JPH0532896B2 - - Google Patents
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- Publication number
- JPH0532896B2 JPH0532896B2 JP2076764A JP7676490A JPH0532896B2 JP H0532896 B2 JPH0532896 B2 JP H0532896B2 JP 2076764 A JP2076764 A JP 2076764A JP 7676490 A JP7676490 A JP 7676490A JP H0532896 B2 JPH0532896 B2 JP H0532896B2
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- 239000000203 mixture Substances 0.000 claims description 85
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 39
- 239000000654 additive Substances 0.000 claims description 33
- 230000000996 additive effect Effects 0.000 claims description 33
- 239000000919 ceramic Substances 0.000 claims description 31
- 229910052573 porcelain Inorganic materials 0.000 claims description 23
- 239000003985 ceramic capacitor Substances 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 17
- 230000001590 oxidative effect Effects 0.000 claims description 13
- 238000010586 diagram Methods 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 6
- 229910052691 Erbium Inorganic materials 0.000 claims description 6
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 6
- 229910052689 Holmium Inorganic materials 0.000 claims description 6
- 229910052706 scandium Inorganic materials 0.000 claims description 6
- 229910052727 yttrium Inorganic materials 0.000 claims description 6
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 17
- 239000011701 zinc Substances 0.000 description 16
- 229910052725 zinc Inorganic materials 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 229910018068 Li 2 O Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 102000005717 Myeloma Proteins Human genes 0.000 description 2
- 108010045503 Myeloma Proteins Proteins 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920006222 acrylic ester polymer Polymers 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000001089 mineralizing effect Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Inorganic Insulating Materials (AREA)
Description
[産業上の利用分野]
本発明は、誘電体磁器層を少なくとも2以上の
内部電極で挟持してなる単層または積層構造の磁
器コンデンサ及びその製造方法に関するものであ
る。
[従来の技術]
従来、積層磁器コンデンサを製造する際には、
誘電体磁器原料粉末から成る未焼結磁器シート
(グリーンシート)に白金又はパラジウム等の貴
金属の導電性ペーストを所望パターンで印刷し、
これを複数枚積み重ねて圧着し、酸化性雰囲気中
において1300℃〜1600℃で焼成させた。
この焼成により、誘電体磁器原料粉末から成る
未焼結磁器シートは誘電体磁器層となり、白金又
はパラジウム等の貴金属の導電性ペーストは内部
電極となる。
上述のように、導電性ペーストとして白金又は
パラジウム等の貴金属を主成分とするものを使用
すれば、酸化性雰囲気中において1300℃〜1600℃
という高温で焼成させても、目的とする内部電極
を得ることができる。
しかし、白金、パラジウム等の貴金属は高価で
あるため、必然的に積層磁器コンデンサがコスト
高になつていた。
上述の問題を解決することができるものとし
て、本件出願人に係わる特公昭61−14607号公報
には、(Bak-xMx)OkTiO2(但し、MはMg及び/
又はZn)から成る基本成分と、Li2O及びSiO2か
ら成る添加成分とを含む誘電体磁器組成物が開示
されている。
また、特公昭61−14608号公報には、上記の特
公昭61−14607号公報記載の誘電体磁器組成物の
Li2O及びSiO2の代りに、Li2O,SiO2及びMO(但
し、MOはBaO,CaO及びSrOから選択された1
種または2種以上の金属酸化物)から成る添加成
分を含む誘電体磁器組成物が開示されている。
また、特公昭61−14609号公報には、(Bak-x-y
MxLy)OkTiO2(但し、MはMg及び/又はZn、
LはSr及び/又はCa)から成る基本成分と、
Li2O及びSiO2から成る添加成分とを含む誘電体
磁器組成物が開示されている。
また、特公昭61−14610号公報には、上記の特
公昭61−14609号公報記載の誘電体磁器組成物に
おけるLi2O及びSiO2の代りに、Li2O,SiO2及び
MO(但し、MOはBaO,CaO及びSrOから選択さ
れた1種または2種以上の金属酸化物)から成る
添加成分を含む誘電体磁器組成物が開示されてい
る。
また、特公昭61−14611号公報には、(Bak-x
Mx)OkTiO2(但し、MはMg,Zn,Sr及びCaか
ら選択された1種または2種以上の金属元素)か
ら成る基本成分と、B2O3及びSiO2から成る添加
成分とを含む誘電体磁器組成物が開示されてい
る。
また、特公昭62−1595号公報には、(Bak-xMx)
OkTiO2(但し、MはMg,Zn,Sr及びCaから選択
された1種または2種以上の金属元素)から成る
基本成分と、B2O3及びMO(但し、MOはBaO,
MgO,ZnO,SrO及びCaOから選択された1種
または2種以上の金属酸化物)から成る添加成分
とを含む誘電体磁器組成物が開示されている。
また、特公昭62−1596号公報には、上記の特公
昭62−1595号公報記載の誘電体磁器組成物の
B2O3及びMOの代りに、B2O3,SiO2及びMO(但
し、MOはBaO,MgO,ZnO,SrO及びCaOから
選択された1種または2種以上の金属酸化物)か
ら成る添加成分とを含む誘電体磁器組成物が開示
されている。
これらに開示されている誘電体磁器組成物を誘
電体層として使用すれば、還元性雰囲気中におい
て、1200℃以下の温度の焼成で磁器コンデンサを
得ることができ、しかも、その誘電体磁器組成物
の比誘電率を2000以上、比誘電率の温度変化率を
−25℃〜+85℃で−10%〜+10%の範囲にするこ
とができるものである。
[発明が解決しようとする課題]
ところで、近年における電子回路の高密度化に
伴ない、磁器コンデンサの小型化の要求は非常に
強く、上記各公報に開示されている誘電体磁器組
成物よりも更に比誘電率の大きな誘電体磁器組成
物を備えた磁器コンデンサの開発が望まれてい
た。
また、磁器コンデンサは各種の環境下において
使用されるため、上記各公報に開示されている誘
電体磁器組成物よりも更に広い温度範囲にわたつ
て比誘電率の変化率が小さい誘電体磁器組成物を
備えた磁器コンデンサの開発が望まれていた。
そこで、本発明の目的は、非酸化性雰囲気中に
おける1200℃以下の焼成で得られるものであるに
もかかわらず、比誘電率が3000以上、誘電体損失
tanδが2.5%以下、抵抗率ρが1×106MΩ・cm以
上であり、かつ比誘電率の温度変化率が−55℃〜
125℃で−15%〜+15%(25℃を基準)、−25℃〜
85℃で−10%〜+10%(20℃を基準)の範囲に収
まる誘電体磁器組成物を備えた磁器コンデンサ及
びその製造方法を提供することにある。
[課題を解決するための手段]
本発明に係る磁器コンデンサは、誘電体磁器組
成物からなる誘電体磁器層と、この誘電体磁器層
を挟持している少なくとも2以上の内部電極とを
備え、前記誘電体磁器組成物が100重量部の基本
成分と、0.2〜5重量部の添加成分とからなり、
前記基本成分が
(Bak-xMx)Ok(Ti1-zRz)O2-z/2
(但し、MはMg及び/又はZn、RはSc,Y,
Gd,Dy,Ho,Er及びYbから選択された1種ま
たは2種以上の金属元素、k,x,zは
1.00≦k≦1.05
0.01≦x≦0.10
0.002≦z≦0.06
を満足する数値)で表わされる物質からなり、
前記添加成分がB2O3とSiO2とMO(但し、MO
はBaO,SrO,CaO,MgO及びZnOから選択さ
れた1種または2種以上の金属酸化物)とからな
り、
前記B2O3と前記SiO2と前記MOとの組成範囲
が、これらの組成をモル%で示す三角図におけ
る、
前記B2O3が1モル%、前記SiO2が80モル%、
前記MOが19モル%の組成を示す第1の点Aと、
前記B2O3が1モル%、前記SiO2が39モル%、
前記MOが60モル%の組成を示す第2の点Bと、
前記B2O3が29モル%、前記SiO2が1モル%、
前記MOが70モル%の組成を示す第3の点Cと、
前記B2O3が90モル%、前記SiO2が1モル%、
前記MOが9モル%の組成を示す第4の点Dと、
前記B2O3が90モル%、前記SiO2が9モル%、
前記MOが1モル%の組成を示す第5の点Eと
前記B2O3が19モル%、前記SiO2が80モル%、
前記MOが1モル%の組成を示す第6の点Fと
をこの順に結ぶ6本の直線で囲まれた領域内のも
のである。
ここで、kの値は1.00≦k≦1.05の範囲が好ま
しい。kの値が1.00未満では、抵抗率ρが1×
106MΩ・cmより小さくなり、静電容量の温度変
化率ΔC-55,ΔC125が−15%〜+15%から外れ、
ΔC-25,ΔC85が−10%〜+10%から外れ、またk
の値が1.05を越えると緻密な焼結体が得られなく
なつてしまうが、kの値が1.00≦k≦1.05の範囲
では所望の電気的特性を有する緻密な焼結体が得
られるからである。
また、xの値は0.01≦x≦0.10の範囲が好まし
い。xの値が0.01未満では静電容量の温度変化率
ΔC-55が−15%〜+15%から外れ、xの値が0.10
を越えると、静電容量の温度変化率ΔC85が−10
%〜+10%から外れてしまうが、xの値が0.01≦
x≦0.10の範囲では所望の電気的特性を有するも
のが得られるからである。
なお、M成分であるMgとZnはほゞ同様に働
き、0.01≦x≦0.10を満足する範囲でMgとZnの
うちの一方または両方を使用することによつて所
