JPH0529295A - Chemical solution dipping processing device - Google Patents

Abstract

PURPOSE:To provide a chemical liquid dipping processing device which processes a semiconductor substrate in a shorter time by drying up chemical liquid attached to the substrate in a chemical liquid drying section before the chemical liquid attached to the substrate in a chemical liquid tank is removed in a rinsing tank. CONSTITUTION:In a semiconductor substrate chemical liquid dipping type processing device provided with a chemical liquid tank 1, a rinsing tank 3, and a drying section 4, a chemical liquid drying section 2 is provided between the chemical liquid tank 1 and the rinsing tank 3. The chemical liquid drying section 2 is equipped with a centrifugal dryer, a vacuum dryer, a hot air dryer or the like. First, a cassette 5 where semiconductor substrates are housed is brought to the chemical liquid tank 1 by a transfer equipment and dipped into it. Then, the cassette 5 dipped in the chemical liquid tank 1 for a certain time is brought to the chemical liquid drying section 2. The chemical liquid attached to the cassette 5 is dried up in this section. In succession, the cassette 5 is brought to the rinsing tank 3 and dipped. The cassette 5 is fully rinsed in a short time. Last, the cassette 5 is transferred to a drying section 4 by a transfer equipment 6 and dried up, and the dried cassette 5 is taken out by the transfer equipment 6. By this setup, a processing time can be shortened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical liquid immersion type processing apparatus provided with a chemical liquid tank for processing a semiconductor substrate, a water washing tank for cleaning and a drying section for drying.

[0002]

2. Description of the Related Art FIG. 2 is a schematic view of a conventional chemical liquid immersion type processing apparatus. As shown in FIG. 2, a conventional chemical liquid immersion type processing apparatus includes a chemical liquid tank 1 for storing a chemical liquid for processing a semiconductor substrate, a water washing tank 3 for washing the semiconductor substrate treated with the chemical liquid with water, and a rinsed semiconductor material. Drying unit 4 for removing water
And a transfer machine 6 for moving the cassette 5 accommodating a plurality of semiconductor substrates in the direction of the arrow and immersing it in each tank.

The operation of this chemical liquid immersion type processing apparatus is as follows.
The cassette 5 in which the semiconductor substrate is stored is carried to the chemical liquid tank 1 by the transfer machine 6 and immersed therein. Next, the cassette 5 immersed in the chemical liquid tank 1 after a certain time has passed is transferred to the water washing tank 3 by the transfer machine 6 and immersed therein. Then, the chemical liquid adhered to the semiconductor substrate and the cassette 5 in the chemical liquid tank 1 is washed away in the water washing tank 3. Next, the cassette 5 is carried to the drying unit 4 by the transfer machine 6 and dried, and then taken out by the transfer machine 6.

As described above, the conventional chemical liquid immersion type processing apparatus is inexpensive as equipment and is easy to handle, and thus has been widely used in the manufacture of semiconductor devices.

[0005]

However, this conventional chemical liquid immersion type processing apparatus has a drawback that it takes a long time to be completely rinsed because the chemical liquid is immersed in the semiconductor substrate or cassette while being immersed in the rinse tank. . In particular, recently, as semiconductor substrates have become larger in diameter, cassettes have become larger in size, and these tanks have become larger in size, and this problem has become more and more serious. Eg 6
When comparing the inch substrate with the 8 inch substrate, the 8 inch substrate requires twice as long time as the 6 inch substrate, and there is a problem that the manufacturing capacity of the chemical liquid immersion type processing apparatus is reduced. Also, the tank itself may be enlarged, but it is not a special measure because it requires a large floor area.

An object of the present invention is to provide a chemical liquid immersion type processing apparatus which can process a semiconductor substrate in a chemical solution in a shorter time in order to solve such a problem.

[0007]

A chemical solution immersion type processing apparatus of the present invention comprises a chemical solution tank for storing a chemical solution for treating the surface of a semiconductor substrate and a washing tank for washing and removing the chemical solution, and the semiconductor substrate is continuously connected to each tank. In a chemical liquid immersion type processing apparatus for immersing and processing by immersing the semiconductor substrate in the rinsing tank,
A chemical liquid drying unit for drying the chemical liquid adhering to the semiconductor substrate is provided.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a schematic view of a chemical liquid immersion type processing apparatus showing an embodiment of the present invention. As shown in FIG. 1, this chemical liquid immersion treatment apparatus is provided with a chemical liquid drying unit 2 between a chemical liquid tank 1 and a water washing tank 3. Other than that, it is the same as the conventional one.

Next, the operation of this chemical liquid immersion type processing apparatus will be described. First, the cassette 5 accommodating the semiconductor substrate is carried to the chemical liquid tank 1 by the transfer machine 6 and immersed therein. Next, the cassette 5 immersed in the chemical liquid tank 1 for a certain period of time is transported to the chemical liquid drying unit 3 by the transfer device 6. The cassette 5 is dried by the attached chemical solution, and then transferred to the washing tank 3 by the transfer machine 6 and immersed therein. The cassette 5 is now thoroughly rinsed with water in a short time. Finally, the cassette 5 is carried to the final drying section 4 by the transfer machine 6 and dried, and then taken out by the transfer machine 6. Here, as the chemical solution drying unit, a centric dryer, a vacuum dryer, a warm air dryer, or the like is used.

[0011]

As described above, according to the present invention, since the chemical solution drying section for drying the chemical solution adhering to the semiconductor substrate is provided after the chemical solution tank, the chemical solution on the semiconductor substrate is removed to some extent. There is an effect that it is possible to obtain a chemical liquid immersion type processing apparatus that can perform chemical liquid processing in a short time.

[Brief description of drawings]

FIG. 1 is a schematic view showing a chemical liquid immersion type processing apparatus showing an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a conventional chemical liquid immersion type processing apparatus.

[Explanation of symbols]

 1 Chemical Solution Tank 2 Chemical Solution Drying Section 3 Washing Tank 4 Drying Section 5 Cassette 6 Transfer Bar

Claims (1)

Claim: What is claimed is: 1. A chemical solution immersion type, comprising: a chemical solution tank for storing a chemical solution for treating the surface of a semiconductor substrate; and a water washing tank for washing and removing the chemical solution, wherein the semiconductor substrate is continuously immersed in each tank for treatment. In the processing apparatus, a chemical solution immersion type processing apparatus is provided, which comprises a chemical solution drying section for drying the chemical solution adhering to the semiconductor substrate before the semiconductor substrate is washed with water in the washing tank.