JPH05299577A - Multi-chip module structure - Google Patents

Abstract

(57) [Abstract] [Purpose] Regarding the improvement of the multi-chip module structure for mounting semiconductor chips and chip parts, since guide frames are provided on both sides of the board, it becomes possible to mount the parts on both sides of the board, and the small size An object of the present invention is to provide a multi-chip module structure capable of providing a large number of external connection terminals on a substrate. [Structure] A substrate 1 on which semiconductor chips 4 and chip components 6 connected by bonding wires 5 are mounted on both front and back surfaces, and bonding pads 1a used for electrical external connection are formed on the outer periphery, and one surface of the substrate 1. The guide frame 2 provided on the substrate 1, the guide frame 3 provided on the back surface of the substrate 1 on which the guide frame 2 is provided, the spot coat 7 for covering the semiconductor chip 4 and the bonding wire 5, and the substrate 1 And the exterior material 8 filled in the space surrounded by the guide frame 2 and the guide frame 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvement of a multichip module structure for mounting semiconductor chips and chip parts.

With the recent miniaturization of electronic devices, there has been a demand for higher density and higher integration of semiconductor components. Therefore, hybrid integrated circuits and multichip module semiconductor components have been proposed. However, in order to further increase the density, it is necessary to improve the electrical connection method when mounting a hybrid integrated circuit or a multi-chip module on a pin grid array substrate (hereinafter abbreviated as PGA substrate) or a printed wiring board. Is required.

Under the circumstances as described above, there is a demand for a multi-chip module having a structure capable of high-density electrical connection when mounted on a PGA or a printed wiring board.

[0004]

2. Description of the Related Art A conventional multi-chip module will be described in detail. FIG. 7 is a diagram showing a conventional multi-chip module structure, and FIG. 8 is a diagram showing an example of use of the conventional multi-chip module.

As shown in FIG. 7, a conventional multi-chip module has a semiconductor chip 4 and a chip component 6 mounted on a substrate 11 having external connection terminals 11a, and is formed on the substrate 11. The wiring pattern electrically connected to the semiconductor chip 4 is electrically connected using the bonding wire 5, the semiconductor chip 4 and the bonding wire 5 are covered by spot coat, and the substrate 11 is covered by the mold resin 18. And is molded.

The pitch of the external connection terminals 11a currently used is 2.54 mm or 1.27 mm. When mounting such a multi-chip module on a printed wiring board,
As shown in FIG. 8 (a), the printed wiring board is provided with through holes having the same pitch as the external connection terminals 11a of the multichip module, and the external connection terminals 11a are directly inserted into the through holes and soldered, or As shown in FIG. 8B, a connector for inserting the external connection terminal 11a is provided on the printed wiring board, and the external connection terminal 11a of the multichip module is inserted and mounted in this connector.

[0007]

In the conventional multi-chip module described above, when the multi-chip module and the printed wiring board are connected by the external connection terminal, the multi-chip module is directly soldered to the printed wiring board. It is difficult to reduce the size of the multi-chip module below the area required to mount the connector on the printed wiring board, and the number of external connection terminals that can be provided in the limited area is limited. Therefore, it is extremely difficult to increase the number of terminals, and there is a problem that the number of components that can be mounted is limited because the semiconductor chip and the chip components are mounted on only one surface of the substrate.

According to the present invention, since the guide frames are provided on both surfaces of the board in the above situation, components can be mounted on both surfaces of the board, and a large number of external connection terminals can be provided on a small board. The purpose of the present invention is to provide a multi-chip module structure as described below.

[0009]

In the multi-chip module structure of the present invention, semiconductor chips and chip parts connected by bonding wires are mounted on both front and back surfaces, and bonding pads used for electrical external connection are formed on the outer periphery. A substrate, a guide frame provided on one surface of the substrate, a guide frame provided on the back surface of the surface of the substrate on which the guide frame is provided, a spot coat for covering the semiconductor chip and the bonding wire, It is configured to include a substrate and an exterior material filled in a space surrounded by these guide frames.

