JPH05309651A - Prepreg and printed-wiring board used thereof - Google Patents
Prepreg and printed-wiring board used thereofInfo
- Publication number
- JPH05309651A JPH05309651A JP11354892A JP11354892A JPH05309651A JP H05309651 A JPH05309651 A JP H05309651A JP 11354892 A JP11354892 A JP 11354892A JP 11354892 A JP11354892 A JP 11354892A JP H05309651 A JPH05309651 A JP H05309651A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- wiring board
- resin
- printed
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 2
- 238000012216 screening Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- -1 polyacryl Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器、電気機器、
コンビュ−タ−、通信機器等に用いられるプリント配線
板及びそれに用いられるプリプレグに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a printed wiring board used for a computer, a communication device and the like, and a prepreg used for the same.
【０００２】[0002]
【従来の技術】従来、プリント配線板等に用いられてい
るプリプレグは、紙、ガラス布等の長尺基材に樹脂を含
浸、乾燥した長尺樹脂含浸基材を所要寸法に切断したプ
リプレグのため、液体レジストで露光する場合、表面側
からの露光が裏面側迄到達するので、厚みが１ｍｍ未満
のように薄いプリント配線板では対応できないという問
題があった。2. Description of the Related Art Conventionally, a prepreg used for a printed wiring board or the like is a prepreg obtained by cutting a long resin-impregnated base material impregnated with resin into a long base material such as paper or glass cloth and dried to a required size. Therefore, when the liquid resist is used for exposure, the exposure from the front surface reaches the back surface, so that there is a problem that a thin printed wiring board having a thickness of less than 1 mm cannot be used.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来のプリプレグを用いたプリント配線板では露
光工程でのトラブルが多い。本発明は従来の技術におけ
る上述の問題点に鑑みてなされたもので、その目的とす
るところは厚みが１ｍｍ未満のプリント配線板であって
も安心して露光処理できるプリント配線板を提供するこ
とにある。As described in the prior art, the printed wiring board using the conventional prepreg has many troubles in the exposure process. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a printed wiring board that can be safely exposed even if the printed wiring board has a thickness of less than 1 mm. is there.
【０００４】[0004]
【課題を解決するための手段】本発明は、ＵＶ遮蔽性及
び又は蛍光特性を有するプリプレグの片面に、金属箔を
配設ー体化したことを特徴とするプリプレグ及び該プリ
プレグを最外層とするプリント配線板のため、厚みが１
ｍｍ未満のプリント配線板であっても安心して露光処理
することがでのるもので、以下本発明を詳細に説明す
る。According to the present invention, a prepreg characterized by arranging a metal foil on one surface of a prepreg having a UV shielding property and / or a fluorescent property, and the prepreg as an outermost layer are provided. Thickness is 1 because it is a printed wiring board
The present invention will be described in detail below, because even a printed wiring board of less than mm can be safely exposed.
【０００５】本発明に用いるプリプレグの基材は、ガラ
ス、アスベスト等の無機質繊維や、ポリエステル、ポリ
アミド、ポリアクリル、ポリビニルアルコ−ル、ポリイ
ミド、ポリフエニレンサルフアイド、ポリフエニレンオ
キサイド、フッ素樹脂等の有機質繊維や木綿等の天然繊
維からなる織布、不織布、マット、紙等である。The base material of the prepreg used in the present invention includes inorganic fibers such as glass and asbestos, polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, polyphenylene sulfide, polyphenylene oxide, and fluororesin. Woven fabrics, non-woven fabrics, mats, papers and the like made of organic fibers and natural fibers such as cotton.
【０００６】基材に含浸させる樹脂としては、フエノ−
ル樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ポリ
イミド樹脂、ビニルエステル樹脂、ポリブタジエン樹
脂、ポリアミド樹脂、ポリフエニレンオキサイド樹脂、
ポリフエニレンサルフアイド樹脂、ポリエチレンテレフ
タレート樹脂、ポリブチレンテレフタレート樹脂、フッ
素樹脂等が用いられ、必要に応じてタルク、クレ−、炭
酸カルシュウム、水酸化アルミニュ−ム、シリカ等の無
機質粉末充填剤を添加することができる。As the resin with which the substrate is impregnated, phenol
Resin, epoxy resin, unsaturated polyester resin, polyimide resin, vinyl ester resin, polybutadiene resin, polyamide resin, polyphenylene oxide resin,
Polyphenylene sulfide resin, polyethylene terephthalate resin, polybutylene terephthalate resin, fluororesin, etc. are used, and if necessary, inorganic powder fillers such as talc, clay, calcium carbonate, aluminum hydroxide and silica are added. can do.
【０００７】プリプレグに含有させるＵＶ遮蔽性、蛍光
特性物質としては、サルチル酸系、ベンゾフェノン系、
ベンゾトリアゾール系、ヒドロキシベンゾエート系、シ
アノアクリレート系等の紫外線吸収能力のある物や蛍光
物質全般で、添加量は樹脂固型分１００重量部（以下単
に部と記す）に対し０．１〜４部であることが好まし
い。プリプレグの厚みとしては０．１〜０．２ｍｍで、
樹脂量は３５〜５５重量％（以下単に％と記す）である
ことが好ましい。金属箔としては銅、アルミニュウム、
真鍮、ニッケル、鉄等の単独、合金、複合箔で厚み０．
０１８〜０．０７ｍｍのものが好ましい。内層材として
は片面又は両面金属箔張積層板に回路形成したものが用
いられ、樹脂層としては樹脂塗布層、プリプレグ、樹脂
フイルム、樹脂シート等が用いられ特に限定するもので
はない。UV-shielding and fluorescent characteristic substances contained in the prepreg include salicylic acid type, benzophenone type,
For all benzotriazole-based, hydroxybenzoate-based, cyanoacrylate-based, etc. UV-absorbing substances and fluorescent substances, the addition amount is 0.1 to 4 parts with respect to 100 parts by weight of resin solid content (hereinafter simply referred to as "part"). Is preferred. The thickness of the prepreg is 0.1 to 0.2 mm,
The amount of resin is preferably 35 to 55% by weight (hereinafter simply referred to as%). As the metal foil, copper, aluminum,
Brass, nickel, iron, etc. alone, alloy, composite foil with a thickness of 0.
