JPH0531337U - In-vehicle electronic device - Google Patents
In-vehicle electronic deviceInfo
- Publication number
- JPH0531337U JPH0531337U JP3735392U JP3735392U JPH0531337U JP H0531337 U JPH0531337 U JP H0531337U JP 3735392 U JP3735392 U JP 3735392U JP 3735392 U JP3735392 U JP 3735392U JP H0531337 U JPH0531337 U JP H0531337U
- Authority
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- Prior art keywords
- conductive
- connector pin
- electronic device
- conductive case
- vehicle
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003990 capacitor Substances 0.000 claims abstract description 49
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 230000008054 signal transmission Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 208000032368 Device malfunction Diseases 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Filters And Equalizers (AREA)
Abstract
(57)【要約】
【目的】 耐電磁波特性を向上させ、且つ制約のある実
装スペース内におさまり組立性が良く、部品点数の少な
い低コストの車載用電子装置を提供すること。
【構成】 車載用電子装置において、コネクタピン3b
とバイパスコンデンサ4とを包囲するように導電性ケー
ス1a内に配設した導電性壁部材1fと、実装基板2a
面上に壁部材1fと協同してコネクタピン3bとバイパ
スコンデンサ4とを包囲する収納領域を形成する導体パ
ターン領域2fとを設け、壁部材1fと導電体パターン
領域2fとを導電性ケース1aと同電位とする。また、
バイパスコンデンサ4に替えL−Cフィルタを用いる。
(57) [Abstract] [Purpose] To provide a low-cost in-vehicle electronic device which has improved electromagnetic wave resistance, is easily assembled in a restricted mounting space, and has a small number of parts. [Constitution] In a vehicle-mounted electronic device, a connector pin 3b
A conductive wall member 1f disposed in the conductive case 1a so as to surround the bypass capacitor 4 and the bypass capacitor 4, and a mounting substrate 2a.
A conductor pattern region 2f forming a storage region surrounding the connector pin 3b and the bypass capacitor 4 in cooperation with the wall member 1f is provided on the surface, and the wall member 1f and the conductor pattern region 2f are connected to the conductive case 1a. Set to the same potential. Also,
An LC filter is used instead of the bypass capacitor 4.
Description
【0001】[0001]
本考案は車載用電子装置に関し、特に電波障害対策を施した車載用電子装置に 関するものである。 The present invention relates to a vehicle-mounted electronic device, and more particularly to a vehicle-mounted electronic device provided with measures against radio interference.
【0002】[0002]
従来、この種の車載用電子装置としては、例えば、特公昭63−23018号 公報に開示されたものが知られている。 Conventionally, as this type of vehicle-mounted electronic device, for example, one disclosed in Japanese Patent Publication No. 63-23018 is known.
【0003】 図6はこのような従来の車載用電子装置の一例を示す分解斜視図である。図6 において、導電性ケース1a及びふた1bはともにアルミニウムや鉄等の電気導 電材料により作られている。3bはコネクタハウジング3aに貫挿するように設 けられたコネクタピンであって、一方の側は導電性ケース1a内に包囲して収納 されるプリント基板2a上のスルーホール3cに接続される。バイパスコンデン サ4は、その一端がコネクタピン3bに銅箔パターン3dを介して接続されてい る。FIG. 6 is an exploded perspective view showing an example of such a conventional vehicle-mounted electronic device. In FIG. 6, both the conductive case 1a and the lid 1b are made of an electrically conductive material such as aluminum or iron. Reference numeral 3b denotes a connector pin provided so as to be inserted into the connector housing 3a, and one side thereof is connected to a through hole 3c on the printed circuit board 2a which is enclosed and housed in the conductive case 1a. One end of the bypass capacitor 4 is connected to the connector pin 3b via the copper foil pattern 3d.
【0004】 また、プリント基板2a上には銅箔パターン3eが図に示すように銅箔パター ン3dに接近するように延在して設けられており、バイパス用コンデンサ4の他 方の端子が接続される。このパターン3eはプリント基板取り付け用ネジ1cに より導電性ケース1aへ電気的に導通するように接続される。A copper foil pattern 3e is provided on the printed circuit board 2a so as to extend close to the copper foil pattern 3d as shown in the figure, and the other terminal of the bypass capacitor 4 is provided. Connected. The pattern 3e is electrically connected to the conductive case 1a by a printed board mounting screw 1c.
