JPH05286155A - End face type thermal head - Google Patents

End face type thermal head

Info

Publication number
JPH05286155A
JPH05286155A JP11822692A JP11822692A JPH05286155A JP H05286155 A JPH05286155 A JP H05286155A JP 11822692 A JP11822692 A JP 11822692A JP 11822692 A JP11822692 A JP 11822692A JP H05286155 A JPH05286155 A JP H05286155A
Authority
JP
Japan
Prior art keywords
substrate
heating resistor
thermal head
type thermal
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11822692A
Other languages
Japanese (ja)
Inventor
Noboru Ueno
昇 上野
Hiromasa Marumo
浩昌 丸茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Priority to JP11822692A priority Critical patent/JPH05286155A/en
Publication of JPH05286155A publication Critical patent/JPH05286155A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To increase the area of the heating resistor part of an end face type thermal head by a simple means. CONSTITUTION:A substrate part A is constituted in such a manner that an independent electrode 3 and a common electrode 5 are formed on the flat surface of a substrate 1 with an underglaze 2 thereon, a heating resistor 6 is formed between the electrodes, and a surface formed by cutting through the heating resistor 6 and each electrode is used as a printing surface. The substrate part A and a substrate part B obtained by cutting the front end vertically are stuck together so that they are superimposed. By superimposing the substrate parts A and B, an end face type thermal head having a heating part which is twice as large in area as it was can be easily obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、端面型サーマルヘッド
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an end face type thermal head.

【0002】[0002]

【従来の技術】基板の端面に発熱抵抗体を形成した端面
型サーマルヘッドは、プラテンへの対向部を発熱素子部
分とすることができるため、硬質カード等の屈曲困難な
被印刷媒体へも印刷可能なサーマルプリンターを容易に
実現できる。
2. Description of the Related Art An end face type thermal head having a heating resistor formed on the end face of a substrate can print on a hard-to-bend print medium such as a hard card because the facing part to the platen can be used as a heating element part. A possible thermal printer can be easily realized.

【0003】従来、基板の端面に発熱抵抗体を形成する
方法として、蒸着・フォトリソにより端面に電極を形成
し、その上に抵抗体を印刷する製法が一般的であった。
しかし、この端面に対する蒸着やエッチングには特殊な
マスクと煩雑な工程が必要となる。
Conventionally, as a method of forming a heating resistor on the end face of a substrate, a method of forming an electrode on the end face by vapor deposition / photolithography and printing a resistor on the electrode has been generally used.
However, a special mask and complicated steps are required for vapor deposition and etching on this end face.

【0004】上記の問題を解消するため、本願発明者等
は、先に特願平3−188273号において、基板の平
面側に印刷工法により電極および抵抗体を形成し、抵抗
体の真上で基板を切断することにより、その断面をカー
ト摺動面とする端面型サーマルヘッドを提案している。
また、その際、カードに対して適性な印字スピードで印
刷するには、断面の発熱体の面積を印刷工法で形成でき
る最大の膜厚以上にする必要から、基板を斜めにカット
し、断面積を増大させた構造のサーマルヘッドも提案し
ている。
In order to solve the above-mentioned problems, the inventors of the present application previously disclosed, in Japanese Patent Application No. 3-188273, to form electrodes and resistors by a printing method on the flat surface side of a substrate, and place them directly above the resistors. We have proposed an end-face type thermal head whose cross section is a cart sliding surface by cutting the substrate.
In addition, at that time, in order to print at an appropriate printing speed on the card, the area of the heating element in the cross section must be equal to or larger than the maximum film thickness that can be formed by the printing method. We have also proposed a thermal head with a structure that increases the temperature.

