JPH05264831A - Optical waveguide device - Google Patents
Optical waveguide deviceInfo
- Publication number
- JPH05264831A JPH05264831A JP6482892A JP6482892A JPH05264831A JP H05264831 A JPH05264831 A JP H05264831A JP 6482892 A JP6482892 A JP 6482892A JP 6482892 A JP6482892 A JP 6482892A JP H05264831 A JPH05264831 A JP H05264831A
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- substrate
- optical
- electrode
- ridges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000009434 installation Methods 0.000 claims abstract description 23
- 230000005684 electric field Effects 0.000 claims abstract description 7
- 239000013307 optical fiber Substances 0.000 abstract description 18
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
(57)【要約】 （修正有）
【目的】 光軸ずれ等による損失を抑制し、かつ、光部
品の接続に要する作業、および電極に配線を接続する作
業を効率化する装置を提供する。
【構成】 光導波路基板１の両側部に２本の凹条部１３
を形成し、これに挟まれた下面凸部１０に、光導波路１
１と光導波路１１に電界を印加するための電極１２とを
形成する。設置用基板２の上面には凸条部２３ａ、２３
ｂ、上面凹部２０を形成する。凸条部２３ａ、２３ｂ
は、光導波路基板１の凹条部１３にそれぞれ嵌合する。
電極引き出しパターン２２の一端部は電極１２にバンプ
４を介して接合し、他端部は配線５に接続されている。
また、光導波路基板１の端面の光導波路１１と設置用基
板２に形成された光ファイバ用の溝２４に設置した光フ
ァイバ３のコア３１との光軸は略一致している。
(57) [Summary] (Correction) [Object] To provide a device that suppresses loss due to misalignment of the optical axis, etc., and that makes work required for connecting optical components and work for connecting wiring to electrodes efficient. [Structure] Two concave stripes 13 are provided on both sides of the optical waveguide substrate 1.
And the optical waveguide 1 is formed on the lower surface convex portion 10 sandwiched between them.
1 and an electrode 12 for applying an electric field to the optical waveguide 11 are formed. The ridges 23a, 23
b, the upper surface recess 20 is formed. Ridges 23a, 23b
Fit into the recessed portions 13 of the optical waveguide substrate 1.
One end of the electrode lead pattern 22 is joined to the electrode 12 via the bump 4, and the other end is connected to the wiring 5.
The optical axes of the optical waveguide 11 on the end face of the optical waveguide substrate 1 and the core 31 of the optical fiber 3 installed in the optical fiber groove 24 formed in the installation substrate 2 are substantially coincident with each other.
Description
【０００１】[0001]
【産業上の利用分野】本発明は光通信分野における光導
波路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical waveguide device in the field of optical communication.
【０００２】[0002]
【従来の技術】例えば、光導波路と光ファイバとの接続
において、設置用基板に形成した嵌合用の凹部と光ファ
イバ設置用の溝とに、嵌合用の段付部を有した光導波路
と光ファイバとを各々はめ込む方法がある。そして、光
導波路が電気配線を必要とする場合には、光導波路を設
置している設置用基板の面の裏側に開けてある電極用の
穴等より配線を行っている。この具体的な方法は、特許
出願番号６３−６２２５２に記載されている。2. Description of the Related Art For example, in connection of an optical waveguide and an optical fiber, an optical waveguide and an optical waveguide having a stepped portion for fitting in a recess for fitting and a groove for mounting the optical fiber formed in a substrate for installation. There is a method of fitting each of the fibers. When the optical waveguide requires electric wiring, wiring is performed through a hole for an electrode or the like opened on the back side of the surface of the installation substrate on which the optical waveguide is installed. This particular method is described in Patent Application No. 63-62252.
