JPH0528738B2 - - Google Patents
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- Publication number
- JPH0528738B2 JPH0528738B2 JP62178594A JP17859487A JPH0528738B2 JP H0528738 B2 JPH0528738 B2 JP H0528738B2 JP 62178594 A JP62178594 A JP 62178594A JP 17859487 A JP17859487 A JP 17859487A JP H0528738 B2 JPH0528738 B2 JP H0528738B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- group
- parts
- formula
- silica powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Description
(産業上の利用分野)
本発明は硬化性液状シリコーンゴム組成物、特
には電気、電子回路部品、テレビのフライバツク
トランス、各種HICなどのポツテイング、コーテ
イング絶縁封止用に有用とされる、低粘度で熱膨
張係数の小さい硬化性液状シリコーンゴム組成物
に関するものである。
(従来の技術)
一般家庭の電化製品オーデイオ、テレビ、ビデ
オテープなど、また自動車用などに使用されてい
るHICやテレビのフライバツクトランス、さらに
は各種の電気、電子回路の絶縁ポツテイングやコ
ーテイングにはシリカを充填した液状ゴムが使用
されているが、この液状ゴムはいずれも熱膨張、
熱収縮が大きいためにストレスにより硬化時、試
験時、使用時に表面が盛り上がるものが多く、し
たがつてケースの歪み、セラミツク基板の割れ、
リード線の断線などの不都合を生じることが多か
つた。
そのため、この液状ゴムについては熱膨張係数
の低いシリカ粒子を充填するということも試みら
れているが、これには高充填に伴つて組成物の粘
度が上昇して流動性が悪化するために実用に供し
得なくなるという欠点がある。
(発明の構成)
本発明はこのような不利を解決した効果性液状
シリコーンゴム組成物に関するもので、これは(1)
平均式
(Field of Industrial Application) The present invention relates to a curable liquid silicone rubber composition, which is particularly useful for potting, coating, and insulating sealing of electrical and electronic circuit parts, television flyback transformers, and various HICs. The present invention relates to a curable liquid silicone rubber composition having a low viscosity and a low coefficient of thermal expansion. (Prior technology) For insulating potting and coating of general home appliances such as audio, television, and video tapes, HICs used in automobiles, flyback transformers of televisions, and various electric and electronic circuits. Liquid rubber filled with silica is used, but this liquid rubber does not undergo thermal expansion or
Due to large thermal contraction, the surface of many products swells due to stress during curing, testing, and use, resulting in distortion of the case, cracking of the ceramic substrate, and
Inconveniences such as breakage of lead wires often occur. For this reason, attempts have been made to fill this liquid rubber with silica particles that have a low coefficient of thermal expansion, but this is not practical because the viscosity of the composition increases with high filling and the fluidity deteriorates. The disadvantage is that it cannot be used. (Structure of the Invention) The present invention relates to an effective liquid silicone rubber composition that solves the above-mentioned disadvantages.
average formula
【式】(こゝにRは炭素数1〜8
の非置換または置換1価炭化水素基、aは1.9〜
2.07)で示される、1分子中に脂肪族不飽和基を
少なくとも1個含有する、25℃における粘度が50
〜10000cSであるオルガノポリシロキサン100重
量部、(2)1分子中にけい素原子に結合した水素原
子(≡Si−H結合)を少なくとも2個有するオル
ガノハイドロジエンポリシロキサン0.1〜50重量
部、(3)(a)平均粒子径が60μm以下の密融シリカ粉
30〜100重量%と、(b)平均粒子径が60μm以下の
結晶シリカ粉70〜0重量%とからなるシリカ粉
100〜1000重量部、(4)触媒量の白金または白金系
化合物および(5)1分子中に少なくとも1個のヒド
ロシリル化官能基および/またはSiOH基を含有
する、分子量が2300以下の有機けい素化合物0.5
〜30重量部とからなることを特徴とするものであ
る。
すなわち、本発明者らは従来の不利を解決した
低粘度で流動性がよく、熱膨張係数の小さい液状
シリコーンゴム組成物の開発について種々検討し
た結果、これには従来公知の硬化性シリコーンゴ
ム組成物において使用されている充填剤としての
シリカ粉末の平均粒子径および種類を特定すると
共にこれに適切なオルガノポリシロキサン系の希
釈剤を添加すればよいことを見出し、このシリカ
粉末として上記した平均粒子径が60μm以下の溶
融シリカを選択し、1分子中にヒドロキシル化官
能性基、SiOH基を含有する低粘度の有機けい素
化合物を添加すれば目的を達成されることを確認
して本発明を完成させた。
本発明の組成物を構成する第1成分としてのオ
ルガノポリシロキサンは平均式が[Formula] (where R is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 8 carbon atoms, and a is 1.9 to 8 carbon atoms.