望の電気的特性を得ることができる。
また、zの値は、0.002≦z≦0.06の範囲が好
ましい。zの値が0.002未満では静電容量の温度
変化率がΔC-55が−15%〜+15%から外れ、
ΔC-25が−10%〜+10%から外れてしまい、zの
値が0.06を越えると緻密な焼結体が得られなくな
つてしまうが、0.002≦z≦0.06の範囲では、所
望の電気的特性を有する緻密な焼結体が得られる
からである。
また、R成分は、静電容量の温度特性の改善に
寄与するものである。すなわち、R成分の添加に
よつて−55℃〜125℃の範囲での静電容量の温度
変化率ΔC-55〜ΔC125を−15%〜+15%の範囲に
容易に収めることが可能になると共に−25℃〜85
℃の範囲での静電容量の温度変化率ΔC-25〜ΔC85
を−10%〜+10%の範囲に容易に収めることが可
能になり、かつ各温度範囲における静電容量の温
度変化率の変動幅を小さくすることができるもの
である。
また、R成分は抵抗率ρを大きくする作用及び
焼結性を高める作用を有するものである。
なお、R成分のSc,Y,Gd,Dy,Ho,Er及
びYbはほゞ同様に働き、これらから選択された
1つを使用しても、または複数を組み合わせて使
用しても同様な効果が得られるものである。
ただし、zの値は、R成分が1種または複数種
のいずれの場合においても0.002≦z≦0.06の範
囲にすることが望ましい。
なお、前記基本成分を示すの組成式中におい
て、x,z,kはもちろんそれぞれの元素の原子
数を示している。
また、前記基本成分の中に、本発明の目的を阻
害しない範囲で微量のMnO2(好ましくは0.05〜
0.1重量%)等の鉱化剤を添加し、焼結性を向上
させてもよい。また、その他の物質を必要に応じ
て添加してもよい。
また、基本成分を得るための出発原料を、実施
例で示したもの以外の例えばBaO,SrO,CaO等
の酸化物または水酸化物またはその他の化合物と
してもよい。
次に、添加成分の添加量は、100重量部の基本
成分に対し、0.2〜5重量部の範囲が好ましい。
添加成分の添加量が0.2重量部未満の場合には、
焼成温度が1250℃であつても緻密な焼結体が得ら
れず、また、添加成分の添加量が5重量部を越え
ると、比誘電率εsが3000未満となり、しかも静電
容量の温度変化率ΔC-55が−15%〜+15%から外
れるが、添加成分が0.2〜5重量部の範囲にある
場合は、所望の電気的特性のものが得られるから
である。
添加成分の組成は、B2O3−SiO2−MOの組成
比をモル%で示す三角図の第1〜5の点A〜Fを
順に結ぶ6本の直線で囲まれた領域内が好まし
い。
添加成分の組成をこの領域外とすれば、緻密な
焼結体を得ることができないが、この領域内の組
成とすれば、所望の電気的特性の焼結体を得るこ
とができるからである。
なお、添加成分の出発原料は酸化物、水酸化物
等の他の化合物としてもよい。
次に、本発明に係る磁器コンデンサの製造方法
は、上記の基本成分と添加成分とからなる未焼結
の磁器粉末の混合物を調製する工程と、前記混合
物からなる未焼結磁器シートを形成する工程と、
前記未焼結磁器シートを少なくとも2以上の導電
性ペースト膜で挟持させた積層物を形成する工程
と、前記積層物を非酸化性雰囲気中において焼成
する工程と、前記焼成を受けた積層物を酸化性雰
囲気中において熱処理する工程とを備えたもので
ある。
ここで、非酸化性雰囲気中の焼成温度は、電極
材料を考慮慮して種々変えることができる。
ニツケルを内部電極とする場合には、1050℃〜
1200℃の範囲でニツケル粒子の凝集がほとんど生
じない。
また、非酸化性雰囲気はH2やCOなどの還元性
雰囲気のみならず、N2やArなどの中性雰囲気で
あつてもよい。
また、酸化性雰囲気中における熱処理の温度
は、ニツケル等の電極材料と磁器の酸化とを考慮
して種々変更することが可能である。
この熱処理の温度は実施例では600℃としたが、
これに限定されるものではなく、焼結温度よりも
低い温度であればよく、好ましくは500℃〜1000
℃の範囲がよい。
なお、本発明は積層磁器コンデンサ以外の一般
的な単層の磁器コンデンサにも勿論適用可能であ
る。
[実施例]
まず、第1表のNo.1の試料の調製方法とその電
気的特性について説明する。
基本成分の調製
配合1の化合物を各々秤量し、これらを15時間
湿式混合して原料混合物を得た。
[Industrial Field of Application] The present invention relates to a ceramic capacitor having a single-layer or laminated structure in which a dielectric ceramic layer is sandwiched between at least two internal electrodes, and a method for manufacturing the same. [Conventional technology] Conventionally, when manufacturing multilayer ceramic capacitors,
A conductive paste of noble metal such as platinum or palladium is printed in a desired pattern on an unsintered porcelain sheet (green sheet) made of dielectric porcelain raw material powder,
A plurality of these sheets were stacked and pressed together, and fired at 1300°C to 1600°C in an oxidizing atmosphere. Through this firing, the unsintered porcelain sheet made of the dielectric porcelain raw material powder becomes a dielectric porcelain layer, and the conductive paste of noble metal such as platinum or palladium becomes an internal electrode. As mentioned above, if a conductive paste containing a noble metal such as platinum or palladium is used as a main component, the temperature will exceed 1300℃ to 1600℃ in an oxidizing atmosphere.
The desired internal electrodes can be obtained even by firing at such high temperatures. However, since precious metals such as platinum and palladium are expensive, the cost of multilayer ceramic capacitors has inevitably increased. As a solution to the above-mentioned problem, Japanese Patent Publication No. 14607, filed by the applicant, describes (Ba kx M x )O k TiO 2 (where M is Mg and/or
Disclosed is a dielectric ceramic composition comprising a basic component consisting of Zn or Zn) and additive components consisting of Li 2 O and SiO 2 . In addition, Japanese Patent Publication No. 61-14608 describes the dielectric ceramic composition described in the above-mentioned Japanese Patent Publication No. 61-14607.
Instead of Li 2 O and SiO 2 , Li 2 O, SiO 2 and MO (where MO is one selected from BaO, CaO and SrO)
A dielectric ceramic composition is disclosed that includes an additive component consisting of a metal oxide or two or more metal oxides. In addition, in Special Publication No. 61-14609, (Ba kxy
M x L y ) O k TiO 2 (where M is Mg and/or Zn,
L is a basic component consisting of Sr and/or Ca),
A dielectric ceramic composition is disclosed that includes an additive component consisting of Li 2 O and SiO 2 . Furthermore, in Japanese Patent Publication No. 61-14610, Li 2 O, SiO 2 and
A dielectric ceramic composition containing an additive component consisting of MO (where MO is one or more metal oxides selected from BaO, CaO, and SrO) is disclosed. In addition, in Special Publication No. 61-14611, (Ba kx
A basic component consisting of M x )O k TiO 2 (where M is one or more metal elements selected from Mg, Zn, Sr, and Ca) and an additive component consisting of B 2 O 3 and SiO 2 A dielectric ceramic composition comprising: In addition, in Special Publication No. 1595/1983, (Ba kx M x )
A basic component consisting of O k TiO 2 (where M is one or more metal elements selected from Mg, Zn, Sr and Ca), B 2 O 3 and MO (where MO is BaO,
A dielectric ceramic composition containing an additive component consisting of one or more metal oxides selected from MgO, ZnO, SrO, and CaO is disclosed. In addition, Japanese Patent Publication No. 62-1596 describes the dielectric ceramic composition described in Japanese Patent Publication No. 62-1595 mentioned above.
