JPH052143B2 - - Google Patents
Info
- Publication number
- JPH052143B2 JPH052143B2 JP10701385A JP10701385A JPH052143B2 JP H052143 B2 JPH052143 B2 JP H052143B2 JP 10701385 A JP10701385 A JP 10701385A JP 10701385 A JP10701385 A JP 10701385A JP H052143 B2 JPH052143 B2 JP H052143B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- chromium
- layer
- chromium oxide
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 claims description 73
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 38
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 38
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 27
- 229910052804 chromium Inorganic materials 0.000 claims description 27
- 239000011651 chromium Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 150000000703 Cerium Chemical class 0.000 claims description 6
- 238000007796 conventional method Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 54
- 239000000243 solution Substances 0.000 description 31
- 150000003839 salts Chemical class 0.000 description 8
- 229910052684 Cerium Inorganic materials 0.000 description 6
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 6
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 6
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910001902 chlorine oxide Inorganic materials 0.000 description 1
- MAYPHUUCLRDEAZ-UHFFFAOYSA-N chlorine peroxide Chemical compound ClOOCl MAYPHUUCLRDEAZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、フオトマスクの作成時におけるフオ
トマスクブランクスのエツチング方法に関し、更
に詳しくは透明基板上にクロム、酸化クロム多層
遮光層を備えたフオトマスクブランクスの該遮光
層上に常法に従つてフオトレジスト等の所望パタ
ーンの被覆体を設け、該被覆体で覆われていない
部分をエツチングして窓部を形成するフオトマス
クブランクスのエツチング方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for etching a photomask blank when producing a photomask, and more specifically to a photomask having a multilayer light-shielding layer of chromium and chromium oxide on a transparent substrate. The present invention relates to a method of etching a photomask blank, which comprises providing a covering of a desired pattern, such as a photoresist, on the light-shielding layer of the blank according to a conventional method, and etching the portions not covered with the covering to form windows.
(従来の技術)
従来、この種フオトマスクブランクスのエツチ
ング方法としては、第1図示の如く透明基板a上
にクロム層bと酸化クロム層cの多層遮光層dを
備えたフオトマスクブランクスeの該遮光層d上
に常法に従つてフオトレジスト等の被覆体fを設
けて所望パターンを形成し、次で第2図示の如く
被覆体fで覆われていない部分の遮光層dをセリ
ウム()塩系エツチング液でエツチングして窓
部hを形成する方法が知られている。(Prior Art) Conventionally, as a method for etching this type of photomask blank, there has been a method for etching a photomask blank e, which has a multilayer light shielding layer d of a chromium layer b and a chromium oxide layer c on a transparent substrate a, as shown in FIG. A coating f such as photoresist is provided on the light-shielding layer d according to a conventional method to form a desired pattern, and then, as shown in the second figure, the portions of the light-shielding layer d not covered with the coating f are coated with cerium (). A method of forming the window h by etching with a salt-based etching solution is known.
(発明が解決しようとする問題点)
しかしながら、前記従来法によれば、セリウム
()塩系エツチング液によるクロムと酸化クロ
ムに対するエツチング速度が4:1と差があるた
めに、第2図示の如くクロム層bの方がエツチン
グされ過ぎて酸化クロム層cにオーバハング部g
が形成されてしまいクリテイカルデイメンシヨン
にばらつきが生じたり、また該オーバハング部g
が欠落した場合にはパターンエツジにギザつきが
生じたりして、得られたフオトマスクのパターン
精度があまり良くないという不都合を有してい
た。(Problems to be Solved by the Invention) However, according to the conventional method, there is a difference in etching rate of 4:1 between chromium and chromium oxide by the cerium () salt-based etching solution, and as shown in the second figure, The chromium layer b is etched too much and there is an overhang part g on the chromium oxide layer c.
is formed, causing variations in critical dimensions, and the overhang portion g.
If the photomask is missing, the edges of the pattern may become jagged, resulting in a disadvantage that the pattern accuracy of the resulting photomask is not very good.