2.07), contains at least one aliphatic unsaturated group in one molecule, and has a viscosity of 50 at 25°C.
100 parts by weight of an organopolysiloxane with ~10000 cS, (2) 0.1 to 50 parts by weight of an organohydrodiene polysiloxane having at least two hydrogen atoms bonded to silicon atoms (≡Si-H bonds) in one molecule, ( 3)(a) Densely fused silica powder with an average particle size of 60μm or less
30 to 100% by weight; and (b) 70 to 0% by weight of crystalline silica powder with an average particle size of 60 μm or less.
100 to 1000 parts by weight, (4) a catalytic amount of platinum or a platinum-based compound, and (5) an organosilicon with a molecular weight of 2300 or less, containing at least one hydrosilylation functional group and/or SiOH group in one molecule. compound 0.5
~30 parts by weight. That is, the present inventors have conducted various studies on the development of a liquid silicone rubber composition with low viscosity, good fluidity, and a small thermal expansion coefficient that overcomes the conventional disadvantages. They identified the average particle diameter and type of silica powder as a filler used in products, and found that it was sufficient to add an appropriate organopolysiloxane diluent to the silica powder. We confirmed that the objective could be achieved by selecting fused silica with a diameter of 60 μm or less and adding a low-viscosity organosilicon compound containing a hydroxylated functional group or SiOH group in one molecule, and developed the present invention. Completed. The organopolysiloxane as the first component constituting the composition of the present invention has an average formula of
【式】
で示され、Rはメチル基、エチル基、プロピル
基、ブチル基などのアルキル基、シクロヘキシル
基などのシクロアルキル基、ビニル基、アリル基
などのアルケニル基、フエニル基、トリル基など
のアリール基またはこれらの基の炭素原子に結合
した水素原子の一部または全部をハロゲン原子、
シアノ基などで置換したクロロメチル基、トリフ
ルオロプロピル基、シアノエチル基などから選択
される炭素原子数が1〜8の非置換または置換1
価炭化水素で、aが1.9〜2.07である線状または
分枝状のものとされるが、これは後記する第2成
分としてのオルガノハイドロジエンポリシロキサ
ンと付加反応させるために1分子にビニル基など
の脂肪族不飽和基を少なくとも1個含有するもの
とされ、これに下記のものが例示される。
(b〜fは正の整数)。
このようなオルガノポリシロキサンは例えば末
端基となる[Formula], R is an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a cycloalkyl group such as a cyclohexyl group, an alkenyl group such as a vinyl group or an allyl group, a phenyl group, a tolyl group, etc. Some or all of the hydrogen atoms bonded to the aryl group or the carbon atoms of these groups are replaced by halogen atoms,
Unsubstituted or substituted 1 having 1 to 8 carbon atoms selected from chloromethyl group substituted with cyano group, trifluoropropyl group, cyanoethyl group, etc.
It is a linear or branched hydrocarbon with a value of 1.9 to 2.07, but it has a vinyl group in one molecule for addition reaction with the organohydrodiene polysiloxane as the second component described later. It contains at least one aliphatic unsaturated group such as, for example, the following. (b to f are positive integers). Such organopolysiloxanes can serve as terminal groups, e.g.
