JPH0523635A - Spin coating apparatus and method - Google Patents
Spin coating apparatus and methodInfo
- Publication number
- JPH0523635A JPH0523635A JP3184381A JP18438191A JPH0523635A JP H0523635 A JPH0523635 A JP H0523635A JP 3184381 A JP3184381 A JP 3184381A JP 18438191 A JP18438191 A JP 18438191A JP H0523635 A JPH0523635 A JP H0523635A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- guard plate
- coated
- cleaning
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
(57)【要約】
【目的】 角形の基板、特に長方形の基板に発生する裏
面回り塗布液を簡便に効率良く除去する。
【構成】 表面に塗布液が塗布された基板１３を回転さ
せ、塗布液を遠心力により広げて基板１３の表面に塗布
膜を形成する回転手段であるテーブル１１およびモータ
１２と、基板１３の裏面を洗浄する洗浄液を吐出する洗
浄ノズル１６とを備える。また、基板１３の側辺部に密
着可能であり、かつ洗浄液に対して耐性を有するガード
板１５と、ガード板１５が基板１３の側辺部に密着する
位置、およびガード板１５が基板１３の回転の妨げにな
らない位置にガード板１５を移動させることが可能なガ
ード支持柱１９とを備える。
(57) [Summary] [Purpose] To easily and efficiently remove the backside coating liquid generated on a rectangular substrate, especially a rectangular substrate. [Structure] A table 11 and a motor 12, which are rotating means for rotating a substrate 13 having a surface coated with a coating liquid and spreading the coating liquid by a centrifugal force to form a coating film on the surface of the substrate 13, and a back surface of the substrate 13. And a cleaning nozzle 16 for discharging a cleaning liquid for cleaning. Further, the guard plate 15 that can be in close contact with the side portion of the substrate 13 and is resistant to the cleaning liquid, the position where the guard plate 15 is in close contact with the side portion of the substrate 13, and the guard plate 15 of the substrate 13 A guard support column 19 capable of moving the guard plate 15 to a position that does not hinder rotation is provided.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面に塗布液が塗布さ
れた平板状の被塗布体を回転させ、前記塗布液を遠心力
により広げて前記被体の表面に塗布膜を形成する回転手
段と、前記被塗布体の裏面を洗浄する洗浄液を吐出する
洗浄ノズルとを備えたスピン塗布装置（スピンコータ）
およびスピン塗布方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to rotation for rotating a plate-shaped object to be coated whose surface is coated with a coating solution and spreading the coating solution by centrifugal force to form a coating film on the surface of the object. And a cleaning nozzle for discharging a cleaning liquid for cleaning the back surface of the object to be coated (spin coater)
And a spin coating method.
【０００２】[0002]
【従来の技術】スピン塗布装置は、塗布膜の厚さの均一
性に優れていることから、半導体ウエハ、露光マスク用
の基板等の被塗布体（以下基板という）上に微細パター
ンを形成するホトリソグラフィにおいて、上記基板にフ
ォトレジスト等の塗布液を塗布する際に一般的に用いら
れている。2. Description of the Related Art A spin coating apparatus forms a fine pattern on an object to be coated (hereinafter referred to as a substrate) such as a semiconductor wafer or a substrate for an exposure mask because a coating film has excellent thickness uniformity. In photolithography, it is generally used when applying a coating liquid such as a photoresist to the substrate.