(問題点を解決するための手段)
本発明者らは、過マンガン酸塩系エツチング液
が酸化クロム層のみを選択的にエツチングする性
質を有するという知見を得、かかる知見に基い
て、過マンガン酸塩系エツチング液によるエツチ
ング処理とセリウム()塩系エツチング液によ
るエツチング処理とを組合せることによつてエツ
チング後の酸化クロム層とクロム層の端面を精確
に同一面に合せることができるフオトマスクブラ
ンクスのエツチング方法を提供するもので、その
第1発明は、透明基板上にクロム、酸化クロム多
層遮光層を備えたフオトマスクブランクスの該遮
光層上に常法に従つてフオトレジスト等の所望パ
ターンの被覆体を設け、該被覆体で覆われていな
い部分をエツチングして窓部を形成するフオトマ
スクブランクスのエツチング方法において、まず
セリウム()塩系エツチング液で酸化クロム層
とクロム層を共にエツチングして、次で酸化クロ
ム層のオーバハングした部分を過マンガン酸塩系
エツチング液でエツチングしながらこれらクロム
層と酸化クロム層の端面を合わせることを特徴と
する。(Means for Solving the Problems) The present inventors have obtained the knowledge that permanganate-based etching solution has the property of selectively etching only the chromium oxide layer, and based on this knowledge, A photomask that allows the end faces of the chromium oxide layer and the chromium layer to be precisely aligned on the same plane after etching by combining etching treatment with an acid salt-based etching liquid and etching treatment with a cerium salt-based etching liquid. A method of etching a blank is provided, and the first invention is a photomask blank having a multilayer light shielding layer of chromium and chromium oxide on a transparent substrate. In the etching method for photomask blanks in which a window portion is formed by providing a covering body and etching the portion not covered by the covering body, first, both the chromium oxide layer and the chromium layer are etched with a cerium () salt-based etching solution. Then, the end surfaces of the chromium oxide layer and the chromium oxide layer are brought together while etching the overhanging portion of the chromium oxide layer with a permanganate-based etching solution.
また、本願の第2発明は、透明基板上にクロ
ム、酸化クロム多層遮光層を備えたフオトマスク
ブランクスの該遮光層上に常法に従つてフオトレ
ジスト等の所望パターンの被覆体を設け、該被覆
体で覆われていない部分をエツチングして窓部を
形成するフオトマスクブランクスのエツチング方
法において、まず過マンガン酸塩系エツチング液
で酸化クロム層のみをエツチングしておき、次で
セリウム()塩系エツチング液で該酸化クロム
層と該クロム層をエツチングしながらこれら酸化
クロム層とクロム層の端面を合わせることを特徴
とする。 In addition, the second invention of the present application provides a photomask blank having a multilayer light-shielding layer of chromium and chromium oxide on a transparent substrate. In the etching method for photomask blanks in which windows are formed by etching the areas not covered by the coating, only the chromium oxide layer is first etched with a permanganate-based etching solution, and then cerium () salt is etched. The method is characterized in that the end surfaces of the chromium oxide layer and the chromium layer are brought together while etching the chromium oxide layer and the chromium layer with an etching solution.
エツチングの対象となるフオトマスクブランク
スは、一般にガラス等の透明基板にクロム層と更
に酸化クロム層を蒸着法やスパツタリング法にて
多層遮光層に形成してある。 Photomask blanks to be etched generally have a chromium layer and a chromium oxide layer formed on a transparent substrate such as glass to form a multilayer light-shielding layer by vapor deposition or sputtering.
フオトマスクブランクスの多層遮光層を所望パ
ターンに被覆する被覆体は、一般にはフオトレジ
ストを該遮光層の全面に亘つて被覆して原型パタ
ーンを介して予定区域のみ感光させ、これを現像
処理して該感光部或いは未感光部のみを該遮光層
上に残すフオトレジスト法などによつて形成す
る。 In order to coat the multilayer light-shielding layer of photomask blanks in a desired pattern, generally the photoresist is coated over the entire surface of the light-shielding layer, only the predetermined area is exposed to light through the original pattern, and then this is developed. It is formed by a photoresist method or the like in which only the exposed area or the unexposed area is left on the light shielding layer.
尚、フオトマスクブランクスは予めパターン化
されていないフオトレジスト被覆層を備えるよう
にしたものも用い得る。 Note that a photomask blank provided with a photoresist coating layer that is not patterned in advance may also be used.
