JPH0528026U - Electric double layer capacitor - Google Patents

Abstract

(57) [Abstract] [Purpose] Improve stability (mountability) during surface mounting [Structure] At least one coin-shaped capacitor cell is included, and lead terminals are attached to each electrode surface of the capacitor cell. , An electric double layer capacitor comprising a capacitor body 1 formed by bending the free end side of each of the lead terminals in the same direction which is substantially perpendicular to the electrode surface, wherein each lead terminal 10, 20 is welded to the electrode surface. Terminal bodies 11 and 21 having welded parts,
The soldering portions 13 and 23, which are bent so as to be substantially parallel to the soldering surface of the mounting board on the tip side of the terminal bodies 11 and 21, are provided.
The width of 3, 23 is formed to be equal to or larger than the width of the terminal bodies 11, 21.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electric double layer capacitor, and more particularly to an electric double layer capacitor suitable for surface mounting on a printed circuit board.

[0002]

[Prior Art]

 The electric double layer capacitor has a coin-shaped capacitor cell as a minimum unit and is used in a state in which a plurality of stacked capacitor cells are stacked according to the application. When mounting on a board, lead terminals are attached to each electrode surface.

6 and 7 show a capacitor body 1 as a conventional example thereof. That is, the same capacitor body 1 is formed by stacking two capacitor cells 2 and 3. According to this, a cup-shaped coupling member 4 is attached to, for example, the anode surface 2a side of one capacitor cell 2. The cathode surface 3b side of the other capacitor cell 3 is fitted in the coupling member 4.

A sleeve 5 made of a heat-shrinkable and electrically insulating resin is covered around the capacitor body 1, and a lead terminal 6 is provided on a cathode surface 2b and an anode surface 3a located at both ends of the laminated body. , 7 are attached respectively.

Here, since the cases of the capacitor cells 2 and 3, the coupling member 4 and the lead terminals 6 and 7 are made of stainless steel, they are attached by, for example, laser welding.

[0006]

[Problems to be solved by the device]

 To apply to surface mounting, bend the free end side of each lead terminal 6, 7 in the same direction substantially orthogonal to each electrode surface 2b, 3a, and further mount the respective tip portions 6a, 7a to the board surface to be mounted. It is bent at a right angle to be parallel.

That is, the tip portions 6a and 7a are preliminarily plated with solder, and the same portions are soldered.

However, the lead terminals 6 and 7 that have been conventionally used have the tip portions 6a and 7a that are thinly formed into a pin shape so as to be inserted into the through holes of the substrate, and thus lack in stability during mounting. , Not practical.

[0009]

[Means for Solving the Problems]

 The present invention has been made in order to solve the above-mentioned conventional drawbacks, and its structural feature is to include at least one coin-shaped capacitor cell, and to attach lead terminals to each electrode surface of the capacitor cell. , An electric double layer capacitor having a capacitor body formed by bending the free end side of each of the lead terminals in the same direction at a right angle to the electrode surface, each lead terminal being welded to the electrode surface by welding. Part of the terminal body and a soldering part that is bent so that it is substantially parallel to the soldering surface of the mounting board on the tip side of the terminal body, and the width of the soldering part is It is formed to be equal to or wider than the width of the main body.

In this case, it is preferable to form a notch groove or a through hole in the soldering portion.

[0011]

[Action]

 As in the above configuration, the width of the soldered portion is formed to be equal to or larger than the width of the terminal body, so that the stability at the time of board mounting is improved.

In addition, by providing a notch groove or a through hole in the soldering portion, the solderability is improved, and a pin engaging with it is planted on the board side to mount them as a guide. Positioning at the time can also be performed.

[0013]

【Example】

 An embodiment of the present invention will be described with reference to FIGS. 1 to 5. However, the configuration of the capacitor body 1 is the same as that of the conventional example described above, and therefore the description thereof is omitted here.

As shown in FIG. 1, this electric double layer capacitor has a pair of lead terminals 10 and 20 attached to each electrode surface of the capacitor body 1.

Each of the lead terminals 10 and 20 is provided with a terminal body 11 or 21 having a predetermined width and having a substantially cruciform welded portion that is welded to the electrode surface. In this case, the terminal main bodies 11 and 21 include leg portions 12 and 22 that are bent at a substantially right angle from a predetermined portion thereof toward the mounting board side, and the mounting portions are mounted at the tip ends of the leg portions 12 and 22. The soldering portions 13 and 23, which are bent so as to be substantially parallel to the soldering surface of, are connected in series.

