JPH05299542A - Heat dissipation type semiconductor chip carrier and semiconductor device - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To obtain a semiconductor device that has no unfilled part, has a good appearance, and has excellent moisture resistance. A heat dissipation type semiconductor chip carrier having a groove-shaped recess 2 from one end to the other end of the metal plate 1 on an outer exposed surface of the metal plate 1 attached to an insulating substrate 3, and a semiconductor chip of this heat dissipation type semiconductor chip carrier. It has a semiconductor chip mounted in the mounting recess 7, and the filling of the groove-shaped recess 2 and the formation of the outer shell body 9 are integrally performed by the sealing resin composition 8 for resin sealing of the semiconductor chip. Semiconductor device being made.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip carrier used for mounting a semiconductor chip and a semiconductor device in which the semiconductor chip is mounted and resin-sealed, and particularly to a semiconductor chip carrier and a semiconductor excellent in heat dissipation. It relates to the device.

[0002]

2. Description of the Related Art In recent years, a printed wiring board such as an epoxy resin laminated board using glass cloth as a base material has been used as an insulating substrate constituting a semiconductor chip carrier. However, in such a printed wiring board, heat conductivity is poor, and heat generated from the mounted semiconductor chip cannot be radiated well.

A heat radiation type semiconductor chip carrier which solves the above problems is disclosed in Japanese Utility Model Laid-Open No. 61-38997.
This disclosed technique is illustrated in the cross-sectional view of FIG. A conductor circuit 5 is formed on the surface of the insulating substrate 3, and a concave portion 2 and a convex portion 15 are formed on one surface on the back surface of the substrate, which is the opposite surface of the conductor circuit 5, and a metal plate 1 having a flat opposite surface is formed by an adhesive. 4 is a semiconductor chip mounting substrate having a semiconductor chip mounting recess 7 formed on the surface of the insulating substrate 3 so that the flat portion of the metal plate 1 is exposed. The purpose of arranging the concave portions 2 and the convex portions 15 on the surface is to improve the heat radiation performance by increasing the heat radiation area, and there is no description suggesting the moldability in resin sealing.

FIG. 6 shows a sectional view of another conventional example.
In a semiconductor device in which a metal plate 1 for heat dissipation is embedded and resin-sealed, as a device for ensuring the fixation of the metal plate 1, an inclined side surface and a step difference that shrinks outward are provided. .. FIG. 7 is a plan view showing the flow of the molten encapsulating resin molding material during resin encapsulation for obtaining this semiconductor device. Since the metal plate 1 does not have a groove-shaped recess, the molten sealing resin molding material enters the mold from the gate 14 and then is interrupted by the metal plate 1 and divided into two hands as shown by the arrow, which is the innermost part of the mold. Therefore, there is a problem that unfilling is likely to occur at this merging point.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to improve the flow of an encapsulating resin molding material when a heat dissipation type semiconductor chip carrier is resin-encapsulated and to form a semiconductor without unfilling the molding material. An attempt is made to provide a heat dissipation type semiconductor chip carrier that can be formed into a device.

Another object of the present invention is to provide a semiconductor device having a good appearance and excellent moisture resistance.

[0007]

The first invention made in view of the above points is characterized in that a groove is formed from one end to the other end of the metal plate on the outer exposed surface of the metal plate attached to the insulating substrate. A heat-dissipating semiconductor chip carrier having a groove-shaped recess, and a second aspect of the present invention is a semiconductor device in which an outer shell is integrally formed with the sealing resin composition filled in the groove-shaped recess. ..

[0008]

An embodiment of the present invention will be described below with reference to the drawings. The present invention is not limited to these examples.