[0010]

That is, in the present invention, guide frames are provided on the front surface and the back surface of the substrate on the outer periphery of which bonding pads used for electrical external connection are formed, and chip components and semiconductor chips are mounted on both the front and back surfaces of the substrate for bonding. Since the semiconductor chip connected by the wire is covered with the spot coat and the space surrounded by the substrate and the guide frame is filled with the exterior material, approximately twice as many chip components and semiconductor chips are mounted on the substrate of the same area. Since a large number of bonding pads are used for external connection, the number of external connection terminals can be increased, and high integration of the multichip module can be achieved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. 1 and 2 are views showing a multi-chip module structure of an embodiment according to the present invention, FIG. 3 is a view showing an arrangement of bonding pads of a multi-chip module according to another embodiment of the present invention, and FIG. FIG. 5 is a diagram showing a first usage example of a multi-chip module of one embodiment, FIG. 5 is a diagram showing a second usage example of a multi-chip module of one embodiment of the present invention, and FIG. 6 is a view of one embodiment of the present invention. It is a figure which shows the 3rd example of use of a multichip module.

As shown in FIGS. 1 and 2, a multi-chip module according to an embodiment of the present invention has a substrate 1 having a bonding pad 1a used for electrical external connection formed on the outer periphery thereof.
The guide frame 2 is fixed to one surface of the substrate 1, the semiconductor chip 4 and the chip component 6 connected by the bonding wires 5 are mounted on the surface of the substrate 1 in the guide frame 2, and the guide frame 2 of the substrate 1 is provided. Similarly, the semiconductor chip 4 and the chip component 6 connected by the bonding wire 5 are mounted on the surface opposite to the surface, the semiconductor chip 4 and the bonding wire 5 are covered with the spot coat 7, and the guide frame 2 and The space surrounded by the guide frame 3 and the substrate 1 is filled with the exterior material 8.

The bonding pad 1a is formed by depositing a metal film on the surface of the substrate 1 by vapor deposition and patterning it by a lithographic technique. Therefore, the pitch is 100 μm to 200 μm.
It can be set to μm.

Since the bonding pads 1a are provided as the external connection terminals in this way, the pitch of the bonding pads 1a can be made small, and the number of external connection terminals that can be provided per unit length is significantly increased. It is possible.

If the bonding pads 1a are arranged in two rows as shown in FIG. 3, the bonding pads 1a can be made even denser. Since such a multi-chip module can be wired by the bonding wire 5 using the bonding pad 1a, it can be mounted on the pin grid array substrate (PGA substrate) and covered with the spot coat 7 as shown in FIG. It will be possible.

Similarly, when the multichip module is mounted on the printed wiring board, it can be wired by the bonding wire 5 using the bonding pad as shown in FIG. 5, so that it is mounted on the printed wiring board as shown in FIG. Then, it becomes possible to cover with the spot coat 7.

Further, it becomes possible to mount the TAB lead provided on the base film and the bonding pad 1a of the multi-chip module by pressure bonding, and cover with the spot coat 7 as shown in FIG.

[0018]

As is apparent from the above description, according to the present invention, the number of semiconductor chips and chip parts that can be mounted per unit area is significantly increased by changing the structure very easily, and In addition, it is possible to provide a large number of external connection terminals, and it is possible to provide a multi-chip module structure that can be expected to achieve significant economic and reliability improvement effects.

[Brief description of drawings]

FIG. 1 is a diagram showing a multi-chip module structure according to an embodiment of the present invention,

FIG. 2 is a view taken along the line AA of FIG.

FIG. 3 is a view showing an arrangement of bonding pads of a multi-chip module of another embodiment according to the present invention,

FIG. 4 is a diagram showing a first usage example of the multi-chip module of one embodiment according to the present invention;

FIG. 5 is a diagram showing a second use example of the multi-chip module of one embodiment according to the present invention;

FIG. 6 is a diagram showing a third usage example of the multi-chip module of one embodiment according to the present invention;

FIG. 7 is a diagram showing a conventional multi-chip module structure,

FIG. 8 is a diagram showing a usage example of a conventional multi-chip module,

[Explanation of symbols]

1 is a substrate, 1a is a bonding pad, 2 is a guide frame, 3
Is a guide frame, 4 is a semiconductor chip, 5 is a bonding wire, 6 is a chip component, 7 is a spot coat, 8 is an exterior material,

Claims (1)

[Claims] 1. A bonding pad (1a) for mounting semiconductor chips (4) and chip parts (6) connected by bonding wires (5) on both front and back surfaces and used for electrical external connection.
A substrate (1) formed on the outer circumference, a guide frame (2) provided on one surface of the substrate (1), and a guide frame (2) provided on the back surface of the substrate (1) on which the guide frame (2) is provided. A guide frame (3), a spot coat (7) for covering the semiconductor chip (4) and the bonding wire (5), the substrate (1), the guide frame (2) and the guide frame (3). A multi-chip module structure comprising: an exterior material (8) filling an enclosed space.