【０００３】しかしながら、スピン塗布装置には、例え
ば図３（ａ），（ｂ）にそれぞれ示すように、回転して
いる角形の基板３３ａ，３３ｂの表面（上面）にその上
側から塗布液を塗布する場合には、各基板３３ａ，３３
ｂの各辺の空気の乱れを比較的強く起こす部分（風を切
る位置）の裏面（下面）に塗布液（以下裏面回り塗布液
３７ａ，３７ｂという）がそれぞれ回り込むことがあ
る。特に厚膜を塗布する場合には、この裏面回り塗布液
３７ａ，３７ｂはかなり広範囲に及ぶものである。However, in the spin coating device, as shown in FIGS. 3A and 3B, for example, the coating liquid is applied from the upper side to the surfaces (upper surfaces) of the rotating rectangular substrates 33a and 33b. When doing so, each of the substrates 33a, 33
In some cases, the coating liquid (hereinafter, referred to as back surface coating liquids 37a and 37b) may go around to the back surface (bottom surface) of the portion (position where the air is cut off) on each side of b where air turbulence is relatively strong. Especially when a thick film is applied, the backside coating liquids 37a and 37b have a fairly wide range.
【０００４】従来、このような裏面回り塗布液に関して
は、下記（イ）、（ロ）、（ハ）の技術のように対処し
たものがある。Conventionally, as for such a backside coating liquid, there are some which have been dealt with as the following techniques (a), (b) and (c).
【０００５】（イ）図４（ａ），（ｂ）に示すように、
長方形の基板４３の裏面回り塗布液４７を除去するため
に基板４３の下側（裏側）に洗浄ノズル４６を設けて基
板を回転させながら洗浄するもの。(A) As shown in FIGS. 4 (a) and 4 (b),
In order to remove the coating liquid 47 around the back surface of the rectangular substrate 43, a cleaning nozzle 46 is provided on the lower side (back side) of the substrate 43 to clean the substrate while rotating the substrate.
【０００６】（ロ）特開平２−１２６９７０号公報に記
載されているように回転プログラムに工夫を凝らして対
処するもの。(B) As described in Japanese Patent Application Laid-Open No. 2-126970, a rotation program is devised to deal with it.
【０００７】（ハ）実開平２−１７２６８号公報および
特開平３−５６１６３号公報にそれぞれ記載されている
ように、凹部を有する基板ホルダを用い、この凹部に基
板を落しこむもの。(C) As described in Japanese Utility Model Application Laid-Open No. 2-17268 and Japanese Patent Application Laid-Open No. 3-56163, a substrate holder having a recess is used, and the substrate is dropped into the recess.
【０００８】[0008]
【発明が解決しようとする課題】上記従来の技術のう
ち、（イ）のものでは、図４（ａ）に示すように、基板
４３の中心部付近に洗浄ノズル４６を設けた場合には実
際に裏面回りが発生する位置まで洗浄液が届かない。ま
た届かせるように単位時間当たりの吐出量を多くする
と、勢いが強いために基板４３表面上に洗浄液が回り込
んでしまう。また、図４（ｂ）に示すように、基板４３
の中心部より離れた位置に洗浄ノズル４６を設けた場合
には、基板４３の長手方向が洗浄ノズル４６上にあると
きは基板４３の下面が洗浄されるが、長手方向が洗浄ノ
ズル４６上から外れたときは洗浄液が基板４３より上に
吐出されることになり、この洗浄液が基板４３の上面に
かかってしまう。Among the above-mentioned conventional techniques, in the case of (a), when the cleaning nozzle 46 is provided near the central portion of the substrate 43, as shown in FIG. The cleaning liquid does not reach the position where the back surface is generated on the. Further, if the discharge amount per unit time is increased so that the cleaning liquid can reach the cleaning liquid, the cleaning liquid wraps around the surface of the substrate 43 due to the strong momentum. In addition, as shown in FIG.
When the cleaning nozzle 46 is provided at a position distant from the center of the substrate, the lower surface of the substrate 43 is cleaned when the longitudinal direction of the substrate 43 is on the cleaning nozzle 46, but the longitudinal direction is from the cleaning nozzle 46. When the cleaning liquid comes off, the cleaning liquid is ejected above the substrate 43, and the cleaning liquid reaches the upper surface of the substrate 43.
