JPH05299530A - Resin-sealed semiconductor device and manufacturing method thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] Surface mount type resin-sealed semiconductor device without leads. [Structure] A terminal portion of a semiconductor chip (6) on a die pad (4) is wire-bonded to a conductor portion (2) provided around it by a metal thin wire (1), which is part of each of the metal thin wires. Is sealed with resin so as to be exposed on the upper surface, and the exposed thin metal wire is used for bonding to the wiring on the printed circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a resin-sealed semiconductor device and a method for manufacturing the same.

[0002]

2. Description of the Related Art A resin-encapsulated semiconductor device intended to protect a semiconductor chip from a pollution source and mechanical damage is well known, and is widely used because of its low cost and excellent mass productivity. In this resin-encapsulated semiconductor device, various terminals of the semiconductor chip on the die pad and corresponding leads having relatively high rigidity are connected with a thin metal wire such as gold or copper, followed by resin molding, and then the leads are connected. The exposed portion of is processed into a shape suitable for mounting, that is, insertion or surface mounting on a printed circuit board, and if necessary, bent, and then plated to form a semiconductor device.

[0003]

Some problems occur due to the mechanical and chemical processing of the lead portion after the resin sealing as described above. That is, there is a high possibility that this processing will cause undesired deformation of the lead portion, and there is a high possibility that the resin sealing portion will be damaged. Even if these problems are solved, in the semiconductor device manufactured in this way, the lead portion protrudes from the edge portion thereof, so that the deformation may occur during transportation or storage. Such formation is
In particular, it is a big problem in the surface mount type device.

That is, such deformation often causes contact between the leads and reduction in flatness of the leads. In particular, this decrease in flatness may cause the leads to partly float up from the surface during mounting on the surface of the printed board, making it impossible to adhere to the board. Therefore, a protective container such as a special tray for storing and transferring the semiconductor device is required.

An object of the present invention is to provide a surface mount type resin-sealed semiconductor device which does not have a lead portion which is the root of various problems and a manufacturing method thereof.

[0006]

SUMMARY OF THE INVENTION According to the present invention,
The wire-bonding thin metal wire itself used for connecting the terminal portion of the semiconductor chip and the lead is exposed on the upper surface of the resin-sealed semiconductor device and replaced with the lead, and is used as a contact with the externally mounted printed circuit board. ..

[0007]

In the past, since there are no leads that require mechanical processing after resin encapsulation, various problems resulting from this are essentially nonexistent. The semiconductor device of the present invention is placed upside down on a printed board on which a solder paste has been placed in advance, and is fixed to the board by an appropriate reflow process.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a resin-sealed semiconductor device 10 according to the present invention.
FIG. In FIG. 1, the semiconductor chip 6 is arranged on the die pad 4. An insulating and heat resistant adhesive tape 3 is arranged outside the region of the die pad 4 on which the semiconductor chip 6 is arranged, and the conductor portion 2 is provided on the tape 3 at a position corresponding to the terminal portion of the semiconductor chip 4. Will be placed. The terminal portion and the conductor portion 2 are connected to each other by the metal wire 1 by wire positioning in the conventional manner. Then, the whole is sealed with a suitable resin sealing body 5 to manufacture the semiconductor device 10 of the present invention.

As shown in FIG. 1, the central portions of the metal thin wires 1 are exposed on the upper surface of the resin sealing body 5. FIG. 2 is a plan view of the semiconductor device 10 of FIG. 1, and shows the exposed thin metal wire 1.

An example of mounting the semiconductor device 10 having such a structure on the printed board 12 is shown in FIG. In FIG. 3, the semiconductor device 10 is placed upside down on the external mounting printed circuit board 12 to which the solder paste 11 has been applied in advance at predetermined locations, and the solder paste is melted using an appropriate reflow device to expose the exposed metal. The thin wire 1 is bonded to a printed wiring (not shown) on the substrate 12.