【０００３】[0003]
【発明が解決しようとする課題】設置する光導波路がス
イッチ機能等を有した光導波路基板である場合、スイッ
チを機能させるために電気信号を光導波路基板の電極に
送る必要がある。その電極を下側にして設置用基板に設
置する場合、光ファイバおよび光導波路を設置している
設置用基板の面の裏側に開けてある電極用の穴を通して
電極に配線を接続する。これは光部品設置面の裏側での
作業であり、また、作業面積が小さいため、その作業性
は非常に悪かった。When the optical waveguide to be installed is an optical waveguide substrate having a switch function or the like, it is necessary to send an electric signal to the electrode of the optical waveguide substrate in order to make the switch function. When the electrode is placed on the installation substrate with the lower side, the wiring is connected to the electrode through an electrode hole formed on the back side of the surface of the installation substrate on which the optical fiber and the optical waveguide are installed. This was a work on the back side of the optical component installation surface, and the work area was small, so the workability was extremely poor.
【０００４】本発明は以上の問題に鑑み、光軸ずれ等に
よる損失を抑制し、かつ、光部品の接続に要する作業、
および電極に配線を接続する作業を効率化することを目
的とする。In view of the above problems, the present invention suppresses loss due to misalignment of the optical axis and the work required for connecting optical components,
It is also intended to make the work of connecting wiring to the electrodes more efficient.
【０００５】[0005]
【課題を解決するための手段】以上の問題を解決するた
め、側面近傍に段差を設けることにより下面に凸部が形
成され、光導波路とこの光導波路に電界を印加するため
の電極とがこの下面凸部に形成された光導波路基板と、
この光導波路基板の下面凸部が嵌合される上面凹部が形
成され、かつこれらを嵌合させたときに前述の電極に一
端部が対面し、他端部が光導波路基板から露呈する電極
引き出しパターンが上面凹部に形成された設置用基板と
により構成され、光導波路基板の端面の光導波路とこの
設置用基板に設置する光部品との光軸を略一致させる光
部品用の溝が、その設置用基板に形成されていることを
特徴とする。また、光導波路基板には光軸方向に延びる
２本の凹条部が両側部近傍に形成されて、これによる段
差の間が前記下面凸部をなし、設置用基板には前記２本
の凹条部にそれぞれ嵌合する凸条部が形成されてこの間
が上面凹部をなし、前記凸条部の一方は中間部で切り欠
かれて前記電極引き出しパターンの他端部が前記露呈位
置に引き出されていることを特徴とする。In order to solve the above problems, a step is provided near the side surface to form a convex portion on the lower surface, and the optical waveguide and the electrode for applying an electric field to the optical waveguide are An optical waveguide substrate formed on the lower surface convex portion,
An electrode lead-out is formed in which an upper surface concave portion to which a lower surface convex portion of this optical waveguide substrate is fitted is formed, and when these are fitted, one end faces the above electrode and the other end is exposed from the optical waveguide substrate. The pattern is composed of the installation substrate formed in the recessed portion on the upper surface, and the optical waveguide groove on the end face of the optical waveguide substrate and the optical component groove for substantially aligning the optical axes of the optical components installed on the installation substrate are It is characterized in that it is formed on the installation substrate. In addition, two concave stripes extending in the optical axis direction are formed on the optical waveguide substrate in the vicinity of both sides, and the lower surface convex portion is formed between the steps formed by the concave stripes. Protruding ridges that fit into the respective ridges are formed, and an interval between the ridges is formed as an upper surface recess. It is characterized by
【０００６】[0006]
【作用】本発明により、光導波路基板には下面凸部が形
成され、設置用基板には上面凹部が形成されるので、こ
れらの嵌合により位置決めがされる。そして、設置用基
板に光導波路の光軸に合わせた光部品用の溝が形成され
るため、光部品を溝に沿って設置するだけで損失の少な
い結合ができる。また、光導波路に電界を印加するため
の電極の引き出しパターンは、一端部が光導波路基板の
電極と対面し、他端部が露呈し光導波路装置の表面に出
すことができる。According to the present invention, since the lower surface convex portion is formed on the optical waveguide substrate and the upper surface concave portion is formed on the installation substrate, positioning is performed by fitting them. Since the groove for the optical component aligned with the optical axis of the optical waveguide is formed on the installation substrate, the optical component can be coupled with little loss simply by installing the optical component along the groove. In addition, the electrode lead-out pattern for applying an electric field to the optical waveguide can be exposed on the surface of the optical waveguide device with one end facing the electrode of the optical waveguide substrate and the other end exposed.
