JPH0533255Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a diamond cutting wheel used for cutting concrete, asphalt, stone, and other materials.

[Conventional technology]

As a conventional diamond cutting grindstone,
A device in which a large number of segment chips are fixed to the outer periphery of a disk-shaped iron substrate is known.

This segment type diamond cutting wheel is superior to continuous type diamond cutting wheels, which have a layer of grinding wheel fixed to the entire outer periphery of the substrate, due to the action of the slits provided between the segment chips. ing.

However, it is difficult to completely discharge chips even with such segment type machines, and there is a desire for a tool that is even more effective in discharging chips.

Furthermore, in such a diamond cutting wheel, a large amount of frictional heat is generated during cutting, particularly in the middle region of the segment chips, which causes burning of the cutting wheel and a reduction in cutting ability.

Therefore, in order to solve the conventional problems,
Various attempts have been made.

For example, Japanese Utility Model Application Publication No. 61-35742 discloses a cutting whetstone in which concave portions are formed on the outer peripheral surface of segment chips.

[The problem that the idea aims to solve]

However, the recess formed in the same publication has a rectangular cross section where the bottom and side surfaces of the recess intersect at right angles, and chips tend to remain at the corner where the bottom and side surfaces intersect, making it difficult to effectively remove chips. is difficult to discharge. Furthermore, with such a structure, it is not possible to reduce the temperature rise at the center of the segment chip.

This problem can be solved, for example, by dividing the segment chip into smaller pieces to increase the number of slits, or by increasing the width of the slits.

However, when the slit width is increased, the segment tip hits the workpiece intermittently during cutting, resulting in
It also causes vibrations that affect sharpness.

Furthermore, when the number of slits is increased, the length of each segment chip becomes shorter, the bonding area between the chip and the iron substrate decreases, and safe adhesion cannot be maintained.

The problem to be solved by the present invention is a method for maintaining the adhesion of segment chips in a segment type cutting wheel while enhancing the chip discharge effect, and effectively reducing the generation of frictional heat generated by cutting. It's about getting.

[Means to solve the problem]

In order to solve the above-mentioned problems, the diamond cutting grindstone of the present invention has trapezoidal concave portions extending outward at both ends of the outer peripheral surface of a segment chip fixed to the outer periphery of a disc-shaped iron substrate, It is characterized in that a recessed portion for supplying cooling water is formed at an intermediate position at the bonded portion to the iron substrate.

For the purpose of removing chips, the trapezoid-shaped recess should preferably have a width of 1.0 mm to 10 mm at the narrow end and a depth of 2 mm to about 1 mm from the base so as not to divide the chip.

In addition, the trapezoidal recess essentially has the same function as a slit, so even if it is open outward, it has a shape that does not affect the grinding wheel, the substrate, or the overall strength, and can be placed at any location. Any number of them can be provided.

[Effect]

In the present invention, the outwardly expanding trapezoidal recesses provided at both ends of the outer peripheral surface of the segment chip allow
Chips during cutting are discharged to the outside along the trapezoidal tapered surface, and the discharge of chips is more complete without shortening the segment tip.

In addition, by forming a recess for supplying cooling water at the bonded part with the iron substrate, which is located approximately in the middle of the segment chip, the central part of the segment chip, which conventionally reaches the highest temperature during cutting, can be effectively cooled. becomes possible.

〔Example〕

FIGS. 1 and 2 are plan views showing the diamond cutting grindstone of this example.

As shown in the figure, the diamond cutting whetstone of this embodiment has segment chips 3 fixed to the outer peripheral surface of a disk-shaped iron substrate 2 on which slits 1 are provided at equal intervals. Two trapezoidal recesses 4 are formed that widen in the direction, and a recess 5 is formed at approximately the middle of the segment chip and at the bonded portion to the iron substrate.

The trapezoidal recess 4 has a trapezoidal shape with a width a of 1.0 mm to 10 mm widening toward the periphery as shown in FIG. 2, and a depth b of at least 1/2 the height of the segment chip 3.

In this way, by making the recess 4 into an outwardly expanding trapezoidal shape, chips from cutting are discharged to the outside along the tapered surface, and the chips are discharged more completely. It is possible to reduce the increase in cutting resistance due to residual chips at the points and the wear of the segment tips.

The recess 5 is provided approximately in the middle of the segment chip 3, thereby making it possible to efficiently supply cooling water flowing along the side surface of the substrate 2 during the cutting operation.

This makes it possible to effectively cool the central portion of the segment chip 3, which conventionally tends to reach the highest temperature during cutting, and to effectively discharge chips.

Furthermore, when the segment tip 3 is worn down to the bottom of the concave portion 4 on the outer periphery, the concave portion 5 on the iron substrate 2 side opens, so that a concave portion always exists on the cutting surface of the tip during use, increasing grinding efficiency. be able to.

[Effect of idea]

The present invention can achieve the following effects.

(1) Since trapezoidal recesses are formed on both ends of the outer circumferential surface of the segment chip, the length of each segment chip can be maintained without shortening, and the adhesive force can be maintained and chips can be discharged. The effect can be increased.

(2) Since a recess for supplying cooling water is formed at the bonded part with the iron substrate, which is approximately in the middle of the segment chip, the central part of the segment chip, which conventionally reaches the highest temperature during cutting, can be effectively cut. It becomes possible to cool down and improve cutting performance. Furthermore, since cooling water can be effectively supplied, the discharge of chips is promoted, and an increase in cutting resistance due to residual chips at the cutting point and wear of the segment chips can be reduced.

[Brief explanation of the drawing]

FIG. 1 is an overall plan view of a diamond cutting wheel according to an embodiment of the present invention, and FIG. 2 is an enlarged view of the main parts of the diamond cutting wheel shown in FIG. 1. 1... Slit, 2... Iron substrate, 3... Segment chip, 4, 5... Trapezoidal recess.

Claims (1)

[Scope of utility model registration request] A trapezoidal concave portion 4 expanding outward is formed at both ends of the outer circumferential surface of the segment chip 3 fixed to the outer circumference of the disk-shaped iron substrate 2.
A diamond cutting grindstone characterized in that a recess 5 for supplying cooling water is formed at a substantially intermediate position of the segment chip 3 and at the bonded portion to the iron substrate 2.