【0005】 このような構成において、導電性ケース1aの外から照射された電磁波は高周 波となりコネクタピン3bを通して導電性ケース1a内に入り込み、バイパス用 コンデンサ4およびパターン3eを通して導電性ケース1aへと流れる。したが ってプリント基板2a上に搭載された電子素子2b,2c等からなる電子回路に は高周波電流が流れ込まず、電子回路の誤動作を防ぐことができる。In such a configuration, the electromagnetic wave emitted from the outside of the conductive case 1a becomes a high frequency wave, enters the conductive case 1a through the connector pin 3b, and enters the conductive case 1a through the bypass capacitor 4 and the pattern 3e. Flows. Therefore, the high frequency current does not flow into the electronic circuit including the electronic elements 2b and 2c mounted on the printed circuit board 2a, and the malfunction of the electronic circuit can be prevented.
【0006】[0006]
図7は図6に示す従来の車載用電子装置の耐電磁波特性を示す図である。図7 において、横軸は周波数を、縦軸は電界強度(耐電磁波特性)を示す。図7から 明らかなように40ワット出力をもつ電磁波が照射された場合、ある周波数帯域 において、耐電磁波特性が極端に弱い周波数帯があることが判明した。 FIG. 7 is a diagram showing electromagnetic wave resistance of the conventional vehicle-mounted electronic device shown in FIG. In FIG. 7, the horizontal axis represents frequency and the vertical axis represents electric field strength (electromagnetic wave resistance characteristic). As is clear from FIG. 7, when an electromagnetic wave having an output of 40 watts was irradiated, it was found that there was a frequency band in which the electromagnetic wave resistance was extremely weak in a certain frequency band.
【0007】 上記のように耐電磁波特性が極端に弱い周波数帯があると、この周波数帯にお いて車載電子装置内の電子回路が誤動作するという問題があった。このような点 から車載用としての使用環境を考慮すると、更に技術的に耐電磁波特性の優れた 車載用電子装置を開発する必要性に迫られている。If there is a frequency band in which the electromagnetic wave resistance is extremely weak as described above, there is a problem that the electronic circuit in the vehicle-mounted electronic device malfunctions in this frequency band. From this point of view, considering the use environment for in-vehicle use, there is an urgent need to develop an in-vehicle electronic device that is technically excellent in electromagnetic wave resistance.
【0008】 本考案は上述した耐電磁波特性が従来の車載用電子装置では、満足できないと いう問題点を改善するためになされたもので、耐電磁波特性を向上させ、且つ制 約のある実装スペース内におさまり組立性が良く、しかも部品点数の少ない低コ ストの車載用電子装置を提供することを目的とする。The present invention has been made in order to solve the problem that the above-mentioned electromagnetic wave resistance characteristics cannot be satisfied by the conventional in-vehicle electronic device. Therefore, the electromagnetic wave resistance characteristics are improved and the mounting space is restricted. It is an object of the present invention to provide a low-cost electronic device for automobiles, which is housed inside and has a good assembling property and a small number of parts.
【0009】[0009]
上記課題を解決するため本考案は、図1に示すような、電子回路を実装した実 装基板2aと、実装基板2aを包囲して収納する導電性ケース1aと、電子回路 と導電性ケース1aの外部との信号伝送を行うために導電性ケース1aの外部へ 引き出されたコネクタピン3bと、一端がコネクタピンに接続され他端が実装基 板上2aの導電部材であって導電性ケース1aに接続されているもの3eに接続 され、且つコネクタピン3bの引出口近傍に位置するように実装基板2aに搭載 されたバイパスコンデンサ4とを具備してなる車載用電子装置において、 (1)コネクタピン3bとバイパスコンデンサ4とを包囲するように導電性ケ ース1a内に配設した導電性壁部材1fと、導電性壁部材1fに接する実装基板 2a面上に導電性壁部材1fと協同してコネクタピン3bとバイパスコンデンサ 4とを包囲する収納領域を形成する導電体パターン領域2fとを設け、壁部材1 fと導電体パターン領域2fとを導電性ケース1aと同電位とすることを特徴と する。 In order to solve the above problems, the present invention provides a mounting board 2a on which an electronic circuit is mounted, a conductive case 1a surrounding and housing the mounting board 2a, an electronic circuit and a conductive case 1a, as shown in FIG. And a connector pin 3b pulled out to the outside of the conductive case 1a for transmitting signals to and from the outside of the conductive case 1a, and a conductive member of one end connected to the connector pin and the other end on the mounting substrate 2a which is the conductive case 1a. An on-vehicle electronic device, which is connected to the device 3e connected to, and is equipped with a bypass capacitor 4 mounted on the mounting substrate 2a so as to be located in the vicinity of the outlet of the connector pin 3b. A conductive wall member 1f arranged in the conductive case 1a so as to surround the pin 3b and the bypass capacitor 4, and a conductive wall member on the surface of the mounting substrate 2a in contact with the conductive wall member 1f. A conductor pattern region 2f forming a storage region surrounding the connector pin 3b and the bypass capacitor 4 in cooperation with f is provided, and the wall member 1f and the conductor pattern region 2f are set to the same potential as the conductive case 1a. It is characterized by doing.