【０００７】[0007]
【実施例】図１及至図２に光ファイバとスイッチ機能を
有した光導波路とを接続した実施例を示す。1 and 2 show an embodiment in which an optical fiber and an optical waveguide having a switch function are connected.
【０００８】光導波路基板１の両側部近傍には光軸方向
に延びる２本の凹条部１３が形成され、これによる段差
に挟まれる下面凸部１０に、光導波路１１と光導波路１
１に電界を印加するための電極１２とが形成されてい
る。Two concave stripes 13 extending in the optical axis direction are formed in the vicinity of both sides of the optical waveguide substrate 1, and the optical waveguide 11 and the optical waveguide 1 are formed on the lower surface convex portion 10 sandwiched by the stepped portions.
1 is formed with an electrode 12 for applying an electric field.
【０００９】設置用基板２の上面中央部には凸条部２３
ａ、２３ｂを残して掘り込まれ、上面凹部２０が形成さ
れている。そして、凸条部２３ａ、２３ｂは、光導波路
基板１の凹条部１３とにそれぞれ嵌合している。電極引
き出しパターン２２の一端部は電極１２とバンプ４を介
して接合し、他端部は配線５と接続されている。このよ
うにするため、電極引き出しパターン２２の一端部は電
極１２と対面し、他端部は光導波路基板１が覆う部分か
ら露呈するように引き出され、凸条部２３ａは中間部で
切り欠かれ、電極引き出しパターン２２は上面凹部２０
の略均一平面上に形成されている。A ridge 23 is formed in the center of the upper surface of the installation substrate 2.
The upper surface recessed portion 20 is formed by excavating a and 23b. The ridges 23a and 23b are fitted into the ridges 13 of the optical waveguide substrate 1, respectively. One end of the electrode lead-out pattern 22 is joined to the electrode 12 via the bump 4, and the other end is connected to the wiring 5. For this reason, one end of the electrode lead-out pattern 22 faces the electrode 12, the other end is led out so as to be exposed from the portion covered by the optical waveguide substrate 1, and the ridge 23a is cut out at the middle. The electrode lead-out pattern 22 is the upper surface recess 20.
Is formed on a substantially uniform plane.
【００１０】また、光導波路基板１の端面の光導波路１
１と設置用基板２に形成された光ファイバ用の溝２４に
設置した光ファイバ３のコア３１との光軸は略一致して
いる。Further, the optical waveguide 1 on the end face of the optical waveguide substrate 1
The optical axes of 1 and the core 31 of the optical fiber 3 installed in the optical fiber groove 24 formed in the installation substrate 2 are substantially coincident with each other.
【００１１】以下、前述の実施例の装置の作製工程を説
明する。The manufacturing process of the device of the above embodiment will be described below.
【００１２】シリコンを基板とした光導波路基板１には
光導波路１１およびこの光導波路１１に電界を印加する
ための電極１２が形成されている。そして、光導波路１
１が形成されている面に、ポジ型ホトレジストを使用し
たレジストパターン（図示せず）形成後、エッチングに
より凹条部１３を形成、レジストを除去する。An optical waveguide 11 having a silicon substrate is provided with an optical waveguide 11 and an electrode 12 for applying an electric field to the optical waveguide 11. And the optical waveguide 1
After forming a resist pattern (not shown) using a positive photoresist on the surface where 1 is formed, a groove 13 is formed by etching and the resist is removed.
