JPH05325468A - Method for attaching magnetic plate to disk substrate - Google Patents

Method for attaching magnetic plate to disk substrate

Info

Publication number
JPH05325468A
JPH05325468A JP4157306A JP15730692A JPH05325468A JP H05325468 A JPH05325468 A JP H05325468A JP 4157306 A JP4157306 A JP 4157306A JP 15730692 A JP15730692 A JP 15730692A JP H05325468 A JPH05325468 A JP H05325468A
Authority
JP
Japan
Prior art keywords
magnetic plate
disk substrate
disk
substrate
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4157306A
Other languages
Japanese (ja)
Inventor
Daiki Kobayashi
大樹 小林
Hiromichi Takano
博通 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP4157306A priority Critical patent/JPH05325468A/en
Priority to EP19930303837 priority patent/EP0572153B1/en
Priority to DE69319663T priority patent/DE69319663T2/en
Priority to AT93303837T priority patent/ATE168492T1/en
Publication of JPH05325468A publication Critical patent/JPH05325468A/en
Priority to US08/390,436 priority patent/US5572509A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5344Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially annular, i.e. of finite length, e.g. joining flanges to tube ends
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • B29C65/0609Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding characterised by the movement of the parts to be joined
    • B29C65/0618Linear
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • B29C65/0609Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding characterised by the movement of the parts to be joined
    • B29C65/0627Angular, i.e. torsional
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B29C65/081Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations having a component of vibration not perpendicular to the welding surface
    • B29C65/082Angular, i.e. torsional ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/567Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using a tamping or a swaging operation, i.e. at least partially deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
    • B29C65/568Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits using a tamping or a swaging operation, i.e. at least partially deforming the edge or the rim of a first part to be joined to clamp a second part to be joined using a swaging operation, i.e. totally deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841Holding or clamping means for handling purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/61Joining from or joining on the inside
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/135Single hemmed joints, i.e. one of the parts to be joined being hemmed in the joint area
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/737Articles provided with holes, e.g. grids, sieves

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)

Abstract

PURPOSE:To house and hold a magnetic plate on a disk substrate with a fixed clearance in a loosely fitted state. CONSTITUTION:In a state where the magnetic plate 5 is arranged in a magnetic plate housing recessed part 6 provided in the center of the disk substrate 2, a horn 17 which generates torsional vibration is allowed to abut on so as to form a projecting part 19 which projects toward the inner side of the recessed part 6 from the periphery of the recessed part 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光ディスクや光磁気デ
ィスク等の如く所望の情報信号が記録される情報信号記
録ディスクを構成するディスク基板に配設される磁性板
の取付け方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a magnetic plate disposed on a disk substrate which constitutes an information signal recording disk for recording desired information signals such as an optical disk and a magneto-optical disk.

【0002】[0002]

【従来の技術】従来、光ディスクや光磁気ディスクの如
く所望の情報信号が記録される情報信号記録用のディス
クが提案されている。この種のディスクは、情報信号の
高密度記録が可能であるので、極めて小径のものが提案
されている。例えば、直径を略64mmとなし、楽音信
号で略74分の記録を可能となす光ディスク或いは光磁
気ディスクが提案されている。
2. Description of the Related Art Conventionally, discs for recording information signals, such as optical discs and magneto-optical discs, on which desired information signals are recorded have been proposed. This type of disc is capable of high density recording of information signals, so that a disc having an extremely small diameter has been proposed. For example, there has been proposed an optical disk or a magneto-optical disk having a diameter of about 64 mm and capable of recording a music signal for about 74 minutes.

【0003】このように小径であって、情報信号の高密
度記録が可能となされた光磁気ディスクは、ディスク回
転駆動装置に装着されて高速で回転操作される。そし
て、高速で回転駆動された状態で、光磁気ディスクの一
主面に形成された信号記録層に設けられた微細な記録ト
ラックに、光学ピックアップ装置から出射される光ビー
ムを照射するとともに、磁界ヘッド等の外部磁界発生装
置から記録すべき情報信号に応じて磁界変調された外部
磁界を印加することによって所望の情報信号の記録が行
われる。
The magneto-optical disk having such a small diameter and capable of high-density recording of information signals is mounted on a disk rotation driving device and rotated at a high speed. Then, while being driven to rotate at a high speed, a fine recording track provided on the signal recording layer formed on one main surface of the magneto-optical disk is irradiated with a light beam emitted from the optical pickup device, and a magnetic field is generated. A desired information signal is recorded by applying an external magnetic field that is magnetic field modulated according to the information signal to be recorded from an external magnetic field generator such as a head.

【0004】このように高速で回転駆動されながら微細
な記録トラックに光ビームを正確に照射するためには、
光磁気ディスクは、ディスク回転駆動装置のディスクテ
ーブルに確実に一体化されるとともに上記ディスクテー
ブルの軸心に回転中心を高精度に位置決めして装着され
る必要がある。かかる目的を達成するために、従来にお
いては、光磁気ディスク側に磁性材料からなる金属板を
配設し、これをディスクテーブル側に設けたマグネット
で吸引することにより、上記光磁気ディスクをディスク
テーブル上にチャッキングするようにしたディスク装着
方式が提案されている。
In order to accurately irradiate a fine recording track with a light beam while being rotationally driven at such a high speed,
The magneto-optical disk is required to be securely integrated with the disk table of the disk rotation driving device and to be mounted with the rotation center positioned with high accuracy on the axis of the disk table. In order to achieve such an object, conventionally, a metal plate made of a magnetic material is arranged on the side of the magneto-optical disk, and this is attracted by a magnet provided on the side of the disk table. A disk mounting method has been proposed in which the disk is chucked upward.

【0005】このマグネットの吸引力を利用したマグネ
ットチャッキング方式に用いられる光磁気ディスクは、
図9に示すように、透明なポリカーボネート樹脂等の合
成樹脂を円盤形状に成形して形成されたディスク基板5
1を備えている。このディスク基板51の一方の主面5
1a側には、所望の情報信号が記録される情報信号記録
層が形成されている。そして、上記ディスク基板51
は、情報信号記録層が形成される一方の主面51aと対
向する他方の主面51bを情報信号の書込み読出し面と
なし、この書込み読出し面側から信号記録層に光ビーム
を照射することによって所望の情報信号の記録或いは再
生が行われる。
The magneto-optical disk used in the magnet chucking system utilizing the attractive force of this magnet is
As shown in FIG. 9, a disk substrate 5 formed by molding a transparent synthetic resin such as a polycarbonate resin into a disc shape.
1 is provided. One main surface 5 of the disk substrate 51
An information signal recording layer on which a desired information signal is recorded is formed on the 1a side. Then, the disc substrate 51
Defines the other main surface 51b opposite to the one main surface 51a on which the information signal recording layer is formed as an information signal writing / reading surface, and irradiates the signal recording layer with a light beam from this writing / reading surface side. Recording or reproduction of a desired information signal is performed.