Each of the leg portions 12 and 22 is so designed that the soldering portions 13 and 23 thereof are in the same plane when the lead terminals 10 and 20 are attached to the capacitor body 1. It is bent into a substantially L shape from the part.

The lead terminals 10 and 20 are both made of stainless steel, but the soldering parts 13 and 23 are plated with solder or tin.

In the example of FIG. 1, the soldering parts 13 and 23 are formed to have the same width as the leg parts 12 and 22 of the terminal bodies 11 and 21, thereby ensuring the stability when mounting on the board. There is.

2 to 5 show modified examples of the soldering parts 13 and 23. Although only one soldering portion 13 is shown in these drawings, the other soldering portion 23 can be similarly modified.

First, in the first modified example of FIG. 2, the soldering portion 13 has flanges 13 a and 13 a that are continuously provided so as to project to the side thereof, and the width thereof as a whole is the leg of the terminal body 11. It is made larger than the width of the portion 12. This flange 13a may be only one. The shape of the flange 13a is rectangular as shown in the drawing, but may be trapezoidal or arcuate.

Next, in the second modified example of FIG. 3, a notch groove 13 b is formed at the edge of the soldering portion 13. Instead of the notch groove 13b, a through hole 13c may be formed in the soldering portion 13 as shown in the third modification of FIG.

According to the second modified example and the third modified example, the solderability is improved. Further, as illustrated in FIG. 3, the pin 31 is set up on the printed circuit board 30 side, and the notch groove 13b or the through hole 13c is engaged with the pin 31 to determine the position at the time of mounting. You can

FIG. 5 shows a fourth modification in which the first modification and the second modification are combined. That is, the notch groove 13b is formed at the end edge of the soldering portion 13 having the flanges 13a, 13a which spread to both sides.

According to the fourth modification, both stability and solderability at the time of mounting are improved, and positioning with respect to the board can be easily performed. Although the combination of the modified examples is arbitrary and not shown in the drawings, the same effect as the fourth modified example can be obtained by combining the first modified example and the third modified example.

The notch groove 13b and the through hole 13c do not necessarily have to be provided in both the lead terminals 10 and 20 and may be provided in either one. Further, for example, the notch groove 13b may be formed in one lead terminal and the through hole 13c may be formed in the other lead terminal 20.

[0026]

[Effect of the device]

 As described above, according to the present invention, there is provided an electric double layer capacitor having good stability (mountability) with respect to a printed circuit board when surface-mounted.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a capacitor body and a lead terminal of an electric double layer capacitor according to an embodiment of the present invention in a separated state.

FIG. 2 is a perspective view of an essential part showing a first modified example of the present invention.

FIG. 3 is a perspective view of an essential part showing a second modified example of the present invention.

FIG. 4 is a perspective view of an essential part showing a third modified example of the present invention.

FIG. 5 is a perspective view of an essential part showing a fourth modified example of the present invention.

FIG. 6 is an exploded perspective view showing an electric double layer capacitor as a conventional example.

FIG. 7 is a sectional view of the conventional example.

[Explanation of symbols]

 1 Capacitor body 2,3 Capacitor cell 4 Coupling member 5 Sleeve 10,20 Lead terminal 11,21 Terminal body 12,22 Leg part 13,23 Soldering part 13a Flange 13b Notch groove 13c Through hole

Claims (4)

[Scope of utility model registration request] 1. At least one coin-shaped capacitor cell is provided, and a lead terminal is attached to each electrode surface of the capacitor cell, and the free end side of each lead terminal is substantially perpendicular to the electrode surface. In an electric double layer capacitor provided with a capacitor body bent in the same direction, each lead terminal has a terminal body having a welded portion to be welded to the electrode surface, and a solder of a mounting board at a tip end side of the terminal body. And a soldering portion bent so as to be substantially parallel to the soldering surface, the width of the soldering portion being formed to be equal to or larger than the width of the terminal body. Double layer capacitor. 2. The electric double layer capacitor according to claim 1, wherein the soldering portion is provided with a flange extending laterally from the soldering portion. 3. The electric double layer capacitor according to claim 1, wherein a cutout groove is formed at an edge of the soldered portion. 4. The electric double layer capacitor according to claim 1, wherein the soldering portion has a through hole.