【００１３】また、シリコンを基板とした設置用基板２
に、光ファイバ設置用の溝２４の部分と電極引き出しパ
ターンを通すための溝の部分（凸条部２３ａの中間部の
切り欠かれている部分）とを凸条部２３ａ、２３ｂ用の
部分に加えたレジストパターン（図示せず）をネガ型ホ
トレジストを使用して形成する。この凸条部２３ａ、２
３ｂ用のレジストパターンの形成にあたっては、前述の
光導波路基板の加工用のマスクパターン（レチクル）と
同一のマスクパターン（レチクル）を用いることで、正
逆が反転したパターンにできる。A substrate 2 for installation using silicon as a substrate
In addition, the groove portion 24 for installing the optical fiber and the groove portion for passing the electrode lead-out pattern (the notched portion in the middle of the protrusion portion 23a) are formed into the portions for the protrusion portions 23a and 23b. An added resist pattern (not shown) is formed using a negative photoresist. These ridges 23a, 2
When forming the resist pattern for 3b, the same mask pattern (reticle) as the above-described mask pattern (reticle) for processing the optical waveguide substrate is used, whereby a pattern in which normal and reverse are reversed can be formed.
【００１４】次に、エッチングにより、嵌合用の凸条部
２３ａ、２３ｂおよび光ファイバ設置用の溝２４を形成
する。この時、光導波路１１の光軸と設置する光ファイ
バ３のコア３１との光軸は、光の接合面において略一致
するように、光ファイバ設置用の溝２４は形成されてい
る。また、同一のマスクパターン（レチクル）で感光し
たポジ型ホトレジストおよびネガ型ホトレジストによる
レジストパターンを利用したことにより、光導波路基板
１は設置位置の確度の高い嵌合ができる。そして、レジ
ストを除去した後、上面凹部２０の表面に電極引き出し
パターン２２を形成する。Next, the protrusions 23a and 23b for fitting and the groove 24 for installing the optical fiber are formed by etching. At this time, the optical fiber installation groove 24 is formed so that the optical axis of the optical waveguide 11 and the optical axis of the core 31 of the optical fiber 3 to be installed are substantially coincident with each other at the light joining surface. Further, the optical waveguide substrate 1 can be fitted with high accuracy in the installation position by using the resist patterns of the positive photoresist and the negative photoresist exposed with the same mask pattern (reticle). Then, after removing the resist, the electrode lead-out pattern 22 is formed on the surface of the upper surface recess 20.
【００１５】その後、設置用基板２のそれぞれの溝に沿
って、光導波路基板１および光ファイバ３を設置し、紫
外線硬化樹脂により部品を固定する。また、電極１２と
電極引き出しパターン２２との接合は、バンプ４を介し
たフリップチップ方式により行う。そして、電極引き出
しパターン２２に配線５を接続する。After that, the optical waveguide substrate 1 and the optical fiber 3 are installed along the respective grooves of the installation substrate 2, and the components are fixed by the ultraviolet curable resin. Further, the electrode 12 and the electrode lead-out pattern 22 are joined by the flip chip method via the bump 4. Then, the wiring 5 is connected to the electrode lead pattern 22.
【００１６】上記構成によれば、光ファイバと光導波路
間との精度の高い光軸合わせ、および電極と電極引き出
しパターンとの位置合わせが、それぞれの溝に部品を設
置するだけで容易にできる。According to the above structure, highly accurate optical axis alignment between the optical fiber and the optical waveguide, and positional alignment between the electrode and the electrode lead-out pattern can be easily performed only by installing parts in the respective grooves.
【００１７】本発明は前述の実施例に限らず様々な変形
が可能である。The present invention is not limited to the above-mentioned embodiment, but various modifications can be made.
【００１８】実施例では、光導波路基板から見て２入力
２出力となっているが、１入力１出力、または複数入力
複数出力等でも良い。また、光導波路基板に接続する光
部品は光ファイバに限らず、例えば、半導体レーザや光
導波路でも良い。In the embodiment, two inputs and two outputs are seen from the optical waveguide substrate, but one input and one output or multiple inputs and multiple outputs may be used. Further, the optical component connected to the optical waveguide substrate is not limited to the optical fiber, but may be, for example, a semiconductor laser or an optical waveguide.