【0005】図5に、上記提案の端面型サーマルヘッド
を示す。上記端面型サーマルヘッドは、基板1と、その
端面1aに沿って、この端面1aと交わる基板平面1b
上に形成されたアンダーグレーズ2と、個別電極3並び
に絶縁膜4で絶縁した共通電極5、発熱抵抗体6、この
発熱抵抗体6と各電極3,5を被覆するオーバーグレー
ズ7とから成り、共通電極5並びに個別電極3が櫛歯状
に交互に配置され、それらの間に発熱抵抗体6が充填さ
れ、発熱抵抗体6と電極3,5の横切断面8が斜めにカ
ットし、この切断面をオーバーグレーズで被覆した構造
である。
FIG. 5 shows the end face type thermal head proposed above. The above-mentioned end surface type thermal head includes a substrate 1 and a substrate plane 1b that intersects the end surface 1a along the end surface 1a.
The underglaze 2 formed above, the common electrode 5 insulated by the individual electrode 3 and the insulating film 4, the heat generating resistor 6, and the overglaze 7 covering the heat generating resistor 6 and the electrodes 3 and 5, The common electrodes 5 and the individual electrodes 3 are alternately arranged in a comb shape, and the heating resistors 6 are filled between them, and the heating resistors 6 and the lateral cut surfaces 8 of the electrodes 3 and 5 are obliquely cut. This is a structure in which the cut surface is covered with overglaze.

【0006】[0006]

【発明が解決しようとする課題】上記提案の端面型サー
マルヘッドは、基板を斜めにカットすることにより、発
熱抵抗体の断面積が増大されたが、断面積をより大きく
するには、切断の角度を鋭角にする必要があり、加工面
での難しさや限界があり、また、斜めにカットすること
により、基板先端は脆くなり、欠け等が発生しやすい等
の問題がある。
In the above-proposed edge-type thermal head, the cross-sectional area of the heating resistor is increased by cutting the substrate diagonally. There is a problem that it is necessary to make the angle acute, there is a difficulty and a limit in the processing surface, and when the substrate is cut obliquely, the tip of the substrate becomes fragile and chips or the like are likely to occur.

【0007】[0007]

【発明の目的】本発明は、上述した端面型サーマルヘッ
ドにおいて、基板を斜めにカットすることなしに、断面
積を増大させることができるサーマルヘッドを提供する
ことを目的としている。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a thermal head of the above-mentioned end face type thermal head which can increase the cross-sectional area without cutting the substrate obliquely.

【0008】[0008]

【課題を解決するための手段】本発明は、基板と、この
基板の端面に沿ってその基板と交わる基板の平面上に積
層されたアンダーグレーズと、個別電極並びに共通電
極、発熱抵抗体、この発熱抵抗体と各電極を被覆するオ
ーバーグレーズおよびこれらの端面を被覆するオーバー
グレーズとから成り、前記個別電極並びに共通電極は櫛
歯状に交互に配置されると共にそれらの間に発熱抵抗体
が充填され、前記発熱抵抗体と前記各電極の切断面を印
字面とするところの基板部を2枚重ね合わせて発熱抵抗
体の面積を拡大させたことを要旨としている。
According to the present invention, a substrate, an underglaze laminated on a plane of the substrate intersecting the substrate along an end face of the substrate, an individual electrode, a common electrode, a heating resistor, and It consists of a heating resistor and an overglaze that covers each electrode and an overglaze that covers these end faces. The individual electrodes and the common electrode are alternately arranged in a comb shape, and the heating resistor is filled between them. Then, the gist is that the area of the heating resistor is enlarged by superimposing two substrate portions where the cut surfaces of the heating resistor and the electrodes are used as the printing surface.

【0009】[0009]

【作用】上記のように、同じ構成の基板を2枚重ね合わ
せると、面積が2倍の発熱抵抗部を持つ摺動面が形成さ
れる。
As described above, when two substrates having the same structure are superposed on each other, a sliding surface having a heating resistance portion having a double area is formed.

【0010】[0010]

【実施例】図1に、本発明の一実施例による端面型サー
マルヘッドを示す。なお、同図において、図5と同一又
は類似する部材には同じ符号が付されている。
FIG. 1 shows an end surface type thermal head according to an embodiment of the present invention. In the figure, the same or similar members as those in FIG. 5 are designated by the same reference numerals.

