JPH0528519B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a mounting structure for an electronic circuit package, and more particularly to a mounting structure for a high-density mounting type electronic circuit package used in mobile electronic equipment. .

[Prior Art] Conventionally, the mounting structure of this type of electronic circuit package has evolved from the early days of mounting electronic components on printed circuit boards and wiring between each printed circuit board using connecting wires or printed wiring. In order to achieve miniaturization, the structure has changed to one in which the circuits on a printed circuit board are integrated into a single package, but the integrated circuit is also generally of the printed circuit board mounting type.

FIG. 2 is a perspective view showing an example of the mounting structure of a conventional electronic circuit package.

This example has a mounting structure in which a packaged integrated circuit 11 is attached to a printed circuit board 12, and each printed circuit board is wired with a connecting line 14.

[Problem that the invention seeks to solve]

The mounting structure of the conventional electronic circuit package described above is such that even if all the circuits on the printed circuit board are housed in one integrated circuit, the integrated circuit is a printed circuit board mounted package, so once the circuits are mounted on the printed circuit board, The structure must be such that the wiring between the printed circuit boards must be done after installation. Integrated circuits are large, for example 2 inches x 2 inches, and the number of pins is also small.
There are devices with over 100 pins, and when these are mounted on a printed circuit board, as shown in Figure 2, the area required for wiring the printed circuit board wiring pattern is more than twice that of the integrated circuit. There is a problem in that the wiring between the printed circuit boards on which the integrated circuits are mounted is inefficient, and it is difficult to miniaturize the electronic device as a whole.

Additionally, in order to mount multiple large integrated circuits on a single printed circuit board, the printed circuit board itself must become larger.
There is a problem in that the entire electronic device becomes large in size, which does not meet the intention of making it smaller and lighter.

An object of the present invention is to provide a mounting structure for an electronic circuit package that can reduce the size and weight of electronic equipment and improve wiring work efficiency.

[Means for solving problems]

The mounting structure of the electronic circuit package of the present invention is as follows:
A multi-layered electronic circuit package having a plurality of wrapping connection type pin terminals protruding from the side surface and a plurality of mounting holes penetrating the package surface, and a plurality of wrapping connection type pin terminals protruding from the side surface. and a mounting hole penetrating through the mounting hole at a position corresponding to the mounting hole, and a connector connection package provided on one side of the laminated electronic circuit package, and a connector for external connection and a mounting hole corresponding to the mounting hole. a first plate having a penetrating mounting hole at a position and attached to the outside of the connector connection package; and a laminated electronic circuit package having a penetrating mounting hole at a position corresponding to the mounting hole. a second plate attached to the other side of the board, and a bolt for assembling the first plate, the connector connection package, each of the electronic circuit packages, and the second plate by passing through their respective mounting holes and fixing the second plate. [Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings. explain.

1A and 1B are perspective views of a mounting structure of an electronic circuit package and an electronic circuit package showing an embodiment of the present invention.

In this embodiment, a plurality of electronic circuit packages 1 each having a plurality of wrapping connection type pin terminals 2 protruding from the side surface and mounting holes 3 penetrating the package surface at four corners are stacked. A connector connection package 4 having a plurality of pin terminals 2 and four mounting holes 3 like the electronic circuit package 1 is provided on one side of the electronic circuit package 1. A first plate 5 having an external connection connector 6 and four mounting holes 3 is provided on the outside, and the terminals of the external connection connector 6 and the pin terminals 2 of the connector connection package 4 are provided.
A second plate 7 with four mounting holes 3 is provided on the other side of the stacked electronic circuit package 1, and the first plate 5 and the connector connection package 1 are connected internally. 4, a plurality of electronic circuit packages 1, and a second plate 7 are assembled by passing through mounting holes 3 and fixing them with bolts 8.

Wiring 9 between pin terminals 2 of each electronic circuit package 1 and connector connection package 4
This can be done by wrapping connections, which allows automatic wiring using a computer.

Incidentally, bolts 8 can be used for attachment to the main body of the electronic device, and the four sides can be covered with side plates to perform dust-proof and moisture-proof treatment.

〔Effect of the invention〕

As explained above, the present invention consists of stacking a plurality of electronic circuit packages and connector connection packages each having a plurality of wrapping connection type pin terminals protruding from the sides, and fixing the packages by sandwiching them between plates provided on both sides. By using an assembled structure, there is no need for a printed circuit board and each package can be stacked closely together, making it possible to reduce the size of the integrated circuit itself to a point close to the volume of simply stacking it, and also to reduce the size of the integrated circuit itself, which has been used as an intermediate component until now. This eliminates the need for printed circuit boards, and the conventional mounting soldering work on printed circuit boards and soldering work between each printed circuit board are reduced to simple assembly work and wrapping work, further improving assembly and wiring work efficiency. There is an effect that can be done.

In addition, post-mounting inspections can be easily performed by simply removing the side plate, making it highly maintainable.Furthermore, it can withstand severe environmental conditions such as vibration and shock by potting the four sides of the wrapping connection. It also has the effect of being easy to deal with.

[Brief explanation of the drawing]

FIGS. 1a and 1b are perspective views of an electronic circuit package mounting structure and an electronic circuit package showing an embodiment of the present invention, and FIG. 2 is a perspective view showing an example of a conventional electronic circuit package mounting structure. It is. 1... Package for electronic circuit, 2... Pin terminal, 3... Mounting hole, 4... Package for connector connection, 5... First plate, 6... Connector for external connection, 7... Second Plate, 8... Bolt, 9... Wiring, 11... Integrated circuit, 12... Printed circuit board, 13... Printed wiring, 14... Connection wire.

Claims (1)

[Claims] 1 A multi-layered electronic circuit package each having a plurality of wrapping connection type pin terminals protruding from the side surface and a plurality of mounting holes penetrating the package surface, and a plurality of wrapping connection type pins protruding from the side surface. A connector connecting package provided on one side of the laminated electronic circuit package has a terminal and a penetrating mounting hole at a position corresponding to the mounting hole, and corresponds to the external connection connector and the mounting hole. a first plate having a penetrating mounting hole at a position corresponding to the mounting hole and mounted on the outside of the connector connection package; and a first plate having a penetrating mounting hole at a position corresponding to the mounting hole for the laminated electronic circuit. The second plate attached to the other side of the package, the first plate, the connector connection package, each electronic circuit package, and the second plate are assembled by passing through their respective mounting holes and fixing them. 1. A mounting structure for an electronic circuit package, comprising a bolt, and a pin terminal of the connector connection package and a terminal of the external connection connector are internally wired.