【0010】 (2)また、バイパスコンデンサ4に替え図4に示すように第1及び第2のコ イル素子5a,5cとコンデンサ素子5bを具備し、第1及び第2のコイル素子 の一端を互いに接続し、該接続部にコンデンサ素子5bの一端を接続してなるL −Cフィルタ5を用い、L−Cフィルタ5の第1のコイル素子5aの他端をコネ クタピンの一端が接続されている電子回路に接続すると共に、第2のコイル素子 5cの他端を該コネクタピン3bの該一端に接続し、更にコンデンサ素子5bの 他端を実装基板上の導電部材であって導電性ケース1aに接続されているもの3 eに接続することを特徴とする。(2) Further, instead of the bypass capacitor 4, as shown in FIG. 4, first and second coil elements 5a and 5c and a capacitor element 5b are provided, and one end of each of the first and second coil elements is An L-C filter 5 is used, which is connected to each other and one end of a capacitor element 5b is connected to the connection portion. One end of a connector pin is connected to the other end of the first coil element 5a of the L-C filter 5. The second coil element 5c, the other end of the second coil element 5c is connected to the one end of the connector pin 3b, and the other end of the capacitor element 5b is a conductive member on the mounting board, which is the conductive case 1a. It is characterized in that it is connected to one 3e connected to.
【0011】[0011]
上記(1)の考案ではコネクタピン3bとバイパスコンデンサ4とが導電性ケ ース1aと同電位の導電性壁部材1fで取り囲まれているので、電子装置のコネ クタピン3bを介して入出力線路に誘起された高周波電流は、このバイパスコン デンサ4と導電性壁部材1fを通して、導電性ケース1aへバイパスされるため 、後に詳述するように従来の構造の車載用電子装置に比べて高周波電流のバイパ ス効果、即ち耐電磁波特性が向上する。 In the invention of (1) above, the connector pin 3b and the bypass capacitor 4 are surrounded by the conductive wall member 1f having the same potential as the conductive case 1a, so that the input / output line is connected via the connector pin 3b of the electronic device. Since the high frequency current induced in the electric field is bypassed to the conductive case 1a through the bypass capacitor 4 and the conductive wall member 1f, the high frequency current is higher than that of the vehicle-mounted electronic device having the conventional structure as described later. Bypass effect, that is, electromagnetic wave resistance is improved.
【0012】 また、(2)の考案ではバイパスコンデンサに替えL−Cフィルタ5を用いる ことにより、電子装置のコネクタピン3bを介して入出力線路に誘起された高周 波電流は、後に詳述するようにL−Cフィルタ5のコンデンサ素子5bを通して 、導電性ケース1aへバイパスされるため、後に詳述するように従来の構造の車 載用電子装置に比べて高周波電流のバイパス効果、即ち耐電磁波特性が向上する 。Further, in the invention of (2), by using the LC filter 5 instead of the bypass capacitor, the high frequency current induced in the input / output line via the connector pin 3b of the electronic device will be described in detail later. As described above, since it is bypassed to the conductive case 1a through the capacitor element 5b of the LC filter 5, the bypass effect of the high-frequency current, that is, the resistance to high-frequency current is improved as compared with the vehicle-mounted electronic device having the conventional structure, as will be described later. The electromagnetic wave characteristics are improved.
【0013】 また、(2)の考案では後に詳述するように(1)の考案のようにコネクタピ ン3bとバイパスコンデンサ4とが導電性ケース1aと導電位の導電性壁部材1 fで取り囲まれていなくとも、(1)の考案よりも優れた耐電磁波特性を示すの で、導電性壁部材1fが不要となり、(1)の考案よりも構造が簡単になる。Further, in the invention of (2), as described in detail later, as in the invention of (1), the connector pin 3b and the bypass capacitor 4 are surrounded by the conductive case 1a and the conductive wall member 1f of the conductive level. Even if it is not provided, since the electromagnetic wave resistance characteristic is superior to that of the invention of (1), the conductive wall member 1f is unnecessary, and the structure is simpler than that of the invention of (1).