【0006】また、上記ディスク基板51の中央部に
は、ディスク回転駆動装置側に配設されるセンタリング
部材が係合するセンター孔52が穿設されている。さら
に、上記ディスク基板51の一方の主面51a側の中央
部には、金属材料よりなる円盤状をなす磁性板53が上
記センター孔52を閉塞するように配設されている。か
かる磁性板53は、上記ディスク基板51の一方の主面
51a側にセンター孔52を囲んで形成された磁性板収
納凹部54に嵌合するように配設されている。そして、
この磁性板収納凹部54に配設された磁性板53は、当
該磁性板収納凹部54の周縁部が超音波加工されること
により当該凹部54の内方に向かって突出形成される突
出部55によって、上記ディスク基板51に対し収納保
持されるようになっている。
A center hole 52 is formed in the center of the disk substrate 51 so that a centering member provided on the disk rotation drive side can engage with the center hole 52. Further, a disk-shaped magnetic plate 53 made of a metallic material is disposed in the center of the one main surface 51a side of the disk substrate 51 so as to close the center hole 52. The magnetic plate 53 is arranged so as to fit into a magnetic plate storage recess 54 formed on the one main surface 51a side of the disk substrate 51 so as to surround the center hole 52. And
The magnetic plate 53 disposed in the magnetic plate storage recess 54 is formed by the protrusion 55 that is formed so as to project inward of the recess 54 by ultrasonically processing the peripheral edge of the magnetic plate storage recess 54. The disc substrate 51 is housed and held.

【0007】ところで、上記磁性板53のディスク基板
51への取付けは、次のようにして行われている。先
ず、図9に示すように、ディスク基板51をディスク受
台56に位置決めして載置する。上記ディスク受台56
は、ディスク基板51に設けられた磁性板収納凹部54
の外周に突設される突出部59を内部に収納して当該デ
ィスク基板51を位置決めするディスク受け部57を有
し、当該突出部59を該ディスク受け部57に収納する
ことによって、上記ディスク基板51を位置決めするよ
うになっている。
The attachment of the magnetic plate 53 to the disk substrate 51 is performed as follows. First, as shown in FIG. 9, the disc substrate 51 is positioned and placed on the disc receiving base 56. The disk support 56
Is a magnetic plate storage recess 54 provided on the disk substrate 51.
Has a disc receiving portion 57 for accommodating the disc substrate 51 by accommodating a projecting portion 59 projecting on the outer periphery of the disc substrate, and by accommodating the projecting portion 59 in the disc receiving portion 57, 51 is positioned.

【0008】次に、上記ディスク受け部57に載置され
たディスク基板51の磁性板収納凹部54の開口周縁部
にホーン58を当接させ、図示しない超音波発振器から
の超音波振動をこのホーン58に伝達せしめる。このと
き印加する超音波振動は、ディスク基板2の主面2aと
平行な方向,つまり超音波横振動とする。この結果、上
記磁性板収納凹部54のホーン58が接している部分が
摩擦熱で溶け、当該開口周縁部の樹脂が上記凹部54の
内方に張り出して突出部55が形成される。これによ
り、上記磁性板53が上記磁性板収納凹部54内に遊嵌
状態で収納保持されることになる。なお、スウェージン
グは、ディスク基板51から磁性板53が脱落しないよ
うに、上記磁性板収納凹部54の数個所、例えば4ヵ所
に設ける。
Next, a horn 58 is brought into contact with the opening peripheral edge of the magnetic plate accommodating concave portion 54 of the disc substrate 51 placed on the disc receiving portion 57, and ultrasonic vibration from an ultrasonic oscillator (not shown) is applied to this horn. 58. The ultrasonic vibration applied at this time is a direction parallel to the main surface 2a of the disk substrate 2, that is, ultrasonic transverse vibration. As a result, the portion of the magnetic plate housing recess 54 in contact with the horn 58 is melted by frictional heat, and the resin at the peripheral edge of the opening protrudes inward of the recess 54 to form the protrusion 55. As a result, the magnetic plate 53 is housed and held in the magnetic plate housing recess 54 in a loosely fitted state. It should be noted that swaging is provided at several places, for example, four places, of the magnetic plate accommodating recess 54 so that the magnetic plate 53 does not fall off from the disk substrate 51.

【0009】[0009]

【発明が解決しようとする課題】ところが、上記超音波
横振動においては、ディスク基板51の厚さ方向への伝
播が少ないために、上記磁性板5の脱落を防止する突出
部55の厚みを比較的高精度に制御できるという利点を
有するものの、一回の作業で多くても2ヵ所しかスウェ
ージングでなきいという欠点がある。したがって、タク
トタイムの増大による生産性の劣化、並びに数個所に設
けられる突出部55の強度不足が発生する。
However, in the ultrasonic transverse vibration, since the propagation of the disk substrate 51 in the thickness direction is small, the thickness of the protrusion 55 for preventing the magnetic plate 5 from falling is compared. Although it has an advantage that it can be controlled with extremely high precision, it has a drawback that swaging can be performed in only two places at most in one operation. Therefore, the productivity is deteriorated due to the increase in the takt time, and the strength of the protruding portions 55 provided at several places is insufficient.

【0010】このため、さらに従来においては、図10
に示すように、ディスク基板51の主面51aに対して
垂直に円柱状をなすホーン58を当接させ、かかるホー
ン58に縦振動を印加することが行われている。かかる
超音波縦振動では、一度のスウェージングにより磁性板
収納凹部54の周縁全周に亘って円環状の突出部55を
形成することができるため、タクトタイムの面で非常に
生産性が良い。
For this reason, as shown in FIG.
As shown in FIG. 3, a columnar horn 58 is brought into contact with the main surface 51a of the disk substrate 51 perpendicularly, and a longitudinal vibration is applied to the horn 58. With such ultrasonic longitudinal vibration, since the annular protrusion 55 can be formed over the entire circumference of the magnetic plate accommodating recess 54 by one swaging, productivity is very good in terms of tact time.

【0011】しかしながら、ディスク基板51に対して
垂直な方向の振動であるために、図11に示す突出部5
5の厚みTを制御することは非常に困難で、磁性板53
がディスク基板51に対して固定されやすい。磁性板5
3がディスク基板51に固定されると、これら金属材料
よりなる磁性板58と合成樹脂よりなるディスク基板5
1の熱膨張係数の差からディスク基板51が変形する虞
れがある。この結果、ディスク基板51に複屈折が生
じ、光学特性の劣化により、情報信号の書込み或いは読
出し不良が生ずる虞れがある。
However, since the vibration is in the direction perpendicular to the disk substrate 51, the protrusion 5 shown in FIG.
It is very difficult to control the thickness T of the magnetic plate 53.
Are easily fixed to the disc substrate 51. Magnetic plate 5
When 3 is fixed to the disk substrate 51, the magnetic plate 58 made of these metal materials and the disk substrate 5 made of synthetic resin
The disk substrate 51 may be deformed due to the difference in thermal expansion coefficient of 1. As a result, birefringence occurs in the disk substrate 51, and there is a risk that writing or reading of an information signal may be defective due to deterioration of optical characteristics.

