JPH0521834A - Semiconductor photoelectric conversion device - Google Patents

Abstract

(57) [Summary] (Modified) [Object] An object of the present invention is to provide a semiconductor photoelectric conversion device which can be easily mounted on a mounting substrate of a photointerrupter with its optical axis vertical. According to the present invention, a light emitting element 1 and a light receiving element 2 are mounted on a first lead and a second lead, respectively, on which each of these elements is mounted with their optical axes aligned with each other, and on each of the elements. Third and fourth leads electrically connected to each other, and transparent resin 3-1 and 3-2 for covering the respective elements so that an object to be detected can pass between the respective elements, and the resin. And a photointerrupter 10 having a light-shielding resin 9 covering a part of the first to fourth leads; a photointerrupter attachment for attaching the photointerrupter in a direction in which the optical axis intersects a photointerrupter attachment surface. And a body 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor photoelectric conversion device, and more particularly to an improvement of a photo interrupter, which is incorporated in a camera, an OA device or the like and is used for detecting an object.

[0002]

2. Description of the Related Art In this type of device, a light emitting chip (L
ED) and the light-receiving chip are mounted on the leads respectively, and the light-emitting element and the light-receiving element, which are primary-molded, are primary-molded with a resin that is transparent to infrared light. FIGS. 12 and 13 show a transmissive photointerrupter that is secondarily molded with a photosensitive resin and integrated. Here, FIG. 12A is a top view of the light emitting element 1 side, and FIG.
2 (b) is a plan view, FIG. 12 (c) is a top view on the side of the light receiving element 2, and FIG. 12 (d) is a plan view. 3-1 here
3-2 is a primary molding resin, 4-1 and 4-2 are slit forming portions (where light enters and exits), 5 is a lead frame,
9 is a secondary mold resin.

To obtain the structure shown in FIG. 12, a light emitting device (LE
D chip) 1 and light receiving element (light receiving chip) 2 are die-bonded on a bed at a predetermined position of the lead frame 5, wires 7-1 and 7-2 are bonded, and a resin 3-1 transparent to infrared light is used. , 3-2, primary molding is performed to a shape having slit forming portions 4-1 and 4-2 through which light enters and exits. Next, as shown in FIG. 13, the light emitting element 1 and the light receiving element 2
With the lead terminals facing in the same direction so as to face each other so that the optical axes 8 coincide with each other, and are installed in a mold for secondary molding. This secondary molding die is for incorporating the light emitting element 1 and the light receiving element 2 into one package and molding with the light-shielding resin 9. The mold (package) 9 of the photo interrupter 10 is molded by this molding. And slits 4-1 and 4-
2 and the object passing gap 11 are formed.

13 (a), 13 (b) and 13 (c) are a perspective view, a vertical sectional view and a lateral sectional view of the lead-cut final shape after the above secondary molding, the photo interrupter 10 is mounted. The package structure is such that the optical axis 8 is parallel to the substrate 12. Numeral 13 is a hole for pressing the element when the primary mold element is set in the mold (a hole for inserting and removing the pin for pressing the primary mold element so that the resin 9 does not surround the slit portion 4-2).

[0005]

FIGS. 14 and 15 are for explaining the problems of the conventional example. FIG. 14 (a) is the passage detection side of the object 14 to be detected, and FIG. 14 (b) is the object to be detected. Object 15
This is an example of detecting the passage of holes and the number of the holes 16. That is, in general, when the photo interrupter 10 is mounted on the substrate 12, the optical axis 8 of FIG. 13 becomes parallel to the substrate 12, and the detection target 14 or 15 is detected across the optical axis. The object to be detected 14 or 15 with respect to the substrate 12.
Will stand upright and move in parallel, or stand upright and move in an arc. Therefore, in the case where the detected object has to be positioned horizontally rather than vertically with respect to the substrate 12 due to the component set configuration of the device, the shape of the conventional photo interrupter 10 is inconvenient, and as shown in FIG. The user is forced to lay the interrupter 10 on its side (the optical axis is perpendicular to the substrate) and use it. Therefore, an extra space is secured to provide a separate substrate 17 for the interrupter 10, or a flexible substrate (when the substrate 17 is flexible) is soldered and laid around. Reference numeral 18 is a symbol indicating the moving direction of the detected object 14.