過マンガン酸塩系エツチング液としては一般に
は亜鉛、アンモニウム、カドミウム、カリウム、
カルシウム、銀、ストロンチウム、セシウム、ナ
トリウム、バリウム、マグネシウム、リチウム、
ルビジウム等の過マンガン酸塩の1/10N〜3N溶
液が用いられる。 Permanganate-based etching solutions generally include zinc, ammonium, cadmium, potassium,
Calcium, silver, strontium, cesium, sodium, barium, magnesium, lithium,
A 1/10N to 3N solution of permanganate such as rubidium is used.
また、セリウム()塩系エツチング液として
は、一般には硝酸第二セリウムアンモニウムと過
塩素酸の混合水溶液が用いられる。 Further, as the cerium salt-based etching solution, a mixed aqueous solution of ceric ammonium nitrate and perchloric acid is generally used.
これら、両エツチング液を用いてクロム層と酸
化クロム層の端面を合せるには、各エツチング液
の液温とフオトマスクブランクスの各エツチング
液への浸漬時間を調整すること等によつて行う。 In order to align the end faces of the chromium layer and the chromium oxide layer using both of these etching solutions, the temperature of each etching solution and the immersion time of the photomask blank in each etching solution are adjusted.
(実施例)
以下、添附図面に従つて本願の第1発明並びに
第2発明の実施例を夫々実施例1及び実施例2と
して示す。(Example) Examples of the first invention and the second invention of the present application will be described below as Example 1 and Example 2, respectively, with reference to the accompanying drawings.
実施例 1
まず、第3図示の如くガラス製の透明基板1上
に膜厚61nmのクロム層2、及び膜厚25nmの酸
化クロル層3の多層遮光層4を備えたフオトマス
クブランクス5を用意して、該遮光層4上にフオ
トレジスト(例えばAZ1350(ヘキスト社製))の
被覆層を設け、該被覆層に常法の現像処理を施し
てこれを所望パターンの被覆体6形成する。Example 1 First, as shown in the third diagram, a photomask blank 5 was prepared, which was provided with a multilayer light shielding layer 4 consisting of a chromium layer 2 with a thickness of 61 nm and a chlorine oxide layer 3 with a thickness of 25 nm on a transparent substrate 1 made of glass. Then, a coating layer of photoresist (for example, AZ1350 (manufactured by Hoechst)) is provided on the light-shielding layer 4, and the coating layer is subjected to a conventional development process to form a coating 6 in a desired pattern.
次で、第4図示の如く該フオトマスクブランク
ス5を硝酸第二セリウムアンモニウム100g、過
塩素酸26c.c.、純水440c.c.から成る液温20℃のエツ
チング液に60秒間浸漬して酸化クロム層3とクロ
ム層2を共にエツチングして窓部7を形成し、該
エツチング液を水洗する。 Next, as shown in Figure 4, the photomask blank 5 is immersed for 60 seconds in an etching solution containing 100 g of ceric ammonium nitrate, 26 c.c. of perchloric acid, and 440 c.c. of pure water at a temperature of 20°C. The window portion 7 is formed by etching both the chromium oxide layer 3 and the chromium layer 2, and the etching solution is washed away with water.
最後に、第5図示の如く該フオトマスクブラン
クス5を0.5Nの過マンガン酸カリウム水溶液か
ら成る液温60℃のエツチング液に180秒間浸漬し
て酸化クロム層3のオーバハングした部分をエツ
チングし、該エツチング液を水洗してエツチング
処理を終了した。 Finally, as shown in Figure 5, the photomask blank 5 is immersed in an etching solution of 0.5N potassium permanganate aqueous solution at a temperature of 60°C for 180 seconds to etch the overhanging portion of the chromium oxide layer 3. The etching solution was washed with water to complete the etching process.
得られたフオトマスクの酸化クロム層3とクロ
ム層2の端面は極めて精確に同一面に整合してい
た。 The end faces of the chromium oxide layer 3 and the chromium layer 2 of the obtained photomask were extremely accurately aligned to the same plane.