【0012】そこで本発明は、上述の技術的な課題に鑑
みて提案されたものであって、磁性板をディスク基板に
対して一定したクリアランスを持って遊嵌状態に収納保
持させることができるとともに、一度にスウェージング
可能となす生産性に優れたディスク基板に対する磁性板
の取付け方法を提供することを目的とする。
Therefore, the present invention has been proposed in view of the above technical problem, and the magnetic plate can be housed and held in a loosely fitted state with a fixed clearance with respect to the disk substrate. An object of the present invention is to provide a method of attaching a magnetic plate to a disk substrate, which enables swaging at one time and is excellent in productivity.

【0013】[0013]

【課題を解決するための手段】上述の目的を達成するた
めに、本発明方法は、磁性板をディスク基板のセンター
に設けられる磁性板収納凹部に配した状態で、ねじり振
動を発生する超音波発生手段を上記磁性板収納凹部の周
縁に当接させることによって、上記磁性板収納凹部の周
縁より当該凹部の内方に向かって突出する突出部を形成
し、この突出部により上記磁性板をディスク基板に取付
けることを特徴とするものである。
In order to achieve the above-mentioned object, the method of the present invention is an ultrasonic wave which generates a torsional vibration in a state where a magnetic plate is arranged in a magnetic plate accommodating recess provided in the center of a disk substrate. By bringing the generating means into contact with the peripheral edge of the magnetic plate accommodating recess, a protrusion is formed that protrudes inward from the peripheral edge of the magnetic plate accommodating recess, and the magnetic plate is disc-shaped by the protrusion. It is characterized by being attached to a substrate.

【0014】このときに印加する超音波振動の周波数
は、15kHz〜50kHzとする。また、ディスク基
板をディスク押さえ手段によって押さえ込んだ状態でス
ウェージングする。
The frequency of the ultrasonic vibration applied at this time is set to 15 kHz to 50 kHz. In addition, the disk substrate is swaged while being pressed by the disk pressing means.

【0015】さらに本発明方法は、磁性板をディスク基
板のセンターに設けられる磁性板収納凹部に配した状態
で、先端に段差部が設けられたホーンを有してなる超音
波発生手段を上記磁性板収納凹部の周縁に当接させるこ
とによって、上記磁性板収納凹部の周縁より当該凹部の
内方に向かって突出する突出部を形成し、この突出部に
より上記磁性板をディスク基板に取付けることを特徴と
するものである。
Further, in the method of the present invention, the ultrasonic wave generating means having a horn having a stepped portion at the tip thereof is arranged in the state where the magnetic plate is disposed in the magnetic plate accommodating concave portion provided at the center of the disk substrate. By abutting against the peripheral edge of the plate accommodating recess, a protrusion protruding from the peripheral edge of the magnetic plate accommodating recess toward the inside of the recess is formed, and the magnetic plate is attached to the disk substrate by this protrusion. It is a feature.

【0016】[0016]

【作用】本発明に係る方法においては、ディスク基板の
センターに設けられた磁性板収納凹部に磁性板を配した
状態で、この磁性板収納凹部の周縁にねじり振動を発生
する超音波発生手段を当接させると、上記ねじり振動に
よる摩擦熱で当該磁性板収納凹部の周縁が溶け出し、こ
の磁性板収納凹部の内周側に円環状に張り出す突出部が
形成される。また、超音波発生手段がディスク基板に当
接する前に、ディスク押さえ手段がディスク基板を押さ
え込み、当該ディスク基板を固定するため、正確なスウ
ェージングが行える。
In the method according to the present invention, the ultrasonic wave generating means for generating the torsional vibration at the peripheral edge of the magnetic plate accommodating recess is provided with the magnetic plate disposed in the magnetic plate accommodating recess provided in the center of the disk substrate. When brought into contact with each other, the peripheral edge of the magnetic plate accommodating recess is melted by the frictional heat due to the torsional vibration, and an annular projecting portion is formed on the inner peripheral side of the magnetic plate accommodating recess. Further, before the ultrasonic wave generating means comes into contact with the disk substrate, the disk holding means holds down the disk substrate and fixes the disk substrate, so that accurate swaging can be performed.

【0017】さらに、本発明においては、超音波発生手
段を構成するホーンの先端に段差部が設けられているの
で、ねじり振動により溶け出した樹脂のディスク基板か
らの飛び出しがこの段差部によって規制される。
Further, in the present invention, since the step portion is provided at the tip of the horn constituting the ultrasonic wave generating means, the step portion prevents the resin melted by the torsional vibration from jumping out from the disk substrate. It

【0018】[0018]

【実施例】以下、本発明を適用した具体的な実施例につ
いて図面を参照しながら詳細に説明する。なお、本実施
例は、本発明を、直径を64mmとなす光磁気ディスク
に適用した例である。先ず、本発明が適用される光磁気
ディスクについて説明する。かかる光磁気ディスク1
は、図1に示すように、透過性を有するポリカーボネー
ト樹脂等の合成樹脂材料を一体成形して形成されるディ
スク基板2を備えてなる。このディスク基板2は、直径
を略64mmとなし、厚さを略1.2mmの円盤状に形
成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described in detail below with reference to the drawings. The present embodiment is an example in which the present invention is applied to a magneto-optical disk having a diameter of 64 mm. First, a magneto-optical disk to which the present invention is applied will be described. Such a magneto-optical disk 1
As shown in FIG. 1, the disk substrate 2 is formed by integrally molding a transparent synthetic resin material such as a polycarbonate resin. The disc substrate 2 has a diameter of about 64 mm and is formed in a disk shape with a thickness of about 1.2 mm.

【0019】このディスク基板2を用いて構成された光
磁気ディスク1は、上記ディスク基板2の一方の主面2
a側に所望の情報信号が記録される情報信号記録層が形
成されてなる信号記録部を有してなり、これと反対側の
他方の主面2bを情報信号の書込み読出し面となすとと
もに、この書込み読出し面側から上記信号記録層に光ビ
ームを照射することによって前記情報信号の記録再生が
行われるように構成されている。
A magneto-optical disc 1 constructed by using this disc substrate 2 is one main surface 2 of the disc substrate 2.
It has a signal recording part formed with an information signal recording layer for recording a desired information signal on the a side, and the other main surface 2b on the opposite side is used as a writing / reading surface of the information signal, and The information signal is recorded / reproduced by irradiating the signal recording layer with a light beam from the writing / reading surface side.