4a and 4b show a semiconductor device 10 of the present invention.
The main steps of one embodiment of the manufacturing method of

In FIG. 4a, the insulating and heat-resistant adhesive tape 3 is formed on the peripheral portion of the die pad 4, and corresponding to various terminal portions of the semiconductor chip 6 to be arranged in the central portion,
The conductor portion 2 is provided. Then, the semiconductor chip 6 is arranged in the central portion, and its terminal portion and the conductor portion 2 are connected by the metal thin wires 1, respectively. At this time, the length of the thin metal wire 1 is selected so that the central portion thereof projects from the upper surface of the resin sealing portion shown by the dotted line 10 'in FIG.

Next, as shown in FIG. 4b, the upper and lower molds 7 are formed.
It is placed between a and 7b. As a result, the surplus length portion of the thin metal wire 1 comes into line contact with the bottom wall of the upper mold 7a.

Next, an appropriate resin is injected into the mold through a sprue portion (not shown) of the mold.

Thus, the resin-sealed semiconductor device of FIG. 1 is obtained. In order to make the area of the thin metal wire 1 exposed on the upper surface of the resin sealing portion 5 sufficient for bonding to the printed board, the upper surface of the resin sealing portion 5 may be polished. The polishing depth that maximizes the bonding area corresponds to the radius of the metal thin wire 1. However, in order to ensure the adhesion between the metal thin wire 1 and the resin sealing portion 5 as well, About 1 in diameter
It has been found that it should be equivalent to 0%.

Instead of performing the polishing step as described above, a honing step performed prior to the plating process of the lead portion in the conventional resin-sealed semiconductor device may be used.

[0017]

As described above, since the semiconductor device of the present invention does not have a lead portion as in the conventional case, there is no processing step to be performed on the lead and all problems caused by the lead are solved. To be done.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a plan view of the semiconductor device of FIG.

FIG. 3 is a diagram showing mounting of the semiconductor device of FIG. 1 on a printed circuit board.

FIG. 4 is a view showing a main part of a manufacturing process of the semiconductor device of FIG.

[Explanation of symbols]

 1 Wire Bond Metal Fine Wire 2 Conductor Section 3 Insulation Heat Resistant Adhesive Tape 4 Die Pad 5 Resin Sealing Section 6 Semiconductor Chip 7a, 7b Mold Die

Claims (4)

[Claims] 1. A semiconductor chip disposed on a die pad and having a plurality of terminal portions, and a die pad portion outside a region where the semiconductor chip is disposed, corresponding to a terminal portion of the semiconductor chip via an insulating layer. Part of the metal thin wire, the metal thin wire connecting the terminal portion of the semiconductor chip and the conductor portion, respectively, the semiconductor chip on the die pad, the conductor portion and the metal thin wire, respectively. A resin-encapsulated semiconductor device, which comprises a resin encapsulation portion that encapsulates so that only one is exposed on the upper surface. 2. A step of disposing a semiconductor chip having a plurality of terminal portions on a die pad and disposing a conductor portion corresponding to the terminal portion via an insulating layer in a peripheral die pad portion, and a step of disposing the semiconductor chip. The step of connecting the terminal portion and the conductor portion with a sufficiently long metal thin wire, and the semiconductor chip, the conductor portion and the metal thin wire, and only a part of each metal thin wire contacts the bottom wall of the upper mold. A method of manufacturing a resin-encapsulated semiconductor device, which comprises the steps of: arranging in a cavity formed by the upper and lower molds in this manner, and injecting a resin into the cavity to perform resin sealing. 3. The method according to claim 2, further comprising polishing the upper surface of the resin-sealed semiconductor device after the resin-sealing.
A method for manufacturing the resin-encapsulated semiconductor device described. 4. The method of manufacturing a resin-sealed semiconductor device according to claim 3, wherein the polishing step is performed such that about 10% of the diameter of the thin metal wire is removed by polishing from the upper surface. ..