It is preferably 018 to 0.07 mm. As the inner layer material, a circuit-formed one-sided or double-sided metal foil-clad laminate is used, and as the resin layer, a resin coating layer, a prepreg, a resin film, a resin sheet, or the like is used, and there is no particular limitation.
【０００８】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００９】[0009]
【実施例】臭素化エポキシ樹脂ワニスに、２・２’ハイ
ドロキシ５’メチルフェニルベンゾトリアゾールを樹脂
固型分１００部に対して２部添加した積層板用ワニス
を、厚さ０．１ｍｍのガラス布に乾燥後樹脂量が４５％
になるように含浸、乾燥して得たプリプレグの片面に厚
み０．０３５ｍｍの銅箔を配設ー体化してＵＶ遮蔽プリ
プレグを得た。次に厚み０．３ｍｍの両面回路内層材の
上下面に、厚み０．１ｍｍのエポキシ樹脂含浸ガラス布
プリプレグ１枚を各々介して上記ＵＶ遮蔽プリプレグを
配設した積層体を、成形圧力４０Ｋｇ／ｃｍ2 、１６５
℃で６０分間積層成形して厚み０．８ｍｍの４層回路プ
リント配線板を得た。EXAMPLE A varnish for a laminated plate, which is obtained by adding 2 parts of 2.2 'hydroxy 5'methylphenylbenzotriazole to 100 parts of the resin solid content of a brominated epoxy resin varnish, and using a glass cloth having a thickness of 0.1 mm. After drying, the amount of resin is 45%
A copper foil having a thickness of 0.035 mm was disposed and formed on one surface of the prepreg obtained by impregnation and drying so that a UV shielding prepreg was obtained. Next, a laminated body in which the above UV shielding prepregs are arranged on the upper and lower surfaces of a double-sided circuit inner layer material having a thickness of 0.3 mm through one epoxy resin-impregnated glass cloth prepreg having a thickness of 0.1 mm is formed at a molding pressure of 40 Kg / cm. 2 , 165
By laminating at 60 ° C. for 60 minutes, a 4-layer circuit printed wiring board having a thickness of 0.8 mm was obtained.
【００１０】[0010]
【比較例】実施例と同じ内層材の上下面に、厚み０．１
ｍｍのエポキシ樹脂含浸ガラス布プリプレグを各々２枚
介して厚み０．０３５ｍｍの銅箔を配設した積層体を実
施例と同様に処理して厚み０．８ｍｍの４層回路プリン
ト配線板を得た。[Comparative example] The same inner layer material as in the example, with a thickness of 0.1
mm epoxy resin-impregnated glass cloth prepregs were interposed between the two layers, and a laminate having a 0.035 mm-thick copper foil disposed therein was treated in the same manner as in the example to obtain a 4-layer circuit printed wiring board having a thickness of 0.8 mm. .
【００１１】実施例及び比較例のプリント配線板を露光
処理した結果は表１のようである。The results of exposing the printed wiring boards of Examples and Comparative Examples are shown in Table 1.
【００１２】[0012]
【表１】 [Table 1]
【００１３】[0013]
【発明の効果】本発明は上述したごとく構成されてい
る。特許請求の範囲に記載した構成を有するプリプレグ
及びプリント配線板においては、露光工程でのトラブル
が全くなく、本発明の優れていることを確認した。The present invention is constructed as described above. It was confirmed that the prepreg and the printed wiring board having the configurations described in the claims have no trouble in the exposure step and the present invention is excellent.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｋ 105:22 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI technical display area // B29K 105: 22
Claims (2)
リプレグの片面に、金属箔を配設ー体化したことを特徴
とするプリプレグ。1. A prepreg comprising a prepreg having a UV-shielding property and / or a fluorescent property, and a metal foil provided on one surface of the prepreg.
ＵＶ遮蔽性及び又は蛍光特性を有するプリプレグの片面
に金属箔を配設ー体化したプリプレグを配設ー体化した
ことを特徴とするプリント配線板。2. The required number of inner layer materials, the outermost layer of the resin layer,
A printed wiring board, characterized in that a prepreg having a metal foil disposed on one side of a prepreg having a UV shielding property and / or a fluorescent property is disposed on the one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11354892A JPH05309651A (en) | 1992-05-06 | 1992-05-06 | Prepreg and printed-wiring board used thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11354892A JPH05309651A (en) | 1992-05-06 | 1992-05-06 | Prepreg and printed-wiring board used thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05309651A true JPH05309651A (en) | 1993-11-22 |
Family
ID=14615101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11354892A Pending JPH05309651A (en) | 1992-05-06 | 1992-05-06 | Prepreg and printed-wiring board used thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05309651A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2316101A (en) * | 1996-08-01 | 1998-02-18 | Rogers Corp | Electrical substrate containing single resin thermosetting compositions |
-
1992
- 1992-05-06 JP JP11354892A patent/JPH05309651A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2316101A (en) * | 1996-08-01 | 1998-02-18 | Rogers Corp | Electrical substrate containing single resin thermosetting compositions |
| GB2316101B (en) * | 1996-08-01 | 2000-05-03 | Rogers Corp | An electrical substrate material |
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