【0014】[0014]
以下本考案の実施例を図面を用いて説明する。 〔実施例1〕 図1は請求項1記載の考案の車載用電子装置の一例を示す分解斜視図である。 図1において、図6の従来の車載用電子装置の構成部分と同一部分には同一符号 を付し、その詳細説明は省略する。 An embodiment of the present invention will be described below with reference to the drawings. [Embodiment 1] FIG. 1 is an exploded perspective view showing an example of a vehicle-mounted electronic device according to the first aspect of the invention. In FIG. 1, the same components as those of the conventional vehicle-mounted electronic device of FIG. 6 are designated by the same reference numerals, and detailed description thereof will be omitted.
【0015】 図1の車載用電子装置では、高周波電流のバイパスコンデンサ4にブロックコ ンデンサを使用することにより実装スペースを小さくしている。該ブロックコン デンサであるバイパスコンデンサ4は共通端子4aをプリント基板2aの固定用 のネジ取り付け部2eへパターン3eで接続することにより、導電性ケース1a に電気的に接続できるようになっている。その他の端子4bはパターンで3d及 びスルーホール3cを介してコネクタピン3bのそれぞれの端子に接続する。バ イパスコンデンサ4はコネクタピン3bに接近してプリント基板2a上に搭載さ れる。コネクタピン3bとバイパスコンデンサ4とは共に導電性ケース1a内に これを仕切るように設けられた導電性壁部材1fで包囲されて収容されている。In the vehicle-mounted electronic device of FIG. 1, the mounting space is reduced by using a block capacitor for the bypass capacitor 4 for high frequency current. The bypass capacitor 4, which is the block capacitor, can be electrically connected to the conductive case 1a by connecting the common terminal 4a to the fixing screw mounting portion 2e of the printed circuit board 2a by the pattern 3e. The other terminals 4b are connected to the respective terminals of the connector pin 3b through a pattern 3d and through holes 3c. The bypass capacitor 4 is mounted on the printed board 2a close to the connector pin 3b. Both the connector pin 3b and the bypass capacitor 4 are enclosed and housed in the conductive case 1a by a conductive wall member 1f provided so as to partition the same.
【0016】 一方この導電性壁部材1fに囲まれたプリント基板2aのコネクタピン3bに 接する面にパターン領域2fに導電性ケースに接するパターンを設けている。即 ち、図1の点線の斜線を施した部分の裏面にスルーホール3cの部分を除いて全 面銅箔パターンとして残し、これをパターン領域2fとして用いる。On the other hand, a pattern contacting the conductive case is provided in the pattern region 2f on the surface of the printed circuit board 2a that is surrounded by the conductive wall member 1f and that contacts the connector pins 3b. Immediately, a copper foil pattern except the through hole 3c is left on the back surface of the hatched portion of FIG. 1 and used as the pattern area 2f.
【0017】 このような構成とすることにより、コネクタピン3bとバイパスコンデンサ4 とは導電性ケース1a内に設けられた導電性壁部材1fとパターン領域2fから なる収納領域に収納されることになる。With such a configuration, the connector pin 3b and the bypass capacitor 4 are housed in the housing area composed of the conductive wall member 1f and the pattern area 2f provided in the conductive case 1a. ..
【0018】 上記構成の車載用電子装置において、コネクタピン3bを介して入出力線路に 誘起された高周波電流は、このバイパスコンデンサ4と導電性壁部材1fを通し て、導電性ケース1aへバイパスされるため、図6に示す従来構造の車載用電子 装置に比べて高周波電流のバイパス効果、即ち耐電磁波特性が向上する。In the vehicle-mounted electronic device having the above structure, the high frequency current induced in the input / output line through the connector pin 3b is bypassed to the conductive case 1a through the bypass capacitor 4 and the conductive wall member 1f. Therefore, as compared with the vehicle-mounted electronic device having the conventional structure shown in FIG. 6, the bypass effect of the high frequency current, that is, the electromagnetic wave resistance is improved.
