JPH05267U - Jet soldering device - Google Patents

Abstract

(57) [Abstract] [Purpose] Reasonably captures and collects fine particles of scattered solder before they reach and adhere to the printed circuit board, eliminating the problems of the prior art, and soldering in a jet atmosphere in an inert gas atmosphere. Another object of the present invention is to provide a soldering device which has a large economical effect such as efficiency improvement and labor saving and equipment saving. A solder flow soldering device in which a solder bath equipped with a jet nozzle is installed in an inert gas atmosphere, and a buffer plate is arranged on the upstream side and the downstream side of the jet nozzle so as to be rotatable and adjustable, respectively. In the above, the above-mentioned buffer plates are provided with means for capturing and collecting scattered solder particles on the upper ends thereof.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement in a device for carrying out jet soldering in an atmosphere of an inert gas such as nitrogen gas while carrying a printed circuit board on which electronic components are mounted.

[0002]

[Prior art and its problems]

 As shown in FIGS. 6 and 7, there is known a jet type soldering device in which buffer plates 2 and 3 are arranged on the upstream side and the downstream side of the jet nozzle 1 so as to be rotatable and adjustable, respectively. The buffer plates 2 and 3 adjust the flow amount of the solder jetted from the jet nozzle 1 and returned to the solder bath, that is, the gap a between the lower end edges of the buffer plates 2 and 3 and the duct side wall 1a of the jet nozzle 1. Is adjusted to minimize the contact between the paddle jetted from the jet nozzle 1 and the outside air to suppress the degree of oxide film formation. Reference numeral 4 in FIG. 7 is a spherical interference flow conductor in which recessed corrugations are formed between the solder jet peak waveforms so that complete gas elimination and complete soldering can be achieved.

When the jet nozzle as described above is used in the atmosphere, the solder is oxidized by oxygen in the atmosphere, and an oxide film is formed on the surface of the solder. The generation of such an oxide film is not only a loss of solder, but also the fluidity of the solder is inferior, resulting in a decrease in jet soldering efficiency.

Therefore, in recent years, an apparatus for performing jet soldering in an inert gas atmosphere such as nitrogen gas has been developed. However, when jet soldering is performed in an inert gas atmosphere, the oxide film does not form on the solder surface, so there is the economical advantage of less solder loss, but the solder fluidity is significantly improved. Therefore, the jet solder often scatters as shown in the figure. The scattering of the solder means scattering of fine solder particles, and the fine solder particles adhere to unnecessary portions of the printed circuit board.

That is, they may be attached between the patterns on the printed circuit board or between the electronic components to cause an electrical trouble such as a short circuit. Also, for example, it may get into open parts such as connectors, or may pass through holes or slits in the printed circuit board from below and adhere to the upper surface of the printed circuit board, causing electrical problems. There is. In addition, there is a problem that the fine particles adhere to the vicinity of the jet nozzle, the carrier of the printed circuit board, the carrier claw, etc. to contaminate them.

For this reason, it is necessary to remove the fine particles of the solder to be attached by cleaning means after performing the jet soldering. This is an extra work separate from the soldering work, and not only the equipment for this is required, but also a lot of time and labor are wasted, which is a serious problem.

An object of the present invention is to reasonably capture and collect fine particles of scattered solder before they reach and adhere to a printed circuit board, and solve the problems of the prior art. It is intended to provide a soldering device which can improve the soldering efficiency and has a large economical effect such as labor saving and facility saving.

[0008]

[Means for Solving the Problems]

 According to the configuration of the present invention which solves the problems of the prior art, a solder bath equipped with a jet nozzle is installed in an inert gas atmosphere, and a buffer plate is rotated upstream and downstream of the jet nozzle. In the adjustable jet soldering device, a trapping and collecting means for the scattered solder particles is provided at the upper ends of both the buffer plates.

[0009]

[Action]

 The solder jetted from the jet nozzle not only solders the printed circuit board, but also the fine solder particles generated from the solder flow flowing down between the jet nozzle and the buffer plate are scattered on the buffer plate. The capturing and collecting means provided on the upper portion prevents the scattering and adhesion to the printed board.

[0010]

【Example】

 Next, details of the embodiments of the present invention will be described with reference to the drawings. 1 is a vertical sectional front view of the device of the present invention, FIG. 2 is a vertical sectional front view of a jet nozzle section, FIG. 3 is a vertical sectional front view of a jet nozzle section, and FIG. 4 is another exemplary embodiment of FIG. FIG. 5 is a vertical sectional front view, and FIG. 5 is a vertical sectional front view showing another embodiment of FIG.