【式】と[Formula] and
【式】や【Formula】Ya
【式】あるいは[Formula] or
【式】
などのような対応するシロキサンオリゴマーとを
苛性カリ、水酸化セシウムのようなアルカリ触媒
または硫酸などの存在下に−10〜200℃の適温で
加熱平衡化反応させたのち触媒を中和するという
一般的な方法で調整することができるが、このも
のの重合度は低過すぎるとこの組成物から得られ
る硬化物が硬くてもろいものとなり、高過すぎる
と組成物の粘度が上がり過ぎるので、25℃におけ
る粘度が50〜10000cSの範囲のものとすることが
よく、この好ましい範囲は100〜1000cSとされ
る。
つぎにこの組成物における第2成分としてのオ
ルガノハイドロジエンポリシロキサンは上記した
第1成分としてのビニル基含有オルガノポリシロ
キサンと付加反応させるものであるということか
ら1分子中にけい素原子に結合した水素原子(≡
SiH結合)を少なくとも2個含有する必要があ
り、これには下記のものが例示されるが、これは
上記した第1成分としてのビニル基含有オルガノ
ポリシロキサンと相溶するものとすることがよ
い。
この種のオルガノハイドロジエンポリシロキサ
ンは〔(CH3)3Si〕2Oまたは〔H(CH3)2Si〕2Oと
[Formula] In the presence of an alkaline catalyst such as caustic potash, cesium hydroxide, or sulfuric acid, heat equilibration reaction is carried out at an appropriate temperature of -10 to 200℃, and then the catalyst is neutralized. However, if the degree of polymerization is too low, the cured product obtained from this composition will be hard and brittle, and if it is too high, the viscosity of the composition will increase too much. The viscosity at 25° C. is preferably in the range of 50 to 10,000 cS, with a preferred range of 100 to 1,000 cS. Next, since the organohydrodiene polysiloxane as the second component in this composition is subjected to an addition reaction with the above-mentioned vinyl group-containing organopolysiloxane as the first component, it is necessary to add the organohydrodiene polysiloxane as the second component to the vinyl group-containing organopolysiloxane in one molecule. Hydrogen atom (≡
It is necessary to contain at least two (SiH bonds), and the following are exemplified, but it is preferable that this be compatible with the vinyl group-containing organopolysiloxane as the first component. . This type of organohydrodiene polysiloxane is composed of [(CH 3 ) 3 Si] 2 O or [H(CH 3 ) 2 Si] 2 O.
組成物から5×5×6mmの試料を調製し、サー
マル・デイライトメーター・DL−1500(真空理工
社製商品名)で測定した。
〔燃焼時間〕
UL94Vの測定法に準じて5本のテストピース
10回燃焼させたときの合計燃焼時間で示した。
実施例1〜4、比較例1〜3
分子鎖両末端がジメチルビニルシリル基で封鎖
された、粘度が600cSのジメチルポリシロキサン
24.5部に第1表に示したシリカ粉70部を約10mm
Hgの下で60分間減圧混合し、室温下に20時間放
置したのちブルツクフイールド粘度計で粘度を測
定し、ついでこれに式
で示されるメチルハイドロジエンポリシロキサン
0.52部、白金−ビニルシロキサン錯塩の上記ジメ
チルポリシロキサン溶液、(白金含量1重量%)
0.05部、硬化速度調節剤としてのエチニルシクロ
ヘキサノール0.005部およびカーボンブラツク1
部を上記したジメチルポリシロキサン5部とロー
ル混練して得たカーボンブラツクペースト0.6部
を添加し、均一に混練してから120℃で10分間プ
レスキユアーしたものについてその物性をしらべ
たところ、第2票に示したとおりの結果が得ら
れ、この結果から溶融シリカを用いたものは粘度
が低く、熱膨張係数も小さく、このシリカについ
ては細粒よりも粗粒のほうが200℃、4時間のポ
ストキユアー後の燃焼時間の変化も小さいことが
確認された。
A 5 x 5 x 6 mm sample was prepared from the composition and measured using a thermal daylight meter DL-1500 (trade name, manufactured by Shinku Riko Co., Ltd.). [Burning time] 5 test pieces according to UL94V measurement method
It is expressed as the total combustion time when ignited 10 times. Examples 1 to 4, Comparative Examples 1 to 3 Dimethylpolysiloxane with a viscosity of 600 cS, in which both ends of the molecular chain are blocked with dimethylvinylsilyl groups.
Add 70 parts of the silica powder shown in Table 1 to 24.5 parts by approximately 10 mm.
After mixing under reduced pressure for 60 minutes under Hg and leaving it at room temperature for 20 hours, the viscosity was measured using a Burckfield viscometer, and then the formula Methylhydrodiene polysiloxane represented by
0.52 parts, the above dimethylpolysiloxane solution of platinum-vinylsiloxane complex salt (platinum content: 1% by weight)
0.05 parts, 0.005 parts of ethynylcyclohexanol as curing rate regulator and 1 part of carbon black.