【0019】 図2は図1の車載用電子装置の耐電磁波特性を示す図である。図2と図7とを 比較して明らかなように本車載用電子装置は、図6に示す従来構造の車載用電子 装置よりその耐電磁波特性が向上していることが分かる。なお、図2において横 軸は周波数を、縦軸は電界強度(耐電磁波特性)を示す。FIG. 2 is a diagram showing the electromagnetic wave resistance of the vehicle-mounted electronic device of FIG. As is clear from comparison between FIG. 2 and FIG. 7, it can be seen that this vehicle-mounted electronic device has improved electromagnetic wave resistance characteristics as compared with the vehicle-mounted electronic device of the conventional structure shown in FIG. In FIG. 2, the horizontal axis represents frequency and the vertical axis represents electric field strength (electromagnetic wave resistance).
【0020】 〔実施例2〕 図3は請求項2記載の考案の車載用電子装置の一例を示す分解斜視図である。 図3において、図1及び図6の車載用電子装置の構成部分と同一部分には同一符 号を付し、その詳細説明は省略する。Second Embodiment FIG. 3 is an exploded perspective view showing an example of a vehicle-mounted electronic device according to the second aspect of the invention. In FIG. 3, the same parts as those of the vehicle-mounted electronic device of FIGS. 1 and 6 are designated by the same reference numerals, and detailed description thereof will be omitted.
【0021】 図3の車載用電子装置と図1の車載用電子装置と主なる相違点は、図3の車載 用電子装置はバイパスコンデンサ4に替えL−Cフィルタ5を用いている点及び 導電性ケース1a内に設けられた導電性壁部材1fが設けられていない点である 。L−Cフィルタ5は図4にその等価回路を示すように第1のコイル素子5a及 び第2のコイル素子5cとコンデンサ素子5bを具備し、第1のコイル素子5a と第2のコイル素子5cのそれぞれの一端を互いに接続し、該接続部にコンデン サ素子5bの一端を接続してなる。このL−Cフィルタ5をコネクタピン3bの 本数だけ(図3では3個)設けている。The main difference between the on-vehicle electronic device of FIG. 3 and the on-vehicle electronic device of FIG. 1 is that the on-vehicle electronic device of FIG. 3 uses the LC filter 5 instead of the bypass capacitor 4 and the conductivity. That is, the conductive wall member 1f provided in the flexible case 1a is not provided. The LC filter 5 includes a first coil element 5a, a second coil element 5c and a capacitor element 5b as shown in the equivalent circuit of FIG. 4, and the first coil element 5a and the second coil element 5a are included. One ends of the capacitors 5c are connected to each other, and one end of the capacitor element 5b is connected to the connecting portion. The LC filters 5 are provided by the number of connector pins 3b (three in FIG. 3).
【0022】 そして、図3に示すように複数個のL−Cフィルタ5の第1のコイル素子5a の他端5atはそれぞれコネクタピン3bで信号伝送を行う電子回路にスルーホ ール3c等を介して接続すると共に、第2のコイル素子5cの他端5ctはそれ ぞれスルーホール3c及びパターン3dを介してコネクタピン3bに接続し、更 にコンデンサ素子5bの他端5btはプリント基板2a上の共通のパターン3e に接続する。該パターン3eはプリント基板2aに固定するためのネジ1c及び 取り付け穴3fを介して導電性ケース1aに接続してアースされている。なお、 パターン3dは極力短く形成されている。Then, as shown in FIG. 3, the other ends 5at of the first coil elements 5a of the plurality of LC filters 5 are respectively connected to electronic circuits for transmitting signals by the connector pins 3b through through holes 3c and the like. The other end 5ct of the second coil element 5c is connected to the connector pin 3b through the through hole 3c and the pattern 3d, and the other end 5bt of the capacitor element 5b is on the printed circuit board 2a. Connect to the common pattern 3e. The pattern 3e is connected to the conductive case 1a via a screw 1c for fixing to the printed board 2a and a mounting hole 3f and is grounded. The pattern 3d is formed as short as possible.
【0023】 上記構成の車載用電子装置において、コネクタピン3bを介して入出力線路に 誘起された高周波電流は、L−Cフィルタ5のコンデンサ素子5bを通って導電 性ケース1aへバイパスされるから、図6に示す従来の構造の車載用電子装置に 比べて高周波電流のバイパス効果、即ち耐電磁波特性が向上する。In the vehicle-mounted electronic device having the above configuration, the high frequency current induced in the input / output line via the connector pin 3b is bypassed to the conductive case 1a through the capacitor element 5b of the LC filter 5. As compared with the vehicle-mounted electronic device having the conventional structure shown in FIG. 6, the bypass effect of the high frequency current, that is, the electromagnetic wave resistance is improved.