実施例 2
第6図示の如く実施例1と同様にして、フオト
マスクブランクス5に所望パターンのフオトレジ
スト被覆体6を形成する。Example 2 As shown in the sixth figure, a photoresist coating 6 of a desired pattern is formed on a photomask blank 5 in the same manner as in Example 1.
次で、第7図示の如く該フオトマスクブランク
ス5を0.5Nの過マンガン酸カリウム水溶液から
成る液温60℃のエツチング液に180秒間浸漬して
セリウム()塩系のエツチング液に対してクロ
ム層2よりもエツチングされにくい酸化クロム層
3のみを予めエツチングしておき、該エツチング
液を水洗いする。 Next, as shown in Figure 7, the photomask blank 5 is immersed in an etching solution of 0.5N potassium permanganate at a temperature of 60°C for 180 seconds to remove the chromium layer from the cerium salt-based etching solution. Only the chromium oxide layer 3, which is more difficult to be etched than the chromium oxide layer 2, is etched in advance, and the etching solution is washed with water.
最後に、第8図示の如く該フオトマスクブラン
クス5を硝酸第二セリウムアンモニウム100g、
過塩素酸26c.c.、純水440c.c.から成る液温20℃のエ
ツチング液に40秒間浸漬してこんどは酸化クロム
層3とクロム層2を共にエツチングして窓部7を
形成し、該エツチング液を水洗してエツチング処
理を終了した。 Finally, as shown in Figure 8, the photomask blank 5 was mixed with 100 g of ceric ammonium nitrate.
The window portion 7 is formed by immersing it in an etching solution containing 26 c.c. of perchloric acid and 440 c.c. of pure water at a temperature of 20° C. for 40 seconds to etch both the chromium oxide layer 3 and the chromium layer 2. Then, the etching solution was washed with water to complete the etching process.
得られたフオトマスクの酸化クロム層3とクロ
ム層2の端面は極めて精確に同一面に整合してい
た。 The end faces of the chromium oxide layer 3 and the chromium layer 2 of the obtained photomask were extremely accurately aligned to the same plane.
(発明の効果)
このように、本願の第1発明並びに第2発明の
フオトマスクブランクスのエツチング方法によれ
ば、セリウム()塩系エツチング液の酸化クロ
ムとクロムに対するエツチング速度の差と過マン
ガン酸塩系エツチング液の酸化クロムに対する選
択的エツチングとを利用して、エツチング後の多
層遮光層の酸化クロム層とクロム層の端面を簡単
且つ極めて精確に同一面に合せることができる効
果を有する。(Effects of the Invention) As described above, according to the photomask blank etching methods of the first and second inventions of the present application, the difference in the etching rate between chromium oxide and chromium in the cerium () salt-based etching solution and the difference in the etching rate of permanganate By utilizing the selective etching of chromium oxide by a salt-based etching solution, the end faces of the chromium oxide layer and the chromium layer of the multilayer light-shielding layer after etching can be easily and extremely accurately aligned on the same surface.
第1図並びに第2図は夫々従来のフオトマスク
ブランクスのエツチング方法によるエツチング液
処理前並びに処理後のフオトマスクブランクスの
裁断面図、第3図乃至第5図は夫々本願第1発明
のフオトマスクブランクスのエツチング方法の1
実施例によるエツチング液処理前、セリウム
()塩系エツチング液処理後並びに過マンガン
酸塩系エツチング液処理後のフオトマスクブラン
クスの裁断面図、第6図乃至第8図は夫々本願第
2発明のフオトマスクブランクスのエツチング方
法の1実施例によるエツチング液処理前、過マン
ガン酸塩系エツチング液処理後並びにセリウム
()塩系エツチング液処理後のフオトマスクブ
ランクスの裁断面図である。
1……透明基板、2……クロム層、3……酸化
クロム層、4……多層遮光層、5……フオトマス
クブランクス、6……被覆体、7……窓部。
FIGS. 1 and 2 are cross-sectional views of photomask blanks before and after treatment with an etching solution by a conventional photomask blank etching method, respectively, and FIGS. 3 to 5 are cross-sectional views of photomask blanks of the first invention of the present application, respectively. Method 1 of etching blanks
6 to 8 are cross-sectional views of the photomask blanks before treatment with an etching solution, after treatment with a cerium () salt-based etching solution, and after treatment with a permanganate-based etching solution according to the embodiment, respectively, according to the second invention of the present application. FIG. 3 is a cross-sectional view of a photomask blank before being treated with an etching solution, after being treated with a permanganate-based etching solution, and after being treated with a cerium salt-based etching solution according to an embodiment of the method for etching photomask blanks. DESCRIPTION OF SYMBOLS 1...Transparent substrate, 2...Chromium layer, 3...Chromium oxide layer, 4...Multilayer light shielding layer, 5...Photomask blank, 6...Coating, 7...Window part.