FIG. 1 shows a solder bath 12 having a two-wave structure that is hermetically connected to the lower side of a midway portion of a duct 11 in which an inert gas such as nitrogen gas is sealed. An upstream solder chamber 12a and a downstream solder chamber 12b, which are divided by the wall 13, are formed. Jet nozzles 14 and 15 are provided in the solder chambers 12a and 12b, respectively. On the upstream and downstream sides of the jet nozzles 14 and 15, buffer plates 18 and 19 axially supported between the end plates 16 and 17 constituting the nozzles are attached so as to be rotatable and adjustable. Further, since the correspondence relationship between the buffer plates 18 and 19 and the jet nozzles 14 and 15 is as described above, detailed description thereof will be omitted. In the figure, reference numeral 20 denotes a carrier of a print substrate (not shown) having a parallel double-threaded chain structure and having electronic components mounted thereon.

According to the present invention having the above-described structure, the solder particles, which are refracted toward the jet nozzles 14 and 15 at the upper ends of the buffer plates 18 and 19 and are scattered, reach the printed board. The shield plates 18a and 19a having an eave structure for preventing the above are provided. As shown in FIGS. 2 and 3, the shielding plates 18a and 19a have a role of preventing and capturing the fine particles of the rice field that are scattered and rising, and naturally collecting the fine particles down-flowing.

FIGS. 4 and 5 show an embodiment in which the shield plates 18 a, 19 a can be adjusted up and down with respect to the buffer plates 18, 19. In this embodiment, the bottom plate portions 18b and 19b formed on the shield plates 18a and 19a are slidably abutted on the outer side surfaces of the buffer plates 18 and 19, and the bottom plate portions 18b and 19b of the shield plates 18a and 19a are fixed. Longitudinal guide holes 21 are formed at a plurality of places, and tightening metal fittings 22 such as bolts and nuts provided on the buffer plates 18 and 19 are inserted into the guide holes 21 so that the buffer plates 18 and 19 have shield plates 18a, The vertical movement of 19a is adjusted so that, for example, when the solder fine particles are often scattered, the shield plates 18a and 19a are lowered so as to be captured in the initial stage of the scattering.

A means for airtightly connecting the solder bath 12 to the duct 11 as shown in FIG. 1 will be described. An opening 23 is formed in the lower plate constituting the duct 11, and a downward sealing skirt 24 is attached so as to surround the opening 23. On the other hand, a seal frame body 25 having an upwardly U-shaped cross section is provided above the peripheral edge of the solder bath 12. Inside the seal frame body 25, a liquid material such as oil that is heat-resistant and not flammable, or A sealing material 26 made of an elastic material such as a closed-cell sponge is accommodated, and the opening edge of the sealing skirt 24 is immersed in the sealing material 26, or is inserted into the sealing material to seal the sealing material, and the duct is formed. The oxygen concentration in 11 is prevented from increasing.

Reference numeral 27 shown in FIG. 3 and FIG. 5 is a spherical interference flow conductor, in which a recessed corrugation is formed between solder jet peak waveforms so that complete gas elimination and complete soldering can be achieved. It is a thing. In addition, although the above-mentioned embodiment has explained the soldering apparatus of the two-wave structure using the two jet nozzles 14 and 15, it can be applied to the soldering apparatus of the one-wave structure. In addition, the structure of the jet nozzle is not limited to the configuration of the illustrated embodiment.

[0016]

[Effect of the device]

 As described above, according to the configuration of the present invention, the following effects can be obtained. Fine particles of the solder generated and scattered by the highly flowable solder flow jetted from the jet nozzle are reasonably trapped by the trapping and recovery means provided on the upper part of the buffer plate, and all the problems of the above-mentioned conventional techniques are solved. Can be solved by simple means.

[Brief description of drawings]

FIG. 1 is a vertical front view of the device of the present invention.

FIG. 2 is a vertical sectional front view of a jet nozzle portion.

FIG. 3 is a vertical sectional front view of a jet nozzle portion having an interference fluid.

FIG. 4 is a vertical sectional front view showing another embodiment of FIG.

5 is a vertical sectional front view showing another embodiment of FIG. 3. FIG.

FIG. 6 is a vertical sectional front view of a conventional jet nozzle unit.

FIG. 7 is a vertical sectional front view of a conventional jet nozzle unit.

[Explanation of symbols]

 Reference Signs List 11 duct 12 solder bath 12a solder chamber 12b solder chamber 13 partition wall 14 jet nozzle 15 jet nozzle 16 end plate 17 end plate 18 buffer plate 18a shield plate 19 buffer plate 19a shield plate

Claims (1)

[Claims for utility model registration] [Claim 1] A solder bath equipped with a jet nozzle is installed in an inert gas atmosphere, and a buffer plate is rotationally adjusted upstream and downstream of the jet nozzle, respectively. A jet-type soldering device, wherein the jet-type soldering device is capable of being disposed, and means for collecting and collecting scattered solder particles is provided on the upper ends of the both buffer plates.