized.

[0009]

【Example】

 An embodiment of the present invention will be described with reference to FIGS.

The same functional parts as those of the conventional example are designated by the same reference numerals.

FIG. 1 is a cross-sectional view of a semiconductor device according to this embodiment, and FIG. 2 is a side cross-sectional view showing a fit between an outer frame and a circuit board of the semiconductor device according to this embodiment.

As shown in FIGS. 1 and 2, a conductor 8 is inserted into the inner wall surface of the outer frame 2 so that a contact portion with a component is exposed on the surface of the inner wall surface. Mount the component 9.

Here, as a method of forming the circuit wiring on the outer frame 2, for example, as the resin material of the outer frame 2, polyethylene terephthalate having a heat distortion temperature of 200 ° C. or higher, polyphenylene sulfide, or the like is used. When manufacturing the outer frame 2 by injection molding, there is a method in which a circuit formed by a metal frame is insert-molded to integrate the outer frame and the circuit pattern.

Next, the semiconductor component 4 other than the electronic component 9 and the input / output terminal 5 are mounted on the pattern 11 on the circuit board 1. The input / output terminal 5 may be attached to the inside of the outer frame depending on the circuit configuration.

Next, the circuit board 1 and the outer frame 2 are fixed and integrated by an adhesive 6, and the circuit pattern of the conductor 8 on the inner wall surface of the outer frame 2 and the pattern on the circuit board 1 are fixed by the brazing material 10. 11 are interconnected to form one predetermined circuit. Finally, the resin 3 for encapsulation is injected and cured in the inside to obtain the semiconductor device of this embodiment.

In the semiconductor device of this embodiment obtained as described above, the component mounting area, which is conventionally limited to only one surface on the base plate on the bottom surface, can be extended to the inner wall surface of the outer frame. The internal space of the device can be effectively utilized, and the semiconductor device can be downsized. As a method of forming the circuit on the outer frame 2, there is also a method of plating a conductor on the surface of the high heat resistant thermoplastic resin.

[0017]

[Effect of the device]

 As described above, according to the present invention, in the semiconductor device in which the circuit board is mounted on the bottom surface of the outer frame and the sealing resin is injected into the outer frame, the components are also mounted on the inner wall surface of the outer frame. Further, the internal space of the semiconductor device can be effectively utilized, the semiconductor device has the same function as the conventional one, and a smaller semiconductor device can be realized.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing a fit between a circuit board and an outer frame of a semiconductor device according to an embodiment of the present invention.

FIG. 3 is a sectional view of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Outer frame 3 Sealing resin 4 Electronic component (on circuit board) 8 Circuit (conductor exposed part of inner wall of outer frame) 9 Electronic component (on inner wall of outer frame)

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device in which a circuit board having electronic components mounted thereon is mounted on a bottom surface of an outer frame, and a sealing resin is injected into the outer frame, wherein a circuit is formed on an inner wall surface of the outer frame. A semiconductor device comprising a part of the electronic component mounted on the circuit.