【００１９】さらに、光導波路基板はスイッチ機能を有
したデバイスに限らず、例えば、変調機能を有したデバ
イスでも良い。Further, the optical waveguide substrate is not limited to the device having the switch function, but may be, for example, the device having the modulation function.
【００２０】設置用基板の溝のエッチングは実施例では
一度に行ったが、各部分で分割して行うことも可能であ
り、また、ネガ型ホトレジストとポジ型ホトレジストと
の使用方法は問わない。基板はシリコンを用いたが材質
はこれに限らない。Although the groove of the installation substrate was etched at once in the embodiment, it can be divided into individual portions and the method of using the negative photoresist and the positive photoresist does not matter. Silicon was used for the substrate, but the material is not limited to this.
【００２１】[0021]
【発明の効果】以上の通り、本発明によれば、設置用基
板の上に光導波路基板を精度良く実装できる。そして、
光導波路基板の光軸に合わせた光部品用の溝がエッチン
グにより精度良く形成される。このため、光部品を溝に
沿って設置するだけで損失の少ない結合ができる。ま
た、光導波路に電界を印加するための電極の引き出しパ
ターンを光導波路装置の表面に露呈することにより、配
線を行う際に作業性が良く、作業効率を上げることがで
きる。As described above, according to the present invention, the optical waveguide substrate can be accurately mounted on the installation substrate. And
A groove for an optical component aligned with the optical axis of the optical waveguide substrate is accurately formed by etching. Therefore, it is possible to perform the coupling with a small loss simply by installing the optical component along the groove. Further, by exposing the extraction pattern of the electrode for applying an electric field to the optical waveguide on the surface of the optical waveguide device, workability is good when wiring is performed, and work efficiency can be improved.
【図１】本発明の実施例の概略図である。FIG. 1 is a schematic diagram of an embodiment of the present invention.
【図２】本発明の実施例の断面概略図である。FIG. 2 is a schematic sectional view of an embodiment of the present invention.
１…光導波路基板、１０…下面凸部、１１…光導波路、
１２…電極、１３…光導波路基板の嵌合用の凹条部、２
…設置用基板、２０…上面凹部、２２…電極引き出しパ
ターン、２３ａ、２３ｂ…設置用基板の嵌合用の凸条
部、２４…光ファイバ設置用の溝、３…光ファイバ、３
１…光ファイバのコア、４…バンプ、５…配線。DESCRIPTION OF SYMBOLS 1 ... Optical waveguide substrate, 10 ... Lower surface convex part, 11 ... Optical waveguide,
12 ... Electrodes, 13 ... Recesses for fitting the optical waveguide substrate, 2
... Installation substrate, 20 ... Upper surface recessed portion, 22 ... Electrode drawing pattern, 23a, 23b ... Fitting ridge portion of the installation substrate, 24 ... Optical fiber installation groove, 3 ... Optical fiber, 3
1 ... Optical fiber core, 4 ... Bump, 5 ... Wiring.
Claims (2)
に凸部が形成され、光導波路と、この光導波路に電界を
印加するための電極とが前記下面凸部に形成された光導
波路基板と、 前記光導波路基板の前記下面凸部が嵌合される上面凹部
が形成され、かつこれらを嵌合させたときに前記電極に
一端部が対面し、他端部が前記光導波路基板から露呈す
る電極引き出しパターンが前記上面凹部に形成された設
置用基板とにより構成され、 前記光導波路基板の端面の前記光導波路と前記設置用基
板に設置する光部品との光軸を略一致させる光部品用の
溝が、前記設置用基板に形成されていることを特徴とす
る光導波路装置。1. An optical waveguide substrate in which a convex portion is formed on the lower surface by providing a step near the side surface, and an optical waveguide and an electrode for applying an electric field to the optical waveguide are formed on the lower convex portion. An upper surface concave portion to which the lower surface convex portion of the optical waveguide substrate is fitted is formed, and when these are fitted, one end faces the electrode and the other end is exposed from the optical waveguide substrate. For an optical component in which an electrode lead-out pattern is formed by a mounting substrate formed in the upper surface recess, and the optical axes of the optical waveguide on the end face of the optical waveguide substrate and the optical component mounted on the mounting substrate are substantially aligned with each other. The optical waveguide device, wherein the groove is formed in the installation substrate.
