JPH0528084U - PCB grounding structure - Google Patents
PCB grounding structureInfo
- Publication number
- JPH0528084U JPH0528084U JP8239591U JP8239591U JPH0528084U JP H0528084 U JPH0528084 U JP H0528084U JP 8239591 U JP8239591 U JP 8239591U JP 8239591 U JP8239591 U JP 8239591U JP H0528084 U JPH0528084 U JP H0528084U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- chassis
- solder
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】
【目的】 電子機器において、部品点数が少なく構造が
簡単なプリント基板の接地構造を提供する。
【構成】 プリント基板１に形成したアースパターンの
銅箔露出部1cに半田を一様に付着させる。このプリント
基板１をシャーシ２に嵌め込み、底面1aの四隅に設けた
ボス2d上に載置して、ネジ３によりこのボス2dに取付け
る。これによりプリント基板１の銅箔露出部1bの半田面
と、突出部2bに設けた当接部2cとは圧接され、プリント
基板１はシャーシ２に接地される。
(57) [Abstract] [Purpose] To provide a grounding structure for a printed circuit board having a small number of parts and a simple structure in an electronic device. [Structure] Solder is uniformly attached to a copper foil exposed portion 1c of an earth pattern formed on a printed circuit board 1. The printed board 1 is fitted into the chassis 2, placed on the bosses 2d provided at the four corners of the bottom surface 1a, and attached to the boss 2d with the screws 3. As a result, the solder surface of the copper foil exposed portion 1b of the printed circuit board 1 and the contact portion 2c provided on the protruding portion 2b are brought into pressure contact with each other, and the printed circuit board 1 is grounded to the chassis 2.
Description
【０００１】[0001]
この考案は電子機器におけるプリント基板の接地構造に関する。 The present invention relates to a grounding structure for a printed circuit board in an electronic device.
【０００２】[0002]
従来の電子機器におけるプリント基板の接地構造では、図２に示すように、プ リント基板11のパターン面11a に形成したアースパターンの銅箔露出部11b に、 金属板12の曲げ部12a を半田付けして、この金属板12を２本のネジ13で、シャー シ14の底面14a に設けた突出部14b に取付け、金属板12を介してプリント基板11 のアースパターンをシャーシ14に接続していた。 In the conventional grounding structure of the printed circuit board in the electronic device, as shown in FIG. 2, the bent part 12a of the metal plate 12 is soldered to the exposed copper foil part 11b of the ground pattern formed on the pattern surface 11a of the printed circuit board 11. Then, the metal plate 12 was attached to the projecting portion 14b provided on the bottom surface 14a of the chassis 14 with two screws 13, and the ground pattern of the printed circuit board 11 was connected to the chassis 14 via the metal plate 12. .
【０００３】[0003]
しかし、上記した従来のプリント基板の接地構造は、プリント基板と金属板と の半田付けに時間がかかり、作業性も悪かった。 However, in the above-described conventional grounding structure for a printed circuit board, it takes time to solder the printed circuit board and the metal plate, and workability is poor.
【０００４】 また、金属板をネジで取付けるので、作業工数が多くなっていた。Further, since the metal plate is attached with screws, the number of work steps is increased.
【０００５】 更に、金属板を介しているためプリント基板に発生した熱の放熱が阻害されて いた。Further, since the metal plate is interposed, the heat radiation of the heat generated in the printed circuit board is hindered.
【０００６】 この考案は上記した点に鑑みてなされたものであり、その目的とするところは 従来例の欠点を解消し、部品点数が少なく構造が簡単なプリント基板の接地構造 を提供するところにある。The present invention has been made in view of the above points, and an object thereof is to solve the drawbacks of the conventional example and to provide a grounding structure for a printed circuit board with a small number of parts and a simple structure. is there.
【０００７】[0007]
この考案のプリント基板の接地構造は、プリント基板に形成したアースパター ンの銅箔露出部に半田を一様に付着させた半田面を、シャーシに設けた突出部に 接触させ、プリント基板のアースパターンとシャーシとを接続する様に構成した ものである。 The grounding structure of the printed circuit board of this invention is the grounding of the printed circuit board by making the solder surface, which is the solder evenly adhered to the exposed copper foil of the ground pattern formed on the printed circuit board, contact the protruding part provided on the chassis. It is configured to connect the pattern and the chassis.