16 to 19 show conventional examples in which the light receiving element 2 is a light receiving IC chip including a Schmitt circuit.
That is, in the light receiving IC chip, the passage of the object is detected by ON / OFF (logical value) determination. That is, the detection of the passage of the object is made to correspond to one logic, and the non-detection of the passage is made to correspond to the other logic.If this judgment is made to have a hysteresis characteristic by a Schmitt circuit, etc. Chantering between detections can be prevented.

16A is a top view of the light emitting element 1 side, FIG. 16B is a plan view of the same, FIG. 16C is a top view of the light receiving element (light receiving IC chip) 2 side, and FIG. ) Is the same plan view. 17 (a), (b), and (c) are perspective views, vertical cross-sectional views, and lead-cut final shapes after secondary molding.
FIG. FIG. 18 and FIG. 19 are explanatory views of the problems of this conventional example.

Conventional examples of FIGS. 12 to 15 and FIGS. 16 to 19
The difference between the conventional example is that the latter conventional example requires three leads 5 on the light receiving side, and the bonding wire 7-2 connecting between the leads 5 and the main surface of the light receiving IC chip 2 is also 3
Although this is required, the drawback is the same as the former conventional example.

[0009]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor photoelectric conversion device which can be easily mounted on a mounting board of a photo interrupter with its optical axis perpendicular.

According to the present invention, a light emitting element, a light receiving element, first and second leads for mounting each of these elements in a state where the optical axes of these elements are aligned with each other, and an electrical element are electrically connected to each of the elements. Electrically connecting the third and fourth leads, each of the elements, and a transparent resin that covers each of the elements so that an object to be detected can pass therethrough, and the resin and the first to fourth leads. A photointerrupter having a light-shielding resin that partially covers the photointerrupter; and a photointerrupter mounting body for mounting the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface. The present invention also includes a light emitting element, a light receiving element,
First and second leads for mounting each of these elements in a state where the optical axes of the elements are aligned with each other, and third, fourth, and fifth leads electrically connected to the elements, respectively. A transparent resin that covers each of the elements such that an object to be detected can pass between the elements, and a light-shielding resin that covers the resin and a part of the first to fifth leads. And a photointerrupter mounting body for mounting the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface.

That is, according to the present invention, by devising the lead shape in the resin of the package, it is possible to easily mount with the optical axis perpendicular to the mounting board of the photo interrupter, and the separate board 17 of FIGS. It is possible to easily detect an object to be detected which moves in a state parallel to the substrate, by eliminating the need to use the above-mentioned device and reducing the mounting space.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1A is a perspective view of the same embodiment, FIG. 1B is a sectional view of the same, and FIG. 1C is a front view of the same. 2 shows the structure after the primary molding of the embodiment of FIG. 1, FIG. 2 (a) is a top view of the light emitting side of the same structure, FIG. 2 (b) is the same plan view, and FIG. 2 (c) is the light receiving side. 2D is a plan view of FIG. In these figures, the same reference numerals are used for the parts corresponding to those of the conventional example. Reference numerals 5-1 and 5-2 denote leads to be mounted with the optical axes 8 of the light emitting element 1 and the light receiving element 2 aligned, respectively.
Reference numerals 3 and 5-4 are leads respectively connected to the elements 1 and 2 by wire bonding. The leads 5-1 to 5-4 are
Initially, the lead frame 5 is integrated. The distance between the leads 5-2 and 5-4 on the terminal side (for example, 3.81).
mm) 21 is larger than the distance (for example, 1.27 mm) 22 on the terminal side between the leads 5-1 and 5-3, and the leads 5-2 and 5-4.
Are formed downward in the light-shielding resin 9 as shown in FIG. 1B, and the leads 5-1 to 5-4 are taken out from the same direction of the surface of the resin 9 along the surface of the inter-plug mounting substrate 12. ing. The leads 5-1 to 5-4 are formed along the surface of the substrate 12 near their ends, and are attached to the substrate surface together with the interrupter 10.

