JPH0526751Y2 - - Google Patents
Info
- Publication number
- JPH0526751Y2 JPH0526751Y2 JP1988019143U JP1914388U JPH0526751Y2 JP H0526751 Y2 JPH0526751 Y2 JP H0526751Y2 JP 1988019143 U JP1988019143 U JP 1988019143U JP 1914388 U JP1914388 U JP 1914388U JP H0526751 Y2 JPH0526751 Y2 JP H0526751Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- heater block
- tape
- semiconductor
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019143U JPH0526751Y2 (cs) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019143U JPH0526751Y2 (cs) | 1988-02-15 | 1988-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01123343U JPH01123343U (cs) | 1989-08-22 |
| JPH0526751Y2 true JPH0526751Y2 (cs) | 1993-07-07 |
Family
ID=31234392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019143U Expired - Lifetime JPH0526751Y2 (cs) | 1988-02-15 | 1988-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526751Y2 (cs) |
-
1988
- 1988-02-15 JP JP1988019143U patent/JPH0526751Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01123343U (cs) | 1989-08-22 |
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