【0020】この光磁気ディスク1を構成するディスク
基板2の中央部には、図2に示すように、記録再生装置
内に配設されるディスク回転駆動装置を構成するディス
クテーブルの中心部に配設されたセンタリング部材(図
示は省略する。)が係合するセンター孔3が穿設されて
いる。このセンター孔3は、円形の孔としてディスク基
板2を貫通して穿設され、上記信号記録層に同心円状又
は螺旋状に形成される記録トラックの曲率中心に、この
センター孔3の中心を一致させるように形成されてい
る。
As shown in FIG. 2, the central portion of the disc substrate 2 constituting the magneto-optical disc 1 is arranged at the central portion of the disc table constituting the disc rotation driving device arranged in the recording / reproducing apparatus. A center hole 3 is formed in which a provided centering member (not shown) is engaged. The center hole 3 is formed as a circular hole penetrating the disk substrate 2, and the center of the center hole 3 coincides with the center of curvature of a recording track formed concentrically or spirally on the signal recording layer. It is formed to let.

【0021】また、上記ディスク基板2の他方の主面2
b側の中央部には、上記センター孔3を囲んで、円環状
の突出部4が一体的に形成されている。この突出部4
は、肉厚の薄いディスク基板2に穿設されるセンター孔
3の深さを深くすることなく、この光磁気ディスク1が
装着されるディスクテーブル側に配設されるセンタリン
グ部材の上記センター孔3に対する突出量を大きくな
し、上記光磁気ディスク1の回転中心を上記ディスクテ
ーブルの軸心に一致させて装着させるセンタリング操作
を確実に行わせるように機能するものである。さらに、
この突出部4の先端面4aは、上記ディスクテーブルへ
の装着基準面として機能する。
The other main surface 2 of the disk substrate 2
An annular projecting portion 4 is integrally formed in the center portion on the b side so as to surround the center hole 3. This protrusion 4
The center hole 3 of the centering member arranged on the side of the disk table on which the magneto-optical disk 1 is mounted, without increasing the depth of the center hole 3 formed in the thin disk substrate 2. The amount of protrusion with respect to is increased, and the centering operation for mounting the magneto-optical disk 1 with the rotation center of the magneto-optical disk 1 aligned with the axis of the disk table is performed reliably. further,
The tip surface 4a of the protruding portion 4 functions as a reference surface for mounting on the disc table.

【0022】また、上記突出部4は、少なくともディス
ク基板2の内周側の信号記録層が形成されない非信号記
録領域内において形成され、ディスク基板2の厚さに略
等しい突出量を持って突出形成されている。したがっ
て、ディスク基板2の突出部4が形成された部分は、基
板本体部に比し約2倍の厚さとなされている。
The projecting portion 4 is formed at least in the non-signal recording area on the inner peripheral side of the disk substrate 2 where the signal recording layer is not formed, and projects with a projection amount substantially equal to the thickness of the disk substrate 2. Has been formed. Therefore, the portion of the disk substrate 2 on which the protruding portion 4 is formed is about twice as thick as the substrate body portion.

【0023】そして、上記ディスク基板2の一方の主面
2a側の中央部には、センター孔3を囲んでマグネット
吸引用の磁性板5が配設される円環状をなす磁性板収納
凹部6が形成されている。この磁性板収納凹部6は、上
記突出部4の外周径より小径であって、ディスク基板2
の厚さに略等しい深さに形成されてなる。また、この磁
性板収納凹部6の開口内周径は、上記センター孔3の開
口径より大きくなされている。したがって、この磁性板
収納凹部6の底部には、円環状をなす平坦面6aが設け
られる。この平坦面6aが上記磁性板5を載置する載置
面となる。
At the center of the one main surface 2a side of the disk substrate 2, there is formed an annular magnetic plate accommodating recess 6 which surrounds the center hole 3 and is provided with a magnetic plate 5 for attracting magnets. Has been formed. The magnetic plate accommodating recess 6 has a diameter smaller than the outer peripheral diameter of the protrusion 4, and the disk substrate 2
Is formed to a depth approximately equal to the thickness of. Further, the inner diameter of the opening of the magnetic plate housing recess 6 is larger than the diameter of the center hole 3. Therefore, an annular flat surface 6a is provided at the bottom of the magnetic plate storage recess 6. The flat surface 6a serves as a mounting surface on which the magnetic plate 5 is mounted.

【0024】一方、上記磁性板収納凹部6に収納保持さ
れる磁性板5は、例えばステンレス板等の金属材料を円
盤状に打ち抜き加工することにより形成されるものであ
る。かかる磁性板5は、上記磁性板収納凹部6に収納さ
れるに足る大きさの円盤として形成されるとともに、こ
の磁性板収納凹部6に収納保持されたときに、その外周
面5aが当該磁性板収納凹部6の内周壁6bと接触しな
いような大きさに形成されている。また、この磁性板5
の中心部には、製造工程上ハンドリングするために使用
される小さな円形の孔7が穿設されている。
On the other hand, the magnetic plate 5 accommodated and held in the magnetic plate accommodating recess 6 is formed by punching a metal material such as a stainless plate into a disc shape. The magnetic plate 5 is formed as a disk having a size large enough to be stored in the magnetic plate storage recess 6, and when the magnetic plate 5 is stored and held in the magnetic plate storage recess 6, the outer peripheral surface 5a thereof is the magnetic plate. It is formed in such a size that it does not come into contact with the inner peripheral wall 6b of the storage recess 6. Also, this magnetic plate 5
A small circular hole 7 used for handling in the manufacturing process is formed in the center of the.

【0025】そして、上述のようにして形成された磁性
板5は、次に述べる超音波発生手段を備えた取付け装置
によって上記ディスク基板2に対して取付けられてい
る。かかる取付け装置は、図3に示すように、ディスク
基板2を載置するディスク載置手段であるディスク基板
支持テーブル8と、ディスク基板2に超音波を印加する
超音波発生手段である超音波発生機構部9とから構成さ
れている。
The magnetic plate 5 formed as described above is attached to the disk substrate 2 by an attaching device having an ultrasonic wave generating means described below. As shown in FIG. 3, such a mounting device includes a disk substrate supporting table 8 which is a disk mounting means for mounting the disk substrate 2 and an ultrasonic wave generating means which is an ultrasonic wave generating means for applying an ultrasonic wave to the disk substrate 2. It is composed of a mechanical section 9.

