JPH05282941A - How to connect lead laminated tape - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a method for connecting a lead laminated tape having a large mechanical strength at the connecting portion. [Structure] The plastic film on both sides of the lead laminate tape to be connected is peeled off, the lead foils are stacked on top of each other and bonded with low temperature solder, and then the one plastic film which has been peeled off in advance is put on the lead tape again. paste,
After that, a method of connecting the lead laminate tapes in which a reinforcing plastic film is attached over the plastic films of both lead laminate tapes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a lead laminate tape forming a water shield layer of a power cable with a water shield layer, for example.

[0002]

2. Description of the Related Art Conventionally, the problems to be solved by the invention
Since the single length of the lead foil manufactured by the lead foil manufacturer is as short as 500 to 750 m, the laminate tape can only be short length products, so long length impermeable cable cannot be produced and productivity is poor. There was a problem.

When it is necessary to connect a lead laminate tape, the following method has been conventionally used. That is,
After cutting the end part of the lead laminated tape perpendicular to the length direction of the tape, peeling off the plastic film of the end, stacking the lead foils, iron the lead foil from the top with the normal solder interposed between them. Alternatively, a plate with a heater is used for heating and bonding, and then one of the plastic films, which has been peeled off in advance, is bonded on a lead tape using an adhesive or the like to form a connection part.

In the above-mentioned conventional connection method, since the lead foils are bonded together by using the normal solder, the solders are difficult to melt, a gap is formed in the overlapping portion of the lead foils, and a partial discharge occurs when the power is applied. There was a problem. In addition, the end of the lead laminated tape is cut and connected perpendicularly to the length direction of the tape, and further, the peeled plastic film is simply pasted again on the soldering of the lead foil. There was a problem that the strength was insufficient and the cable was cut at the time of manufacturing.

[0005]

SUMMARY OF THE INVENTION The present invention solves the above problems and provides a method for connecting a lead laminate tape having a large mechanical strength at the connecting portion, which is characterized by the lead laminate tape to be connected. After peeling off the plastic film on both sides of the terminal, overlapping the lead foils and bonding them with low temperature solder, and then re-adhering one of the plastic films which had been peeled off in advance on the lead tape, and then both lead laminates It consists in sticking a reinforcing plastic film over the plastic film of the tape.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a vertical cross-sectional view of a specific example of a lead laminated tape connecting part connected by the connecting method of the present invention, FIG. 2 (a) is a top view of FIG. 1, and FIG. It is a figure. In the drawing, A is a laminated tape for connection, which is a lead foil.
Insulating film such as PVC film on one side of 1A 2A
On the other surface, a semiconductive film 3A such as a semiconductive PVC film is laminated and integrated with an adhesive or the like. B is the other laminated tape to be connected. Similarly, an insulating film 2B is laminated on one surface of the lead foil 1B, and a semiconductive film 3B is laminated on the other surface via an adhesive layer.

At the time of connection, the end portions of the lead laminated tapes A and B are formed at an angle θ with respect to the tape length direction.
Cut so that it becomes = 30 °. Then, the insulating films 2A and 2B and the semiconductive films 3A and 3B at the ends of the tapes A and B are peeled off to expose the ends of the lead foils 1A and 1B. At this time, the semiconductive film 3A of the laminated tape A is left without being removed, and the insulating film 2A is removed. on the other hand,
The insulating film 2B at the end of the laminated tape B is left without being removed, and the semiconductive film 3B is removed.

In such a state, the exposed ends of the lead foils 1A and 1B are overlapped with each other via the low temperature solder 4, and the lead foils are heated and bonded with an iron or the like. At this time, if the low temperature solder 4 is crushed in advance and then bonded, it can be bonded evenly. Next, the end a of the semi-conductive film 3A that has been left without being peeled and removed is attached again onto the lead foil 1A with an adhesive or the like, and similarly, the end b of the insulating film 2B is attached with an adhesive. Re-attach via etc. After that, a reinforcing insulating film 5 such as a PVC film is laid over the insulating film 2A of the laminating tape A and the insulating film 2B of the laminating tape B by an adhesive or the like to reinforce. Further, the semi-conductive film 3A of the laminating tape A and the semi-conductive film 3B of the laminating tape B are also reinforced with a semi-conductive PVC film or the like.
As shown in (a), first, both side edges were reinforced with a reinforcing semiconductive film 6, and the reinforcing portion 6 was covered to be reinforced with a reinforcing semiconductive film 7 to form a lead laminated tape connection portion.

In this way, the ends of the tape are cut and connected at an angle θ = 30 ° with respect to the length direction of the tape, and further,
By adhering a reinforcing film on the lead foil connection to reinforce it, it is possible to have sufficient strength against pulling and bending of the cable during processing or installation of the cable.

[0010]

As described above, according to the connection method of the present invention, since the superposed portion of the lead foil is heat-bonded by using the low temperature solder, uniform bonding can be obtained and the mechanical strength is increased. Moreover, it is possible to prevent partial discharge when the cable is charged. Further, since the reinforcing film is attached and reinforced on the connecting portion of the lead foil, it is possible to have sufficient strength against pulling and bending of the cable. Therefore, if the connection method of the present invention is used to manufacture a power cable with a water shield layer, a lead laminated tape having a length up to the full capacity of the water shield tape supply can be used. It is extremely effective for long production.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a specific example of a lead laminated tape connecting portion connected by a connecting method of the present invention.

2 (a) is a top view of FIG. 1, and FIG. 2 (b) is FIG.
FIG.

[Explanation of symbols]

 A, B Laminating tape 1A, 1B Lead foil 2A, 2B Insulation film 3A, 3B Semi-conductive film 4 Low temperature solder 5 Reinforced insulation film 6,7 Reinforced semi-conductive film

Claims (1)

[Claims] 1. A method of connecting a lead laminate tape in which a plastic film is laminated and integrated on both sides of a lead foil, the plastic film on both sides of the end of the lead laminate tape to be connected is peeled off, and the lead foils are superposed on each other at a low temperature. It is characterized in that one plastic film that has been bonded with solder and then peeled off in advance is re-applied to the lead tape, and then the reinforcing plastic film is applied over the plastic film of both lead laminate tapes. How to connect lead laminated tape.