JPH05263221A - Vacuum thin film manufacturing equipment - Google Patents

Abstract

(57) [Summary] [Purpose] Falling substances do not mix into the evaporation source and prevent sudden changes in the evaporation state during film formation. Realizes uniform film formation on the substrate. [Structure] A base material 14 is provided directly above a crucible 12 in a chamber 11.
To arrange. Below the shutter 16 that opens and closes the opening 15A of the horizontal shutter plate 15, above the crucible 12, there are tilted shield members 21, 22, 23, 2 for preventing substrate heating in multiple stages.
4 are arranged side by side along the vertical direction. Inclined shield member 2
1, 22, 23, and 24 are formed by a pair of plate members that face each other in a V shape in a vertical plane. Openings 21A, 22A, 23A, and 24A are defined between the pair of plate members, and a lower step 22A thereof than the opening area of the upper opening 21A of the inclined shield member 21, and a lower step 23A thereof, further The bottom 24A is set smaller in order. The edge portion of the lowermost inclined shield member 24 on the inclined lower side is positioned above the outer side of the crucible 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum thin film manufacturing apparatus such as a sputtering apparatus and a vacuum vapor deposition apparatus, and more particularly to a structure of a shield installed for heat insulation of a substrate, and more particularly to evaporation during continuous film formation of a ceramic material. Evaporation technology with improved stability.

[0002]

2. Description of the Related Art Today, plastic films are widely used as various packaging materials as materials having excellent strength and transparency. In particular, for the packaging of foods, medical products, etc., a metal thin film of aluminum or the like formed by a winding-type vacuum vapor deposition method is used in order to provide gas barrier properties and moisture resistance. Further, as a film having a function of allowing the contents to be seen through, a film having a ceramic transparent film such as silicon oxide deposited thereon is used.

As the vapor-deposited substrate film, transparent plastic films such as polyethylene, polypropylene and polyethylene terephthalate which are widely used today are used. Further, as the ceramics of the evaporation material, there are used ceramics such as silicon oxide, alumina, magnesia, etc. which are harmless, have excellent transparency and gas barrier properties. Since this ceramic evaporation material requires a high evaporation temperature and has a low thermal conductivity, it is often formed by a vacuum evaporation method of an electron beam heating method or a sputtering method as an evaporation method.

As shown in FIG. 3, the electron beam vapor deposition apparatus used for this vacuum vapor deposition is installed in the lower part of the chamber 31 and holds the evaporation material 32 which is a solid material.
And several KeV to the evaporation material 32 in this crucible 33.
An irradiation unit (not shown) for irradiating an electron beam having a high energy of several tens KeV is provided. In the chamber 31, a base material 34 is arranged immediately above the crucible 33, and a heat insulating shield plate 35 is installed below the base material 34. This shield plate 35 is held substantially horizontally,
An opening 35A is formed directly above the crucible 33. A shutter 36 is provided below the shield plate 35 so that the opening 35A can be opened and closed. The shield plate 35 is cooled by cooling water supplied through a cooling pipe. 37 is a vacuum pump. Therefore, the evaporation material 32 heated by the electron beam irradiation generates vapor from its surface layer,
This vapor will adhere to the surface of the base material 34 arranged above the crucible 33. At this time, the shield plate 35 prevents the base material 34 from being heated by the vaporized particles spreading outward.

In addition to this evaporation method,
There are a vapor deposition method such as a resistance heating method and an induction heating method, or a sputtering method. Even in these systems, the same shield plate as above is used.

[0006]

However, in such a conventional vacuum vapor deposition apparatus, reattachment of vaporized particles is unavoidable on the surface of the shield plate, and it takes a long time to wind a long base material. When performing a vapor deposition operation, a phenomenon occurs in which the adhered matter that has grown on the shield plate comes off. If this fallen object is mixed in the heating part or the evaporation part such as the crucible during evaporation, the evaporation state will be changed abruptly. As a result, this abnormal evaporation has made it impossible to obtain a product having a uniform film quality. At this time, in the case of a material such as a metal that is easily remelted, it is not impossible to reuse the falling object as the evaporation material. However, in the case of a ceramic material, the maximum heated portion is limited and the material is highly evaporative and highly site-dependent, and at the same time, the redeposit may be a composition different from the raw material. Many. Therefore, when the foreign matter is mixed into the heating portion, the evaporation state changes greatly.

Therefore, an object of the present invention is to provide a vacuum vapor deposition apparatus which realizes a uniform vaporization state of vaporized material by preventing the reattachment of vaporized particles from falling onto the vaporization source. Has a purpose.

[0008]

According to a first aspect of the present invention, there is provided an evaporation source, and a base material held above the evaporation source,
A heat-insulating shield for the substrate, which is provided between the evaporation source and the substrate and has an opening, is provided so that the evaporation material from the evaporation source adheres to the surface of the substrate through the opening. In the vacuum thin film manufacturing apparatus described above, the shield is composed of a plurality of stages of shield members arranged in parallel in the vertical direction, and the shield member of these shield members is lower in opening than the upper member. The area is small. In other words, the vacuum thin film manufacturing apparatus is a vacuum thin film manufacturing apparatus in which the shield plate installed between the evaporation source and the film-forming substrate has a multi-tiered roof type.

