JPH0527809Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] The present invention relates to a chip part that is surface-mounted on a printed circuit board using a mounter and that can be measured by locking a measurement probe. .

[Conventional technology]

Conventionally, check terminals have been used as an alternative to the above-mentioned chip parts, and they have shapes as shown in FIGS. 3A and 3B and FIG. 5A. The check terminal of the shape shown in Fig. 3 A and B is connected to the hole 44 as shown in Fig. 4 A and B.
After soldering other electrical components (not shown) to the circuit board 43 with the hole 43 opened, the end portion is inserted through the hole 44 and fastened. Thereafter, solder 46 is applied using a soldering iron, and the check terminal 4 is applied to the conductor portion 45 on the board.
1 or 42 electrically and mechanically. Now turn on the power to the circuit board 43 and check the hook-shaped portion 48 of the probe terminal 47 to the check terminal 41 or 4.
2 and connected to the probe terminal 47, the signal waveform can be measured by an oscilloscope, the ammeter can measure the current value, or the voltmeter can measure the voltage value, etc., and this can be used to inspect the circuit board. I was going there as.

The check terminal 50 shown in FIG. It has the same dimension as the direction dimension. Therefore, it is easy to design the mounting land on the circuit board, and since the flat plate portion 51 is soldered with a soldering iron, there is no need to provide a hole in the circuit board. In the case of the check terminal 50, as shown in FIG. The hook-shaped portion 48 of the probe terminal 47 and the hole 53 are engaged, and the signal waveform is detected by an oscilloscope connected to the probe terminal, the current value is detected by an ammeter, or the voltage is detected by a voltmeter. It can measure values, etc., and was used to inspect circuit boards after soldering components.

[Problem that the invention attempts to solve]

In the case of the above-mentioned check terminals 41 and 42, other electrical parts are mounted by a mounter, and soldering can be done by dip soldering or reflow soldering, which is automated, whereas irregularly shaped parts Because of this, it was difficult to automate and had to be done manually. That is, it was necessary to insert the end of the check terminal into a hole in the circuit board and solder it with a soldering iron. Furthermore, since it is relatively difficult to automate the check terminal 50, it has been manually mounted on the circuit board and soldered using a soldering iron. Further, since the opening 53 was small, dip soldering would fill the opening with solder, making dip soldering impossible.

An object of the present invention is to provide a chip component that can be automatically mounted using a mounter, can be reflow soldered or dip soldered, and can lock a probe terminal.

[Means to solve the problem]

In order to solve the above problems, the present invention is made of a metal plate with one side that can be soldered and the other side that cannot be soldered, and has a box-shaped cross section with the non-solderable side inside. Chip parts solve the above problems.

[Effect]

The above technical means works as follows. By making the chip part a metal cylinder with a box-shaped cross section,
The shape can be approximately the same as a standard resistance chip. Also, since non-solderable metal is exposed inside the cylindrical body of the chip component, solder cannot be applied.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. A chip component 1 according to an embodiment of the present invention shown in FIG. 1 includes a probe locking part 4, a soldering part 5,
It's getting more familiar. The cross section is box-shaped with a slit 9 as shown in Figure 1D, and the chip parts 1,
2 and 3 have a structure in which solder plating 8 is applied to the outer surface of stainless steel material 7. Therefore, the stainless steel material 7 is exposed inside the chip parts 1, 2, and 3. Figures 1(b) and 1(c) show other embodiments according to the present invention, in which recesses 6, 6 are formed in the probe locking part 4, and the probe terminal 47 is attached to the probe locking part 4, compared to FIG. 1b. It has a structure that makes it easy to lock. The material used is a stainless steel metal plate with solder plating on one side, similar to that shown in FIG. 1A. The length and width dimensions of chip parts 1, 2, and 3 are 3.2 mm x 1.6 mm or 2 mm x
It is 1.25mm, the same size as a standard chip resistor, making it easier to tape for automatic mounting and to pack into magazines. FIG. 2 shows a chip component 2 of the type shown in FIG. Shows a circuit board. When power is applied to the circuit board, the hook-shaped portion 48 at the tip of the probe terminal 47 is locked to the probe locking portion 4 of the chip component 2 soldered onto the measurement land 22, and the signal and voltage of the measurement land are Measure current, etc.

In the above embodiment, the chip parts 1, 2,
Since the three opposing probe locking portions 4 have the same shape, either probe locking portion 4 may be mounted facing the printed circuit board. That is, since the chip parts 1, 2, and 3 have no distinction between front and back, there is no need to check the front and back sides when mounting them.

Although this embodiment shows stainless steel as the solderable metal, any other metal may be used as long as it is not solderable. Although solder is shown as the solderable metal in this embodiment, other metals such as tin may be used as long as they are solderable metals. Furthermore, in this example, plating technology is used to make one side of the metal plate solderable and the other side unsolderable, but there are other methods that can be metalized without necessarily using plating technology. That is good, and depending on the case, you may also use clad wood.

[Effect of idea]

As explained above, the chip component according to the present invention has the same longitudinal and lateral dimensions as a standard chip resistor, and has the advantage of being easy to mount automatically. Alternatively, a chip component with a box-shaped cross section is formed by metallizing one side of a non-solderable metal plate with a solderable metal, with the non-solderable surface facing inside. Solder adheres to the outside of the component and is soldered to the solder land, while the inside has unsolderable metal exposed, so no soldering occurs, allowing deep soldering. Since the probe terminals are not blocked, the probe terminals can be reliably locked.

[Brief explanation of the drawing]

Figure 1 A, B, and C are perspective views of an embodiment of the present invention;
Fig. 1D is a sectional view of the embodiment of the present invention, Fig. 2 is an explanatory view of the use of the present invention, Fig. 3 is a perspective view of the conventional example, Fig. 4 is an explanatory view of the conventional example, and Fig. 5 is an explanatory view of the use of the conventional example. FIG. 7 is a perspective view and a usage explanatory diagram of another conventional example. 1, 2, 3... Chip parts, 4... Locking part, 4
7...Measurement probe, 48...Hook-shaped part.

Claims (1)

[Scope of utility model registration request] A chip component characterized in that one side is made of a solderable metal plate and the other side is a non-solderable metal plate, and the chip part is formed into a box-shaped cylinder in cross section with the non-solderable side facing inside.