0.6 parts of carbon black paste obtained by roll-kneading 5 parts of dimethylpolysiloxane described above was added, kneaded uniformly, and press-cured at 120°C for 10 minutes. The results shown in Figure 1 are obtained, and from these results, the viscosity of the fused silica is lower, and the coefficient of thermal expansion is lower.For this silica, the coarse particles are better than the fine particles after post-curing at 200℃ for 4 hours. It was confirmed that the change in combustion time was also small.
【表】【table】
【表】【table】
【表】
実施例5、比較例4
前記した実施例1〜4で使用したジメチルビニ
ルシリル基で分子鎖両末端が封鎖されたジメチル
ポリシロキサンとメチルハイドロジエンポリシロ
キサン、第1表に示した溶融シリカ(球形シリ
カ)S−C5、塩化白金酸の2−エチルヘキサノ
ール変性溶液(白金濃度2重量%)、式
で示される有機けい素化合物、エチニルシクロヘ
キサノール、前記実施例1〜4で使用したカーボ
ンブラツクペーストおよびベンゾトリアーゾール
1部を上記のジメチルシロキサン99部とロール混
練して得たベンゾトリアゾールペーストを第3表
に示した量で配合して2種の組成物を作り、これ
らを実施例1〜4と同様に処理してその物性をし
らべたところ、第4表に示したとおりの結果が得
られた。
また、これらの組成物についてはメチルハイド
ロジエンポリシロキサンの入らないものを室温下
に2ケ月保存したのち観察したところ、実施例5
の組成物は簡単に再混合することができ、このも
のは良好な流動性を示したが、比較例4の組成物
はクリープ硬化を起こし、再混合で流動をさせる
のには倍以上の混合時間が必要であつた。[Table] Example 5, Comparative Example 4 The dimethylpolysiloxane and methylhydrodienepolysiloxane whose molecular chain ends were blocked with dimethylvinylsilyl groups used in Examples 1 to 4 above, and the melting conditions shown in Table 1. Silica (spherical silica) S-C5, 2-ethylhexanol modified solution of chloroplatinic acid (platinum concentration 2% by weight), formula A benzotriazole paste obtained by roll kneading the organosilicon compound represented by ethynylcyclohexanol, the carbon black paste used in Examples 1 to 4, and 1 part of benzotriazole with 99 parts of the above dimethylsiloxane was used as the third Two types of compositions were made by blending in the amounts shown in the table, and these were treated in the same manner as in Examples 1 to 4 to examine their physical properties, and the results shown in Table 4 were obtained. . In addition, when these compositions were observed after being stored at room temperature for 2 months without methylhydrodiene polysiloxane, Example 5 was found.
The composition of Comparative Example 4 could be easily remixed and showed good fluidity, but the composition of Comparative Example 4 suffered from creep hardening and required more than twice as much mixing to achieve fluidity upon remixing. I needed time.
【表】【table】
【表】【table】
【表】【table】
Claims (1)
aは1.9〜2.07)で示される、1分子中に脂肪
族不飽和基を少なくとも1個含有する、25℃に
おける粘度が50〜10000cSであるオルガノポリ
シロキサン 100重量部、 (2) 1分子中にけい素原子に結合した水素原子
(≡Si−H結合)を少なくとも2個有するオル
ガノハイドロジエンポリシロキサン
0.1〜50重量部、 (3) (a)平均粒子径が60μm以下の溶融シリカ粉30
〜100重量%と、(b)平均粒子径が60μm以下の
結晶シリカ粉70〜0重量%とからなるシリカ粉
100〜1000重量部、 (4) 触媒量の白金または白金系化合物 (5) 1分子中に少なくとも1個のヒドロシリル化
官能基および/またはSiOH基を含有する、分
子量が2300以下の有機けい素化合物
0.5〜30重量部、 とからなることを特徴とする硬化性液状シリコー
ンゴム組成物。[Claims] 1 (1) Average formula [Formula] (where R is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 8 carbon atoms,
100 parts by weight of an organopolysiloxane with a viscosity of 50 to 10,000 cS at 25°C, containing at least one aliphatic unsaturated group in one molecule, where a is 1.9 to 2.07), (2) Organohydrodiene polysiloxane having at least two hydrogen atoms bonded to silicon atoms (≡Si-H bonds)
0.1 to 50 parts by weight, (3) (a) Fused silica powder with an average particle size of 60 μm or less30
silica powder consisting of ~100% by weight and (b) 70% to 0% by weight of crystalline silica powder with an average particle size of 60 μm or less
100 to 1000 parts by weight, (4) Catalytic amount of platinum or platinum-based compound (5) Organosilicon compound containing at least one hydrosilylation functional group and/or SiOH group in one molecule and having a molecular weight of 2300 or less
0.5 to 30 parts by weight of a curable liquid silicone rubber composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17859487A JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17859487A JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6422967A JPS6422967A (en) | 1989-01-25 |