【0026】上記ディスク基板支持テーブル8は、載置
されたディスク基板2を位置決めし得るように構成され
てなるものであって、平板状をなす支持テーブル本体1
0の上面側に、該ディスク基板2を位置決め載置させる
ためのディスク基板載置テーブル11を備えている。か
かるディスク基板載置テーブル11は、図4に示すよう
に、中央部にディスク基板2の突出部4を遊嵌状態に嵌
合させる突出部嵌合凹部13を有した円盤体として形成
されている。上記突出部嵌合凹部13は、上記ディスク
基板2の突出部4を内部に収容し得るに足る円環状をな
す凹みとして形成され、該突出部4を収納したときにそ
の内周壁13aと当該突出部4の外周面4bとの間に若
干の隙間が開くようになっている。したがって、上記デ
ィスク基板2は、そのセンターに設けられる突出部4が
上記突出部嵌合凹部13に嵌合することによって上記デ
ィスク基板載置テーブル11に位置決めされることにな
る。
The disc substrate support table 8 is constructed so as to position the placed disc substrate 2, and the support table body 1 has a flat plate shape.
On the upper surface side of 0, a disk substrate mounting table 11 for positioning and mounting the disk substrate 2 is provided. As shown in FIG. 4, the disc substrate mounting table 11 is formed as a disc body having a protrusion fitting concave portion 13 for fitting the protrusion 4 of the disc substrate 2 in a loosely fitted state in the central portion. .. The protrusion fitting recess 13 is formed as an annular recess sufficient to accommodate the protrusion 4 of the disk substrate 2 therein, and when the protrusion 4 is accommodated, the inner peripheral wall 13a and the protrusion 13a. A slight gap is opened between the outer peripheral surface 4b of the portion 4. Therefore, the disc substrate 2 is positioned on the disc substrate mounting table 11 by fitting the protrusion 4 provided at the center of the disc substrate 2 into the protrusion fitting recess 13.

【0027】このディスク基板2が位置決めされた状態
では、上記突出部嵌合凹部13の底面13bに該ディス
ク基板2の突出部4の先端面4aが支持され、ディスク
基板載置テーブル11の円環状をなす上端面11aに該
ディスク基板2の情報信号の書込み読出し面となる主面
2bが支持される。なお、上記のように構成されたディ
スク基板支持テーブル8には、上記ディスク基板載置テ
ーブル11上に載置したディスク基板2を確実に固定す
るために、真空ポンプを用いて真空吸引する吸引機構
(図示は省略する。)が設けられている。
In the state where the disc substrate 2 is positioned, the tip end surface 4a of the protrusion 4 of the disc substrate 2 is supported by the bottom surface 13b of the protrusion fitting recess 13, and the annular shape of the disc substrate mounting table 11 is formed. The main surface 2b which serves as the information signal writing / reading surface of the disk substrate 2 is supported on the upper end surface 11a. A suction mechanism for vacuum-sucking the disk substrate supporting table 8 configured as described above using a vacuum pump in order to securely fix the disk substrate 2 mounted on the disk substrate mounting table 11. (Not shown).

【0028】一方、超音波発生機構部9は、図3に示す
ように、主として超音波発振器から発生せしめられる電
気エネルギーを機械振動に変換する超音波振動子15
と、この超音波振動子15の機械振動を増幅するコーン
16と、その増幅された機械振動を被加工物に伝播する
円柱状をなすホーン17とから構成されている。これら
超音波振動子15及びコーン16並びにホーン17は、
その順序で縦一列に一体化されてなり、エアシリンダ1
8によって、ディスク基板2に対して上下動するように
なされている。また、上記ディスク基板支持テーブル8
と超音波発振器との間には制御盤が設けられ、上記ディ
スク基板2に対するホーン17の加圧力及び振幅量並び
にスウェージング深さが制御されるようになっている。
On the other hand, as shown in FIG. 3, the ultrasonic wave generation mechanism section 9 has an ultrasonic vibrator 15 which mainly converts electric energy generated from an ultrasonic oscillator into mechanical vibration.
And a cone 16 for amplifying the mechanical vibration of the ultrasonic transducer 15 and a horn 17 having a columnar shape for propagating the amplified mechanical vibration to the workpiece. These ultrasonic transducer 15, cone 16 and horn 17 are
In that order, the air cylinders 1 are integrated in a vertical line.
By means of 8, the disk substrate 2 can be moved up and down. In addition, the disk substrate support table 8
A control panel is provided between the ultrasonic wave oscillator and the ultrasonic oscillator to control the pressing force and amplitude of the horn 17 with respect to the disk substrate 2 and the swaging depth.

【0029】そして、特に本実施例では、上記ホーン1
7の先端に段差部12が設けられている。上記段差部1
2は、ディスク基板2の磁性板収納凹部6の周縁をスウ
ェージングする溶着部14の外周縁より外方に張り出し
て設けられ、スウェージング時にこの溶着部14の回り
から溶け出す樹脂の飛び出しを規制する役目をする。な
お、上記溶着部14は、磁性板収納凹部6の周縁をスウ
ェージングするに足る大きさの円柱体として形成されて
いる。
In particular, in this embodiment, the horn 1 is used.
A step portion 12 is provided at the tip of 7. The step 1
2 is provided so as to project outward from the outer peripheral edge of the welded portion 14 that swages the peripheral edge of the magnetic plate housing recess 6 of the disk substrate 2, and restricts the protrusion of the resin that melts around the welded portion 14 during swaging. Play a role. The welded portion 14 is formed as a columnar body having a size sufficient for swaging the peripheral edge of the magnetic plate housing recess 6.

【0030】また、上記超音波発生機構部9には、ディ
スク基板載置テーブル11上に載置したディスク基板2
を確実に固定するためのディスク押さえ手段20が設け
られている。上記ディスク押さえ手段20は、ディスク
基板2を直接上から押さえて当該ディスク基板2を固定
するディスク押さえ部21と、このディスク押さえ部2
1を支持する支持アーム22とから構成されている。
Further, the ultrasonic wave generating mechanism section 9 has a disk substrate 2 mounted on a disk substrate mounting table 11.
A disc holding means 20 for securely fixing the disc is provided. The disc holding means 20 holds a disc substrate 2 directly from above and fixes the disc substrate 2, and a disc holding portion 21.
1 and a support arm 22 that supports the unit 1.

【0031】上記ディスク押さえ部21は、上記ディス
ク基板載置テーブル11の外径寸法と略同じ外径寸法と
されたリングとして形成され、その円環状をなす平坦面
とされるディスク押さえ面21aによって、上記ディス
ク基板2の主面2aを面接触状態で支持するようになっ
ている。また、このディスク押さえ部21は、上記ディ
スク基板2に形成される情報信号記録層にかからない位
置を押さえるようになされており、当該情報信号記録層
を保護するようになっている。一方、支持アーム22
は、上記ディスク押さえ部21に一体的に設けられ、こ
のディスク押さえ部21をディスク基板2に対して上下
動させるようになっている。
The disk pressing portion 21 is formed as a ring having an outer diameter substantially the same as the outer diameter of the disk substrate mounting table 11, and the disk pressing surface 21a is an annular flat surface. The main surface 2a of the disk substrate 2 is supported in a surface contact state. Further, the disc pressing portion 21 is adapted to press a position which does not cover the information signal recording layer formed on the disc substrate 2, and protects the information signal recording layer. On the other hand, the support arm 22
Are provided integrally with the disc holding portion 21 and are configured to move the disc holding portion 21 up and down with respect to the disc substrate 2.

