JPH05267062A - チツプ型ｈｆ磁気コイル装置およびその製造方法 - Google Patents

チツプ型ｈｆ磁気コイル装置およびその製造方法

Info

Publication number: JPH05267062A
Authority: JP; Japan
Prior art keywords: substrate; magnetic core; coil device; chip; magnetic
Prior art date: 1990-09-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP3250311A

Other languages

English (en)

Japanese (ja)

Inventor

Michael Ganslmeier

ミカエル・ガンスルマイアー

Horst Wuenschmann

ホルスト・ヴューンシュマン

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

GW ELECTRON GmbH

Original Assignee

GW ELECTRON GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-09-04

Filing date

1991-09-04

Publication date

1993-10-15

1990-09-04 Priority claimed from DE4027994A external-priority patent/DE4027994A1/de

1991-09-04 Application filed by GW ELECTRON GmbH filed Critical GW ELECTRON GmbH

1993-10-15 Publication of JPH05267062A publication Critical patent/JPH05267062A/ja

Status Pending legal-status Critical Current

Links

230000005291 magnetic effect Effects 0.000 title claims abstract description 133
238000004519 manufacturing process Methods 0.000 title claims description 31
239000004020 conductor Substances 0.000 claims abstract description 84
238000000034 method Methods 0.000 claims abstract description 48
238000004804 winding Methods 0.000 claims abstract description 33
239000000463 material Substances 0.000 claims abstract description 30
239000004033 plastic Substances 0.000 claims abstract description 24
229920003023 plastic Polymers 0.000 claims abstract description 24
239000000758 substrate Substances 0.000 claims description 88
238000000576 coating method Methods 0.000 claims description 26
229920005989 resin Polymers 0.000 claims description 26
239000011347 resin Substances 0.000 claims description 26
239000011248 coating agent Substances 0.000 claims description 24
239000011159 matrix material Substances 0.000 claims description 14
238000005266 casting Methods 0.000 claims description 13
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
229910052802 copper Inorganic materials 0.000 claims description 12
239000010949 copper Substances 0.000 claims description 12
238000007747 plating Methods 0.000 claims description 9
229920001721 polyimide Polymers 0.000 claims description 9
239000002184 metal Substances 0.000 claims description 8
229910052751 metal Inorganic materials 0.000 claims description 8
238000001465 metallisation Methods 0.000 claims description 8
230000000149 penetrating effect Effects 0.000 claims description 8
239000007788 liquid Substances 0.000 claims description 7
238000012360 testing method Methods 0.000 claims description 6
239000012815 thermoplastic material Substances 0.000 claims description 6
239000004642 Polyimide Substances 0.000 claims description 5
239000002131 composite material Substances 0.000 claims description 5
238000005520 cutting process Methods 0.000 claims description 5
230000008018 melting Effects 0.000 claims description 5
238000002844 melting Methods 0.000 claims description 5
229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 5
238000007639 printing Methods 0.000 claims description 5
238000007740 vapor deposition Methods 0.000 claims description 5
229910000859 α-Fe Inorganic materials 0.000 claims description 5
238000005530 etching Methods 0.000 claims description 4
238000004070 electrodeposition Methods 0.000 claims description 3
239000003822 epoxy resin Substances 0.000 claims description 3
238000010438 heat treatment Methods 0.000 claims description 3
229920000647 polyepoxide Polymers 0.000 claims description 3
238000000926 separation method Methods 0.000 claims description 3
GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
239000012777 electrically insulating material Substances 0.000 claims description 2
239000000843 powder Substances 0.000 claims description 2
229910052709 silver Inorganic materials 0.000 claims description 2
239000004332 silver Substances 0.000 claims description 2
238000005476 soldering Methods 0.000 claims 3
238000001035 drying Methods 0.000 claims 1
238000005553 drilling Methods 0.000 description 10
238000013461 design Methods 0.000 description 6
235000012489 doughnuts Nutrition 0.000 description 4
238000009713 electroplating Methods 0.000 description 3
239000000696 magnetic material Substances 0.000 description 3
229910000679 solder Inorganic materials 0.000 description 3
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
238000004140 cleaning Methods 0.000 description 2
238000003780 insertion Methods 0.000 description 2
230000037431 insertion Effects 0.000 description 2
230000002093 peripheral effect Effects 0.000 description 2
239000004215 Carbon black (E152) Substances 0.000 description 1
230000001154 acute effect Effects 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
239000000872 buffer Substances 0.000 description 1
239000003990 capacitor Substances 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000009833 condensation Methods 0.000 description 1
230000005494 condensation Effects 0.000 description 1
238000010924 continuous production Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
230000002950 deficient Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
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238000007598 dipping method Methods 0.000 description 1
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238000005516 engineering process Methods 0.000 description 1
230000005294 ferromagnetic effect Effects 0.000 description 1
238000013100 final test Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
229930195733 hydrocarbon Natural products 0.000 description 1
150000002430 hydrocarbons Chemical class 0.000 description 1
230000006698 induction Effects 0.000 description 1
238000009413 insulation Methods 0.000 description 1
230000004130 lipolysis Effects 0.000 description 1
238000003801 milling Methods 0.000 description 1
230000006911 nucleation Effects 0.000 description 1
238000010899 nucleation Methods 0.000 description 1
230000035515 penetration Effects 0.000 description 1
238000001259 photo etching Methods 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
239000011148 porous material Substances 0.000 description 1
238000012545 processing Methods 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
238000010791 quenching Methods 0.000 description 1
230000000171 quenching effect Effects 0.000 description 1
230000000284 resting effect Effects 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
230000007704 transition Effects 0.000 description 1
238000002604 ultrasonography Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1