FIG. 3 shows another embodiment of the present invention, which is shown in FIG.
Is a perspective view, and FIG. 3 (b) is a sectional view of the same. Lead 5-
2, 5-4 are formed in the resin 9 and led out from one side of the resin 9, and the leads 5-1 and 5-3 are led out from the other side of the resin 9. Leads 5-1 and 5-3
2 and the interval 21 between the leads 5-2 and 5-4 may be the same as in FIG. 2, but may be unified to either one. The forming of the leads 5-1 to 5-4 outside the resin and the attachment to the substrate 12 are the same as in the previous embodiment.

FIG. 4A shows a method for obtaining the configuration shown in FIGS. First, the light emitting element 1 and the light receiving element 2 are connected to leads 5-1 and
Die bonding and wire bonding are performed at predetermined positions of 5-2, and primary molding is performed with resins 3-1 and 3-2 that are transparent to infrared light. At this time, a desired primary mold is performed in a subsequent secondary mold so that a slit through which LED light goes in and out can be formed. As shown in FIG. 4A, the inner lead portion is formed into a light-emitting and light-receiving side.
At 33, the secondary molding of the light-shielding resin 9 is performed in a state where the primary mold bodies 3-1 and 3-2 are pressed toward each other. In this case, the leads 5-1 to 5-4 are arranged in the same row so as to have an equal pitch between adjacent leads and are taken out to the outside, and are formed so that they can be surface-mounted easily even on the outside.

FIG. 4B is a method for obtaining the structure of FIG. 3 and is different from FIG. 4A in that the leads 5-1, 5-3 and 5-
Mold 3 so that 2, 5 and 3 are drawn out in opposite directions.
This is the point where the arrangement within 1 is performed.

FIG. 5 shows a further embodiment of the present invention in which the outer leads are not formed and are mounted on a plane. In this case, the interrupter 10 is the hole 4 of the substrate 12.
It is fitted in 1. FIG. 5 shows both an example in which the leads are taken out from only one side and an example in which the leads are taken out from both sides.

FIG. 6 shows a further different embodiment of the present invention in which the outer leads are inserted into the holes of the substrate 12 and are connected by the solder 51 for mounting. FIG. 6 also shows both the case where the leads are taken out from only one of the resins 9 and the case where the leads are taken out from both of the one side and the other side.

According to the embodiment described above, the substrate 1
The photo interrupter 10 having a structure that can be mounted with the optical axis 8 perpendicular to the mounting mounting surface of No. 2 can be realized while reducing the number of components and the mounting space. 7 to 11 show an embodiment in which the light receiving element 2 is a light receiving IC chip including a Schmitt circuit, and FIGS.
This is an improved version of the conventional example.

FIG. 7A is a perspective view of the embodiment, and FIG.
7B is a sectional view of the same, and FIG. 7C is a front view of the same. Figure 8
8A shows the structure after the primary molding of the embodiment of FIG.
8B is a top view of the same side on the light emitting side, FIG. 8B is a plan view of the same, FIG. 8C is a top view of the light receiving side, and FIG. In these figures, the same reference numerals are used for the portions corresponding to the above-mentioned embodiment. Reference numerals 5-1 and 5-2 denote leads mounted on the light emitting element 1 and the light receiving element (light receiving IC chip) 2 with their optical axes 8 aligned with each other. , 2 respectively connected by wire bonding. The point that three bonding wires 7-2 for connecting the leads 5-2, 5-4, 5-5 and the main surface of the light receiving element 2 are required is the same as in the conventional example shown in FIGS. . The leads 5-1 to 5-5 are first integrated as a lead frame. The space (for example, 1.6 mm) 21 on the terminal side between the leads 5-2 and 5-5 is the lead 5-
Space on the terminal side between 1, 5 and 3 (for example, 3.20 mm) 22
In smaller size, the leads 5-2, 5-4, 5-5 are formed downward in the light-shielding resin 9 as shown in FIG. 7B, and the leads 5-1 to 5-5 are formed on the interrupter mounting substrate 12. It is taken out from the same direction as the surface of the resin 9 along the surface.
The leads 5-1 to 5-5 are formed near the ends thereof along the surface of the substrate 12 and attached to the substrate surface together with the lower surface of the interrupter 10.