【0032】上記のように構成された取付け装置を用い
て磁性板5をディスク基板2に遊嵌状態に保持せしめる
には、次のようにして行う。先ず、図4に示すように、
ディスク基板2をディスク基板載置テーブル11上に載
置する。すなわち、ディスク基板載置テーブル11に設
けられた突出部嵌合凹部13内に、ディスク基板2の突
出部4を収納保持させる。これにより、ディスク基板2
のディスク基板載置テーブル11に対する装着位置が決
まる。
In order to hold the magnetic plate 5 on the disk substrate 2 in a loosely fitted state by using the mounting device constructed as described above, the procedure is as follows. First, as shown in FIG.
The disc substrate 2 is placed on the disc substrate placing table 11. That is, the protruding portion 4 of the disk substrate 2 is housed and held in the protruding portion fitting concave portion 13 provided in the disk substrate mounting table 11. As a result, the disk substrate 2
The mounting position for the disk substrate mounting table 11 is determined.

【0033】しかる後、ディスク基板載置テーブル11
に内蔵される吸引機構を動作させて、上記ディスク基板
2を真空吸引により当該ディスク基板載置テーブル11
上に固定せしめる。
After that, the disk substrate mounting table 11
By operating a suction mechanism built in the disk substrate 2 by vacuum suction, the disk substrate mounting table 11
Fix it on top.

【0034】次に、上記ディスク基板2の磁性板収納凹
部6内に磁性板5を投入する。この結果、磁性板5は、
図4に示すように上記突出部嵌合凹部13の底面13a
に面接触状態で保持される。次に、ディスク押さえ手段
20を下降せしめ、ディスク基板載置テーブル11上に
載置されるディスク基板2に当接させる。そして、この
ディスク押さえ手段20のディスク押さえ部21に所定
の圧力を加え、上記ディスク基板2をディスク基板載置
テーブル11上に確実に固定せしめる。
Next, the magnetic plate 5 is put into the magnetic plate housing recess 6 of the disk substrate 2. As a result, the magnetic plate 5 is
As shown in FIG. 4, the bottom surface 13a of the protrusion fitting recess 13
Are held in surface contact with each other. Next, the disc holding means 20 is lowered and brought into contact with the disc substrate 2 placed on the disc substrate placing table 11. Then, a predetermined pressure is applied to the disc pressing portion 21 of the disc pressing means 20 to securely fix the disc substrate 2 on the disc substrate mounting table 11.

【0035】しかる後、上記エアシリンダ18によって
ホーン17を下降させ、図5に示すように、その先端の
溶着部14をディスク基板2の情報信号記録層が形成さ
れてなる一主面2aにおける磁性板収納凹部6の開口周
縁部に当接させる。次いで、エアシリンダ18によって
所定の加圧力Fをディスク基板2に与えた状態で、当該
ディスク基板2にねじり振動を印加する。
Thereafter, the horn 17 is lowered by the air cylinder 18, and as shown in FIG. 5, the welded portion 14 at the tip of the horn 17 is magnetized on the one main surface 2a of the disk substrate 2 on which the information signal recording layer is formed. The plate storage recess 6 is brought into contact with the peripheral edge of the opening. Next, a torsional vibration is applied to the disk substrate 2 with a predetermined pressure F being applied to the disk substrate 2 by the air cylinder 18.

【0036】ここに言うねじり振動は、ホーン17の軸
心Oをセンターとして当該ホーン17を時計回り方向と
反時計回り方向に交互に切り換えて平面的に回転させる
ことにより生ずる振動を指す。また、ここで印加するね
じり振動の周波数は、後述する磁性板5のディスク基板
2からの脱落を防止する突出部19の厚みの制御性を考
慮し、15kHz〜50kHzの範囲とする。中でも、
20kHzがより好ましい。また、ねじり振動の振幅
は、ディスク基板2の材料によって多少異なるが、20
μm〜70μmの範囲が好ましい。本実施例では、70
μmとした。
The torsional vibration referred to here means a vibration generated by alternately switching the horn 17 in the clockwise direction and the counterclockwise direction about the axis O of the horn 17 as a center and rotating the horn 17 in a plane. Further, the frequency of the torsional vibration applied here is set in the range of 15 kHz to 50 kHz in consideration of the controllability of the thickness of the protrusion 19 that prevents the magnetic plate 5 from falling off from the disk substrate 2 described later. Above all,
20 kHz is more preferable. The amplitude of the torsional vibration is slightly different depending on the material of the disc substrate 2,
The range of μm to 70 μm is preferable. In this embodiment, 70
μm.

【0037】すると、図6に示すように、ホーン17が
接触された磁性板収納凹部6の開口周縁部が摩擦熱によ
って溶け出す。その溶け出した樹脂23のうち一部は、
図7に示すように、ホーン17の溶着部14の外周囲か
ら外に向かって飛び出そうとするが、該ホーン17には
段差部12が設けられるため、その段差部12の段差面
によって樹脂23の飛び出しが抑えられる。また、ディ
スク基板2の主面2aから飛び出る樹脂23の高さを規
制することができる。樹脂23の高さが大きいと、光磁
気ディスク1をディスクカートリッジに収納したとき
に、カートリッジの内壁面に当該樹脂23が接触し、光
磁気ディスク1のセンタリング等に悪影響を与える。し
かしながら、本実施例では、溶着部14の周縁より飛び
出す樹脂23の高さを規制できるため、ディスクカート
リッジに収納しても何ら問題はない。
Then, as shown in FIG. 6, the peripheral edge of the opening of the magnetic plate accommodating recess 6 with which the horn 17 is in contact melts out by frictional heat. Part of the melted resin 23 is
As shown in FIG. 7, an attempt is made to pop out from the outer periphery of the welded portion 14 of the horn 17, but since the step portion 12 is provided on the horn 17, the resin 23 is formed by the step surface of the step portion 12. Can be suppressed. Further, the height of the resin 23 protruding from the main surface 2a of the disc substrate 2 can be regulated. When the height of the resin 23 is large, when the magneto-optical disk 1 is housed in a disk cartridge, the resin 23 comes into contact with the inner wall surface of the cartridge, which adversely affects the centering of the magneto-optical disk 1. However, in this embodiment, since the height of the resin 23 protruding from the peripheral edge of the welded portion 14 can be regulated, there is no problem even if it is stored in the disk cartridge.