Landscapes

Coils Or Transformers For Communication (AREA)
Coils Of Transformers For General Uses (AREA)
Insulating Of Coils (AREA)
Manufacturing Cores, Coils, And Magnets (AREA)

JP3250311A 1990-09-04 1991-09-04 チツプ型ｈｆ磁気コイル装置およびその製造方法 Pending JPH05267062A (ja)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
DE4027994A DE4027994A1 (de)	1990-09-04	1990-09-04	Hf-magnetspulenanordnung und verfahren zu ihrer herstellung
DE91105864.2		1991-04-12
DE4027994.4		1991-04-12
EP91105864A EP0473875B1 (de)	1990-09-04	1991-04-12	Verfahren zum Herstellen einer HF-Magnetspulenanordnung in Chip-Bauweise

Publications (1)

Publication Number	Publication Date
JPH05267062A true JPH05267062A (ja)	1993-10-15

Family

ID=25896545

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP3250311A Pending JPH05267062A (ja)	1990-09-04	1991-09-04	チツプ型ｈｆ磁気コイル装置およびその製造方法

Country Status (2)

Country	Link
JP (1)	JPH05267062A (de)
AT (1)	ATE101301T1 (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2002329615A (ja) *	2001-05-02	2002-11-15	Ohira Denshi Kk	トロイダルコイル
JP2002343652A (ja) *	2001-05-18	2002-11-29	Nichicon Corp	リアクトルまたは変圧器
JP2004259944A (ja) *	2003-02-26	2004-09-16	Densei Lambda Kk	インダクタンス素子の製造方法
JP2006165212A (ja) *	2004-12-07	2006-06-22	Sony Corp	インダクタンス素子及びその製造方法、並びに配線基板
JP2010516056A (ja) *	2007-01-11	2010-05-13	プラナーマグインコーポレイテッド	平面型広帯域トランス
WO2016111282A1 (ja) *	2015-01-07	2016-07-14	株式会社村田製作所	コイル部品
JP2019102755A (ja) *	2017-12-07	2019-06-24	株式会社村田製作所	コイル部品およびその製造方法
CN117038286A (zh) *	2023-08-15	2023-11-10	惠州市可立克电子有限公司	一种一体式大电流共模电感

1991
- 1991-04-12 AT AT91105864T patent/ATE101301T1/de not_active IP Right Cessation
- 1991-09-04 JP JP3250311A patent/JPH05267062A/ja active Pending

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2002329615A (ja) *	2001-05-02	2002-11-15	Ohira Denshi Kk	トロイダルコイル
JP2002343652A (ja) *	2001-05-18	2002-11-29	Nichicon Corp	リアクトルまたは変圧器
JP2004259944A (ja) *	2003-02-26	2004-09-16	Densei Lambda Kk	インダクタンス素子の製造方法
JP2006165212A (ja) *	2004-12-07	2006-06-22	Sony Corp	インダクタンス素子及びその製造方法、並びに配線基板
JP2010516056A (ja) *	2007-01-11	2010-05-13	プラナーマグインコーポレイテッド	平面型広帯域トランス
WO2016111282A1 (ja) *	2015-01-07	2016-07-14	株式会社村田製作所	コイル部品
JPWO2016111282A1 (ja) *	2015-01-07	2017-10-19	株式会社村田製作所	コイル部品
US11430601B2 (en)	2015-01-07	2022-08-30	Murata Manufacturing Co., Ltd.	Coil component
JP2019102755A (ja) *	2017-12-07	2019-06-24	株式会社村田製作所	コイル部品およびその製造方法
CN117038286A (zh) *	2023-08-15	2023-11-10	惠州市可立克电子有限公司	一种一体式大电流共模电感

Also Published As

Publication number	Publication date
ATE101301T1 (de)	1994-02-15

Publication	Publication Date	Title
US5191699A (en)	1993-03-09	Methods of producing a chip-type HF magnetic coil arrangement
US5257000A (en)	1993-10-26	Circuit elements dependent on core inductance and fabrication thereof
TWI258154B (en)	2006-07-11	Electronic transformer/inductor devices and methods for making same
US8591262B2 (en)	2013-11-26	Substrate inductive devices and methods
US9754714B2 (en)	2017-09-05	Embedded magnetic components and methods
US7477122B2 (en)	2009-01-13	Loop type coil parts
US8860543B2 (en)	2014-10-14	Wire-less inductive devices and methods
US9754712B2 (en)	2017-09-05	Embedded magnetic components and methods
US5652561A (en)	1997-07-29	Laminating type molded coil
US20130033353A1 (en)	2013-02-07	Substrate inductive devices and methods
US20070063807A1 (en)	2007-03-22	Magnetic components
HK1002719B (en)	1998-09-11	Method of making magnetic cores
JP3322189B2 (ja)	2002-09-09	インダクタ及びその製造方法
CN106169353A (zh)	2016-11-30	片式电子组件及其制造方法
US4405971A (en)	1983-09-20	Electrical circuit apparatus
JPH05267062A (ja)	1993-10-15	チツプ型ｈｆ磁気コイル装置およびその製造方法
JPH08330142A (ja)	1996-12-13	溝付きコアを有する表面実装電子部材とその製造方法
JPH10335152A (ja)	1998-12-18	表面実装型インダクタ及びその製造方法
CN110136922B (zh)	2021-03-12	具有导电胶成型的线圈导体的电感元件
JPH0364903A (ja)	1991-03-20	印刷回路装置およびその製造方法
JPH0513236A (ja)	1993-01-22	コイル実装電子部品基板とその製造方法
JP2010050316A (ja)	2010-03-04	積層型電子部品及びその製造方法
TW202247728A (zh)	2022-12-01	電路板及其製造方法
JPH0137844B2 (de)	1989-08-09
JPH01194405A (ja)	1989-08-04	チップ形インダクタおよびその製造方法