FIG. 9 shows another embodiment of the present invention, which is shown in FIG.
Is a perspective view, and FIG. 9B is a sectional view of the same. Lead 5-
2,5,4,5 and 5-5 are formed in the resin 9 and led out from one side of the resin 9, and the leads 5-1 and 5-3 are led out from the other side of the resin 9. Lead 5-1
And 5-3 spacing 22 and leads 5-2 and 5-5 spacing 21
8 may be the same as that shown in FIG. 8, but may be unified into either one. The forming of the leads 5-1 to 5-5 outside the resin and the attachment to the substrate 12 are the same as in the previous embodiment.

FIG. 10 shows another embodiment of the present invention, in which the outer leads are not formed and are planarly mounted. In this case, the interrupter 10 is fitted in the hole 41 of the substrate 12. FIG. 10 shows both an example in which the leads are taken out from only one side and an example in which the leads are taken out from both sides.

FIG. 11 shows a further different embodiment of the present invention in which the outer leads are inserted into the holes of the substrate 12 and are connected by the solder 51 to be mounted. FIG. 11 also shows both the case where the leads are taken out from only one of the resins 9 and the case where the leads are taken out from both of the one side and the other side.

The present invention is not limited to the embodiments, but various applications are possible. For example, FIG.
In (d), the spacing between the leads 5-1 and 5-3 is not widened as shown in the figure, but the spacing between the leads 5-2 and 5-5 is made wider than that in the figure, so that the leads 5-2 , 5-5 is larger than the space between leads 5-1 and 5-3,
At least leads 5-1 and 5-3 and lead 5-in the resin
From the same direction of the surface of the light-shielding resin by forming one of 2, 5-4, and 5-5, the leads 5-1 to 5-5 are arranged in the same row along the surface of the photointerrupter mounting body and externally. You may take out to. In this case, for example, the lead 5-1 is arranged between the leads 5-5 and 5-4, and the lead 5-3 is arranged between the leads 5-4 and 5-2.

[0024]

As described above, according to the present invention, a photointerrupter having a structure capable of being mounted with the optical axis perpendicular to the mounting surface can be mounted while reducing the number of parts and mounting space. It can be realized.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram of an embodiment of the present invention.

FIG. 3 is a configuration diagram of another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing the manufacturing method of each of the above embodiments.

FIG. 5 is a cross-sectional view of yet another embodiment of the present invention.

FIG. 6 is a cross-sectional view of yet another embodiment of the present invention.

FIG. 7 is a configuration diagram of still another embodiment of the present invention.

FIG. 8 is a configuration diagram of still another embodiment of the present invention.

FIG. 9 is a configuration diagram of still another embodiment of the present invention.

FIG. 10 is a sectional view of still another embodiment of the present invention.

FIG. 11 is a sectional view of still another embodiment of the present invention.

FIG. 12 is a block diagram of a conventional interrupter.

FIG. 13 is a configuration diagram of a conventional interrupter.

FIG. 14 is an explanatory diagram of the operation and configuration of a conventional photo interrupter.

FIG. 15 is an explanatory diagram of the operation and configuration of a conventional photo interrupter.