【0038】そして、さらにねじり振動を印加すると、
図7に示すように、上記磁性板収納凹部6の開口周縁部
が、当該ホーン17の溶着部14の大きさに対応して凹
所を形成するようにして上記磁性板収納凹部6の内周側
へ張り出す。この結果、上記磁性板収納凹部6の開口周
縁部に、当該磁性板収納凹部6の内周側へ張り出してな
る突出部19が形成される。かかる突出部19は、磁性
板収納凹部6内に収納配置された磁性板5の外周縁部5
aを覆う形で円環状に突出形成され、上記磁性板5のデ
ィスク基板2からの脱落を防止する。また、上記突出部
19は、ねじり振動がディスク基板2の面内方向におけ
るいわゆる横振動に近いものであることから、その厚み
Tは高精度なものとなる。
When torsional vibration is further applied,
As shown in FIG. 7, the inner periphery of the magnetic plate storage recess 6 is formed such that the opening peripheral edge of the magnetic plate storage recess 6 forms a recess corresponding to the size of the welded portion 14 of the horn 17. Stick to the side. As a result, a protrusion 19 is formed on the peripheral edge of the opening of the magnetic plate storage recess 6 so as to project toward the inner peripheral side of the magnetic plate storage recess 6. The projecting portion 19 is formed on the outer peripheral edge portion 5 of the magnetic plate 5 housed in the magnetic plate housing recess 6.
It is formed in an annular shape so as to cover a and prevents the magnetic plate 5 from falling off the disk substrate 2. The thickness T of the protrusion 19 is highly accurate because the torsional vibration is close to so-called lateral vibration in the in-plane direction of the disk substrate 2.

【0039】そして、スウェージング終了後、ホーン1
7並びにディスク押さえ手段20をディスク基板2に対
して上昇せしめ、真空吸引を解除してディスク基板2を
取り出す。この結果、図8に示すように、磁性板5がデ
ィスク基板2に対して遊嵌状態に保持されてなる光磁気
ディスク1が作製される。かかる光磁気ディスク1にお
いては、スウェージングにより形成される突出部19の
厚みを高精度なものとすることができることから、この
突出部19と磁性板収納凹部6に収納されるディスク基
板2との間に一定したクリアランスCを付与することが
できる。つまり、磁性板5を予め設定したクリアランス
Cを持ってディスク基板2に対して遊嵌保持させること
ができることになる。これにより、合成樹脂からなるデ
ィスク基板2と金属材料よりなる磁性板5の熱膨張係数
の差から生ずる上記ディスク基板2の変形を防止するこ
とができる。また、一度のスウェージングで磁性板収納
凹部6の周縁に、突出部19を円環状に形成することが
できるため、タクトタイムの向上並びに強度も向上す
る。
After the swaging is completed, the horn 1
7 and the disc pressing means 20 are raised with respect to the disc substrate 2, the vacuum suction is released, and the disc substrate 2 is taken out. As a result, as shown in FIG. 8, the magneto-optical disk 1 in which the magnetic plate 5 is held in the disk substrate 2 in a loosely fitted state is manufactured. In such a magneto-optical disk 1, since the thickness of the protruding portion 19 formed by swaging can be made highly accurate, the protruding portion 19 and the disk substrate 2 housed in the magnetic plate housing recess 6 are separated from each other. A constant clearance C can be provided between them. That is, the magnetic plate 5 can be loosely fitted and held on the disk substrate 2 with a preset clearance C. As a result, it is possible to prevent the disk substrate 2 from being deformed due to the difference in thermal expansion coefficient between the disk substrate 2 made of synthetic resin and the magnetic plate 5 made of a metal material. Further, since the projecting portion 19 can be formed in an annular shape on the peripheral edge of the magnetic plate accommodating concave portion 6 by one swaging, the tact time is improved and the strength is also improved.

【0040】なお、本実施例では、本発明を光磁気ディ
スクに適用した例を挙げて説明したが、本発明はこの
他、合成樹脂からなるディスク基板を有し、マグネット
チャッキング用の磁性板を有する情報信号記録ディスク
に広く適用できるものである。
In the present embodiment, an example in which the present invention is applied to a magneto-optical disk has been described, but the present invention also has a disk substrate made of synthetic resin and a magnetic plate for magnet chucking. It is widely applicable to information signal recording discs having

【0041】[0041]

【発明の効果】以上の説明からも明らかなように、本発
明の方法においては、磁性板をディスク基板センターに
設けた磁性板収納凹部に配した状態で超音波発生手段を
当該磁性板収納凹部の周縁に当接させ、横振動に近い振
動であるねじり振動を発生させることによりスウェージ
ングを行うため、ディスク基板2の面内方向への張り出
しにより、高精度に厚みが制御された突出部を形成する
ことができる。したがって、このスウェージングにより
形成された突出部とディスク基板との間に一定のクリア
ランスを設けることができ、結果として磁性板を遊嵌状
態で収納保持させることができる。これにより、磁性板
がディスク基板の主面に傾斜して固定的に取付けられて
しまうことを防止できる他、合成樹脂からなるディスク
基板と金属材料からなる磁性板との熱膨張係数の差より
生ずるディスク基板の変形を防止できる。
As is apparent from the above description, in the method of the present invention, the ultrasonic wave generating means is disposed in the magnetic plate accommodating recess provided in the center of the disk substrate, and the ultrasonic wave generating means is disposed in the magnetic plate accommodating recess. Since swaging is performed by bringing the disk substrate 2 into contact with the peripheral edge of the disk substrate and generating a torsional vibration that is a vibration close to a lateral vibration, the protruding portion whose thickness is controlled with high accuracy is formed by the inward projection of the disk substrate 2. Can be formed. Therefore, a certain clearance can be provided between the protrusion formed by this swaging and the disk substrate, and as a result, the magnetic plate can be housed and held in a loosely fitted state. As a result, it is possible to prevent the magnetic plate from being fixedly attached to the main surface of the disk substrate in an inclined manner, and it is caused by the difference in thermal expansion coefficient between the disk substrate made of synthetic resin and the magnetic plate made of a metal material. The deformation of the disk substrate can be prevented.

【0042】また、本発明の方法においては、一度のス
ウェージングで円環状をなす突出部を形成することがで
きるため、タクトタイムを大幅に減少でき、生産性を向
上させることができる。さらには、突出部が円環状とさ
れることから、強度が高まり、磁性板のディスク基板か
らの脱落防止を確実なものとすることができる。
Further, in the method of the present invention, since the annular protrusion can be formed by swaging once, the tact time can be greatly reduced and the productivity can be improved. Further, since the protruding portion is formed into an annular shape, the strength is increased, and the magnetic plate can be reliably prevented from coming off from the disk substrate.

【0043】さらに本発明の方法においては、ホーンの
先端に段差部を設けているので、スウェージング時にホ
ーンの周縁部より溶けて飛び出る樹脂をこの段差部で抑
えることができる。したがって、このディスク基板より
構成される情報信号記録ディスクをディスクカートリッ
ジに収納したときに、上記突起がカートリッジの内壁面
に接触することがない。よって、上記情報信号記録ディ
スクを高精度にセンタリングすることが可能となる。
Further, in the method of the present invention, since the step portion is provided at the tip of the horn, it is possible to suppress the resin that is melted and jumped out from the peripheral portion of the horn at the time of swaging. Therefore, when the information signal recording disk composed of this disk substrate is housed in the disk cartridge, the protrusion does not come into contact with the inner wall surface of the cartridge. Therefore, it is possible to center the information signal recording disk with high accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明が適用される光磁気ディスクの分解斜視
図である。
FIG. 1 is an exploded perspective view of a magneto-optical disk to which the present invention is applied.