Instead of B 2 O 3 and MO, it consists of B 2 O 3 , SiO 2 and MO (where MO is one or more metal oxides selected from BaO, MgO, ZnO, SrO and CaO) A dielectric ceramic composition is disclosed that includes an additive component. If the dielectric ceramic composition disclosed in these documents is used as a dielectric layer, a ceramic capacitor can be obtained by firing at a temperature of 1200°C or less in a reducing atmosphere, and the dielectric ceramic composition can be used as a dielectric layer. The dielectric constant can be set to 2000 or more, and the temperature change rate of the dielectric constant can be made within the range of -10% to +10% at -25°C to +85°C. [Problems to be Solved by the Invention] Incidentally, as the density of electronic circuits has increased in recent years, there has been a strong demand for miniaturization of ceramic capacitors. Furthermore, it has been desired to develop a ceramic capacitor equipped with a dielectric ceramic composition having a large dielectric constant. In addition, since ceramic capacitors are used in various environments, dielectric ceramic compositions with a smaller rate of change in dielectric constant over a wider temperature range than the dielectric ceramic compositions disclosed in the above-mentioned publications are needed. There was a desire to develop a ceramic capacitor with Therefore, the purpose of the present invention is to reduce the relative permittivity of 3000 or more and the dielectric loss even though it can be obtained by firing at 1200°C or lower in a non-oxidizing atmosphere.
tan δ is 2.5% or less, resistivity ρ is 1×10 6 MΩ・cm or more, and the temperature change rate of relative permittivity is -55℃~
-15% to +15% at 125℃ (based on 25℃), -25℃ to
The object of the present invention is to provide a ceramic capacitor equipped with a dielectric ceramic composition whose temperature ranges from -10% to +10% (based on 20°C) at 85°C, and a method for manufacturing the same. [Means for Solving the Problems] A ceramic capacitor according to the present invention includes a dielectric ceramic layer made of a dielectric ceramic composition, and at least two or more internal electrodes sandwiching the dielectric ceramic layer, The dielectric ceramic composition consists of 100 parts by weight of a basic component and 0.2 to 5 parts by weight of an additive component, and the basic component is ( Bakx M x )O k (Ti 1-z R z )O 2- z/2 (However, M is Mg and/or Zn, R is Sc, Y,
One or more metal elements selected from Gd, Dy, Ho, Er, and Yb, k, x, and z are values satisfying 1.00≦k≦1.05 0.01≦x≦0.10 0.002≦z≦0.06) The additive components are B 2 O 3 , SiO 2 and MO (however, MO
is composed of one or more metal oxides selected from BaO, SrO, CaO, MgO and ZnO), and the composition range of the B 2 O 3 , the SiO 2 and the MO is within the range of these compositions. In the triangular diagram showing in mol%, the B 2 O 3 is 1 mol%, the SiO 2 is 80 mol%,
a first point A having a composition of 19 mol % of the MO; 1 mol % of the B 2 O 3 ; and 39 mol % of the SiO 2 ;
a second point B having a composition of 60 mol % of the MO; 29 mol % of the B 2 O 3 ; 1 mol % of the SiO 2 ;
a third point C having a composition of 70 mol % of the MO; 90 mol % of the B 2 O 3 ; 1 mol % of the SiO 2 ;
a fourth point D having a composition of 9 mol % of the MO; 90 mol % of the B 2 O 3 ; 9 mol % of the SiO 2 ;
A fifth point E having a composition of 1 mol% of the MO; 19 mol% of the B 2 O 3 ; 80 mol% of the SiO 2 ;
This is within a region surrounded by six straight lines connecting in this order the sixth point F where the MO has a composition of 1 mol %. Here, the value of k is preferably in the range of 1.00≦k≦1.05. When the value of k is less than 1.00, the resistivity ρ is 1×
10 6 MΩ・cm, the temperature change rate of capacitance ΔC -55 and ΔC 125 deviate from -15% to +15%,
ΔC -25 and ΔC 85 deviate from -10% to +10%, and k
If the value of k exceeds 1.05, it becomes impossible to obtain a dense sintered body, but if the value of k is in the range of 1.00≦k≦1.05, a dense sintered body with the desired electrical properties can be obtained. be. Further, the value of x is preferably in the range of 0.01≦x≦0.10. If the value of x is less than 0.01, the capacitance temperature change rate ΔC -55 will deviate from -15% to +15%, and the value of x will be 0.10.
When the temperature change rate of capacitance ΔC 85 exceeds −10
It deviates from %~+10%, but the value of x is 0.01≦
This is because in the range of x≦0.10, a material having desired electrical characteristics can be obtained. Note that Mg and Zn, which are M components, work in almost the same way, and desired electrical characteristics can be obtained by using one or both of Mg and Zn within a range that satisfies 0.01≦x≦0.10. I can do it. Further, the value of z is preferably in the range of 0.002≦z≦0.06. When the value of z is less than 0.002, the temperature change rate of capacitance ΔC -55 deviates from -15% to +15%,
If ΔC -25 deviates from -10% to +10% and the value of z exceeds 0.06, a dense sintered body cannot be obtained, but in the range of 0.002≦z≦0.06, the desired electrical This is because a dense sintered body having characteristics can be obtained. Furthermore, the R component contributes to improving the temperature characteristics of capacitance. That is, by adding the R component, the temperature change rate of capacitance ΔC -55 to ΔC 125 in the range of -55 °C to 125°C can be easily kept within the range of -15% to +15%. with −25℃~85
Temperature change rate of capacitance in the range ΔC -25 to ΔC 85
can be easily kept within the range of -10% to +10%, and the fluctuation range of the temperature change rate of capacitance in each temperature range can be reduced. Moreover, the R component has the effect of increasing the resistivity ρ and the effect of increasing the sinterability. Note that the R components Sc, Y, Gd, Dy, Ho, Er, and Yb work in almost the same way, and the same effect can be obtained even if one selected from these is used or a combination of several is used. is obtained. However, the value of z is desirably within the range of 0.002≦z≦0.06, regardless of whether there is one type of R component or multiple types of R components. In the composition formula showing the basic components, x, z, and k of course indicate the number of atoms of each element. In addition, a trace amount of MnO 2 (preferably 0.05 to 0.05
A mineralizing agent such as 0.1% by weight) may be added to improve sinterability. Further, other substances may be added as necessary. Further, the starting materials for obtaining the basic components may be oxides or hydroxides other than those shown in the examples, such as BaO, SrO, CaO, or other compounds. Next, the amount of the additive component added is preferably in the range of 0.2 to 5 parts by weight per 100 parts by weight of the basic component. If the amount of added ingredients is less than 0.2 parts by weight,
Even if the firing temperature is 1250°C, a dense sintered body cannot be obtained, and if the amount of additive components exceeds 5 parts by weight, the dielectric constant ε s becomes less than 3000, and the capacitance temperature This is because desired electrical characteristics can be obtained when the rate of change ΔC -55 deviates from -15% to +15%, but the added component is in the range of 0.2 to 5 parts by weight. The composition of the additive component is preferably within the area surrounded by six straight lines connecting the first to fifth points A to F of the triangular diagram showing the composition ratio of B 2 O 3 -SiO 2 -MO in mol%. . If the composition of the additive component is outside this range, a dense sintered body cannot be obtained, but if the composition is within this range, a sintered body with desired electrical characteristics can be obtained. . Note that the starting materials for the additive components may be other compounds such as oxides and hydroxides. Next, the method for manufacturing a porcelain capacitor according to the present invention includes the steps of preparing a mixture of unsintered porcelain powder consisting of the above basic components and additive components, and forming an unsintered porcelain sheet consisting of the mixture. process and
a step of forming a laminate in which the unsintered porcelain sheet is sandwiched between at least two or more conductive paste films; a step of firing the laminate in a non-oxidizing atmosphere; and a step of firing the laminate after the firing. The method includes a step of heat treatment in an oxidizing atmosphere. Here, the firing temperature in the non-oxidizing atmosphere can be varied depending on the electrode material. When using nickel as the internal electrode, the temperature is 1050℃~
Almost no aggregation of nickel particles occurs in the 1200°C range. Furthermore, the non-oxidizing atmosphere may be not only a reducing atmosphere such as H 2 or CO, but also a neutral atmosphere such as N 2 or Ar. Furthermore, the temperature of the heat treatment in the oxidizing atmosphere can be varied in consideration of the oxidation of the electrode material such as nickel and the porcelain. The temperature of this heat treatment was 600°C in the example, but
The temperature is not limited to this, but may be lower than the sintering temperature, preferably 500℃ to 1000℃.