【０００９】また、（ロ）のものでは、円形の基板であ
れば空気の乱れが小さいため効果的であるが、空気の乱
れが大きい角形の基板、特に長方形の基板に応用するこ
とは困難である。In the case of (b), a circular substrate is effective because the turbulence of air is small, but it is difficult to apply it to a rectangular substrate where the turbulence of air is large, particularly a rectangular substrate. is there.
【００１０】さらに、（ハ）のものでは、基板ホルダと
基板とを分離するときに塗布液のたれ等の問題が残る。
また、基板を吸着する基板ホルダの凹部が基板よりも大
きい場合には、この凹部と基板との隙間に塗布液が入り
込んでしまうことがある。Further, in the case of (C), there remains a problem such as dripping of the coating liquid when separating the substrate holder and the substrate.
Further, when the concave portion of the substrate holder that adsorbs the substrate is larger than the substrate, the coating liquid may enter the gap between the concave portion and the substrate.
【００１１】本発明は、角形の基板、特に長方形の基板
に発生する裏面回り塗布液を簡便に効率良く除去するス
ピン塗布装置および方法を提供することを目的とする。It is an object of the present invention to provide a spin coating apparatus and method for easily and efficiently removing the backside coating liquid generated on a rectangular substrate, particularly a rectangular substrate.
【００１２】[0012]
【課題を解決するための手段】本発明のスピン塗布装置
は、表面に塗布液が塗布された平板状の被塗布体を回転
させ、前記塗布液を遠心力により広げて前記被塗布体の
表面に塗布膜を形成する回転手段と、前記被塗布体の裏
面を洗浄する洗浄液を吐出する洗浄ノズルとを備えたス
ピン塗布装置において、前記被塗布体の側辺部に密着可
能であり、かつ前記洗浄液に対して耐性を有するガード
板と、前記ガード板が前記被塗布体の側辺部に密着する
位置、および前記ガード板が前記被塗布体の回転の妨げ
にならない位置に前記ガード板を移動させることが可能
なガード板移動手段とを備えることを特徴とする。According to the present invention, there is provided a spin coating apparatus, wherein a flat plate-shaped object to be coated having a surface coated with a coating solution is rotated, and the coating solution is spread by centrifugal force to cause the surface of the object to be coated. In a spin coating device comprising a rotating means for forming a coating film on the substrate, and a cleaning nozzle for ejecting a cleaning liquid for cleaning the back surface of the object to be coated, the spin coating device is capable of being in close contact with the side portion of the object to be coated, and The guard plate having resistance to the cleaning liquid, the position where the guard plate is in close contact with the side of the object to be coated, and the position where the guard plate does not hinder the rotation of the object to be coated are moved. And a guard plate moving means capable of moving the guard plate.
【００１３】また、本発明のスピン塗布方法は、被塗布
体の表面に塗布液を塗布し、前記被塗布体を回転させて
前記被塗布体の表面に塗布膜を形成した後、前記本発明
のスピン塗布装置が備えるガード板を前記被塗布体の側
辺部に密着させ、前記被塗布体の裏面を洗浄する洗浄液
を吐出することを特徴とする。In the spin coating method of the present invention, the coating liquid is applied to the surface of the article to be coated, the article to be coated is rotated to form a coating film on the surface of the article to be coated, and then the present invention is applied. The spin coating apparatus is provided with a guard plate in close contact with a side portion of the object to be coated, and a cleaning liquid for cleaning the back surface of the object to be coated is discharged.
【００１４】[0014]
【作用】洗浄ノズルより洗浄液を吐出させて裏面回り塗
布液を除去するとき、洗浄液の吐出圧力は、被塗布体の
側辺部にガード板があるため、強めでも被塗布体の上面
にかかることがない。したがって、角形の基板、特に長
方形の被塗布体に発生する裏面回り塗布液を簡便に効率
良く除去できる。When the cleaning liquid is discharged from the cleaning nozzle and the coating liquid around the back surface is removed, the discharge pressure of the cleaning liquid is applied to the upper surface of the object to be coated even if it is strengthened because the guard plate is on the side of the object to be coated. There is no. Therefore, it is possible to easily and efficiently remove the coating liquid around the back surface generated on the rectangular substrate, particularly the rectangular object to be coated.