【0024】 図5は図3の車載用電子装置の耐電磁波特性を示す図である。図5と図7とを 比較して明らかなように本車載用電子装置は、従来構造の車載用電子装置よりそ の耐電磁波特性が向上していることが分かる。また、図5と図2とを比較して明 らかなように本車載用電子装置は図1の車載用電子装置よりその耐電磁波特性が 向上していることが分かる。なお、図5において横軸は周波数を、縦軸は電界強 度(耐電磁波特性)を示す。FIG. 5 is a diagram showing the electromagnetic wave resistance of the vehicle-mounted electronic device of FIG. As is clear from comparison between FIG. 5 and FIG. 7, it can be seen that the in-vehicle electronic device of the present invention has improved electromagnetic wave resistance characteristics as compared with the in-vehicle electronic device of the conventional structure. Further, as is clear from comparison between FIG. 5 and FIG. 2, it can be seen that this vehicle-mounted electronic device has improved electromagnetic wave resistance characteristics as compared with the vehicle-mounted electronic device of FIG. In FIG. 5, the horizontal axis represents frequency and the vertical axis represents electric field strength (electromagnetic wave resistance).
【0025】 また、図5は図3の車載用電子装置は図1の車載用電子装置のようにコネクタ ピン3bとバイパスコンデンサ4とが導電性ケース1aと同電位の導電性壁部材 1fで取り囲まれていなくとも、図1の車載用電子装置よりも優れた耐電磁波特 性を示すので、導電性壁部材1fが不要となり、構造がより簡単となる。5 is similar to the vehicle-mounted electronic device of FIG. 1, the connector pin 3b and the bypass capacitor 4 are surrounded by the conductive wall member 1f having the same potential as the conductive case 1a. Even if it is not provided, since the electromagnetic wave resistance is superior to that of the vehicle-mounted electronic device of FIG. 1, the conductive wall member 1f is unnecessary and the structure becomes simpler.
【0026】[0026]
(1)以上実施例に基づいて説明したように本願の請求項1の考案によれば、 コネクタピンとバイパスコンデンサとを導電性壁部材により包囲するように収納 領域を導電性ケースの中に設けるため、電子装置の入出力線路に誘起された高周 波電流が電子回路の中に入り混む前にこの収納領域の導電性壁部材を通って導電 性ケースにバイパスされるため、耐電磁波特性が向上する。 (1) According to the invention of claim 1 of the present application as described above based on the embodiments, the housing area is provided in the conductive case so that the connector pin and the bypass capacitor are surrounded by the conductive wall member. , The high frequency current induced in the input / output line of the electronic device is bypassed to the conductive case through the conductive wall member in this storage area before it gets into the electronic circuit, and thus the electromagnetic wave resistance is improved. To do.
【0027】 (2)また、コネクタ及びバイパスコンデンサを囲む収納領域はケースがダイ カスト製である場合には、一体成形でできるため組立性能も良く、余分な部品点 数も増やすことなくコスト的にも有利な車載用電子装置を実現できる。(2) Further, when the case is made of die-cast, the housing area surrounding the connector and the bypass capacitor can be integrally molded, so that the assembling performance is good, and the number of extra parts is not increased and the cost is reduced. Can realize an advantageous on-vehicle electronic device.
【0028】 (3)本願の請求項2の考案によれば、バイパスコンデンサに替えL−Cフィ ルタを用いることにより、電子装置のコネクタピンを介して入出力線路に誘起さ れた高周波電流は、L−Cフィルタ5のコンデンサ素子5bを通して、導電性ケ ースへバイパスされるため、耐電磁波特性が大幅に向上する。(3) According to the invention of claim 2 of the present application, by using the LC filter instead of the bypass capacitor, the high frequency current induced in the input / output line via the connector pin of the electronic device is , By bypassing to the conductive case through the capacitor element 5b of the LC filter 5, the electromagnetic wave resistance is significantly improved.