A range of ℃ is preferable. Note that the present invention is of course applicable to general single-layer ceramic capacitors other than multilayer ceramic capacitors. [Example] First, the preparation method of sample No. 1 in Table 1 and its electrical characteristics will be explained. Preparation of Basic Components The compounds of Formulation 1 were each weighed and wet mixed for 15 hours to obtain a raw material mixture.
【表】
ここで、配合1の化合物の重量(g)とモル部
は、基本成分の一般式
(Bak-xMx)Ok(Ti1-zRz)O2-z/2 …(1)
が
(Ba0.98Mg0.03Zn0.01)O1.02
(Ti0.98Er0.02)O1.99
となるように計算して求めた値である。
次に、この原料混合物を150℃で4時間乾燥後、
粉砕し、大気中において約1200℃の温度で2時間
仮焼し、基本成分の粉末を得た。
添加成分の調製
また、配合2の化合物を各々秤量して混合し、
この混合物にアルコールを300c.c.加え、ポリエチ
レンポツトにてアルミナボールを用いて10時間攪
拌した後、大気中において1000℃の温度で2時間
仮焼成した。[Table] Here, the weight (g) and molar parts of the compound of Formulation 1 are calculated from the general formula of the basic components (Ba kx M x )O k (Ti 1-z R z )O 2-z/2 …(1 ) is ( Ba0.98Mg0.03Zn0.01 ) O1.02 ( Ti0.98Er0.02 ) O1.99 . _ _ _ Next, after drying this raw material mixture at 150°C for 4 hours,
It was crushed and calcined in the air at a temperature of about 1200°C for 2 hours to obtain a powder of the basic component. Preparation of additive components In addition, each compound of formulation 2 was weighed and mixed,
300 c.c. of alcohol was added to this mixture, which was stirred for 10 hours using an alumina ball in a polyethylene pot, and then pre-calcined in the air at a temperature of 1000°C for 2 hours.
【表】
ここで、配合2の化合物の重量(g)とモル部
は、B2O3が1モル%、SiO2が80モル%、MOが
19モル%{BaO(3.8モル%)+CaO(3.8モル%)+
SrO(3.8モル%)+MgO(3.8モル%)+ZnO(3.8モ
ル%)}の組成になるように計算して求めた値で
ある。
次に、この仮焼によつて得られたものを300c.c.
の水とともにアルミナポツトに入れ、アルミナボ
ールで15時間粉砕し、しかる後に150℃で4時間
乾燥させて、添加成分の粉末を得た。
尚、MOの内容であるBaO,CaO,SrO,MgO
及びZnOの割合は、第1表に示すように、いずれ
も20モル%となる。
スラリーの調製
次に、100重量部(1000g)の前記基本成分に
対し、2重量部(20g)の前記添加成分を添加
し、更に、アクリル酸エステルポリマー、グリセ
リン、縮合リン酸塩の水溶液からなる有機バイン
ダーを、基本成分と添加成分との合計重量に対し
て15重量%添加し、更に、50重量%の水を加え、
これらをボールミルに入れて、粉砕及び混合して
磁器原料のスラリーを調製した。
未焼結磁器シートの形成
次に、上記スラリーを真空脱泡機に入れて脱泡
し、このスラリーをリバースロールコータに入
れ、ここから得られる薄膜成形物を長尺なポリエ
ステルフイルム上に連続して受け取ると共に、同
フイルム上でこれを100℃に加熱して乾燥させ、
厚さ約25μmの未焼結磁器シートを得た。このシ
ートは長尺なものであるが、これを10cm角の正方
形に裁断して使用する。
導電性ペーストの調製及び印刷
一方、内部電極用の導電性ペーストは、粒径平
均1.5μmのニツケル粉末10gと、エチルセルロー
ス0.9gをブチルカルビトール9.1gに溶解させた
ものとを攪拌機に入れ、10時間攪拌することによ
り得た。そして、この導電性ペーストを長さ14
mm、幅7mmのパターンを50個有するスクリーンを
介して上記未焼結磁器シートの片側に印刷した
後、これを乾燥させた。
未焼結磁器シートの積層
次に、上記印刷面を上にして未焼結磁器シート
を2枚積層した。この際、隣接する上下のシート
において、その印刷面がパターンの長手方向に約
半分程ずれるように配置した。更に、この積層物
の上下両面にそれぞれ4枚ずつ厚さ60μmの未焼
結磁器シートを積層した。
積層物の圧着と裁断
次いで、この積層物を約50℃の温度で厚さ方向
に約40トンの荷重を加えて圧着させた。しかる
後、この積層物を格子状に栽断し、50個の積層体
チツプを得た。
積層体チツプの焼成
次に、この積層体チツプを雰囲気焼成が可能な
炉に入れ、大気雰囲気中において100℃/hの速
度で600℃まで昇温して、有機バインダを燃焼さ
せた。
しかる後、炉の雰囲気を大気からH2(2体積
%)+N2(98体積%)の還元性雰囲気に変えた。
そして、炉をこの還元性雰囲気とした状態を保つ
て、積層体チツプの加熱温度を600℃から焼結温
度の1150℃まで、100℃/hの速度で昇温して
1150℃(最高温度)を3時間保持した後、100
℃/hの速度で600℃まで降温し、雰囲気を大気
雰囲気(酸化性雰囲気)におきかえて、600℃を
30分間保持して酸化処理を行い、その後、室温ま
で冷却して積層焼結体チツプを得た。
外部電極の形成
次に、電極が露出する積層焼結体チツプの側面
に亜鉛とガラスフリツト(glass frit)とビヒク
ル(vehicle)とからなる導電性ペーストを塗布
して乾燥し、これを大気中で550℃の温度で15分
間焼付け、亜鉛電極層を形成し、更にこの上に無
電解メツキ法で銅層を形成し、更にこの上に電気
メツキ法でPb−Sn半田層を設けて、一対の外部
電極を形成した。
これにより、第1図に示すように、3層の誘電
体磁器層12と2層の内部電極14とから成る積
層焼結体チツプ15に一対の外部電極16を形成
した積層磁器コンデンサ10が得られた。
ここで、外部電極16は、亜鉛電極層18と、
この亜鉛電極層18の上に形成された銅層20
と、この銅層20の上に形成されたPb−Sn半田
層22とからなる。
なお、この積層磁器コンデンサ10の誘電体磁
器層12の厚さは0.02mm、一対の内部電極14の
対向面積は5mm×5mm=25mm2である。また、焼結
後の誘電体磁器層12の組成は、焼結前の基本成
分及び添加成分の混合組成と実質的に同じであ
る。
電気的特性の測定
次に、積層磁器コンデンサ10の電気的特性を
測定し、その平均値を求めたところ、第2表に示
すように、比誘電率εsが3510、tanδが1.2%、抵
抗率ρが4.7×106MΩ・cm、25℃の静電容量を基
準にした−55℃及び+125℃の静電容量の変化率
ΔC-55,ΔC125が−11.5%,+6.5%、20℃の静電容
量を基準にした−25℃,+85℃の静電容量の変化
率ΔC-25,ΔC85が−6.5%,−5.2%であつた。
なお、電気的特性は次の要領で測定した。
(A) 比誘電率εsは、温度20℃、周波数1kHz、電圧
(実効値)1.0Vの条件で静電容量を測定し、こ
の測定値と、一対の内部電極14の対向面積25
mm2と、一対の内部電極14間の誘電体磁器層1
2の厚さ0.02mmから計算で求めた。
(B) 誘電体損失tanδ(%)は上記比誘電率の測定
と同一条件で測定した。
(C) 抵抗率ρ(MΩ・cm)は、温度20℃において
DC100Vを1分間印加した後に一対の外部電極
16間の抵抗値を測定し、この測定値と寸法と
に基づいて計算で求めた。
(D) 静電容量の温度特性は、恒温槽の中に試料を
入れ、−55℃,−25℃,0℃,+20℃,+25℃,+
40℃,+60℃,+85℃,+105℃,+125℃の各温度
において、周波数1kHz、電圧(実効値)1.0V
の条件で静電容量を測定し、20℃及び25℃の時
の静電容量に対する各温度における変化率を求
めることによつて得た。
以上、No.1の試料の作成方法及びその特性につ
いて述べたが、試料No.2〜81についても、基本成
分及び添加成分の組成、これ等の割合、及び還元
性雰囲気中における焼成温度を第1表及び第2表
に示すように変化させた他は、No.1の試料と全く
同一の方法で積層磁器コンデンサを作成し、同一
の方法で電気的特性を測定した。
第1表は、各々の試料の基本成分と添加成分の
組成を示し、第2表は各々の試料の焼成温度及び
電気的特性を示す。
なお、第1表の基本成分の欄のx,z,kは、
前述した基本成分の組成式(1)の各元素の原子数、
すなわち(Ti+R)の原子数を1とした場合の
各元素の原子数の割合を示す。
また、xの欄のMg,Znは、前述した基本成分
の組成式(1)のMの内容を示し、zの欄のSc,Y,
Gd,Dy,Ho,Er及びYbは、前述した基本成分
の組成式(1)のRの内容を示している。
これらの欄にはこれらの原子数が示され、また
合計の欄にはMg,Znの合計値が示されている。
添加成分の添加量は基本成分100重量部に対す
る重量部で示されている。添加成分のMOの内容
の欄にはBaO,MgO,ZnO,SrO及びCaOの割
合がモル%で示されている。
第2表において、静電容量の温度特性は、25℃
の静電容量を基準にした−55℃及び+125℃の静
電容量変化率をΔC-55(%)及びΔC125(%)で、
20℃の静電容量を基準にした−25℃及び+85℃の
静電容量変化率をΔC-25(%)及びΔC85(%)で示
されている。[Table] Here, the weight (g) and molar parts of the compound of formulation 2 are: B 2 O 3 is 1 mol %, SiO 2 is 80 mol %, MO is
19 mol% {BaO (3.8 mol%) + CaO (3.8 mol%) +
This value was calculated so that the composition would be SrO (3.8 mol%) + MgO (3.8 mol%) + ZnO (3.8 mol%). Next, the material obtained by this calcination is 300c.c.