【００１５】[0015]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１６】図１（ａ）は本発明のスピン塗布装置の一
実施例を示す概略側面図、図１（ｂ）は図１（ａ）の一
部を省略した概略平面図である。FIG. 1A is a schematic side view showing an embodiment of the spin coating apparatus of the present invention, and FIG. 1B is a schematic plan view with a part of FIG. 1A omitted.
【００１７】本実施例のスピン塗布装置は、図１（ａ）
に示すように、角形（長方形）の基板１３が搭載され
る、基板１３よりも小さいテーブル１１と、このテーブ
ル１１を回転させるモータ１２を備えている。テーブル
１には図示しない真空吸着装置が設けられており、ま
た、基板１３の下方には洗浄ノズル１６が、基板１３の
上方には塗布ノズル１８がそれぞれ設けられている。さ
らに、本実施例のスピン塗布装置は、基板１３の側辺部
に密着可能であり、かつ洗浄ノズル１６から吐出される
洗浄液に対して耐性を有するガード板１５と、ガード板
１５を支持するガード板支持柱１９とを備えている。こ
のガード板支持柱１９は、矢印Ｙ方向（図示上下方向）
に伸縮可能であり、基板１５が回転するときは、縮んで
ガード板１５が基板１３の回転の妨げにならない位置、
すなわち基板１５よりも充分低い高さにガード板１５を
下降（退避）させ、洗浄ノズル１６より洗浄液を吐出す
るときは、伸びてガード板１５が基板１３の側辺部に密
着する位置、すなわちガード板１５を基板１３と同等の
高さにガード板１５を上昇させることが可能であるとと
もに、基板１５の大きさに応じて水平方向すなわち矢印
Ｘ方向（図示左右方向）にガード板１５を移動させるこ
とが可能なガード板移動手段である。The spin coating apparatus of this embodiment is shown in FIG.
As shown in, a table 11 smaller than the substrate 13 on which a rectangular (rectangular) substrate 13 is mounted, and a motor 12 for rotating the table 11 are provided. A vacuum suction device (not shown) is provided on the table 1, a cleaning nozzle 16 is provided below the substrate 13, and a coating nozzle 18 is provided above the substrate 13. Further, the spin coating apparatus according to the present embodiment can be closely attached to the side portion of the substrate 13, and has a guard plate 15 that is resistant to the cleaning liquid discharged from the cleaning nozzle 16, and a guard plate that supports the guard plate 15. And a plate support column 19. This guard plate support pillar 19 is in the arrow Y direction (the vertical direction in the drawing).
A position where the guard plate 15 does not interfere with the rotation of the substrate 13 when the substrate 15 rotates,
That is, when the guard plate 15 is lowered (retracted) to a height sufficiently lower than the substrate 15 and the cleaning liquid is ejected from the cleaning nozzle 16, the guard plate 15 extends and the guard plate 15 comes into close contact with the side portion of the substrate 13, that is, the guard. It is possible to raise the guard plate 15 to the same height as the substrate 13, and move the guard plate 15 in the horizontal direction, that is, in the arrow X direction (left and right direction in the drawing) according to the size of the substrate 15. It is a possible guard plate moving means.
【００１８】次に、本実施例の使用法について説明す
る。Next, the usage of this embodiment will be described.