【0011】図1において、A,Bは同じ構成の基板部
であり、1はセラミック基板、2はアンダーグレーズ、
3は個別電極、4は絶縁膜、5は共通電極、6は発熱抵
抗体であって、両基板部A,Bは、各電極および発熱抵
抗体がそれぞれ互いに貼り合わせて重ね合わせることに
より、一体化されている。上記のように構成されたサー
マルヘッドの製造手順を図2〜図4に基づいて説明す
る。
In FIG. 1, A and B are substrate portions having the same structure, 1 is a ceramic substrate, 2 is an underglaze,
Reference numeral 3 is an individual electrode, 4 is an insulating film, 5 is a common electrode, and 6 is a heating resistor. Both the substrate parts A and B are integrated by bonding the electrodes and the heating resistor to each other. Has been converted. The manufacturing procedure of the thermal head configured as described above will be described with reference to FIGS.

【0012】まず、図2に示すように、アンダーグレー
ズ2を形成したセラミック基板の平面に個別電極3を圧
膜印刷−焼成−フォトリソ・パターニングにより形成
し、絶縁膜4を重ね印刷により形成する。
First, as shown in FIG. 2, individual electrodes 3 are formed on the flat surface of the ceramic substrate on which the underglaze 2 is formed by pressure film printing-firing-photolithography and patterning, and an insulating film 4 is formed by overprinting.

【0013】次に図3に示すように、共通電極5を、個
別電極と同様な手法により形成する。次に、図4に示す
ように、個別電極3と共通電極5の先端側に発熱抵抗体
6を重ね印刷−焼成により形成する。このあと発熱抵抗
体6の上部で基板を垂直方向にカットし、カットされた
2枚の基板を各電極が重なるように貼り合わせ、端面を
研磨して平坦化し、カット面にオーバーグレーズ層を印
刷−焼成により形成することにより、図1の端面型サー
マルヘッドが得られる。
Next, as shown in FIG. 3, the common electrode 5 is formed in the same manner as the individual electrode. Next, as shown in FIG. 4, the heating resistors 6 are formed on the tip ends of the individual electrodes 3 and the common electrode 5 by overlapping printing and firing. After that, the substrate is cut in the vertical direction on the heating resistor 6, the two cut substrates are attached to each other so that the electrodes overlap each other, the end faces are polished and flattened, and the overglaze layer is printed on the cut face. -By forming by firing, the end surface type thermal head of FIG. 1 is obtained.

【0014】上記の如く、基板を貼り合わせると、面積
2倍の発熱体をもつ摺動面が形成される。なお、2枚の
基板は別々に作製したものでもよい。また、重ね合わせ
た基板は、やや斜めにカットして、より断面積を大きく
することも可能である。さらにまた、カットは2枚の基
板を貼り合わせた後でもよい。
As described above, when the substrates are bonded together, a sliding surface having a heating element having an area twice that of the sliding surface is formed. Note that the two substrates may be manufactured separately. It is also possible to cut the stacked substrates slightly diagonally to increase the cross-sectional area. Furthermore, the cutting may be performed after the two substrates are bonded together.

【0015】[0015]

【発明の効果】以上の説明から明らかなように、本発明
は、基板を2枚重ね合わせることにより、発熱部の面積
を大きくしているので、基板を斜めにカットする場合に
比べ工法的に簡単であり、かつ強度を得やすく、欠け等
に強い端面型サーマルヘッドを容易に構成することがで
きる。また、そのことから、端面型サーマルヘッドの製
造工程の簡略化、歩留り向上、コスト低減が可能とな
る。
As is apparent from the above description, according to the present invention, since the area of the heat generating portion is increased by stacking two substrates, it is possible to improve the construction method compared to the case where the substrates are cut diagonally. An end face type thermal head that is simple, easy to obtain strength, and resistant to chipping and the like can be easily configured. Further, from this, it is possible to simplify the manufacturing process of the end surface type thermal head, improve the yield, and reduce the cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す端面型サーマルヘッド
の斜視図である。
FIG. 1 is a perspective view of an end surface type thermal head showing an embodiment of the present invention.

【図2】上記端面型サーマルヘッドの製造手順を示すヘ
ッド構造部分の斜視図である。
FIG. 2 is a perspective view of a head structure portion showing a manufacturing procedure of the end surface type thermal head.

