JPH05245672A - Laser drilling device - Google Patents

Abstract

PURPOSE:To always machine the diameter of a hole to be machined with high accuracy by providing a suction means to adsorb a machining face on the tip surface of a contact part of a material to be machined. CONSTITUTION:The tip face A11 of the contact part of the material B to be machined enclosing the neighborhood of the focus of laser beam R is brought into contact with the material B to be machined to be drilled. Hence, the suction means is provided to adsorb the machining surface B1 of the material B to be machined to the tip face A11 of the contact part of the material B to be machined. The suction means consists of the contact part A1 of the tubular material to be machined enclosing the neighborhood of the focus of the laser beam R, an air suction passage A5 to communicate with the space A4 in this tube and an air suction apparatus connecting with it. In this way, the distance between the machining surface of the material to be machined and a condensing lens can be fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser hole drilling apparatus, and more particularly to a laser hole drilling apparatus for performing highly accurate drilling on a thin workpiece.

[0002]

2. Description of the Related Art FIG. 3 to FIG. 5 use a conventional laser hole drilling apparatus A to drill a small and highly accurate hole having a diameter of about 30 .mu.m on a diaphragm B of a differential thermal sensor which is a workpiece. FIG. 3 is an explanatory view of the case where the height H is lower than the reference value due to the variation of the diaphragm B. Therefore, the tip surface A _{11 of the} workpiece contact portion A ₁ of the laser hole machining apparatus A and the diaphragm B are FIG. 6 is a cross-sectional view of relevant parts for explaining a state in which a gap is formed between the hole-punched surface B ₁ and high-precision hole-punching cannot be performed. Fig. 4 shows the height H due to the variation of the diaphragm B.
Is higher than the reference value, the tip end surface A _{11 of the} workpiece contact portion A ₁ of the laser hole machining apparatus A presses the perforated surface B ₁ of the diaphragm B downward, and the perforated surface B ₁ bends downward. FIG. 4 is a cross-sectional view of a main part for explaining a state in which high-precision drilling cannot be performed. FIG. 5 is a cross-sectional view showing the diaphragm B.

As shown in FIGS. 3 and 4, the laser hole machining apparatus A includes a condenser lens A ₂ for condensing the laser light R and a workpiece contact portion A surrounding the focal point of the laser light R. ₁ and a disc-shaped protective glass A ₃ for preventing the dust generated during the drilling process from adhering to the condenser lens A _2.
It has and. The workpiece contact portion A ₁ has a cylindrical shape, and a funnel-shaped space A ₄ having an upward spread through which the laser light R can pass is formed inside the workpiece contact portion A ₁ , and the funnel-shaped space A ₄ A protective glass A ₃ is fitted to the workpiece contact portion A ₁ so as to close the upper portion of the funnel-shaped space A _{4 on} the upper part of the. Further, a small cylindrical protrusion A ₁₂ that forms the tip end surface A ₁₁ of the workpiece contact portion A ₁ is formed in the lower portion of the funnel-shaped space A ₄ .

[0004] Laser light R transmitted through the condensing lens A ₂ is transmitted through the condensing lens A _2, substantially in the center plane distal end surface A ₁₁ of the workpiece contact portions A ₁ of the laser hole processing unit A is formed The focus position is set so that the focus position can be adjusted slightly up and down depending on the size of the processed hole. The diaphragm B, which is a workpiece, is an extremely thin stainless foil having a thickness of about 20 μm.

[0005]

Therefore, as shown in FIG.
The height H is low due to the variation of the sea urchin diaphragm B and the tip surface A
₁₁And drilled surface B₁There is a gap between the
As shown, the height H is high due to the variation of the diaphragm B.
End face A₁₁With drilled surface B₁Is pressed and bent, the tip surface
A₁₁And drilled surface B₁There is a gap between
And the focal point of the laser beam R is a perforated surface B₁Match
However, there was a problem that the hole of the aimed diameter was not clear.

The present invention has been made in order to solve the above problems, and an object of the present invention is to make a machined hole diameter always a target diameter even if the workpiece has dimensional variation. The object of the present invention is to provide a laser hole drilling device that can be machined into any shape.