[0009]

In the vacuum thin film manufacturing apparatus according to the present invention, the falling material from the upper stage is received by the lower shield member, and the falling material from the lowermost stage is dropped around the evaporation source. As a result, a fallen object that once adheres to the shield member and then falls does not mix into the evaporation source, and the evaporation state does not suddenly change during continuous film formation.

[0010]

Embodiments of the apparatus according to the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of a vacuum vapor deposition device according to the present invention.

In these figures, 11 is a chamber, and a crucible 12 is installed below the inside (on the floor) of the chamber. An evaporation material 13 is held in the crucible 12. A means for heating the evaporation material 13, for example, an electron beam irradiation means is provided in the chamber 11 although not shown. Directly above the crucible 12 is a base material 14 which is a horizontal plate-shaped material having a predetermined area.
For example, various films can be installed as 4. Immediately below the base material 14 is a rectangular opening 15A having a predetermined area.
The horizontal shield plate 15 having the above is fixedly provided, and the horizontal shield plate 15 is formed of, for example, copper, stainless steel, or the like. A shutter 16 is arranged immediately below the horizontal shield plate 15 so as to be able to open and close the opening 15A. The shutter 16 is supported on the upper end of a vertical pole 18 via a horizontal arm 17.

As shown in detail in FIG.
Below the above, above the crucible 12, there are arranged inclining shield members 21, 22, 23, 24 in a plurality of stages for preventing the base material from being heated in the vertical direction. Each of these inclined shield members 21, 22, 23, and 24 is installed so as to incline at a predetermined angle with respect to the horizontal plane and its outer portion is located below the inner portion. As shown in FIG. 2, each of the inclined shield members 21 to 24 is composed of a pair of plate members facing each other in a V shape in a vertical plane. Then, openings 21A, 22A, 23A, 24A having a predetermined opening area are defined between the pair of plate members, and the opening 2 of the upper inclined shield member 21 is formed.
The lower 22A, the lower 23A, and the lower 24A are smaller than the opening area of 1A. And these openings 21A-
24A is all rectangular and its center is the above-mentioned crucible 12
Is set so as to be positioned on a virtual line connecting the center of the horizontal shield plate 15 and the center of the opening 15A of the horizontal shield plate 15. Furthermore, the opening area of the opening 24A of the lowermost inclined shield member 24 is set to be larger than the opening area of the crucible 12 (may be smaller than the opening area of the crucible 12). And the lowermost inclined shield member 24
The lower edge portion of the slope is formed so as to be located above the outer side of the crucible 12.

Reference numeral 25 is a vacuum pump capable of creating a vacuum inside the chamber 11. Further, each of the inclined shield members 21 to 24 may have a shape in which a lower end side edge thereof is curved upward. In this way, the falling object from the upper stage can be reliably received. Further, in order to enhance the heat insulating effect, the inclination angles of the inclined shield members 21 to 24 may be loosened. Further, each of the inclined shield members 21 to 24 is suspended by a column 26 suspended from the horizontal shield plate 14. Although not shown, the shield members 14, 21 to 24 may be cooled by a cooling water pipe or the like. Of course, the shape of the shield member is not limited to the rectangular shape shown in FIG. 1, and may be, for example, a circular umbrella shape.

As described above, since the shield for heat-proofing the base material is a multi-tiered roof type, when the evaporation material 13 (eg, SiO which is a ceramic material) in the crucible 12 is irradiated with an electron beam, the evaporation material is heated to a temperature higher than its melting point. Then, it is evaporated and adhered to the surface of the base material 14 (0.5 mm glass substrate or 12 μm polyester film). In this case, 200
Assuming that the heating for forming the SiO film having a film thickness of 0 angstrom is repeated 10 times, the horizontal shield plate 14
There is a fallen object. However, the ceramic composition, which is the fallen object, is used in the above-mentioned multi-slope roof shield member 2
It does not fall into the upper surfaces of 1 to 24 and mix into the crucible 12. All falling objects fall on the floor of the chamber around the crucible 12. As a result, it is possible to always obtain a good film.

[0015]

As described above, according to the present invention, a fallen object does not mix with the evaporation source, and it is possible to prevent a sudden change in the evaporation state during film formation. As a result, it is possible to realize uniform film formation on the base material. This is particularly effective when forming a film by a large amount of evaporation.

[Brief description of drawings]

FIG. 1 is a perspective view showing a vacuum deposition apparatus according to an embodiment of the present invention with a part thereof cut away.

FIG. 2 is a cross-sectional view showing a vacuum vapor deposition device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a conventional vacuum vapor deposition device.

[Explanation of symbols]

 12 Crucible 13 Evaporation Material 14 Base Material 15 Horizontal Shield Plate 15A Opening 21-24 Inclined Shielding Member 21A-24A Opening

Claims (1)

[Claims] 1. An evaporation source, a base material held above the evaporation source, and a base material heat shield that is provided between the evaporation source and the base material and has an opening. In the vacuum thin film manufacturing apparatus in which the evaporation material from the evaporation source adheres to the surface of the base material through the opening, the shield is composed of a plurality of shield members arranged in parallel in the vertical direction. The vacuum thin film manufacturing apparatus is characterized in that the opening area of the opening of the lower shield member is smaller than that of the upper shield member.