FIG. 1A is a sectional view showing an embodiment of the first present invention, and FIG. 1B is a perspective view thereof. The semiconductor chip carrier has a rectangular insulating substrate 3, a metal plate 1 attached with an adhesive 4 so as to close a through hole formed in a substantially central portion of the insulating substrate 3 and form a semiconductor chip mounting recess 7. Conductor circuit 5 provided on the surface of the insulating substrate 3
And an external terminal 6 attached to one end of the conductor circuit 5 and attached to the outer exposed surface of the metal plate 1 from the one end to the other end of the metal plate 1 having a V-shaped groove 2. The cross-sectional shape is formed in parallel lines. FIG. 1C is a perspective view of an embodiment of the second invention. A semiconductor chip is mounted in the recess 7 of the heat dissipation type semiconductor chip carrier, and one end of a conductor circuit disposed on the surface of the semiconductor chip and the insulating substrate is wire-bonded with a gold wire and set in a molding die,
It is a semiconductor device obtained by resin sealing. On the surface of the metal plate 1 for heat dissipation, the groove-shaped recess 2 formed from one end to the other end of the metal plate is filled with the sealing resin composition 8. Sealing resin composition 8 filled in the groove-shaped recess 2
Is filled at the same time when the heat radiation type semiconductor chip carrier is molded. Therefore, since the sealing resin 8 filled in the groove is integral with the outer shell 9 of the semiconductor device, the metal plate 1 for heat dissipation is securely fixed to the semiconductor device so as to be surrounded by the sealing resin composition 8. Therefore, the movement of the metal plate 1 is suppressed and the metal plate 1 is prevented from coming off.

FIG. 2A is a sectional view showing another embodiment of the first present invention, and FIG. 2B is a perspective view thereof.
The heat dissipation type semiconductor chip carrier is different from that of FIG. 1 in that the shape of the groove-shaped recess 2 formed on the surface of the metal plate 1 is U-shaped and mesh-shaped. Figure 2 (C)
Is a perspective view of a semiconductor device of the second present invention using this heat dissipation type semiconductor chip carrier. FIG. 1D is a cross-sectional view thereof, in which the semiconductor chip 16 is mounted in the concave portion 7 of the heat dissipation type semiconductor chip carrier, and one end of the conductor circuit 5 disposed on the surface of the semiconductor chip 16 and the insulating substrate 3 is gold. A semiconductor device obtained by wire-bonding with wire 10 is set in a molding die and resin-sealed. On the surface of the metal plate 1 for heat dissipation, the groove-shaped recess 2 formed from one end to the other end of the metal plate 1 is filled with the sealing resin composition 8. Sealing resin composition 8 filled in the groove-shaped recess 2
Is integrated with the outer shell 9 of the semiconductor device, the metal plate 1 for heat dissipation is securely fixed to the semiconductor device so as to be surrounded by the sealing resin composition 8, and the movement of the metal plate 1 is suppressed. To prevent or disengage.

The cross-sectional shape of the groove-shaped recess 2 formed on the surface of the metal plate 1 for heat dissipation from one end to the other end of the metal plate is
V-shaped, U-shaped, rectangular, semicircular, etc. can be used as appropriate. Further, as the shape of the groove-shaped recess formed in the metal plate 1 for heat dissipation, it is possible to use a parallel shape from one end of the metal plate to the other end or a cross shape in a mesh shape. Among them, a metal plate parallel to one end to the other end is preferable. This is because the sealing resin molding material smoothly flows in the mold.

As a method of forming the groove-shaped recess 2 in the heat-dissipating metal plate 1, a predetermined metal plate punched or cut out from a large-sized metal plate is re-punched by double punching or cutting. Not only can it be tailored for heat dissipation, but the method of processing a metal plate for heat dissipation shown in the perspective view of FIG. 3A can be used. A large metal plate 1M is provided with a die 1 and a protrusion 1 for forming a groove.
1 is inserted between punch dies 12 each having one and punched once to dissipate heat of a predetermined size having a groove-shaped recess 2 from one end to the other end of the metal plate 1 as shown in the perspective view of FIG. 3 (B). The metal plate 1 for can be obtained.

FIG. 4 is a plan view showing the flow path of the encapsulating resin molding material when resin-encapsulating the heat dissipation type semiconductor chip carrier of the present invention. When the semiconductor chip carrier is resin-sealed, the groove-shaped recess 2 is formed on the surface of the metal plate 1 for heat dissipation so that the molten sealing resin molding material can smoothly flow to the gate position 14 of the mold. By doing so, the molten sealing resin flows through the groove-shaped recess 2 or the mold and reaches the innermost part of the mold while the curing hardly progresses, so that the molten resin fills the semiconductor device as a molded product. Not easily filled. Therefore, the groove-shaped recess 2 is formed in the metal plate 1 for heat dissipation.
By forming the above, it is possible to obtain an outer shell semiconductor device having no unfilled portion without using an advanced molding technique or an expensive mold.