| JPH0528738B2 true JPH0528738B2 (en) | 1993-04-27 |
Family
ID=16051188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17859487A Granted JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422967A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10851242B2 (en) | 2015-12-10 | 2020-12-01 | Shin-Etsu Chemical Co., Ltd. | Addition-curable silicone rubber composition and silicone rubber |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4888226A (en) * | 1988-08-08 | 1989-12-19 | American Telephone And Telegraph Company | Silicone gel electronic device encapsulant |
| US5409995A (en) * | 1989-05-29 | 1995-04-25 | Kanegafuchi Chemical Industry Co., Ltd. | Curing agent, preparation thereof and curable composition comprising the same |
| DE69021341T2 (en) * | 1989-05-29 | 1996-02-15 | Kanegafuchi Chemical Ind | CURING AGENT, METHOD FOR THE PRODUCTION THEREOF AND THE CURABLE COMPOSITION THEREFORE. |
| JPH0660281B2 (en) * | 1989-07-07 | 1994-08-10 | 信越化学工業株式会社 | Curable liquid silicone rubber composition |
| JP2714729B2 (en) * | 1991-06-18 | 1998-02-16 | 信越化学工業株式会社 | Silicone composition for impregnating electronic parts and cured product thereof |
| ATE449123T1 (en) * | 2000-03-31 | 2009-12-15 | Hitachi Chemical Co Ltd | HEAT CURRENT SILICONE COMPOSITION, RESIN FILM, METAL FOIL, INSULATING FILM, METAL CIRCUIT BOARD LAMINATE, MULTI-LAYER CIRCUIT BOARD CONTAINING THE COMPOSITION AND USE OF THE COMPOSITION |
| JP2005146288A (en) * | 2004-12-17 | 2005-06-09 | Shin Etsu Chem Co Ltd | Organopolysiloxane composition |
| JP4803365B2 (en) * | 2006-02-22 | 2011-10-26 | 信越化学工業株式会社 | Thermally conductive silicone composition, thermally conductive silicone molded article and method for producing the same |
| JP2014065900A (en) * | 2012-09-07 | 2014-04-17 | Dow Corning Toray Co Ltd | Curable silicone composition and cured product thereof |
| US12583975B2 (en) | 2019-10-03 | 2026-03-24 | Dow Toray Co., Ltd. | UV-curable organopolysiloxane composition and use thereof |
| CN110746779A (en) * | 2019-10-31 | 2020-02-04 | 西安建筑科技大学 | A kind of polymer composite template and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128310B2 (en) * | 1973-08-13 | 1976-08-18 | ||
| JPS5313508A (en) * | 1976-07-21 | 1978-02-07 | Inoue Shokai | Method of applying antiicorrosive coating for steel pipe pile |
| JPS55118656A (en) * | 1979-03-07 | 1980-09-11 | Hitachi Ltd | Manufacture of semiconductor device, and silicone resin used therefor |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS58138740A (en) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | Resin composition |
| JPS5850007A (en) * | 1982-08-28 | 1983-03-24 | Kubota Ltd | Travelling agricultral machine with automatic turn controlling mechanism |
| JPS59176347A (en) * | 1983-03-25 | 1984-10-05 | Toray Silicone Co Ltd | Organopolysiloxane composition |
| JPS60210643A (en) * | 1983-11-30 | 1985-10-23 | Denki Kagaku Kogyo Kk | Filler and its composition |
| JPS6157347A (en) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | Controller of printer |
| JPS6296568A (en) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | Semiconductor sealing resin composition |
| JPS6296567A (en) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | Semiconductor sealing resin composition |
-
1987
- 1987-07-17 JP JP17859487A patent/JPS6422967A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10851242B2 (en) | 2015-12-10 | 2020-12-01 | Shin-Etsu Chemical Co., Ltd. | Addition-curable silicone rubber composition and silicone rubber |
Also Published As
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| JPS6422967A (en) | 1989-01-25 |
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