【0029】 (4)また、請求項2の考案では請求項1の考案のようにコネクタピン3bと バイパスコンデンサとが導電性ケースと同電位の導電性壁部材で取り囲まれてい なくとも、請求項1の考案よりも優れた耐電磁波特性を示すので、導電性壁部材 が不要となり、構造がより簡単になる。(4) According to the invention of claim 2, even when the connector pin 3b and the bypass capacitor are not surrounded by the conductive wall member having the same potential as the conductive case as in the invention of claim 1, Since the electromagnetic wave resistance is superior to that of the first invention, the conductive wall member is unnecessary and the structure becomes simpler.
【図1】本請求項1記載の考案の実施例に係る車載用電
子装置の分解斜視図である。FIG. 1 is an exploded perspective view of a vehicle-mounted electronic device according to an embodiment of the present invention.
【図2】図1の車載用電子装置の耐電磁波特性を示す図
である。FIG. 2 is a diagram showing electromagnetic wave resistance of the vehicle-mounted electronic device of FIG.
【図3】本請求項2記載の考案の実施例に係る車載用電
子装置の分解斜視図である。FIG. 3 is an exploded perspective view of an in-vehicle electronic device according to an embodiment of the present invention.
【図4】L−Cフィルタ5の等価回路を示す図である。FIG. 4 is a diagram showing an equivalent circuit of an LC filter 5.
【図5】図3の車載用電子装置の耐電磁波特性を示す図
である。5 is a diagram showing electromagnetic wave resistance characteristics of the vehicle-mounted electronic device of FIG.
【図6】従来の車載用電子装置の分解斜視図である。FIG. 6 is an exploded perspective view of a conventional vehicle-mounted electronic device.
【図7】図6の車載用電子装置の耐電磁波特性を示す図
である。FIG. 7 is a diagram showing electromagnetic wave resistance characteristics of the vehicle-mounted electronic device of FIG.
1a 導電性ケース 1b ふた 1c 取り付けネジ 1d 取り付けネジ 1e 取り付けネジ 1f 導電性壁部材 2a プリント基板 2b 電子素子 2c 電子素子 3a コネクタハウジング 3b コネクタピン 3c スルーホール 3d パターン 3e パターン 3f 取り付け穴 4 バイパスコンデンサ 5 L−Cフィルタ 5a コイル素子 5b コンデンサ素子 5c コイル素子 1a conductive case 1b lid 1c mounting screw 1d mounting screw 1e mounting screw 1f conductive wall member 2a printed circuit board 2b electronic element 2c electronic element 3a connector housing 3b connector pin 3c through hole 3d pattern 3e pattern 3f mounting hole 4 bypass capacitor 5 L -C filter 5a coil element 5b capacitor element 5c coil element
Claims (2)
基板を包囲して収納する導電性ケースと、前記電子回路
と前記導電性ケースの外部との信号伝送を行うために前
記導電性ケースの外部へ引き出されたコネクタピンと、
一端が前記コネクタピンに接続され他端が前記実装基板
上の導電部材であって前記導電性ケースに接続されてい
るものに接続され、且つ前記コネクタピンの引出口近傍
に位置するように前記実装基板に搭載されたバイパスコ
ンデンサとを具備してなる車載用電子装置において、 前記コネクタピンと前記バイパスコンデンサとを包囲す
るように前記導電性ケース内に配設した導電性壁部材
と、 該導電性壁部材に接する前記実装基板面上に前記導電性
壁部材と協同して前記コネクタピンと前記バイパスコン
デンサとを包囲する収納領域を形成する導電体パターン
領域とを設け、 前記導電体壁部材と前記導電体パターン領域とを前記導
電性ケースと同電位とすることを特徴とする車載用電子
装置。1. A mounting board on which an electronic circuit is mounted, a conductive case surrounding and housing the mounting board, and the conductive case for performing signal transmission between the electronic circuit and the outside of the conductive case. With the connector pin pulled out of the
The one end is connected to the connector pin and the other end is connected to a conductive member on the mounting board, which is connected to the conductive case, and the mounting is performed so as to be located in the vicinity of the outlet of the connector pin. In a vehicle-mounted electronic device comprising a bypass capacitor mounted on a substrate, a conductive wall member disposed in the conductive case so as to surround the connector pin and the bypass capacitor, and the conductive wall. A conductor pattern region forming a storage region surrounding the connector pin and the bypass capacitor in cooperation with the conductive wall member is provided on the surface of the mounting substrate in contact with the member, and the conductor wall member and the conductor are provided. An in-vehicle electronic device, wherein the pattern region and the conductive case have the same potential.