【００１９】まず、あらかじめガード板支持柱１９を縮
めてガード板１５を図示下方に退避させてから、基板１
３をテーブル１１に搭載して吸着し、モータ１２により
テーブル１１を回転させ、塗布ノズル１８より塗布液を
吐出させて基板１３上に塗布する。塗布が進むにつれ
て、基板１５の下面には塗布液（以下裏面回り塗布液１
７という）が回り込む。次に、モータ１２を停止させ、
基板１３を静止させた状態で、図１（ａ），（ｂ）に示
すように、矢印Ｘ方向の位置を調製しながらガード板支
持柱１９を伸ばしてガード板１５を基板１３の裏面回り
塗布液１７の位置の側辺部に密着するように固定する。
この状態で、洗浄ノズル１６より洗浄液を吐出させて裏
面回り塗布液１７を除去する。このとき、洗浄液の吐出
圧力は、基板１３の側辺部にガード板１５があるため、
強めでも基板１３の上面にかかることがない。したがっ
て、角形の基板、特に長方形の基板１３に発生する裏面
回り塗布液１７を簡便に効率良く除去できる。First, the guard plate support pillar 19 is contracted in advance to retract the guard plate 15 downward in the drawing, and then the substrate 1
3 is mounted on the table 11 and sucked, and the table 11 is rotated by the motor 12 to discharge the coating liquid from the coating nozzle 18 to coat the substrate 13. As the coating progresses, the coating liquid (hereinafter referred to as backside coating liquid 1
7) goes around. Next, stop the motor 12,
With the substrate 13 stationary, as shown in FIGS. 1A and 1B, while adjusting the position in the arrow X direction, the guard plate support pillar 19 is extended to apply the guard plate 15 around the back surface of the substrate 13. The liquid 17 is fixed so as to be in close contact with the side portion at the position.
In this state, the cleaning liquid is discharged from the cleaning nozzle 16 to remove the backside coating liquid 17. At this time, since the discharge pressure of the cleaning liquid is the guard plate 15 on the side of the substrate 13,
Even if it is strengthened, it does not reach the upper surface of the substrate 13. Therefore, the back surface coating liquid 17 generated on the rectangular substrate, particularly the rectangular substrate 13, can be simply and efficiently removed.
【００２０】以上説明した本実施例では、塗布液の吐出
は、基板を回転させて行なうものとしたが、基板を静止
させていてもよい。また、テーブルの形は円形でも角形
でもよい。ガード板の材質は、基板に密着可能であり、
かつ洗浄液に対して耐性を有するものであれば特に限定
されることはないが、フッ素樹脂等の樹脂板が好まし
い。ガード板の厚みは、基板より薄いものであれば特に
限定されない。さらに、洗浄ノズルの取り付け位置は裏
面回り塗布液の真下またはその近傍であり、基板中心点
と基板の角を結んだ線の中点より外側が好ましい。ま
た、ガード板支持柱は、水平方向の移動量が基板の大き
さに比べ充分大きければ、伸縮する必要がない。In this embodiment described above, the coating liquid is discharged by rotating the substrate, but the substrate may be stationary. Further, the shape of the table may be circular or rectangular. The material of the guard plate can be closely attached to the board,
There is no particular limitation as long as it has resistance to the cleaning liquid, but a resin plate such as a fluororesin is preferable. The thickness of the guard plate is not particularly limited as long as it is thinner than the substrate. Furthermore, the mounting position of the cleaning nozzle is immediately below the coating liquid around the back surface or in the vicinity thereof, and is preferably outside the midpoint of the line connecting the substrate center point and the substrate corner. Further, the guard plate support pillar does not need to expand and contract if the amount of horizontal movement is sufficiently larger than the size of the substrate.
【００２１】［実験例１］図１（ａ），（ｂ）に示すス
ピン塗布装置として、直径１２ｃｍの円形のテーブル１
上に長方形（３０ｃｍ×１５ｃｍ）のガラス製の基板１
３（厚さ１ｍｍ）を中心をそろえて設置し、真空吸着し
た。次いで、基板１３の表面中心部に図示しない塗布ノ
ズルを用いて塗布液としてポジティブ型レジスト（ＡＺ
４９０３、ヘキスト社製）を塗布し、１５００ｒｐｍで
２分間回転させ、基板１３上に均一なレジスト膜１４を
作製した。[Experimental Example 1] As a spin coating apparatus shown in FIGS. 1A and 1B, a circular table 1 having a diameter of 12 cm was used.