The mixture was placed in an alumina pot with water and ground with an alumina ball for 15 hours, and then dried at 150°C for 4 hours to obtain a powder of the additive component. In addition, the contents of MO are BaO, CaO, SrO, MgO
As shown in Table 1, the proportions of ZnO and ZnO are both 20 mol%. Preparation of slurry Next, 2 parts by weight (20 g) of the above additive components were added to 100 parts by weight (1000 g) of the basic component, and an aqueous solution of acrylic ester polymer, glycerin, and condensed phosphate was further added. Add an organic binder at 15% by weight based on the total weight of the basic component and additive components, and further add 50% by weight of water,
These were placed in a ball mill, pulverized and mixed to prepare a slurry of porcelain raw materials. Formation of an unsintered porcelain sheet Next, the above slurry is degassed by putting it into a vacuum defoaming machine, and this slurry is put into a reverse roll coater, and the thin film molded product obtained from this is continuously coated on a long polyester film. At the same time, it is heated to 100℃ and dried on the same film.
A green porcelain sheet with a thickness of about 25 μm was obtained. This sheet is long, but it is cut into 10cm squares. Preparation and Printing of Conductive Paste On the other hand, conductive paste for internal electrodes was prepared by placing 10 g of nickel powder with an average particle size of 1.5 μm and 0.9 g of ethyl cellulose dissolved in 9.1 g of butyl carbitol in a stirrer. Obtained by stirring for hours. Then, add this conductive paste to a length of 14
After printing on one side of the unsintered porcelain sheet through a screen having 50 patterns of 7 mm in width and 7 mm in width, it was dried. Lamination of unsintered porcelain sheets Next, two unsintered porcelain sheets were laminated with the above-mentioned printed side facing up. At this time, the adjacent upper and lower sheets were arranged so that their printed surfaces were shifted by about half in the longitudinal direction of the pattern. Furthermore, four unsintered porcelain sheets each having a thickness of 60 μm were laminated on the upper and lower surfaces of this laminate. Pressing and cutting of the laminate Next, this laminate was pressed at a temperature of about 50° C. by applying a load of about 40 tons in the thickness direction. Thereafter, this laminate was cut into grid shapes to obtain 50 laminate chips. Firing of the Laminated Chip Next, the laminated chip was placed in a furnace capable of firing in an atmosphere, and the temperature was raised to 600° C. at a rate of 100° C./h in the air atmosphere to burn the organic binder. Thereafter, the atmosphere in the furnace was changed from air to a reducing atmosphere of H 2 (2% by volume) + N 2 (98% by volume).
Then, while maintaining this reducing atmosphere in the furnace, the heating temperature of the stacked chips was increased from 600°C to the sintering temperature of 1150°C at a rate of 100°C/h.
After holding 1150℃ (maximum temperature) for 3 hours, 100℃
The temperature was lowered to 600℃ at a rate of ℃/h, the atmosphere was changed to atmospheric atmosphere (oxidizing atmosphere), and the temperature was lowered to 600℃.
It was held for 30 minutes to perform oxidation treatment, and then cooled to room temperature to obtain a laminated sintered chip. Formation of external electrodes Next, a conductive paste consisting of zinc, glass frit, and vehicle is applied to the side surface of the laminated sintered chip where the electrodes are exposed, dried, and then exposed to air for 550 min. A zinc electrode layer is formed by baking for 15 minutes at a temperature of An electrode was formed. As a result, as shown in FIG. 1, a multilayer ceramic capacitor 10 is obtained in which a pair of external electrodes 16 are formed on a multilayer sintered chip 15 consisting of three dielectric ceramic layers 12 and two internal electrodes 14. It was done. Here, the external electrode 16 includes a zinc electrode layer 18 and
A copper layer 20 formed on this zinc electrode layer 18
and a Pb-Sn solder layer 22 formed on this copper layer 20. The thickness of the dielectric ceramic layer 12 of this multilayer ceramic capacitor 10 is 0.02 mm, and the opposing area of the pair of internal electrodes 14 is 5 mm x 5 mm = 25 mm 2 . Further, the composition of the dielectric ceramic layer 12 after sintering is substantially the same as the mixed composition of the basic components and additive components before sintering. Measurement of Electrical Characteristics Next, the electrical characteristics of the multilayer ceramic capacitor 10 were measured and the average values were calculated. Rate ρ is 4.7×10 6 MΩ・cm, capacitance change rate ΔC -55 at -55℃ and +125℃ based on capacitance at 25℃, ΔC 125 is -11.5%, +6.5%, The capacitance change rates ΔC -25 and ΔC 85 at -25°C and + 85 °C based on the capacitance at 20°C were -6.5% and -5.2%. Note that the electrical characteristics were measured in the following manner. (A) The relative dielectric constant ε s is calculated by measuring the capacitance under the conditions of temperature 20°C, frequency 1kHz, and voltage (effective value) 1.0V, and this measured value and the opposing area of the pair of internal electrodes 14 25
mm 2 and the dielectric ceramic layer 1 between the pair of internal electrodes 14
It was calculated from the thickness of 2, 0.02 mm. (B) Dielectric loss tan δ (%) was measured under the same conditions as the above measurement of relative dielectric constant. (C) Resistivity ρ (MΩ・cm) at a temperature of 20℃
After applying DC 100V for 1 minute, the resistance value between the pair of external electrodes 16 was measured, and calculated based on this measured value and the dimensions. (D) Temperature characteristics of capacitance are measured by placing the sample in a thermostatic chamber and measuring the temperature at -55℃, -25℃, 0℃, +20℃, +25℃, +
At each temperature of 40℃, +60℃, +85℃, +105℃, +125℃, frequency 1kHz, voltage (effective value) 1.0V
The capacitance was measured under the following conditions, and the rate of change at each temperature with respect to the capacitance at 20°C and 25°C was obtained. The preparation method of sample No. 1 and its characteristics have been described above, but for samples No. 2 to 81, the composition of the basic components and additive components, their ratios, and the firing temperature in a reducing atmosphere were also determined. Except for the changes shown in Tables 1 and 2, a multilayer ceramic capacitor was prepared in exactly the same manner as for sample No. 1, and its electrical characteristics were measured in the same manner. Table 1 shows the composition of the basic components and additive components of each sample, and Table 2 shows the firing temperature and electrical characteristics of each sample. In addition, x, z, k in the basic component column of Table 1 are as follows:
The number of atoms of each element in the composition formula (1) of the basic components mentioned above,
That is, it shows the ratio of the number of atoms of each element when the number of atoms of (Ti+R) is 1. In addition, Mg and Zn in the x column indicate the contents of M in the basic component composition formula (1) mentioned above, and Sc, Y, and
Gd, Dy, Ho, Er, and Yb indicate the content of R in the basic component composition formula (1) described above. These columns show the number of these atoms, and the total column shows the total value of Mg and Zn. The amount of the additive component added is shown in parts by weight based on 100 parts by weight of the basic component. In the MO content column of the additive components, the proportions of BaO, MgO, ZnO, SrO, and CaO are shown in mol%. In Table 2, the temperature characteristics of capacitance are 25℃
The capacitance change rate at -55℃ and +125℃ based on the capacitance of is ΔC -55 (%) and ΔC 125 (%),
The capacitance change rate at -25°C and +85°C based on the capacitance at 20°C is shown as ΔC -25 (%) and ΔC 85 (%).