基板を包囲して収納する導電性ケースと、前記電子回路
と前記導電性ケースの外部との信号伝送を行うために前
記導電性ケースの外部へ引き出されたコネクタピンと、
一端が前記コネクタピンに接続され他端が前記実装基板
上の導電部材であって前記導電性ケースに接続されてい
るものに接続され、且つ前記コネクタピンの引出口近傍
に位置するように前記実装基板に搭載されたバイパスコ
ンデンサとを具備してなる車載用電子装置において、 前記バイパスコンデンサに替え第1及び第2のコイル素
子とコンデンサ素子を具備し、該第1及び第2のコイル
素子の一端を互いに接続し、該接続部にコンデンサ素子
の一端を接続してなるL−Cフィルタを用い、該L−C
フィルタの第1のコイル素子の他端を前記コネクタピン
の一端が接続されていた電子回路に接続すると共に、第
2のコイル素子の他端を該コネクタピンの該一端に接続
し、更にコンデンサ素子の他端を前記実装基板上の導電
部材であって前記導電性ケースに接続されているものに
接続することを特徴とする車載用電子装置。2. A mounting board on which an electronic circuit is mounted, a conductive case surrounding and housing the mounting board, and the conductive case for transmitting signals between the electronic circuit and the outside of the conductive case. With the connector pin pulled out of the
The one end is connected to the connector pin and the other end is connected to a conductive member on the mounting board, which is connected to the conductive case, and the mounting is performed so as to be located in the vicinity of the outlet of the connector pin. An on-vehicle electronic device comprising a bypass capacitor mounted on a substrate, comprising first and second coil elements and a capacitor element in place of the bypass capacitor, and one end of the first and second coil elements. Are connected to each other, and one end of a capacitor element is connected to the connection part.
The other end of the first coil element of the filter is connected to the electronic circuit to which one end of the connector pin is connected, the other end of the second coil element is connected to the one end of the connector pin, and the capacitor element is further connected. The other end is connected to a conductive member on the mounting board, which is connected to the conductive case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3735392U JPH0531337U (en) | 1991-08-05 | 1992-05-07 | In-vehicle electronic device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3-69205 | 1991-08-05 | ||
| JP6920591 | 1991-08-05 | ||
| JP3735392U JPH0531337U (en) | 1991-08-05 | 1992-05-07 | In-vehicle electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0531337U true JPH0531337U (en) | 1993-04-23 |
Family
ID=26376491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3735392U Pending JPH0531337U (en) | 1991-08-05 | 1992-05-07 | In-vehicle electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0531337U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023271A (en) * | 2001-03-21 | 2003-01-24 | Siemens Ag | Electronic equipment |
| JP2014103166A (en) * | 2012-11-16 | 2014-06-05 | Shindengen Electric Mfg Co Ltd | Electronic circuit unit |
| JP2015091076A (en) * | 2013-11-07 | 2015-05-11 | 三菱電機株式会社 | Electronic component module and mounting method thereof |
| JP2017175064A (en) * | 2016-03-25 | 2017-09-28 | 株式会社デンソー | Electronic device and its manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5760267U (en) * | 1980-09-25 | 1982-04-09 | ||
| JPS6096911A (en) * | 1983-10-31 | 1985-05-30 | Nippon Denso Co Ltd | High frequency filter for electronic device |
| JPH01266800A (en) * | 1988-04-18 | 1989-10-24 | Matsushita Electric Ind Co Ltd | Radio frequency electronic equipment |
-
1992
- 1992-05-07 JP JP3735392U patent/JPH0531337U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5760267U (en) * | 1980-09-25 | 1982-04-09 | ||
| JPS6096911A (en) * | 1983-10-31 | 1985-05-30 | Nippon Denso Co Ltd | High frequency filter for electronic device |
| JPH01266800A (en) * | 1988-04-18 | 1989-10-24 | Matsushita Electric Ind Co Ltd | Radio frequency electronic equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023271A (en) * | 2001-03-21 | 2003-01-24 | Siemens Ag | Electronic equipment |
| JP2014103166A (en) * | 2012-11-16 | 2014-06-05 | Shindengen Electric Mfg Co Ltd | Electronic circuit unit |
| JP2015091076A (en) * | 2013-11-07 | 2015-05-11 | 三菱電機株式会社 | Electronic component module and mounting method thereof |
| JP2017175064A (en) * | 2016-03-25 | 2017-09-28 | 株式会社デンソー | Electronic device and its manufacturing method |
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