JPH052603Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a plate plating device for partially plating frames for electronic components such as IC lead frames.

[Prior Art] Normally, when manufacturing lead frames used in semiconductor integrated circuit packages, a plurality of identical patterns are continuously formed in series by etching or punching a thin plate, and these identical patterns form continuous leads. Only the wiring portion of the frame continuum is partially plated, and then each pattern is separated.
That is, gold plating is applied only partially to the area where the integrated circuit is mounted (the island part) and the area where the bonding between the electrodes of the integrated circuit is made using thin metal wires (the tip of the inner lead). This partial plating employs an electroplating method in which the lead frame side is used as a cathode and the plating liquid supply side is used as an anode.

As shown in FIGS. 5 and 6, in the conventional plate plating device, a continuous lead frame as the body 2 to be plated is placed on a mask 3, and the plating liquid flows from the gap between the body 2 to be plated. The object to be plated 2 is held down by a holding member 4 made of soft rubber to prevent leakage. This pressing member 4 is further pressed by a press plate 5 equipped with an air cylinder. As shown in the figure, a part of the press plate 5 and the holding member 4 are cut out to form a groove and a hole as a cathode storage space. This allows the tips of the legs 7 to be pressed against the upper surface of the body 2 to be plated. The diameter of the hole for guiding the leg 7 is 5 to 8 mm. The legs 7 are made of stainless steel round rods or prismatic shapes. Further, a lead wire 8 extending from the electrode body 6 is connected to a negative pole of a power source (not shown) of the plating device. On the other hand, a spargeer 9 for spraying plating liquid is provided below the body 2 to be plated, so that the plating liquid is sprayed onto the exposed surface of the body 2 to be plated located in the opening of the mask 3. This sparger 9 is provided with an anode such as a platinum electrode (not shown), which is connected to the positive electrode of the plating device power source.

When plating a continuous lead frame with such a plate plating device, the body 2 to be plated is placed on the mask 3, and the presser member 4 and press plate 5 are
The body 2 to be plated is pressed down and fixed, the tip of the leg 7 is brought into contact with the body 2 to be plated, and the plating liquid is force-fed to the sparger 9 via the spargeer 9, and the plating liquid is directed upward from below through the spargeer 9. Spray liquid. When the plating liquid is injected, a current flows from the plating liquid supply side to the plated object 2 through the plating liquid, and gold is deposited on the treated surface of the plated object 2, forming a plating layer.

[Problems to be Solved by the Invention] However, in the conventional plate plating device, the legs of the cathode electrode directly contact the object to be plated at only one place, so if the object to be plated is a thin plate or If the material is soft, the object to be plated may be deformed or the surface of the object to be plated may be damaged at the location where the electrode contacts, resulting in a decrease in quality. Furthermore, if the dimensions and shapes of the lead frame series differ, the mounting position of the electrode changes due to one-point contact, and it becomes necessary to change the groove and hole of the cathode storage space accordingly. Therefore, there is a problem in that a plurality of press plates with different cathode storage spaces must be prepared. In addition, in order to directly contact the presser member,
The area may open and the plating liquid may enter, and the unplated area may be plated. Particularly, lead frames, which have many holes and where the plating liquid tends to flow to the back side of the plated surface, are viewed as a problem.

This invention was made in view of the above circumstances, and when the cathode electrode is brought into contact with the body to be plated, it is possible to avoid deformation and damage to the body to be plated, and at the same time It is an object of the present invention to provide a plate plating device that can respond to changes in size and shape.

[Means for solving the problem] The plate-shaped object plating device of this invention is an apparatus for plating plate-shaped objects in which an electrode is pressed against a plate-shaped object to be plated to make it a cathode, the object to be plated is masked and plating liquid is sprayed from the anode side, and the object to be plated is partially electroplated, and is characterized in that the electrode has a thin plate-shaped body and a number of legs that hang down from this body through a pressing member, and when the electrode is pressed against the object to be plated and the legs come into contact with the object to be plated, the legs elastically deform.

[Function] In the plate plating device according to this invention,
The cathode electrode has a thin plate-like body and a plurality of legs that hang down from the body through the holding member.
Therefore, when the electrode is pressed against the body to be plated, the plurality of legs come into contact with the body to be plated, and the pressing force is distributed to a plurality of places without stress concentration in only one place. Furthermore, since the legs deform elastically, the load on the body to be plated is alleviated, and deformation and damage to the body to be plated can be effectively avoided.