FIG. 16 is a block diagram of a conventional interrupter.

FIG. 17 is a block diagram of a conventional interrupter.

FIG. 18 is an explanatory diagram of the operation and configuration of a conventional photo interrupter.

FIG. 19 is an explanatory diagram of the operation and configuration of a conventional photo interrupter.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Light emitting element, 2 ... Light receiving element, 3-1 and 3-2 ... Transparent mold resin, 4-1 and 4-2 ... Slit, 5-1 to 5-
5 ... Lead, 8 ... Optical axis, 9 ... Shading mold resin, 10 ...
Photo interrupter, 11 ... Object passing gap, 1
2 ... Board (mounting body).

Claims (16)

[Claims] 1. A light emitting element, a light receiving element, and each of these elements,
The first and second leads, which are respectively mounted in a state where the optical axes of the respective elements are aligned with each other, and the third and fourth leads electrically connected to the respective elements, and the respective elements, A transparent resin that covers each of these elements so that an object to be detected can pass therethrough, and the resin and the first to fourth portions.
A photointerrupter having a light-shielding resin that covers a part of the lead; and a photointerrupter mounting body that mounts the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface; At least one of the first and third leads and the second and fourth leads is formed to form the first from the same direction on the surface of the light shielding resin.
A semiconductor photoelectric conversion device in which the fourth to fourth leads are arranged in the same row along the surface of the photointerrupter mounting body and taken out to the outside. 2. A light emitting element, a light receiving element, and each of these elements,
The first and second leads, which are respectively mounted in a state where the optical axes of the respective elements are aligned with each other, and the third and fourth leads electrically connected to the respective elements, and the respective elements, A transparent resin that covers each of these elements so that an object to be detected can pass therethrough, and the resin and the first to fourth portions.
A photointerrupter having a light-shielding resin that covers a part of the lead; and a photointerrupter mounting body that mounts the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface; One of the distance between the third leads and the distance between the second and fourth leads is made larger than the other so that at least one of the first and third leads and the second and fourth leads is formed in the resin. A semiconductor photoelectric conversion device, wherein the first to fourth leads are formed in the same row along the surface of the photointerrupter mounting body and taken out from the same direction of the surface of the light-shielding resin after forming. 3. A light emitting element, a light receiving element, and each of these elements,
The first and second leads, which are respectively mounted in a state where the optical axes of the respective elements are aligned with each other, and the third and fourth leads electrically connected to the respective elements, and the respective elements, A transparent resin that covers each of these elements so that an object to be detected can pass therethrough, and the resin and the first to fourth portions.
A photointerrupter having a light-shielding resin that covers a part of the lead; and a photointerrupter mounting body that mounts the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface; At least one of the first and third leads and the second and fourth leads is formed so that the first and third leads are formed from one surface of the light shielding resin and the first and third leads are formed from the other surface of the light shielding resin. A semiconductor photoelectric conversion device characterized in that the second and fourth leads are taken out to the outside. 4. The tip side of the first to fourth leads is
The semiconductor photoelectric conversion device according to claim 1, wherein the semiconductor photoelectric conversion device is formed outside the light-shielding resin so as to be parallel to the mounting surface of the photointerrupter mounting body. 5. The tip side of the first to fourth leads is
The connection is made in such a manner as to intersect the surface of the photointerrupter mounting body on the mounting surface side outside the light-shielding resin.
The semiconductor photoelectric conversion device according to any one of 1. 6. The photointerrupter mounting body according to claim 1 or 3, wherein the photointerrupter mounting body has a hole into which a photointerrupter is inserted until the first to fourth leads are mounted in a parallel state on the mounting surface side. The semiconductor photoelectric conversion device described. 7. The semiconductor photoelectric conversion device according to claim 1, wherein the transparent resin is transparent to at least infrared light. 8. A light emitting element, a light receiving element, and each of these elements,