向に延びる２本の凹条部が両側部近傍に形成されて、こ
れによる段差の間が前記下面凸部をなし、前記設置用基
板の上面には前記２本の凹条部にそれぞれ嵌合する凸条
部が形成されてこの間が前記上面凹部をなし、前記凸条
部の一方は中間部で切り欠かれて前記電極引き出しパタ
ーンの他端部が前記露呈位置に引き出されていることを
特徴とする請求項１記載の光導波路装置。2. On the lower surface of the optical waveguide substrate, two recessed portions extending in the optical axis direction are formed in the vicinity of both sides, and the step between them forms the lower surface convex portion, On the upper surface of the substrate, there are formed ridges that fit into the two ridges, respectively, and between the ridges, the upper surface recesses are formed. The optical waveguide device according to claim 1, wherein the other end of the optical waveguide is pulled out to the exposed position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6482892A JPH05264831A (en) | 1992-03-23 | 1992-03-23 | Optical waveguide device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6482892A JPH05264831A (en) | 1992-03-23 | 1992-03-23 | Optical waveguide device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05264831A true JPH05264831A (en) | 1993-10-15 |
Family
ID=13269500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6482892A Pending JPH05264831A (en) | 1992-03-23 | 1992-03-23 | Optical waveguide device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05264831A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1094355A1 (en) * | 1999-10-19 | 2001-04-25 | Corning Incorporated | Electrical interconnection of planar lightwave circuits |
| WO2003104868A1 (en) * | 2002-06-06 | 2003-12-18 | 富士通株式会社 | Optical module manufacturing method and optical module |
| WO2003058326A3 (en) * | 2001-12-27 | 2004-04-01 | Intel Corp | Flip-chip mounted opto-electronic circuit |
| EP1143273A3 (en) * | 2000-03-22 | 2006-06-07 | Matsushita Electric Industrial Co., Ltd. | Optical fiber device and optical transmission apparatus |
| EP2113806A1 (en) * | 2008-04-29 | 2009-11-04 | Avanex Corporation | Electro-optic device package |
-
1992
- 1992-03-23 JP JP6482892A patent/JPH05264831A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1094355A1 (en) * | 1999-10-19 | 2001-04-25 | Corning Incorporated | Electrical interconnection of planar lightwave circuits |
| EP1143273A3 (en) * | 2000-03-22 | 2006-06-07 | Matsushita Electric Industrial Co., Ltd. | Optical fiber device and optical transmission apparatus |
| WO2003058326A3 (en) * | 2001-12-27 | 2004-04-01 | Intel Corp | Flip-chip mounted opto-electronic circuit |
| US6787919B2 (en) | 2001-12-27 | 2004-09-07 | Intel Corporation | Flip-chip opto-electronic circuit |
| CN100371774C (en) * | 2001-12-27 | 2008-02-27 | 英特尔公司 | Flip-chip photoelectric circuit |
| WO2003104868A1 (en) * | 2002-06-06 | 2003-12-18 | 富士通株式会社 | Optical module manufacturing method and optical module |
| EP2113806A1 (en) * | 2008-04-29 | 2009-11-04 | Avanex Corporation | Electro-optic device package |
| US8206042B2 (en) | 2008-04-29 | 2012-06-26 | Oclaro (North America), Inc. | Electro-optic device packages |
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