JPH05226879A - Component mounting method - Google Patents

Abstract

(57) [Summary] [Object] To reduce the number of empty component supply cassettes that need to be arranged between component supply cassettes according to the tape width of the component in the component supply unit, and to reduce unnecessary movement of the component supply unit. [Structure] After arranging the component supply cassettes in the order of mounting speed, and further arranging the tape widths of the components from small to large to determine the cassette array number, a wasteful empty component supply cassette is removed. Reduce and reduce unnecessary movement of the parts supply unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method which can be suitably applied to a chip component mounting machine or the like.

[0002]

2. Description of the Related Art Conventionally, in the case of creating NC data for mounting in a chip component mounting machine, in order to increase the mounting efficiency, the arrangement position of the component supply cassettes in the component supply unit is determined in order of the component mounting speed. ing.

[0003]

However, even if the arrangement position of the component supply cassette is determined based on the mounting speed order of the components as described above, the width of the tape holding the components is large and small. If the tape width is large, it is necessary to place empty component supply cassettes on both sides of the component supply cassette, so if the arrangement of the component supply cassettes is determined without considering the tape width of the components, the components with large tape width Since the supply cassettes are arranged disjointly, the number of useless empty component supply cassettes increases, and as a result, the movement of the component supply unit is lost.

In view of the above problems of the prior art, it is an object of the present invention to provide a component mounting method which can reduce wasteful empty component supply cassettes and reduce unnecessary movement of the component supply unit.

[0005]

According to the present invention, a plurality of component supply cassettes are arranged in a component supply section, and a component is taken out from a component supply cassette holding a desired component at a predetermined component extraction position and mounted on a board. In the component mounting method, the arrangement of the component supply cassettes is determined in consideration of the tape width of the components set in the component supply cassette.

[0006]

According to the present invention, by determining the arrangement of the component supply cassettes in consideration of the tape width of the components, it is possible to reduce the wasteful empty component supply cassettes and reduce the unnecessary movement of the component supply section. be able to.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting method according to an embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1, step # 1 is a process for taking in the component arrangement information, step # 2 is a process for determining the mounting speed of the component based on the component information and facility operation information, and step # 3 is for the component. Grouping processing is performed for each mounting speed, and step # 4 is a processing for determining the component supply cassette array number by rearranging the component supply cassette width from the small component supply cassette width to the large component supply cassette information within the component mounting speed. In step # 5, the rearranged component arrangement information is output.

Here, as shown in FIG. 2, the component arrangement information in step # 1 is composed of equipment name 6, component name 7, component number 8 and cassette arrangement number 9. As shown in FIG. 3, the part information in step # 2 is composed of a part name 10, a shape code 11, a supply code 12, and the like. As shown in FIG. 4, the equipment operation information includes an equipment name 13, a shape code 14, a mounting speed 15, and the like.

As shown in FIG. 5, the component supply information in step # 4 is composed of a supply code 16 and a cassette width 17.

The respective processes in FIG. 1 will be described in detail below.

Process 1: This is a process for fetching the component arrangement information shown in FIG.

Process 2: This is a process for determining the mounting speed of the component based on the component information of FIG. 3 and the equipment operation information of FIG.

Process 3: As shown in Table 1, this is a process of rearranging parts in order from high speed to low speed according to the mounting speed of the parts.

[0015]

[Table 1]

Process 4: The parts rearranged in Process 3 are shown in FIG.
According to the flow shown in (1), the cassette array number correction table is used to sort the tape widths from small tape width to large tape mounting speed, and the cassette array number is determined as shown in Table 2. If the cassette sequence number is determined in the process 3, the component supply cassettes are wasteful as shown in Table 3.

[0017]

[Table 2]

[0018]

[Table 3]

Process 5: A process for outputting the rearranged component arrangement information.

As described above, according to this embodiment, in a chip component mounter or the like in which various kinds of components are set in the component supply cassette and mounted in the component supply unit, the components to be set in the component supply cassette are By determining the arrangement of the component supply cassettes in consideration of the tape width, it is possible to reduce the number of empty cassettes arranged, reduce the waste of the cassettes, and reduce unnecessary movement of the component supply unit.

[0021]

According to the present invention, as described above, in a chip component mounter or the like in which various types of components are accommodated and mounted in the component supply cassette, the components are set in the component supply cassette. By deciding the arrangement of the component supply cassettes in consideration of the tape width of the components, it is possible to reduce the number of wasted empty component supply cassettes, reduce unnecessary movement of the component supply unit, and reduce the mounting time. It can be shortened and the mobility of equipment can be improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of each process in an embodiment of a component mounting method of the present invention.

FIG. 2 is a configuration diagram of component arrangement information in the embodiment.

FIG. 3 is a configuration diagram of component information according to the embodiment.

FIG. 4 is a configuration diagram of component operation information in the embodiment.

FIG. 5 is a configuration diagram of component supply information in the embodiment.

FIG. 6 is a flow chart showing a method of deciding a cassette array number by rearranging components in the mounting speed from the component tape width to the component tape width in the same embodiment.

Claims (1)

[Claims] 1. A component mounting cassette in which a plurality of component supply cassettes are arranged in a component supply unit, and a component is taken out from a component supply cassette holding a desired component at a predetermined component extraction position and mounted on a board. A component mounting method characterized in that the arrangement of the component supply cassettes is determined in consideration of the tape width of the components set in.