Claims (1)
を備えたフオトマスクブランクスの該遮光層上に
常法に従つてフオトレジスト等の所望パターンの
被覆体を設け、該被覆体で覆われていない部分を
エツチングして窓部を形成するフオトマスクブラ
ンクスのエツチング方法において、まずセリウム
()塩系エツチング液で酸化クロム層とクロム
層を共にエツチングして、次で酸化クロム層のオ
ーバハングした部分を過マンガン酸塩系エツチン
グ液でエツチングしながらこれらクロム層と酸化
クロム層の端面を合わせることを特徴とするフオ
トマスクブランクスのエツチング方法。 2 透明基板上にクロム、酸化クロム多層遮光層
を備えたフオトマスクブランクスの該遮光層上に
常法に従つてフオトレジスト等の所望パターンの
被覆体を設け、該被覆体で覆われていない部分を
エツチングして窓部を形成するフオトマスクブラ
ンクスのエツチング方法において、まず過マンガ
ン酸塩系エツチング液で酸化クロム層のみをエツ
チングしておき、次でセリウム()塩系エツチ
ング液で該酸化クロム層と該クロム層をエツチン
グしながらこれら酸化クロム層とクロム層の端面
を合わせることを特徴とするフオトマスクブラン
クスのエツチング方法。[Scope of Claims] 1. A photomask blank having a multi-layered light-shielding layer of chromium and chromium oxide on a transparent substrate. A coating of a desired pattern such as photoresist is provided on the light-shielding layer according to a conventional method, and the coating is coated with a desired pattern. In the etching method for photomask blanks in which windows are formed by etching the portions not covered with chromium oxide, both the chromium oxide layer and the chromium layer are etched using a cerium salt-based etching solution, and then the chromium oxide layer is etched. A photomask blank etching method characterized by aligning the end surfaces of the chromium layer and the chromium oxide layer while etching the overhanging portion with a permanganate-based etching solution. 2. A photomask blank having a multilayer light-shielding layer of chromium and chromium oxide on a transparent substrate. A coating of a desired pattern such as photoresist is provided on the light-shielding layer according to a conventional method, and the portions not covered with the coating are In the etching method for photomask blanks that forms windows by etching the chromium oxide layer, first, only the chromium oxide layer is etched with a permanganate-based etching solution, and then the chromium oxide layer is etched with a cerium salt-based etching solution. A method for etching photomask blanks, which comprises aligning the end faces of the chromium oxide layer and the chromium layer while etching the chromium layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107013A JPS61267054A (en) | 1985-05-21 | 1985-05-21 | Etching method for photomask blank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107013A JPS61267054A (en) | 1985-05-21 | 1985-05-21 | Etching method for photomask blank |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61267054A JPS61267054A (en) | 1986-11-26 |
| JPH052143B2 true JPH052143B2 (en) | 1993-01-11 |
Family
ID=14448288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60107013A Granted JPS61267054A (en) | 1985-05-21 | 1985-05-21 | Etching method for photomask blank |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61267054A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485814A (en) * | 1990-07-26 | 1992-03-18 | Fujitsu Ltd | Formation of mask |
| JP6564734B2 (en) * | 2015-07-27 | 2019-08-21 | 信越化学工業株式会社 | Photomask blank and photomask manufacturing method |
| EP3125041B1 (en) * | 2015-07-27 | 2020-08-19 | Shin-Etsu Chemical Co., Ltd. | Method for preparing a photomask |
-
1985
- 1985-05-21 JP JP60107013A patent/JPS61267054A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61267054A (en) | 1986-11-26 |
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