JPH0521909A - Multiply beveled substrate - Google Patents

Abstract

(57) [Abstract] [Purpose] A multi-layered board in which a large number of printed wiring boards are assembled on a single board. By improving the arrangement of the printed wiring boards, the production process is rationalized and the production cost is reduced. [Structure] The same electronic components are mounted on the mounting surfaces A of the printed wiring boards 1 and 2, and similarly, the same components are mounted on the mounting surface B as well. These printed wiring boards 1 and 2
Are line-symmetrical on the substrate 5 about the axis of symmetry 3 and
The mounting surfaces A and B are located on the front surface and the back surface, respectively. When the board is inverted about the axis of symmetry 3, the mounting surface of the opposite printed wiring board on which the same electronic component is mounted is located.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-sided printed circuit board in which a large number of printed circuit boards having electronic components mounted on both sides are formed on a single board, and in particular, individual printed circuit boards are assembled together. By improving, it streamlines the production process.

[0002]

2. Description of the Related Art Conventionally, in order to make the process of mounting electronic parts on a printed wiring board efficient, a large number of printed wiring boards of the same kind can be formed on one substrate and the individual printed wiring boards can be processed in parallel. There is a multi-layered substrate. As shown in the top and bottom views of FIGS. 3A and 3B, this is because the mounting surfaces A and B of the respective printed wiring boards 1 and 2 are on the same surface of the substrate 5 and both printed wirings are the same. The plates 1 and 2 are assembled in the same direction.

[0003]

In the multi-chambered board constructed as described above, the electronic components prepared with reference to the reference holes 4 are inserted into the mounting surface A, and the steps such as soldering and inspection are completed. After that, the multi-sided board was turned over and the predetermined electronic components were mounted on the mounting surface B by another production facility.
That is, since the mounting surfaces A and B have different wiring patterns as a matter of course, different operations are required for the device for inserting the electronic component, and each of them is produced on a different line. Human rights costs were high.

[0004]

In order to solve the above-mentioned problems, the multi-chambered board of the present invention comprises a plurality of identical printed wiring boards having electronic components mounted on the front surface and the back surface, respectively.
They are arranged on a single substrate so that their outer shapes are located in line symmetry.

[0005]

In the above structure, when the multi-chambered board is rotated halfway around the axis of symmetry of the printed wiring board facing each other, the original mounting surface A,
The mounting surfaces A and B of the printed wiring board facing the position B are located. That is, even if the multi-chamfered board is turned upside down around the symmetry axis, the mounting surfaces A and B have the same arrangement, and the front and back surfaces of the multi-chamfered board have the same wiring pattern. It becomes possible to do.

[0006]

EXAMPLE An example of the present invention will be described below. 1A and 1B show two printed wiring boards 1 of the same kind,
2 shows a front surface and a back surface of a substrate 5 in which the outer shape is line-symmetrical with respect to the symmetry axis 3. When the substrate 5 configured as described above is rotated halfway around the axis of symmetry 3 from the state of FIG. 1A, as shown in FIG. 1B, the mounting surface A of the printed wiring board 1 is mounted. The mounting surface A of the printed wiring board 2 is located at the position where was. Similarly, as for the mounting surface B, the mounting surface B of the printed wiring board 1 is located where the mounting surface B of the printed wiring board 2 was located. Therefore, the substrate 5
Since the front surface and the back surface have the same pattern arrangement when inverted, they can be manufactured using the same production line.

Further, FIGS. 2A and 2B show a board in which four printed wiring boards are assembled, and printed wiring boards 1 and 2 and printed wiring boards 6 and 7 of the same kind are respectively shown. It is line symmetrical. Also in this case, even if the substrate 5 is inverted, the arrangement of the mounting surfaces of the respective printed wiring boards is the same, so that the front surface and the back surface of the substrate 5 can be run on the same production line. Further, the number of printed wiring boards to be combined on the substrate 5 may be larger in accordance with the production quantity.

[0008]

As described above, according to the multi-sided board of the present invention, it is possible to reduce the production equipment cost and labor cost.
Furthermore, since the production efficiency is improved, the production period can be shortened and the rationalization becomes possible.

[Brief description of drawings]

FIG. 1A is a top view of a multi-chambered substrate according to an embodiment of the present invention, and FIG. 1B is a bottom view of the multi-chambered substrate.

FIG. 2A is a top view of a multi-chamfered substrate according to another embodiment of the present invention. FIG. 2B is a bottom view of the same multi-chamfered substrate.

FIG. 3A is a top view of a conventional multi-chamfered board, and FIG. 3B is a bottom view of the same multi-chamfered board.

[Explanation of symbols]

 1 Printed wiring board 2 Printed wiring board 3 Symmetric axis 4 Reference hole 5 Board 6 Printed wiring board 7 Printed wiring board

Claims (1)

Claim: What is claimed is: 1. A plurality of identical printed wiring boards, each having electronic components mounted on the front surface and the back surface thereof, are arranged on a single board such that their outer shapes are located in line symmetry. Multi-sided board.