[Embodiments] Hereinafter, embodiments of this invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view in the longitudinal direction of a plate plating apparatus according to an embodiment of the invention, and FIG. 2 is a sectional view in the width direction of the plate plating apparatus. A continuous lead frame as an object to be plated 14 is placed on a mask 12 of a plating device 10. The mask 12 is made of an insulating resin, and has a plurality of openings formed so as to match each plating processing location (the island portion and the inner lead tip portion) of the body 14 to be plated. Spurger 13 is mask 1
2, and the plating liquid pumped by a pump (not shown) is injected from below to above through a spargeer 13. A pressing member 16 made of soft rubber is provided to cover the plated 14. This presser member 16 is attached to the lower end of a press plate 18 made of vinyl chloride, and when the press plate 18 is pressed downward by an air cylinder (not shown), the presser member 16 is attached to the plated object 14. It's starting to feel like it's being held down. A groove 19 extending in the width direction is provided approximately at the center of the upper half of the press plate 18 . A hole 20 extends downward from the center of the groove 19 and opens at the lower surface of the press plate 18 . Lead wire 2
8 is guided into the hole 20, and its tip is connected to the electrode 22 at the opening. The base end of this lead wire 28 is connected to the negative pole side of an electroplating battery (not shown). Further, the positive electrode side of this battery is connected to the spargeer 13 side that supplies plating solution.

As shown in FIGS. 3 and 4, the electrode 22 is embedded in the rubber pressing member 16 so that only the tips of its legs 24 are exposed. The electrode 22 is made of a strip-shaped thin plate,
Both ends of the thin plate are bent in the same direction at approximately right angles, and the tips of these bent portions are further bent inward by about 45°. That is, the unbent portion constitutes the body portion 23 and the bent portion constitutes the body portion 24. This electrode 22 is made of stainless steel with a thickness of about 0.1 mm, for example. Further, a connecting plate 26 made of a small thin plate is attached to the approximate center of the body 23, and the connecting plate 26 and the lead wire 28 are connected to each other via a connecting terminal 27 attached to the tip of the lead wire 28.

When partially plating a lead frame using the plate plating device configured as described above, first,
The body 14 to be plated is placed on the mask 12, the press plate 18 is lowered by driving the air cylinder, the body 14 to be plated is pressed down by the pressing member 16, and the electrode 22 is brought into contact with the body 14 to be plated. The object to be plated 14 by keeping the press force by the air cylinder constant
The entire body 14 to be plated is pressed down substantially evenly to prevent the body 14 to be plated from floating up.

When the electrode 22 is pressed against the object to be plated 14, the tips of the pair of legs 24 come into contact with the top surface of the object to be plated 14 at separate points separated from each other. When the press electrode 22 is further pressed, the surrounding rubber pressing member 16 is elastically deformed, and
When the trunk 23 and the legs 24 bend, the pressing member 16
follows the elastic deformation of At this time, the electrode 22 and the holding member 16 are also in close contact with each other without any gaps.

Next, the plating liquid is force-fed to the sparger 13 by a pressure pump, and the plating liquid at a predetermined pressure is injected from the injection port of the sparger 13 for a predetermined time. When the plating liquid contacts the object 14 to be plated, a current flows from the sparger 13 side to the electrode 22 side through the plating liquid, and only the area of the object 14 to be plated that is in contact with the plating liquid is electroplated.

According to the above embodiment, damage and deformation of the lead frame caused by the electrodes could be effectively prevented.

In addition, the hole does not come into direct contact with the lead frame, and by using the presser member 16, it is possible to prevent back plating that tends to adhere to the hole part in the conventional method.
We were able to reduce the amount of plating on areas that do not require plating.

[Effects of the invention] According to this invention, the electrode deforms elastically like a spring and contacts the body to be plated at multiple points, so damage and deformation of the lead frame caused by the electrode can be effectively prevented. . It is also possible to prevent back plating of the lead frame. Therefore, it is possible to improve the quality of lead frame products.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal sectional view showing a plate plating device according to an embodiment of this invention, Fig. 2 is a width sectional view showing the same plate plating device, and Fig. 3 is a state in which it is not pressed against a lead frame. FIG. 4 is a perspective view of the electrode, and FIGS. 5 and 6 are cross-sectional views of a conventional plate plating device. 10...Plate plating device, 12...Mask,
14... body to be plated (lead frame), 16...
... Pressing member, 18 ... Press plate, 20 ... Hole, 2
2... Electrode, 23... Torso, 24... Leg, 28
……Lead.

Claims (1)

[Scope of utility model registration request] In a plate-shaped object plating device that presses an electrode against a plate-shaped object to be plated as a cathode, masks the object to be plated, and injects plating liquid from the anode side, and partially electroplates the object to be plated, the electrode is It has a thin plate-like body and a plurality of legs that hang down from the body through the presser member, and when the electrode is pressed against the body to be plated and the legs come into contact with the body, the legs elastically A device for plating plate-like objects characterized by deformation.