JPH05335437A - Semiconductor device - Google Patents

Abstract

(57) [Abstract] [Purpose] To obtain a semiconductor device that prevents solder defects during mounting. [Structure] A solder resist 4 is formed on the end surface electrode 2 having a good solderability by gold plating or solder plating, from the central portion to the upper portion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device having an end face electrode.

[0002]

2. Description of the Related Art A semiconductor device having an end face electrode is shown in FIG.
As shown in (a) and (b), one or a plurality of semiconductor elements 8 are attached to a package substrate 1 having an end surface electrode 2 having a shape obtained by cutting a through hole in half and a concave element mounting portion 12 with an adhesive 10. The semiconductor element 8 and the wiring 9 are connected by a bonding wire 11, and the semiconductor element 8 and the bonding wire 11 are sealed with a resin 3 such as an epoxy resin.

FIG. 4A is a perspective view showing the vicinity of an end face electrode of this conventional semiconductor device. Au plating, solder plating, or the like is applied to the entire surface of the end face electrode 2 to finish the solderability.

[0004]

When the above-described semiconductor device is mounted on a mounting board, a certain amount of solder is applied to the mounting electrodes on the mounting board by a certain printing method.
The semiconductor device is mounted so that the end surface electrodes and the mounting electrodes on the mounting substrate match. After that, by soldering the end face electrode and the mounting electrode by a solder reflow method using far infrared rays,
The mounting of the semiconductor device on the mounting board has been completed.

However, in the case of the conventional end face electrode 2, since the entire surface of the end face electrode is finished to have a very good solderability by Au plating or the like, at the time of solder reflow, as shown in FIG. 4 (b). Since the solder 5 printed on the mounting electrode 6 is sucked up more than necessary, there occurs a problem that the amount of solder necessary for connecting the mounting electrode 6 and the end surface electrode 2 does not remain on the mounting electrode 6, and the semiconductor There is a problem that the mounting reliability of the device is reduced.

[0006]

A semiconductor device according to the present invention includes a package substrate having a plated end surface electrode on its side surface, a semiconductor element fixed on the package substrate, and the semiconductor element sealed. In a semiconductor device having a resin, a region that hinders solderability is provided in the central portion of the end face electrode.

[0007]

The present invention will now be described with reference to the drawings.

FIGS. 1 (a) and 1 (b) are perspective views showing the vicinity of an end face electrode for explaining a first embodiment of the present invention.

As shown in FIGS. 3A and 3B, the semiconductor device includes a package substrate 1 having an end face electrode 2, wiring 9 and a semiconductor element mounting portion 12, and an adhesive 10 on the package substrate 1. The semiconductor element 8 fixed by the above, the bonding wire 11 for connecting the semiconductor element 8 and the wiring 9 provided on the package substrate 1, and the resin 3 such as epoxy for sealing the semiconductor element 8 and the like. Is configured.

The end surface electrode 2 is previously finished in a good solderability state by Au plating, solder plating, or the like, and a solder resist 4 is applied especially from the central portion to the upper portion.

When the semiconductor device of the first embodiment having the above-described structure is mounted, as shown in FIG. 1B, the mounting electrode 6 and the end face electrode 2 of the semiconductor device are formed by the far infrared solder reflow method. , Solder connection is made, but the solder resist 4 prevents the solder 5 from being sucked upward in the end face electrode 2. For this reason, the amount of solder for obtaining the connection between the mounting electrode 6 and the end surface electrode 2 is sufficient, so that the reliability of mounting is improved.

FIGS. 2A and 2B are perspective views showing the vicinity of the end face electrodes of the semiconductor device according to the second embodiment of the present invention.

End face electrodes 2 provided on the package substrate 1
Au is pre-plated with Au or solder in order to improve solderability, but the central portion of the end face electrode 2A of the second embodiment has an unplated portion 7 not plated with these. Have In this unplated portion 7, before the end face electrode 2A is plated, a solder resist or a photoresist is applied to a part of the end face electrode 2A, and after the plating is performed, the solder resist or the photoresist is removed. Form.

When mounting the semiconductor device of the second embodiment having such a structure, the mounting electrode 6 and the end face electrode 2A of the semiconductor device are soldered by the far infrared ray reflow method as shown in FIG. 2B. However, since the unplated portion 7 is inferior in solderability, the end face electrode 2 is formed similarly to the first embodiment.
Since the solder 5 is prevented from being sucked up in the upper direction,
The mounting electrode 6 and the end surface electrode 2A are connected with a sufficient amount of solder.

[0015]

As described above, according to the present invention, since a region having poor solderability is formed in the central portion of the end face electrode, it is possible to prevent excess solder from being sucked up to the end face electrode during mounting. It is possible to secure the amount of solder required for the connection between the electrode and the end face electrode. Therefore, there is an effect that the reliability of mounting can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of the vicinity of an end face electrode according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the vicinity of an end face electrode according to a second embodiment of the present invention.

3A and 3B are a perspective view and a cross-sectional view of a semiconductor device which is an object of the present invention.

FIG. 4 is a perspective view of an end face electrode and its vicinity of a conventional semiconductor device.

[Explanation of symbols]

 1 Package Substrate 2, 2A End Face Electrode 3 Resin 4 Solder Resist 5 Solder 6 Mounting Electrode 7 Unplated Part 8 Semiconductor Element 9 Wiring 10 Adhesive 11 Bonding Wire 12 Element Mounting Part

Claims (1)

[Claims] 1. A semiconductor device comprising a package substrate having a plated end surface electrode on a side surface thereof, a semiconductor element fixed on the package substrate, and a resin sealing the semiconductor element, wherein the end surface electrode is provided. A semiconductor device having a region for impairing solderability in a central portion of the semiconductor device.