【表】【table】
【表】【table】
【表】【table】
【表】
※印が付された試料は比較例
[Table] Samples marked with * are comparative examples
【表】【table】
【表】【table】
【表】
※印が付された試料は比較例
第1表及び第2表から明らかなように、本発明
に従う試料では、非酸化性雰囲気中において、
1200℃以下の焼成で、非誘電率εsが3000以上、
tanδが2.5%以下、抵抗率ρが1×106MΩ・cm以
上、静電容量の温度変化率ΔC-55及びΔC125が−
15%〜+15%、ΔC-25及びΔC85が−10%〜+10%
の範囲となり、所望特性の磁器コンデンサを得る
ことが出来るものである。
一方、試料No.11〜13,26,31,32,40〜45,
49,50,55,56,62,63,69,80,81では本発明
の目的を達成することができない。従つて、これ
等は本発明の範囲外のものである。
第2表には静電容量の温度変化率ΔC-55,
ΔC125,ΔC-25,ΔC85のみが示されているが、本
発明の範囲に属する試料の−25℃〜+85℃の範囲
の種々の静電容量の温度変化率ΔCは、−10%〜+
10%の範囲に収まり、また、−55℃〜+125℃の範
囲の種々の静電容量の変化率ΔCは、−15%〜+15
%の範囲に収まつている。
次に、本発明の誘電体磁器組成物の組成範囲の
限定理由について述べる。
まず、xの値が、試料No.32に示すように、零の
場合には、静電容量の温度変化率ΔC-55が−15%
〜+15%の範囲外となるが、試料No.33,34に示す
ように、xの値が0.01の場合には、所望の電気的
特性が得られる。従つて、xの下限は0.01であ
る。
一方、試料No.40〜44に示すように、xの値が
0.12の場合には、静電容量の温度変化率ΔC85が−
10%〜+10%の範囲外となるが、試料No.38,39に
示すように、xの値が0.10の場合には、所望の電
気的特性を得ることができる。従つて、xの上限
は0.10である。
なお、M成分であるMgとZnはほゞ同様に働
き、0.01≦x≦0.10を満足する範囲でMgとZnの
うちの一方または両方を使用することによつて所
望の電気的特性を得ることができる。
kの値が、試料No.45に示すように、0.98の場合
には、ρが1×106MΩ・cm未満と大幅に低くな
り、静電容量の温度変化率ΔC-55,ΔC-25,ΔC85
もそれぞれ−15%,−10%より大幅に悪化してし
まうが、試料No.46に示すように、kの値が1.00の
場合には、所望の電気的特性が得られる。従つ
て、kの値の下限は1.00である。
一方、kの値が、試料No.49に示すように、1.07
の場合には緻密な焼結体が得られないが、試料No.
48に示すように、kの値が1.05の場合には、所望
の電気的特性が得られる。従つてkの値の上限は
1.05である。
zの値が、試料No.50,56,63に示すように、0
の場合には静電容量の温度変化率ΔC-55,ΔC-25
がそれぞれ−15%,−10%以内を満たしていない
が、試料No.51,57,64に示すようにzの値が
0.002の場合には、所望の電気的特性が得られる。
従つてzの下限は0.002である。
一方、zの値が試料No.55,62,69,80,81に示
すように、0.07の場合には1250℃で焼成しても緻
密な焼結体が得られないが、試料No.54,61,68,
78,79に示すように0.06の場合には所望の電気的
特性を得ることができる。従つて、zの値の上限
は0.06である。
尚、R成分のSc,Y,Gd,Dy,Ho,Er及び
Ybはほゞ同様に働き、これらから選択された1
つを使用しても、または複数を組み合わせて使用
しても同様な結果が得られる。
そして、R成分が1種または複数種のいずれの
場合においてもzの値を0.002〜0.06の範囲にす
ることが望ましい。
尚、組成式でRで示される成分は、静電容量の
温度特性の改善に寄与するものである。すなわ
ち、R成分の添加によつて−55℃〜125℃の範囲
での静電容量の温度変化率ΔC-55〜ΔC125を−15
%〜+15%の範囲に容易に収めることが可能にな
ると共に−25℃〜85℃の範囲での静電容量の温度
変化率ΔC-25〜ΔC85を−10%〜+10%の範囲に容
易に収めることが可能になり、かつ各温度範囲に
おける静電容量の温度変化率の変動幅を小さくす
ることができる。
また、R成分は抵抗率ρを大きくする作用及び
焼結性を高める作用を有するものである。
また、添加成分の添加量が零の場合には、試料
No.26から明らかなように、焼成温度が1250℃であ
つても緻密な焼結体が得られないが、試料No.27に
示すように、添加量が100重量部の基本成分に対
して0.2重量部の場合には、1190℃の焼成で所望
の電気的特性が得られる。従つて、添加成分の下
限は0.2重量部である。
一方、試料No.31に示すように、添加成分の添加
量が7.0重量部の場合には、比誘電率εsが3000未
満となり、更に、静電容量の温度変化率ΔC-55が
−15%〜+15%の範囲外となるが、試料No.30に示
すように、添加量が5.0重量部の場合には、所望
の電気的特性を得ることができる。従つて、添加
量の上限は5.0重量部である。
添加成分の好ましい組成は、第2図のB2O3−
SiO2−MOの組成比を示す三角図に基づいて決定
することができる。
三角図の第1の点Aは、試料No.1のB2O3が1
モル%、SiO2が80モル%、MOが19モル%の組成
を示し、第2の点Bは、試料No.2のB2O3が1モ
ル%、SiO2が39モル%、MOが60モル%の組成を
示し、第3の点Cは、試料No.3のB2O3が29モル
%、SiO2が1モル%、MOが70モル%の組成を示
し、第4の点Dは試料No.4のB2O3が90モル%、
SiO2が1モル%、MOが9モル%の組成を示し、
第5の点Eは、試料No.5のB2O3が90モル%、
SiO2が9モル%、MOが1モル%の組成を示し、
第6の点Fは、試料No.6のB2O3が19モル%、
SiO2が80モル%、MOが1モル%の組成を示す。
本発明の範囲に属する試料の添加成分の組成は
三角図の第1〜6の点A〜Fをこの順に結ぶ6本
の直線で囲まれた領域内の組成になつている。こ
の領域内の組成とすれば、所望の電気的特性を得
ることができる。
一方、試料No.11〜13のように、添加成分の組成
が本発明で特定した範囲外となれば、緻密な焼結
体を得ることができない。
なお、MO成分は例えば試料No.14〜18に示すよ
うに、BaO,MgO,ZnO,SrO,CaOのいずれ
か1つであつてもよいし、または他の試料に示す
ように適当な比率としてもよい。
[発明の効果]
本発明によれば、誘電体磁器組成物の組成を前
述したようにしたので、比誘電率が3000以上、誘
電体損失tanδが2.5%以下、抵抗率ρが1×106M
Ω・cm以上であり、且つ比誘電率の温度変化率
が、−55℃〜125℃で−15%〜+15%(25℃を基
準)、−25℃〜85℃で−10%〜+10%(20℃を基
準)の範囲に収まる誘電体磁器組成物を備えた磁
器コンデンサを提供することができる。
また、本発明によれば、非酸化性雰囲気中にお
いて1200℃以下の温度で焼成して得ることができ
るので、ニツケル等の卑金属の導電性ペーストを
グリーンシートに塗布し、グリーンシートと導電
性ペーストとを同時に焼成する方法によつて磁器
コンデンサを製造することができる。[Table] Samples marked with * are comparative examples.As is clear from Tables 1 and 2, in the samples according to the present invention, in a non-oxidizing atmosphere,
When fired at 1200℃ or less, the dielectric constant ε s is 3000 or more,
tan δ is 2.5% or less, resistivity ρ is 1 × 10 6 MΩ・cm or more, temperature change rate of capacitance ΔC -55 and ΔC 125 are -
15% to +15%, ΔC -25 and ΔC 85 -10% to +10%
, which makes it possible to obtain a ceramic capacitor with desired characteristics. On the other hand, sample No. 11-13, 26, 31, 32, 40-45,
49, 50, 55, 56, 62, 63, 69, 80, and 81 cannot achieve the object of the present invention. Therefore, these are outside the scope of the present invention. Table 2 shows the temperature change rate of capacitance ΔC -55 ,
Although only ΔC 125 , ΔC -25 , and ΔC 85 are shown, the temperature change rate ΔC of various capacitances in the range of -25°C to +85°C for samples belonging to the scope of the present invention is -10% to +85°C. +
10%, and the rate of change of various capacitances ΔC in the range -55°C to +125°C is -15% to +15°C.