Rectangular (30 cm x 15 cm) glass substrate 1 on top
No. 3 (thickness 1 mm) was placed with its center aligned and vacuum-adsorbed. Next, using a coating nozzle (not shown), a positive resist (AZ
4903, manufactured by Hoechst Co., Ltd.) and rotated at 1500 rpm for 2 minutes to form a uniform resist film 14 on the substrate 13.
【００２２】次いで、１２ｃｍ×５ｃｍ、厚さ０．５ｍ
ｍの長方形のポリテトラフルオロエチレン製のガード板
１５を基板１３の裏面回り塗布液１７の発生位置の側辺
部に密着させた。そして、洗浄ノズル１６より洗浄液と
してアセトンを１０ｋｇｆ／ｃｍ2 の圧力で吐出し、裏
面回り塗布液１７を洗浄した。Next, 12 cm × 5 cm, thickness 0.5 m
A rectangular m-shaped polytetrafluoroethylene guard plate 15 was adhered around the back surface of the substrate 13 to the side portion of the position where the coating liquid 17 was generated. Then, acetone as a cleaning liquid was discharged from the cleaning nozzle 16 at a pressure of 10 kgf / cm 2 to clean the backside coating liquid 17.
【００２３】裏面回り塗布液１７は完全に除去され、洗
浄液の基板１３の表面への回り込みもガード板１５のた
めに発生せず、良好な結果が得られた。The backside coating liquid 17 was completely removed, and the cleaning liquid did not wrap around to the front surface of the substrate 13 due to the guard plate 15. Good results were obtained.
【００２４】［実験例２］図２（ａ）に示すスピン塗布
装置として、１５ｃｍ×１０ｃｍの長方形のテーブル２
１ａ上に長方形（２０ｃｍ×１５ｃｍ）のシリコン製の
基板２３ａ（厚さ０．６ｍｍ）を中心をそろえて設置
し、真空吸着した。次いで、３００ｒｐｍで基板２３ａ
を回転させながら基板２３ａの表面中心部に図示しない
塗布ノズルを用いて塗布液としてレジスト（ＴＦ−２
０、シプレイ社製）を滴下し、滴下終了後、１０００ｒ
ｐｍで９０秒間基板２３ａを回転させ、基板２３ａ上に
均一なレジスト膜（不図示）を形成した。[Experimental Example 2] As a spin coating apparatus shown in FIG. 2A, a rectangular table 2 of 15 cm × 10 cm was used.
A rectangular (20 cm × 15 cm) silicon substrate 23a (having a thickness of 0.6 mm) was placed on 1a with its center aligned and vacuum-adsorbed. Then the substrate 23a at 300 rpm
While rotating the substrate, a resist (TF-2
0, made by Shipley Co., Ltd., and after completion of the dropping, 1000r
The substrate 23a was rotated at pm for 90 seconds to form a uniform resist film (not shown) on the substrate 23a.
【００２５】次いで、１０ｃｍ×５ｃｍ、厚さ０．３ｍ
ｍの長方形のエチレン−プロピレンゴム製のガード板２
５ａを基板２３ａの裏面回り塗布液２７ａの発生位置の
側辺部に密着させた。そして、洗浄ノズル２６ａより洗
浄液としてメチルエチルケトンを１０ｋｇｆ／ｃｍ2 の
圧力で吐出し、裏面回り塗布液２７ａを洗浄した。Next, 10 cm × 5 cm, thickness 0.3 m
m rectangular ethylene-propylene rubber guard plate 2
5a was brought into close contact with the side of the back surface of the substrate 23a where the coating liquid 27a was generated. Then, methyl ethyl ketone as a cleaning liquid was discharged from the cleaning nozzle 26a at a pressure of 10 kgf / cm 2 to clean the backside coating liquid 27a.