【図3】製造手順を示すヘッド構造部分の斜視図であ
る。
FIG. 3 is a perspective view of a head structure portion showing a manufacturing procedure.

【図4】製造手順を示すヘッド構造部分の斜視図であ
る。
FIG. 4 is a perspective view of a head structure portion showing a manufacturing procedure.

【図5】先願発明の端面型サーマルヘッドの斜視図であ
る。
FIG. 5 is a perspective view of an end surface type thermal head of the invention of the prior application.

【符号の説明】[Explanation of symbols]

1 基板 2 アンダーグレーズ 3 個別電極 4 絶縁膜 5 共通電極 6 発熱抵抗体 7 オーバーグレーズ 8 横切断面 A,B 基板部 1 Substrate 2 Underglaze 3 Individual Electrode 4 Insulating Film 5 Common Electrode 6 Heating Resistor 7 Overglaze 8 Cross Section A, B Substrate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 基板と、この基板の端面に沿ってその基
板と交わる基板の平面上に積層されたアンダーグレーズ
と、個別電極並びに共通電極、発熱抵抗体、この発熱抵
抗体と各電極を被覆するオーバーグレーズおよびこれら
の端面を被覆するオーバーグレーズとから成り、前記個
別電極並びに共通電極は櫛歯状に交互に配置されると共
にそれらの間に発熱抵抗体が充填され、前記発熱抵抗体
と前記各電極の切断面を印字面とするところの基板部を
2枚重ね合わせて発熱抵抗体の面積を拡大させたことを
特徴とする端面型サーマルヘッド。
1. A substrate, an underglaze laminated on a plane of the substrate intersecting with the substrate along an end face of the substrate, an individual electrode and a common electrode, a heating resistor, and the heating resistor and each electrode are covered. The above-mentioned individual electrodes and common electrodes are alternately arranged in a comb shape and filled with a heating resistor between them, and the heating resistor and the above-mentioned heating resistor are provided. An end face type thermal head characterized in that the area of a heating resistor is enlarged by stacking two substrate portions where the cut surface of each electrode is the printed surface.
JP11822692A 1992-04-10 1992-04-10 End face type thermal head Pending JPH05286155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11822692A JPH05286155A (en) 1992-04-10 1992-04-10 End face type thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11822692A JPH05286155A (en) 1992-04-10 1992-04-10 End face type thermal head

Publications (1)

Publication Number Publication Date
JPH05286155A true JPH05286155A (en) 1993-11-02

Family

ID=14731349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11822692A Pending JPH05286155A (en) 1992-04-10 1992-04-10 End face type thermal head

Country Status (1)

Country Link
JP (1) JPH05286155A (en)

Similar Documents

Publication Publication Date Title
JPS6316270B2 (en)
KR100234453B1 (en) Thermal head and method of manufacturing the same
JPH05286155A (en) End face type thermal head
KR100339046B1 (en) Thermal print head and method of manufacturing the same
JP2005280044A (en) Inkjet head manufacturing method
JP2575554B2 (en) Edge type thermal head
JP2667734B2 (en) Manufacturing method of thermal print head
JP2579389B2 (en) Thermal head
JP2530931Y2 (en) Thermal head
JPH0825625A (en) Ink jet record head and manufacture thereof
JP3232976B2 (en) Method of manufacturing ink jet recording head
JP2651724B2 (en) Glaze substrate for thermal head and method of manufacturing the same
JP3470824B2 (en) Thermal print head
JPS5812775A (en) Method of manufacturing thermal head
JP2686171B2 (en) Manufacturing method of thermal print head
JP2647270B2 (en) Thermal head
JP2561133B2 (en) Electrode structure of thermal head
JP2832977B2 (en) Thermal head and method of manufacturing the same
JPS61139453A (en) Thermal head
JPS60115463A (en) Thermal head
JPH0890809A (en) Thermal head and manufacture thereof
JPS6295240A (en) Thermal head
JPH034524Y2 (en)
JPH04110160A (en) End face-type thermal head
JPS6364768A (en) Thermal head