JPH0527251B2 - - Google Patents

Info

Publication number
JPH0527251B2
JPH0527251B2 JP59048253A JP4825384A JPH0527251B2 JP H0527251 B2 JPH0527251 B2 JP H0527251B2 JP 59048253 A JP59048253 A JP 59048253A JP 4825384 A JP4825384 A JP 4825384A JP H0527251 B2 JPH0527251 B2 JP H0527251B2
Authority
JP
Japan
Prior art keywords
modified resin
parts
lead frame
adhesive
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59048253A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60193349A (ja
Inventor
Teru Okunoyama
Haruo Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP59048253A priority Critical patent/JPS60193349A/ja
Publication of JPS60193349A publication Critical patent/JPS60193349A/ja
Publication of JPH0527251B2 publication Critical patent/JPH0527251B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP59048253A 1984-03-15 1984-03-15 半導体素子 Granted JPS60193349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59048253A JPS60193349A (ja) 1984-03-15 1984-03-15 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59048253A JPS60193349A (ja) 1984-03-15 1984-03-15 半導体素子

Publications (2)

Publication Number Publication Date
JPS60193349A JPS60193349A (ja) 1985-10-01
JPH0527251B2 true JPH0527251B2 (fr) 1993-04-20

Family

ID=12798279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59048253A Granted JPS60193349A (ja) 1984-03-15 1984-03-15 半導体素子

Country Status (1)

Country Link
JP (1) JPS60193349A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428928A (en) * 1987-07-24 1989-01-31 Toshiba Chem Corp Semiconductor device
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition

Also Published As

Publication number Publication date
JPS60193349A (ja) 1985-10-01

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