As the insulating substrate 3, an insulating material obtained by hardening a resin of a prepreg obtained by impregnating and drying a base material with a resin is used. Here, the insulating material resin has heat resistance,
It is preferable that the resin has excellent moisture resistance and resin purity, especially less ionic impurities. Specifically, epoxy resin, polyimide resin, fluororesin, phenol resin, unsaturated polyester resin, PPO resin and the like are suitable. The base material of the insulating material is not particularly limited, but an inorganic material such as glass fiber is preferable because it has excellent heat resistance and moisture resistance. Further, it is also possible to use an organic fiber cloth substrate having excellent heat resistance and a mixture thereof.

As the metal plate 1 of the present invention, a copper plate, a copper alloy plate, a copper-invar-copper alloy plate, an iron-nickel alloy plate, other steel plates, iron plates, aluminum plates and the like can be appropriately used. Further, it is possible to use those obtained by forming a protective coating having excellent heat dissipation and corrosiveness such as gold plating on the surface of these metal plates.

The resin of the resin composition of the encapsulating resin molding material that forms the outer shell 9 of the semiconductor device and fills the groove-shaped recess 2 formed in the metal plate 1 for heat dissipation is epoxy resin, Polyimide resin, unsaturated polyester resin,
Silicone resins and the like can be used alone, modified, or mixed and used.

In the heat dissipation type semiconductor chip carrier of the first aspect of the present invention, the bottom surface of the semiconductor chip mounting concave portion 7 is formed of the metal plate 1, and the heat generated from the mounted semiconductor chip 9 is absorbed by the metal plate 1 and air. The heat is efficiently dissipated inside and the heat is not trapped in the metal plate 1. Furthermore, by attaching a heat sink having excellent thermal conductivity to the metal plate 1, the heat radiation effect can be further increased. Therefore, I / O
Large number of terminals required, large heat generation, high integration, high functionality,
Suitable as a semiconductor chip carrier for high speed.

[0018]

When the heat-dissipating semiconductor chip carrier is resin-sealed, the molten encapsulating resin molding material enters the cavity from each gate of the mold and is temporarily attached to the surface of the metal plate disposed on the heat-dissipating semiconductor chip carrier. To the other end, it is filled through the groove-shaped concave portion and the periphery of the metal plate. In this case, since there are many channels of the molten sealing resin, the mold is quickly and smoothly filled while the curing of the sealing resin material hardly progresses,
It is considered that since the compatibility of the molten resin at the confluence point also progresses smoothly, the air in the mold and the sealing resin can be exchanged smoothly, so that no unfilling occurs.

[0019]

According to the structure of the heat dissipation type semiconductor chip carrier of the present invention, the flow of the encapsulation resin molding material when forming the heat dissipation type semiconductor chip carrier by resin encapsulation is improved, and the encapsulation resin molding material is not A semiconductor device without filling can be formed. Since the semiconductor device is not unfilled, a semiconductor device having a good appearance and excellent moisture resistance can be obtained.

[Brief description of drawings]

FIG. 1A is a sectional view showing an embodiment of the first present invention. (B) It is a perspective view of FIG. (C) is a perspective view showing an embodiment of the second invention using FIG. 1 (B).

FIG. 2 (A) is a cross-sectional view showing another embodiment of the first present invention. (B) It is a perspective view of FIG. FIG. 3C is a perspective view showing an embodiment of the second invention using FIG. 2B. (D) It is sectional drawing of FIG. 2 (C).

FIG. 3 (A) is a perspective view showing processing of the metal plate for heat dissipation of the present invention. (B) It is a perspective view which shows the metal plate for heat radiation obtained in FIG. 3 (A).

FIG. 4 is a plan view showing an embodiment of the present invention.

FIG. 5 is a sectional view showing a conventional example.

FIG. 6 is a cross-sectional view showing another conventional example.

FIG. 7 is a plan view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal plate 2 Recessed part 3 Insulating substrate 4 Adhesive 5 Conductor circuit 6 External terminal 7 Recessed part for mounting semiconductor chip 8 Sealing resin composition 9 Outer shell 10 Gold wire 11 Projection part 12 Punch die 13 Die die 14 Gate 15 Convex part 16 Semiconductor chip 1M Large size metal plate

Claims (2)

[Claims] 1. A heat dissipation type semiconductor chip carrier, characterized in that a metal plate attached to an insulating substrate has a groove-shaped recess on the outer exposed surface of the metal plate from one end to the other end. 2. A semiconductor device, wherein an outer shell is integrally formed by the sealing resin composition filled in the groove-shaped recess according to claim 1.