It is within the range of %. Next, the reasons for limiting the composition range of the dielectric ceramic composition of the present invention will be described. First, as shown in sample No. 32, when the value of x is zero, the temperature change rate ΔC -55 of capacitance is -15%.
Although it is outside the range of ~+15%, as shown in Sample Nos. 33 and 34, when the value of x is 0.01, desired electrical characteristics can be obtained. Therefore, the lower limit of x is 0.01. On the other hand, as shown in samples No. 40 to 44, the value of x is
0.12, the temperature change rate of capacitance ΔC 85 is −
Although it is outside the range of 10% to +10%, desired electrical characteristics can be obtained when the value of x is 0.10, as shown in sample Nos. 38 and 39. Therefore, the upper limit of x is 0.10. Note that Mg and Zn, which are M components, work in almost the same way, and desired electrical characteristics can be obtained by using one or both of Mg and Zn within a range that satisfies 0.01≦x≦0.10. I can do it. When the value of k is 0.98, as shown in sample No. 45, ρ becomes significantly lower than 1×10 6 MΩ・cm, and the temperature change rate of capacitance ΔC -55 , ΔC -25 , ΔC 85
However, as shown in sample No. 46, when the value of k is 1.00, desired electrical characteristics can be obtained. Therefore, the lower limit of the value of k is 1.00. On the other hand, the value of k is 1.07 as shown in sample No. 49.
Although a dense sintered body cannot be obtained in the case of sample No.
48, when the value of k is 1.05, desired electrical characteristics can be obtained. Therefore, the upper limit of the value of k is
It is 1.05. The value of z is 0 as shown in sample Nos. 50, 56, and 63.
In the case of , the temperature change rate of capacitance ΔC -55 , ΔC -25
are not within -15% and -10%, respectively, but the value of z is
In the case of 0.002, desired electrical characteristics are obtained.
Therefore, the lower limit of z is 0.002. On the other hand, as shown in sample Nos. 55, 62, 69, 80, and 81, when the value of z is 0.07, a dense sintered body cannot be obtained even if fired at 1250°C; ,61,68,
As shown in 78 and 79, when it is 0.06, desired electrical characteristics can be obtained. Therefore, the upper limit of the value of z is 0.06. In addition, R components Sc, Y, Gd, Dy, Ho, Er and
Yb works in almost the same way, and one selected from these
Similar results can be obtained using one or a combination of two or more. It is desirable that the value of z be in the range of 0.002 to 0.06, regardless of whether there is one type of R component or multiple types of R components. Note that the component represented by R in the compositional formula contributes to improving the temperature characteristics of capacitance. In other words, by adding the R component, the temperature change rate of capacitance ΔC -55 to ΔC 125 in the range of -55 °C to 125°C is reduced to -15
It is possible to easily keep the temperature change rate of capacitance ΔC -25 to ΔC 85 in the range of -10% to +10% in the range of -25℃ to 85℃. In addition, the range of fluctuation in the temperature change rate of capacitance in each temperature range can be reduced. Moreover, the R component has the effect of increasing the resistivity ρ and the effect of increasing the sinterability. In addition, if the amount of added components is zero, the sample
As is clear from No. 26, a dense sintered body cannot be obtained even if the firing temperature is 1250°C, but as shown in Sample No. 27, the addition amount is 100 parts by weight of the basic components. In the case of 0.2 parts by weight, desired electrical properties can be obtained by firing at 1190°C. Therefore, the lower limit of the added components is 0.2 parts by weight. On the other hand, as shown in sample No. 31, when the amount of the additive component is 7.0 parts by weight, the relative permittivity ε s is less than 3000, and the temperature change rate ΔC -55 of capacitance is -15 % to +15%, but as shown in sample No. 30, when the amount added is 5.0 parts by weight, desired electrical characteristics can be obtained. Therefore, the upper limit of the amount added is 5.0 parts by weight. The preferred composition of the additive components is B 2 O 3 − in FIG.
It can be determined based on a triangular diagram showing the composition ratio of SiO 2 -MO. The first point A in the triangular diagram is that B 2 O 3 of sample No. 1 is 1.
mol%, SiO 2 is 80 mol % , MO is 19 mol%. The third point C shows the composition of sample No. 3 with 29 mol% of B 2 O 3 , 1 mol% of SiO 2 and 70 mol% of MO. D is sample No. 4 with 90 mol% B 2 O 3 ;
It shows a composition of 1 mol% of SiO 2 and 9 mol% of MO,
At the fifth point E, B 2 O 3 of sample No. 5 is 90 mol%,
Showing a composition of 9 mol% SiO 2 and 1 mol% MO,
At the sixth point F, B 2 O 3 of sample No. 6 is 19 mol%,
The composition is 80 mol% SiO 2 and 1 mol% MO. The composition of the additive components of the sample that falls within the scope of the present invention is within the region surrounded by six straight lines connecting the first to sixth points A to F of the triangular diagram in this order. If the composition is within this range, desired electrical characteristics can be obtained. On the other hand, if the composition of the additive components falls outside the range specified in the present invention, as in Samples Nos. 11 to 13, a dense sintered body cannot be obtained. In addition, the MO component may be any one of BaO, MgO, ZnO, SrO, or CaO, as shown in Sample Nos. 14 to 18, or in an appropriate ratio as shown in other samples. Good too. [Effects of the Invention] According to the present invention, since the composition of the dielectric ceramic composition is as described above, the dielectric constant is 3000 or more, the dielectric loss tan δ is 2.5% or less, and the resistivity ρ is 1×10 6 M
Ω・cm or more, and the temperature change rate of relative dielectric constant is -15% to +15% (based on 25°C) from -55°C to 125°C, -10% to +10% from -25°C to 85°C It is possible to provide a ceramic capacitor with a dielectric ceramic composition that falls within the range of (with reference to 20°C). Further, according to the present invention, since it can be obtained by firing at a temperature of 1200°C or less in a non-oxidizing atmosphere, a conductive paste of a base metal such as nickel is applied to a green sheet, and the green sheet and the conductive paste are A porcelain capacitor can be manufactured by a method in which both are fired at the same time.
第1図は本発明の実施例に係わる積層型磁器コ
ンデンサを示す断面図、第2図は添加成分の組成
範囲を示す三角図である。
12……磁器層、14……内部電極、16……
外部電極。
FIG. 1 is a sectional view showing a multilayer ceramic capacitor according to an embodiment of the present invention, and FIG. 2 is a triangular diagram showing the composition range of additive components. 12...Porcelain layer, 14...Internal electrode, 16...
external electrode.