【０００８】 また、前記銅箔露出部と突出部との接触部は夫々平面をなし面接触する様にし たものである。Further, the contact portion between the exposed portion of the copper foil and the protruding portion has a flat surface and is in surface contact with each other.
【０００９】 更に、前記半田面の半田の厚さが前記プリント基板に塗布されたレジスト膜の 厚さを越えるようにしたものである。Further, the thickness of the solder on the solder surface exceeds the thickness of the resist film applied to the printed board.
【００１０】[0010]
この考案によれば、プリント基板のアースパターンの銅箔露出部に半田を、薄 く一様に付着させているので、この半田面をシャーシの突出部に直接接触させれ ば、プリント基板のアースパターンとシャーシを接地することができる。 According to this invention, the solder is applied thinly and evenly to the exposed copper foil of the grounding pattern of the printed circuit board. The pattern and chassis can be grounded.
【００１１】 また、付着させる半田の厚さを、レジスト膜の厚さより厚くしているのでレジ スト膜に影響されることなくシャーシとの接触は確実になり、接地は完全に行わ れる。Further, since the thickness of the solder to be adhered is made thicker than the thickness of the resist film, the contact with the chassis is ensured without being affected by the resist film, and the grounding is completely performed.
【００１２】[0012]
この考案に係るプリント基板の接地構造の実施例を図１に基づき説明する。 An embodiment of a grounding structure for a printed circuit board according to the present invention will be described with reference to FIG.
【００１３】 図において、１は電子機器のシャーシ内に取付けられるプリント基板、1aはパ ターン面、1bはパターン面1aに形成され平面をなしたアースパターンの銅箔露出 部、1cはシャーシの当接部を除く突出部と当接しないための切り込み部である。In the figure, 1 is a printed circuit board mounted in a chassis of electronic equipment, 1a is a pattern surface, 1b is a copper foil exposed portion of a flat ground pattern formed on the pattern surface 1a, and 1c is a chassis surface. It is a notch that does not come into contact with the protruding portion except the contact portion.
【００１４】 ２は導電性部材で形成され箱形をなした電子機器のシャーシ、2aは底面、2bは シャーシ２内の端部に設けた導電性を有した突出部である。2cは突出部2bの前部 に設けられ、この突出部2bの上面から更に突出し平面をなした当接部である。2d は底面2aの四隅に立設した４つのボスであり、頂部にネジを螺合する孔を備えて いる。Reference numeral 2 is a chassis of a box-shaped electronic device formed of a conductive member, 2 a is a bottom surface, and 2 b is a conductive protrusion provided at an end of the chassis 2. Reference numeral 2c is a contact portion which is provided in the front portion of the protrusion 2b and further protrudes from the upper surface of the protrusion 2b to form a flat surface. 2d are four bosses which are erected at the four corners of the bottom surface 2a, and are provided with holes for screwing at the top.
【００１５】 以上のように構成した本考案の組付けと作用を説明する。The assembling and operation of the present invention constructed as above will be described.
【００１６】 図１に示すように、シャーシ２にプリント基板１のパターン面1aを下にして嵌 め込み、このプリント基板１を底面2aの四隅に立設された４つのボス12d ，12d ，・・・ 上に載置し、４本のネジ３，３，・・・ によって、ボス2d，2d，・・・ に取付 ける。As shown in FIG. 1, the printed circuit board 1 is fitted into the chassis 2 with the pattern surface 1a facing downward, and the printed circuit board 1 is provided with four bosses 12d, 12d, ... Standing at the four corners of the bottom surface 2a. ..Mounted on top and attached to bosses 2d, 2d, ... with 4 screws 3, 3 ,.