【図2】本発明が適用される光磁気ディスクの分解した
状態を示す断面図である。
FIG. 2 is a cross-sectional view showing a disassembled state of a magneto-optical disk to which the present invention is applied.

【図3】本発明を適用した磁性板の取付け装置を示す正
面図である。
FIG. 3 is a front view showing a magnetic plate attachment device to which the present invention is applied.

【図4】ディスク基板に磁性板を投入した状態を示す断
面図である。
FIG. 4 is a cross-sectional view showing a state in which a magnetic plate is placed on the disc substrate.

【図5】ホーンをディスク基板に当接させた状態を示す
断面図である。
FIG. 5 is a cross-sectional view showing a state in which a horn is in contact with a disk substrate.

【図6】スウェージング状態を示す断面図である。FIG. 6 is a cross-sectional view showing a swaging state.

【図7】スウェージング状態の要部拡大断面図である。FIG. 7 is an enlarged cross-sectional view of a main part in a swaging state.

【図8】スウェージング終了後における光磁気ディスク
の断面図である。
FIG. 8 is a cross-sectional view of the magneto-optical disk after swaging is completed.

【図9】横振動を加えてスウェージングする状態を示す
断面図である。
FIG. 9 is a cross-sectional view showing a state of swaging by applying lateral vibration.

【図10】縦振動を加えてスウェージングする状態を示
す断面図である。
FIG. 10 is a cross-sectional view showing a state of swaging by applying vertical vibration.

【図11】縦振動を加えたときのスウェージング状態の
要部拡大断面図である。
FIG. 11 is an enlarged cross-sectional view of a main part in a swaging state when vertical vibration is applied.

【符号の説明】[Explanation of symbols]

1・・・光磁気ディスク 2・・・ディスク基板 3・・・センター孔 5・・・磁性板 6・・・磁性板収納凹部 8・・・ディスク基板支持テーブル 9・・・超音波発生機構部 11・・・ディスク基板載置テーブル 12・・・段差部 14・・・溶着部 15・・・超音波振動子 16・・・コーン 17・・・ホーン 18・・・エアシリンダ 19・・・突出部 20・・・ディスク押さえ手段 21・・・ディスク押さえ部 DESCRIPTION OF SYMBOLS 1 ... Magneto-optical disk 2 ... Disk substrate 3 ... Center hole 5 ... Magnetic plate 6 ... Magnetic plate storage recess 8 ... Disk substrate support table 9 ... Ultrasonic wave generation mechanism part 11 ... Disk substrate mounting table 12 ... Step portion 14 ... Welding portion 15 ... Ultrasonic transducer 16 ... Cone 17 ... Horn 18 ... Air cylinder 19 ... Projection Part 20: Disc holding means 21: Disc holding portion

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 磁性板をディスク基板のセンターに設け
られる磁性板収納凹部に配した状態で、ねじり振動を発
生する超音波発生手段を上記磁性板収納凹部の周縁に当
接させることによって、上記磁性板収納凹部の周縁より
当該凹部の内方に向かって突出する突出部を形成し、こ
の突出部により上記磁性板をディスク基板に取付けるこ
とを特徴とするディスク基板に対する磁性板の取付け方
法。
1. An ultrasonic wave generating means for generating a torsional vibration is brought into contact with a peripheral edge of the magnetic plate storage recess in a state where the magnetic plate is disposed in the magnetic plate storage recess provided in the center of the disk substrate. A method of attaching a magnetic plate to a disk substrate, characterized in that a protrusion is formed to protrude from the peripheral edge of the magnetic plate accommodating recess toward the inside of the recess, and the magnetic plate is attached to the disk substrate by the protrusion.
【請求項2】 超音波振動の周波数が15kHz〜50
kHzであることを特徴とする請求項1記載のディスク
基板に対する磁性板の取付け方法。
2. The frequency of ultrasonic vibration is from 15 kHz to 50 kHz.
The method of attaching a magnetic plate to a disk substrate according to claim 1, wherein the magnetic plate has a frequency of kHz.
【請求項3】 ディスク基板をディスク押さえ手段によ
って押さえ込んだ状態で磁性板をディスク基板に取付け
ることを特徴とする請求項1記載のディスク基板に対す
る磁性板の取付け方法。
3. The method of attaching a magnetic plate to a disc substrate according to claim 1, wherein the magnetic plate is attached to the disc substrate while the disc substrate is being held by the disc holding means.
【請求項4】 磁性板をディスク基板のセンターに設け
られる磁性板収納凹部に配した状態で、先端に段差部が
設けられたホーンを有してなる超音波発生手段を上記磁
性板収納凹部の周縁に当接させることによって、上記磁
性板収納凹部の周縁より当該凹部の内方に向かって突出
する突出部を形成し、この突出部により上記磁性板をデ
ィスク基板に取付けることを特徴とするディスク基板に
対する磁性板の取付け方法。
4. An ultrasonic wave generating means comprising a horn having a stepped portion at a tip thereof in a state where the magnetic plate is arranged in a magnetic plate accommodating recess provided in the center of the disk substrate. A disk characterized by forming a protrusion protruding from the peripheral edge of the magnetic plate accommodating recess toward the inside of the recess by contacting with the peripheral edge, and attaching the magnetic plate to the disk substrate by this protrusion. How to attach a magnetic plate to a substrate.
JP4157306A 1992-05-26 1992-05-26 Method for attaching magnetic plate to disk substrate Pending JPH05325468A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP4157306A JPH05325468A (en) 1992-05-26 1992-05-26 Method for attaching magnetic plate to disk substrate
EP19930303837 EP0572153B1 (en) 1992-05-26 1993-05-18 Method for mounting magnetic plate on a disc substrate
DE69319663T DE69319663T2 (en) 1992-05-26 1993-05-18 Method of mounting a magnetic disk on a disk substrate
AT93303837T ATE168492T1 (en) 1992-05-26 1993-05-18 METHOD FOR FIXING A MAGNETIC PLATE TO A PLATE SUBSTRATE
US08/390,436 US5572509A (en) 1992-05-26 1995-02-16 Method for mounting magnetic plate to disc substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4157306A JPH05325468A (en) 1992-05-26 1992-05-26 Method for attaching magnetic plate to disk substrate

Publications (1)

Publication Number Publication Date
JPH05325468A true JPH05325468A (en) 1993-12-10

Family

ID=15646789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4157306A Pending JPH05325468A (en) 1992-05-26 1992-05-26 Method for attaching magnetic plate to disk substrate

Country Status (1)

Country Link
JP (1) JPH05325468A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022524292A (en) * 2019-02-04 2022-05-02 サフラン・エアクラフト・エンジンズ A method of separating a first machine part from a second machine part.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022524292A (en) * 2019-02-04 2022-05-02 サフラン・エアクラフト・エンジンズ A method of separating a first machine part from a second machine part.

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