【００２６】裏面回り塗布液２７ａは完全に除去され、
洗浄液の基板２３ａの表面への回り込みもガード板２５
ａのために発生せず、良好な結果が得られた。The back surface coating liquid 27a is completely removed,
The guard plate 25 also prevents the cleaning liquid from flowing to the surface of the substrate 23a.
It did not occur because of a, and good results were obtained.
【００２７】［実験例３］図２（ｂ）に示すスピン塗布
装置として、直径１２ｃｍの円形のテーブル２１ｂ上に
長方形（３０ｃｍ×１５ｃｍ）のガラス製の基板２３ｂ
（厚さ１ｍｍ）を中心をそろえて設置し、真空吸着し
た。次いで、基板２３ｂの表面中心部に図示しない塗布
ノズルを用いて塗布液（フォトニース、東レ社製）を塗
布し、３００ｒｐｍで基板２３ｂを回転させ、基板２３
ｂ上に均一な塗布膜（不図示）を形成した。[Experimental Example 3] As the spin coater shown in FIG. 2 (b), a rectangular (30 cm × 15 cm) glass substrate 23b on a circular table 21b having a diameter of 12 cm.
(Thickness 1 mm) was placed with its center aligned and vacuum-adsorbed. Next, a coating liquid (Photo Nice, manufactured by Toray Industries, Inc.) is applied to the central portion of the surface of the substrate 23b using an application nozzle (not shown), and the substrate 23b is rotated at 300 rpm.
A uniform coating film (not shown) was formed on b.
【００２８】次いで、直径１２ｃｍ、厚さ０．５ｍｍの
半円形のポリテトラフルオロエチレン製のガード板２５
ｂを基板２３ｂの裏面回り塗布液２７ｂの発生位置の側
辺部に密着させた。そして、洗浄ノズル２６ｂより洗浄
液としてＮ−メチル−２−ピロリドンを１５ｋｇｆ／ｃ
ｍ2 の圧力で吐出し、裏面回り塗布液２７ｂを洗浄し
た。Next, a semicircular guard plate 25 made of polytetrafluoroethylene having a diameter of 12 cm and a thickness of 0.5 mm.
b was brought into close contact with the side of the back surface of the substrate 23b where the coating liquid 27b was generated. Then, 15 kgf / c of N-methyl-2-pyrrolidone as a cleaning liquid is supplied from the cleaning nozzle 26b.
It was discharged at a pressure of m 2 to wash the backside coating liquid 27b.
【００２９】裏面回り塗布液２７ｂは完全に除去され、
洗浄液の基板２３ｂの表面への回り込みもガード板２５
ｂのために発生せず、良好な結果が得られた。The backside coating liquid 27b is completely removed,
The guard plate 25 prevents the cleaning liquid from wrapping around the surface of the substrate 23b.
It did not occur due to b, and good results were obtained.
【００３０】[0030]
【発明の効果】本発明のスピン塗布装置および方法は、
角形の基板、特に長方形の基板に発生する裏面回り塗布
液を簡便に効率良く除去できる。The spin coating apparatus and method of the present invention are
The coating liquid around the back surface generated on a rectangular substrate, particularly a rectangular substrate, can be removed easily and efficiently.
【００３１】また、本発明のスピン塗布装置は、装置構
成が簡単であり、低コストで作製できる。The spin coating apparatus of the present invention has a simple apparatus configuration and can be manufactured at low cost.
【図１】（ａ）は本発明のスピン塗布装置の一実施例を
示す概略側面図、（ｂ）は図１（ａ）の一部を省略した
概略平面図である。1A is a schematic side view showing an embodiment of a spin coating apparatus of the present invention, and FIG. 1B is a schematic plan view in which a part of FIG. 1A is omitted.