[0007]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a method according to the first aspect of the invention, wherein the tip end surface of the workpiece contact portion surrounding the vicinity of the focal point of the laser beam is the workpiece. In the laser hole drilling device for making a hole by making contact with the processed surface of, the suction means for adsorbing the workpiece to the tip end surface of the workpiece contact portion is provided, In the invention of claim 2, the suction means is
A cylindrical workpiece contact portion that surrounds the vicinity of the focus of the laser light,
An air suction passage communicating with the in-cylinder space of the workpiece contact portion;
An air suction device connected to the air suction passage is provided. In the invention of claim 3, the suction means surrounds the vicinity of the focus of the laser beam and has a ring-shaped thin groove on the tip end surface. It is composed of a formed cylindrical workpiece contact portion, an air suction passage communicating with the groove, and an air suction device connected to the air suction passage.

[0008]

With the above construction, the machining surface of the work piece is attracted to the tip end surface of the work piece contact portion by the suction means, so that the work piece is machined. The surface always coincides with the plane formed by the tip end surface of the workpiece contact portion, and in the invention of claim 2, since the atmospheric pressure in the cylinder space of the workpiece contact portion decreases, The machined surface of the work piece is sucked into the central portion of the plane formed by the tip surface of the contact part, and the machined surface of the work piece always coincides with the plane formed by the tip surface of the work piece contact part. According to the invention of Item 3, the air pressure in the ring-shaped thin groove formed on the tip surface of the cylindrical workpiece contact portion decreases, so that the ring-shaped thin groove on the tip surface of the workpiece contact portion decreases. The machined surface of the workpiece is sucked into the machine, and the machined surface of the workpiece is always the plane formed by the tip surface of the workpiece contact part. It matches the.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the laser hole machining apparatus according to the present invention will be described below with reference to FIG. 1, and a different embodiment will be described with reference to FIG.

FIG. 1 shows a laser hole drilling apparatus A according to one embodiment.
FIG. 6 is a cross-sectional view of a main part for explaining a state in which a small and highly accurate drilling process is performed on the diaphragm B of the differential heat sensor that is a workpiece by using the. The laser hole processing apparatus A shown in FIG. 1 is different from the conventional one in that the air suction path A ₅ communicating with the funnel-shaped space A ₄ corresponding to the in-cylinder space is formed from the side surface of the workpiece contact portion A _1. the workpiece contact portions a ₁ provided with through is the air suction path a ₅ and continuous with the workpiece contact portions a ₁ to intersecting portions of the side surface of the workpiece contact portions a ₁ a cylindrical protrusion Toko provided with air suction ports a _6, providing the air suction device (not shown), and, by connecting the air suction port a ₆ and the air suction device (not shown) with a rubber tube a ₇ is there. Since the same parts as those in the conventional art are designated by the same reference numerals, detailed description thereof will be omitted.

Accordingly, pressure in the funnel-shaped space A ₄ is lowered, the force that sucks the working surface B ₁ of the diaphragm B together with air from the lower portion of the funnel-shaped space A ₄ is applied. Therefore,
During the processing surface B ₁ and the front end surface A ₁₁ of the workpiece contact portions A _1, if Sashidase the diaphragm B by remembering certain gap directly below the workpiece contact portions A _1, is processed surface B ₁ The diaphragm B is lifted by adsorbing to the bottom of the funnel-shaped space A ₄ . The air suction device (not shown) is provided with a suction pressure control mechanism, and the processing surface B ₁ has a funnel-shaped space A ₄
When the suction resistance is increased by adsorbing to the lower part of the suction pressure, the suction pressure is reduced, and the suction is prevented from being forced.

Therefore, the machined surface B ₁ has a workpiece contact portion A ₁ irrespective of the size variation of the height H of the diaphragm B.
Always coincides with the plane formed by the front end surface A ₁₁ of the laser beam, and the focus of the laser beam R coincides with the processed surface B ₁ . Therefore, machined surface B ₁
In this way, it is possible to drill holes with the desired hole diameter with high precision.

FIG. 2 shows a laser hole drilling apparatus according to another embodiment.
Diaphragm of differential thermal sensor which is the work piece using A
The state where small and high-precision drilling is performed on
It is an important section sectional view explaining. Laser hole processing shown in Figure 2
The device A is different from the conventional one in that the workpiece contact portion A is₁
Tip surface A₁₁Ring-shaped narrow groove A₈Forming a groove A ₈
Air suction path A communicating with_FiveWith the air suction path
A_FiveAnd workpiece contact part A₁Is added to the intersection with the side of
Work contact part A₁Is a cylindrical protrusion that is continuous with
Exit A₆Equipped with an air suction device (not shown).
Marked and rubber tube A₇With air suction port A₆And air intake
That is, a pulling device (not shown) is connected. In addition,
Since the same parts as in the past are given the same symbols, details
The description is omitted.