【００１７】 このとき、アースパターンの銅箔露出部1cに一様に薄く付着した半田面とシャ ーシ２の当接部2cとは、面接触し、且つ、圧接されるので、プリント基板１のア ースパターンとシャーシ２は直接電気的に接続され確実に接地される。At this time, the solder surface evenly attached to the copper foil exposed portion 1c of the ground pattern and the contact portion 2c of the chassis 2 are in surface contact and pressure contact, so that the printed circuit board 1 The ground pattern and the chassis 2 are directly electrically connected and reliably grounded.
【００１８】 また、アースパターンの銅箔露出部1cに一様に薄く付着した半田の厚さは、レ ジスト膜の厚さを越えているため、レジスト膜には影響されず当接部2cとの接触 は確実となり、接触不良は発生しない。Further, since the thickness of the solder uniformly and thinly attached to the copper foil exposed portion 1c of the ground pattern exceeds the thickness of the resist film, it is not affected by the resist film and the contact portion 2c. The contact is secure and no contact failure occurs.
【００１９】[0019]
この考案に係るプリント基板の接地構造によれば、上述のように構成したので 、構造が簡単になりプリント基板の組付けが容易になる。 また、部品点数の削減及び金属板の半田付けの工数削除により、大幅なコスト ダウンとなる。 Since the printed circuit board grounding structure according to the present invention is configured as described above, the structure is simplified and the printed circuit board is easily assembled. Also, by reducing the number of parts and eliminating man-hours for soldering metal plates, the cost will be significantly reduced.
【００２０】 また、プリント基板の放熱効果がよくなる。Further, the heat dissipation effect of the printed circuit board is improved.
【００２１】 更に、接地が確実となり強化されるので、電力増幅部で発生する寄生振動を抑 止することができる。Further, since the grounding is surely performed and strengthened, it is possible to suppress the parasitic vibration generated in the power amplification unit.
【図１】本考案におけるプリント基板の接地構造を示す
分解斜視図である。FIG. 1 is an exploded perspective view showing a grounding structure of a printed circuit board according to the present invention.
【図２】従来例におけるプリント基板の接地構造を示す
分解斜視図である。FIG. 2 is an exploded perspective view showing a grounding structure of a printed circuit board in a conventional example.
１ プリント基板 1a パターン面 1b 銅箔露出部 1c 切り込み部 ２ シャーシ 2a 底面 2b 突出部 2c 当接部 2d ボス ３ ネジ 1 Printed circuit board 1a Pattern surface 1b Copper foil exposed part 1c Cut part 2 Chassis 2a Bottom face 2b Projection part 2c Contact part 2d Boss 3 Screw
Claims (3)
の銅箔露出部に半田を一様に付着させた半田面を、シャ
ーシに設けた突出部に接触させ、プリント基板のアース
パターンとシャーシとを接続するように構成したことを
特徴とするプリント基板の接地構造。1. A grounding pattern on a printed circuit board and a chassis are connected to each other by contacting a solder surface on which a solder is evenly attached to a copper foil exposed part of a grounding pattern formed on the printed circuit board with a protrusion provided on the chassis. A grounded structure for a printed circuit board, characterized in that
々平面をなし面接触することを特徴とする請求項１記載
のプリント基板の接地構造。2. The grounding structure for a printed circuit board according to claim 1, wherein the contact portions between the exposed portion of the copper foil and the protruding portion are flat and are in surface contact with each other.
基板に塗布されたレジスト膜の厚さを越えていることを
特徴とする請求項１または２記載のプリント基板の接地
構造。3. The ground structure for a printed circuit board according to claim 1, wherein the thickness of the solder on the solder surface exceeds the thickness of the resist film applied to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8239591U JPH0528084U (en) | 1991-09-13 | 1991-09-13 | PCB grounding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8239591U JPH0528084U (en) | 1991-09-13 | 1991-09-13 | PCB grounding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0528084U true JPH0528084U (en) | 1993-04-09 |
Family
ID=13773401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8239591U Pending JPH0528084U (en) | 1991-09-13 | 1991-09-13 | PCB grounding structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528084U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232165A (en) * | 2001-02-06 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Earthing mechanism and motor control device using the same |
-
1991
- 1991-09-13 JP JP8239591U patent/JPH0528084U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232165A (en) * | 2001-02-06 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Earthing mechanism and motor control device using the same |
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