JPH0528034U - Intermediate structure of electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] To prevent the lead from being deformed when the element is mounted on the lead of the continuous lead frame and the intermediate structure of the electronic component in which the element is molded with the exterior resin is wound. [Structure] On the front and back surfaces of the strip (11) of the continuous lead frame (10), the height is higher than the height of the exterior resin (1) in which the leads (13) are molded, and is longer than the width of the exterior resin (1). The spacer (2) is provided in a protruding manner.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an intermediate structure of an electronic component in which an element is mounted on a lead of a continuous lead frame (hoop-shaped lead frame), and the element is molded with an exterior resin. Specifically, the lead can be wound without deformation. Related to the intermediate structure of electronic components.

[0002]

[Prior Art]

 2. Description of the Related Art Electronic components such as diodes are manufactured from a continuous lead frame which is a strip of lead frame and is elongated in response to a demand for ultra-miniaturization. A conventional example of this continuous lead frame will be described with reference to FIG.

In the continuous lead frame (10), a pair of strips (11) (11) arranged in parallel are connected by a large number of fixed pitch tie bars (12) (12) ... (12) ... Leads (13) and (13) are extended from the strips (11) and (11) between them. An element (not shown) is mounted on the free ends of the leads (13) (13), and the element is molded with the external resin (1) to complete the intermediate structure of the electronic component. The mounting of the element and the molding of the exterior resin (1) are carried out collectively for every plurality by intermittently feeding the continuous lead frame (10). When the intermediate structure is completed, as shown in FIG. 4, the intermediate structure is transferred to a subsequent step such as a lead cutting step in a wound state. After that, when the boundaries between the leads (13) (13) and the strips (11) (11) are cut, a diode, which is an electronic component, is completed.

Electronic components manufactured from the continuous lead frame (10) may be transistors or the like in addition to diodes.

[0005]

[Problems to be solved by the device]

 When the intermediate structure of the electronic component is wound, as shown in FIGS. 4 and 5, the outer peripheral resin (1) and the outer peripheral resin (1) adjacent to each other come into contact with each other or are fitted together. It will be in the state where it did. When the exterior resin (1) and the exterior resin (1) come into contact with each other, they may be pressed against each other and the leads (13) (13) may be deformed in the thickness direction. Further, when the exterior resin (1) and the exterior resin (1) are fitted to each other, the exterior resin (1) and the exterior resin (1) are caught when the intermediate structure of the electronic component is stretched from the wound state, The leads (13) (13) may be deformed in the length direction of the continuous lead frame (10). In this way, when the leads (13) (13) are deformed, they become defective products, so that a separate correction process is required, and there is a problem that productivity is reduced. Further, if the leads (13) (13) are deformed beyond correction, the yield will be reduced.

Therefore, an object of the present invention is to provide an intermediate structure of an electronic component in which leads can be wound without deformation.

[0007]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, a pair of strips arranged in parallel are connected by a large number of tie bars with a constant pitch, and the leads extend inward from each strip between the tie bars. In an intermediate structure of an electronic component in which an element is mounted on the upper part and the element is molded with an exterior resin, an intermediate structure of an electronic component is characterized in that a large number of spacers are convexly provided on the pair of strips. provide.

In addition, the height and the length of the spacer are made larger than the height and the width of the exterior resin, and the protrusions are provided on the front and back surfaces of the strip plate where the leads are extended. Provides an intermediate structure for parts.

[0009]

[Action]

 According to the above-mentioned means, by providing a large number of spacers on each strip, the spacers come into contact with each other when the intermediate structure of the electronic component is wound. Therefore, the exterior resin on the outer peripheral side and the exterior resin on the inner peripheral side which are adjacent to each other do not come into contact with each other, and the exterior resin is not fitted between the exterior resins.

[0010]

【Example】

 An embodiment according to the present invention will be described with reference to FIGS. However, the same parts as the conventional ones are given the same reference numerals and the description thereof will be omitted.

The intermediate structure of the electronic component according to the present invention is one in which a large number of spacers (2) made of, for example, resin are provided on the strip plates (11) (11) of the continuous lead frame (10) at a constant pitch. Is. The spacer (2) is, for example, convexly provided on both front and back surfaces of each strip (11) (11) at the portion where the leads (13) (13) are extended, and the height (H) of the spacer (2) is set. Is made higher than the exterior resin (1) protruding to the surface side, and the length (L) of the spacer (2) is made longer than the width of the exterior resin (1). The size of the exterior resin (1) is hidden by the spacer (2). When such spacers (2) are projected with resin, a cavity for projecting spacers (2) is formed in a mold (not shown) for molding the exterior resin (1), and the element is mounted. At the same time as molding with the exterior resin (1), spacers (2) are provided on the strips (11) (11) in a protruding manner.

In this way, when a large number of spacers (2) with a constant pitch are provided on the strip plates (11) and (11) in a protruding manner, the intermediate structure of the electronic component is completed. This intermediate structure is wound in the same manner as the conventional one and transferred to the subsequent process. At this time, as shown in FIG. 2, the outer peripheral side spacers (2) and the inner peripheral side spacers (2) adjacent to each other come into contact with each other, and the outer peripheral side exterior resin (1) and the inner peripheral side exterior resin (1) are adjacent to each other. No contact with (1) or fitting of another exterior resin (1) between the exterior resin (1) and the exterior resin (1). Therefore, the outer resin (1) is pressed by the other outer resin (1), the leads (13) (13) are deformed in the thickness direction, and the outer resin (1) is changed to the other outer resin (1). The lead (13) (13) is prevented from being deformed in the length direction of the continuous lead frame (10) by being pulled by.

The above is a description of an embodiment according to the present invention. The present invention is not limited to this embodiment and can be modified in design within the scope of the present invention. For example, the spacer is limited to resin. Not something to do. In addition, spacers may be provided on the strip plate of the continuous lead frame in a protruding manner in a step after the element is molded with the exterior resin.

[0014]

[Effect of the device]

 According to the present invention, since the spacer is provided on the strip plate of the continuous lead frame, the leads are not deformed when the intermediate structure of the electronic component is wound. Therefore, the work of correcting the deformed leads can be eliminated, and the productivity and yield of electronic components can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an intermediate structure of an electronic component according to the present invention.

FIG. 2 is a side view of a main part when an intermediate structure of an electronic component according to the present invention is wound.

FIG. 3 is a perspective view of an intermediate structure of a conventional electronic component.

FIG. 4 is a front view of a conventional intermediate structure of an electronic component wound.

FIG. 5 is a plan view illustrating a problem when winding an intermediate structure of a conventional electronic component.

[Explanation of symbols]

 1 Exterior resin 2 Spacer 10 Continuous lead frame 11 Strip plate 12 Tie bar 13 Lead H Height L Length

Claims (2)

[Scope of utility model registration request] 1. An element on a lead of a continuous lead frame in which a pair of strips arranged in parallel are connected by a large number of tie bars having a constant pitch, and leads extend inward from each strip between the tie bars. In the intermediate structure of the electronic component, in which the element is mounted and the element is molded with the exterior resin, a large number of spacers are provided in a protruding manner on each of the pair of strips. 2. The spacer according to claim 1, wherein a height and a length of the spacer are made larger than a height and a width of the exterior resin, and the spacers are provided on the front and back surfaces of the strip plate where the leads are extended. An intermediate structure for electronic components.