Therefore, the air pressure in the space in the groove A ₈ is lowered,
A force that sucks the processed surface B ₁ of the diaphragm B together with air acts from the opening of the lower surface of the groove A ₈ . Therefore, machined surface B ₁
When the diaphragm B is inserted right below the workpiece contact portion A _{1 with} a certain gap between the workpiece contact portion A _{1 and} the tip surface A ₁₁ of the workpiece contact portion A ₁ , the processed surface B ₁ becomes the lower surface of the groove A ₈ . The diaphragm B is sucked up by the opening and lifted up. An air suction device (not shown) is provided with a suction pressure control mechanism. When the machining surface B ₁ is adsorbed by the lower surface opening of the groove A ₈ and suction resistance increases, the suction pressure decreases, and the force is increased. However, since the width of the opening of the lower surface of the groove A ₈ is narrow, the processing surface B ₁ can be bent to the suction side even without using a suction pressure control mechanism of high accuracy. However, an air suction device (not shown) having a simple suction pressure control mechanism is sufficient. Further, even if it is slightly bent, the bending surface is not the portion directly drilled by the laser beam R, so that the accuracy of the hole diameter can be secured.

Therefore, the machined surface B ₁ has a workpiece contact portion A ₁ irrespective of the size variation of the height H of the diaphragm B.
Always coincides with the plane formed by the front end surface A ₁₁ of the laser beam, and the focus of the laser beam R coincides with the processed surface B ₁ . Therefore, machined surface B ₁
In this way, it is possible to drill a hole with the desired hole diameter with high accuracy.

It is needless to say that the present invention is not limited to the embodiments, magnetic force or electrostatic force may be used as the suction means, and the material of the workpiece may be iron or copper.

[0017]

Since the laser hole drilling apparatus of the present invention is constructed as described above, the invention according to claim 1 has suction means even if the workpiece has dimensional variations. The machined surface of the work piece matches the plane formed by the tip surface of the work piece contact area, and the distance from the condenser lens is kept constant, so the machined hole diameter can always be machined to the target hole diameter with high accuracy. In the invention according to claim 2, since the suction force by the difference in air pressure is adopted as the suction means, it is possible to perform high-precision drilling regardless of the material of the workpiece, and the invention according to claim 3 In that case, even if the suction force due to the difference in air pressure is not finely adjusted, the machined surface of the workpiece to be directly drilled by the laser beam R does not bend, and simple and highly accurate drilling can be performed. The effect that a laser hole processing device can be provided is exhibited.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part for explaining an embodiment of a laser hole drilling device of the present invention.

FIG. 2 is a sectional view of an essential part for explaining another embodiment of the laser hole drilling device of the present invention.

FIG. 3 is a cross-sectional view of an essential part for explaining a conventional laser hole drilling device.

FIG. 4 is a cross-sectional view of essential parts for explaining a conventional laser hole drilling device.

FIG. 5 is a cross-sectional view showing a workpiece.

[Explanation of symbols]

A Laser hole processing device A ₁ Workpiece contact part A ₁₁ Tip surface A ₄ Cylinder space A ₅ Air suction path A ₈ groove B Workpiece B ₁ Work surface R Laser light

Claims (3)

[Claims] 1. A laser hole drilling apparatus for making a hole by bringing a tip end surface of a work piece contact portion surrounding a vicinity of a focus of laser light into contact with the work piece, wherein the work surface of the work piece is the work piece. A laser hole processing apparatus, characterized in that suction means for adsorbing to the tip surface of the contact portion is provided. 2. The suction means includes a cylindrical workpiece contact portion surrounding the vicinity of the focal point of the laser beam, an air suction passage communicating with an in-cylinder space of the workpiece contact portion, and the air suction passage. The laser hole drilling apparatus according to claim 1, wherein the laser hole drilling apparatus comprises an air suction device connected thereto. 3. A cylindrical workpiece contact portion surrounding the vicinity of the focal point of the laser beam and having a ring-shaped thin groove formed on the tip surface of said suction means, an air suction path communicating with said groove, The laser hole machining apparatus according to claim 1, comprising an air suction device connected to the air suction path.