First and second leads respectively mounted in a state where the optical axes of the respective elements are matched, third, fourth and fifth leads electrically connected to the respective elements, and the respective elements And a photointerrupter having a transparent resin that covers each of the elements so that the object to be detected can pass therethrough, and a light-shielding resin that covers the resin and a part of the first to fifth leads. A photointerrupter mounting body that mounts the photointerrupter in a direction in which the optical axis intersects a photointerrupter mounting surface; at least first, third and second, fourth, fifth leads in a resin; One of the leads is formed and the first to fifth leads are taken out from the same direction of the surface of the light-shielding resin, arranged in the same row along the surface of the photointerrupter mounting body. That semiconductor photoelectric conversion device. 9. A light emitting element, a light receiving element, and each of these elements,
First and second leads respectively mounted in a state where the optical axes of the respective elements are matched, third, fourth and fifth leads electrically connected to the respective elements, and the respective elements A photointerrupter having a transparent resin that covers between these elements such that an object to be detected can pass therethrough, and a light-shielding resin that covers the resin and a part of the first to fifth leads; A photointerrupter mounting body for mounting the photointerrupter in a direction in which the optical axis intersects a photointerrupter mounting surface; first, third
The distance between the leads is larger than the distance between the second and fifth leads, and at least one of the first and third leads and the second, fourth and fifth leads is formed in the resin to shield light. A semiconductor photoelectric conversion device, wherein the first to fifth leads are arranged in the same row along the surface of the photointerrupter mounting body and taken out from the same direction of the surface of the conductive resin. 10. A light-emitting element, a light-receiving element, and first and second leads for mounting the respective elements in a state where the optical axes of the respective elements are aligned with each other, and electrically connected to the respective elements. The third and fourth and fifth leads, a transparent resin that covers the respective elements so that an object to be detected can pass between the respective elements, the resin and the first to fifth leads. A photointerrupter having a light-shielding resin that covers a part of the photointerrupter; and a photointerrupter mounting body that mounts the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface; One of the first, third and second and fourth leads is formed to form the first and third leads from one surface of the light-shielding resin and the second one from the other surface of the light-shielding resin. 4th and 5th Lead, semiconductor photoelectric conversion device is characterized in that extraction to the outside. 11. The front end side of each of the first to fifth leads is formed outside the light-shielding resin so as to be parallel to the mounting surface of the photointerrupter mounting body. The semiconductor photoelectric conversion device according to item. 12. The first to fifth leads are connected in such a manner that tip ends of the first to fifth leads are arranged outside the light-shielding resin so as to intersect the surface of the photointerrupter mounting body on the mounting surface side. The semiconductor photoelectric conversion device according to item 1. 13. The photointerrupter mounting body according to claim 8 or 10, wherein the photointerrupter mounting body has a hole through which a photointerrupter is inserted until the first to fifth leads are mounted in parallel with each other on the mounting surface side. The semiconductor photoelectric conversion device described. 14. The semiconductor photoelectric conversion device according to claim 8, wherein the transparent resin is transparent to at least infrared light. 15. The light receiving element is a light receiving IC chip including a Schmitt circuit.
The semiconductor photoelectric conversion device according to item. 16. A light-emitting element, a light-receiving element, and first and second leads for respectively mounting these elements with their optical axes aligned with each other, and electrically connected to the respective elements. The third and fourth and fifth leads, a transparent resin that covers the respective elements so that an object to be detected can pass between the respective elements, the resin and the first to fifth leads. A photointerrupter having a light-shielding resin that covers a part of the photointerrupter; and a photointerrupter mounting body that mounts the photointerrupter in a direction in which the optical axis intersects the photointerrupter mounting surface;
The spacing between the fifth leads is set larger than the spacing between the first and third leads, and at least one of the first, third and second, fourth, fifth leads is formed in the resin. The semiconductor photoelectric conversion device is characterized in that the first to fifth leads are arranged in the same row along the surface of the photointerrupter mounting body and taken out from the same direction of the surface of the light-shielding resin.