Claims (1)
この誘電体磁器層を挟持している少なくとも2以
上の内部電極とを備えた磁器コンデンサにおい
て、 前記誘電体磁器組成物が、100重量部の基本成
分と、0.2〜5重量部の添加成分との混合物を焼
成したものからなり、 前記基本成分が (Bak-xMx)Ok(Ti1-zRz)O2-z/2 (但し、MはMg及び/又はZn、RはSc,Y,
Gd,Dy,Ho,Er及びYbから選択された1種ま
たは2種以上の金属元素、k,x,zは 1.00≦k≦1.05 0.01≦x≦0.10 0.002≦z≦0.06 を満足する数値)で表わされる物質からなり、 前記添加成分がB2O3とSiO2とMO(但し、MO
はBaO,SrO,CaO,MgO及びZnOから選択さ
れた1種または2種以上の金属酸化物)とからな
り、 前記B2O3と前記SiO2と前記MOとの組成範囲
が、これらの組成をモル%で示す三角図におけ
る、 前記B2O3が1モル%、前記SiO2が80モル%、
前記MOが19モル%の組成を示す第1の点Aと、 前記B2O3が1モル%、前記SiO2が39モル%、
前記MOが60モル%の組成を示す第2の点Bと、 前記B2O3が29モル%、前記SiO2が1モル%、
前記MOが70モル%の組成を示す第3の点Cと、 前記B2O3が90モル%、前記SiO2が1モル%、
前記MOが9モル%の組成を示す第4の点Dと、 前記B2O3が90モル%、前記SiO2が9モル%、
前記MOが1モル%の組成を示す第5の点Eと、 前記B2O3が19モル%、前記SiO2が80モル%、
前記MOが1モル%の組成を示す第6の点Fと をこの順に結ぶ6本の直線で囲まれた領域内にあ
ることを特徴とする磁器コンデンサ。 2 未焼結の磁器粉末からなる混合物を調製する
工程と、前記混合物からなる未焼結磁器シートを
形成する工程と、前記未焼結磁器シートを少なく
とも2以上の導電性ペースト膜で挟持させた積層
物を形成する工程と、前記積層物を非酸化性雰囲
気中において焼成する工程と、前記焼成を受けた
積層物を酸化性雰囲気中において熱処理する工程
とを備え、 前記未焼結の磁器粉末からなる混合物が、100
重量部の基本成分と、0.2〜5重量部の添加成分
とからなり、 前記基本成分が (Bak-xMx)Ok(Ti1-zRz)O2-z/2 (但し、MはMg及び/又はZn、RはSc,Y,
Gd,Dy,Ho,Er及びYbから選択された1種ま
たは2種以上の金属元素、k,x,zは 1.00≦k≦1.05 0.01≦x≦0.10 0.002≦z≦0.06 を満足する数値)で表わされる物質からなり、 前記添加成分がB2O3とSiO2とMO(但し、MO
はBaO,SrO,CaO,MgO及びZnOから選択さ
れた1種または2種以上の金属酸化物)とからな
り、 前記B2O3と前記SiO2と前記MOとの組成範囲
が、これらの組成をモル%で示す三角図におけ
る、 前記B2O3が1モル%、前記SiO2が80モル%、
前記MOが19モル%の組成を示す第1の点Aと、 前記B2O3が1モル%、前記SiO2が39モル%、
前記MOが60モル%の組成を示す第2の点Bと、 前記B2O3が29モル%、前記SiO2が1モル%、
前記MOが70モル%の組成を示す第3の点Cと、 前記B2O3が90モル%、前記SiO2が1モル%、
前記MOが9モル%の組成を示す第4の点Dと、 前記B2O3が90モル%、前記SiO2が9モル%、
前記MOが1モル%の組成を示す第5の点Eと、 前記B2O3が19モル%、前記SiO2が80モル%、
前記MOが1モル%の組成を示す第6の点Fと をこの順に結ぶ6本の直線で囲まれた領域内にあ
ることを特徴とする磁器コンデンサの製造方法。[Claims] 1. A dielectric ceramic layer made of a dielectric ceramic composition;
In this ceramic capacitor having at least two or more internal electrodes sandwiching a dielectric ceramic layer, the dielectric ceramic composition comprises 100 parts by weight of a basic component and 0.2 to 5 parts by weight of an additive component. It consists of a fired mixture, and the basic components are ( Bakx M x )O k (Ti 1-z R z )O 2-z/2 (where M is Mg and/or Zn, R is Sc, Y ,
One or more metal elements selected from Gd, Dy, Ho, Er, and Yb, k, x, and z are values satisfying 1.00≦k≦1.05 0.01≦x≦0.10 0.002≦z≦0.06) The additive components are B 2 O 3 , SiO 2 and MO (however, MO
is composed of one or more metal oxides selected from BaO, SrO, CaO, MgO and ZnO), and the composition range of the B 2 O 3 , the SiO 2 and the MO is within the range of these compositions. In the triangular diagram showing in mol%, the B 2 O 3 is 1 mol%, the SiO 2 is 80 mol%,
a first point A having a composition of 19 mol % of the MO; 1 mol % of the B 2 O 3 ; and 39 mol % of the SiO 2 ;
a second point B having a composition of 60 mol % of the MO; 29 mol % of the B 2 O 3 ; 1 mol % of the SiO 2 ;
a third point C having a composition of 70 mol % of the MO; 90 mol % of the B 2 O 3 ; 1 mol % of the SiO 2 ;
a fourth point D having a composition of 9 mol % of the MO; 90 mol % of the B 2 O 3 ; 9 mol % of the SiO 2 ;
a fifth point E in which the MO has a composition of 1 mol %; the B 2 O 3 is 19 mol %; the SiO 2 is 80 mol %;
A ceramic capacitor characterized in that the MO is located within a region surrounded by six straight lines connecting in this order a sixth point F having a composition of 1 mol %. 2. A step of preparing a mixture made of unsintered porcelain powder, a step of forming an unsintered porcelain sheet made of the mixture, and a step of sandwiching the unsintered porcelain sheet between at least two or more conductive paste films. forming a laminate, firing the laminate in a non-oxidizing atmosphere, and heat-treating the fired laminate in an oxidizing atmosphere, the unsintered porcelain powder A mixture consisting of 100
It consists of a basic component of 0.2 to 5 parts by weight of an additive component, and the basic component is (Ba kx M x )O k (Ti 1-z R z )O 2-z/2 (However, M is Mg and/or Zn, R is Sc, Y,
One or more metal elements selected from Gd, Dy, Ho, Er, and Yb, k, x, and z are values satisfying 1.00≦k≦1.05 0.01≦x≦0.10 0.002≦z≦0.06) The additive components are B 2 O 3 , SiO 2 and MO (however, MO
is composed of one or more metal oxides selected from BaO, SrO, CaO, MgO and ZnO), and the composition range of the B 2 O 3 , the SiO 2 and the MO is within the range of these compositions. In the triangular diagram showing in mol%, the B 2 O 3 is 1 mol%, the SiO 2 is 80 mol%,
a first point A having a composition of 19 mol % of the MO; 1 mol % of the B 2 O 3 ; and 39 mol % of the SiO 2 ;
a second point B having a composition of 60 mol % of the MO; 29 mol % of the B 2 O 3 ; 1 mol % of the SiO 2 ;
a third point C having a composition of 70 mol % of the MO; 90 mol % of the B 2 O 3 ; 1 mol % of the SiO 2 ;
a fourth point D having a composition of 9 mol % of the MO; 90 mol % of the B 2 O 3 ; 9 mol % of the SiO 2 ;
a fifth point E in which the MO has a composition of 1 mol %; the B 2 O 3 is 19 mol %; the SiO 2 is 80 mol %;
A method for manufacturing a ceramic capacitor, characterized in that the MO is located within a region surrounded by six straight lines connecting in this order a sixth point F having a composition of 1 mol %.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076764A JPH03278414A (en) | 1990-03-28 | 1990-03-28 | Porcelain capacitor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076764A JPH03278414A (en) | 1990-03-28 | 1990-03-28 | Porcelain capacitor and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03278414A JPH03278414A (en) | 1991-12-10 |
| JPH0532896B2 true JPH0532896B2 (en) | 1993-05-18 |
Family
ID=13614663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2076764A Granted JPH03278414A (en) | 1990-03-28 | 1990-03-28 | Porcelain capacitor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03278414A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5132972B2 (en) * | 2007-04-09 | 2013-01-30 | 太陽誘電株式会社 | Dielectric ceramics, manufacturing method thereof, and multilayer ceramic capacitor |
-
1990
- 1990-03-28 JP JP2076764A patent/JPH03278414A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03278414A (en) | 1991-12-10 |
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