【図２】（ａ）は実験例２で用いたスピン塗布装置を示
す概略平面図、（ｂ）は実験例３で用いたスピン塗布装
置を示す概略平面図である。2A is a schematic plan view showing a spin coating apparatus used in Experimental Example 2, and FIG. 2B is a schematic plan view showing a spin coating apparatus used in Experimental Example 3. FIG.
【図３】（ａ），（ｂ）はスピン塗布装置の従来例を示
す平面図である。3A and 3B are plan views showing a conventional example of a spin coating apparatus.
【図４】（ａ），（ｂ）はスピン塗布装置の従来例を示
す平面図である。4A and 4B are plan views showing a conventional example of a spin coating apparatus.
１１，２１ａ，２１ｂ テーブル １２ モータ １３，２３ａ，２３ｂ 基板 １４ レジスト膜 １５，２５ａ，２５ｂ ガード板 １６，２６ａ，２６ｂ 洗浄ノズル １７，２７ａ，２７ｂ 裏面回り塗布液 １８ 塗布ノズル １９ ガード板支持柱 11,21a, 21b table 12 motors 13,23a, 23b Substrate 14 Resist film 15,25a, 25b Guard plate 16, 26a, 26b Cleaning nozzle 17, 27a, 27b Backside coating liquid 18 Application nozzle 19 Guard plate support pillar
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/027 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 21/027
Claims (2)
布体を回転させ、前記塗布液を遠心力により広げて前記
被塗布体の表面に塗布膜を形成する回転手段と、前記被
塗布体の裏面を洗浄する洗浄液を吐出する洗浄ノズルと
を備えたスピン塗布装置において、 前記被塗布体の側辺部に密着可能であり、かつ前記洗浄
液に対して耐性を有するガード板と、 前記ガード板が前記被塗布体の側辺部に密着する位置、
および前記ガード板が前記被塗布体の回転の妨げになら
ない位置に前記ガード板を移動させることが可能なガー
ド板移動手段とを備えることを特徴とするスピン塗布装
置。1. A rotating means for rotating a flat plate-shaped object whose surface is coated with the coating liquid and spreading the coating liquid by centrifugal force to form a coating film on the surface of the surface of the object to be coated; In a spin coating apparatus having a cleaning nozzle for ejecting a cleaning liquid for cleaning the back surface of an application body, a guard plate that can be in close contact with a side portion of the object to be coated, and has resistance to the cleaning liquid, The position where the guard plate is in close contact with the side portion of the object to be coated,
And a guard plate moving means capable of moving the guard plate to a position where the guard plate does not hinder the rotation of the object to be coated.
被塗布体を回転させて前記被塗布体の表面に塗布膜を形
成した後、請求項１記載のスピン塗布装置が備えるガー
ド板を前記被塗布体の側辺部に密着させ、前記被塗布体
の裏面を洗浄する洗浄液を吐出することを特徴とするス
ピン塗布方法。2. The guard provided in the spin coating apparatus according to claim 1, after applying a coating liquid to the surface of the object to be coated and rotating the object to be coated to form a coating film on the surface of the object to be coated. A spin coating method comprising: bringing a plate into close contact with a side portion of the object to be coated and discharging a cleaning liquid for cleaning the back surface of the object to be coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3184381A JPH0523635A (en) | 1991-07-24 | 1991-07-24 | Spin coating apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3184381A JPH0523635A (en) | 1991-07-24 | 1991-07-24 | Spin coating apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0523635A true JPH0523635A (en) | 1993-02-02 |
Family
ID=16152199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3184381A Pending JPH0523635A (en) | 1991-07-24 | 1991-07-24 | Spin coating apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0523635A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014130208A (en) * | 2012-12-28 | 2014-07-10 | Hoya Corp | Holding device for spectacle lens base material and coating liquid coating device |
-
1991
- 1991-07-24 JP JP3184381A patent/JPH0523635A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014130208A (en) * | 2012-12-28 | 2014-07-10 | Hoya Corp | Holding device for spectacle lens base material and coating liquid coating device |
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