JPH0533600U - Electronic component automatic mounting device - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to easily align the center of a take-out tool with the center of a part when taking out an electronic part from a part supply device, so that the part can be taken out reliably. [Structure] The CPU (39) takes into account the deviation amount between the suction nozzle (11) center and the component (4) center of each component supply device (7) stored in the RAM (40), and the component supply table (6). ) Move XY.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 According to the present invention, a chip-shaped electronic component supplied to a component removal position by a component supply device is taken out by a take-out tool of a take-out head section, the take-out state is recognized by a recognition device, and the positional deviation between the take-out tool and the part The present invention relates to an electronic component automatic mounting device that corrects and mounts on a printed circuit board.

[0002]

[Prior Art]

 This type of automatic electronic component mounting apparatus is disclosed in Japanese Patent Application Laid-Open No. 2-103998. This prevents mistakes in ejection by the ejector by adjusting the movement stop position of the component supply base based on the play amount data of the electronic components in the tape storage hole stored in the storage device. is there.

However, the play amount data is the play amount only in the direction parallel to the horizontal movement direction of the component supply table in the storage hole, and does not consider the play amount in the vertical direction. It is thought that mistakes will occur.

[0004]

[Problems to be solved by the device]

 Therefore, it is an object of the present invention to easily align the center of the take-out tool with the center of the part when the electronic part is taken out from the part supply device so that the part can be taken out surely.

[0005]

[Means for Solving the Problems]

 Therefore, in the present invention, the chip-shaped electronic component supplied to the component removal position by the component supply device is taken out by the take-out tool of the take-out head part, and the taking-out state is recognized by the recognition device, and the positional deviation of the take-out tool and the part In an electronic component automatic mounting apparatus that corrects the temperature and mounts it on a printed circuit board, a plurality of the component supply devices are mounted, and the component supply base is movable in the XY directions, and the supply device for each of the component supply devices. A storage device that stores the amount of deviation between the center of the component that is supplied from the center and the center of the take-out tool, and the component supply table is moved in the XY direction in consideration of the amount of deviation that is stored in the storage device when the part is taken out. And a control device for controlling the control.

[0006]

[Action]

 With the above configuration, the control device considers the deviation amount between the center of the parts supplied from the supply device and the center of the takeout tool for each parts supply device stored in the storage device when the parts are taken out. Move the supply base XY.

[0007]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(1) is an XY table that is moved in the X and Y directions by driving the X-axis servo motor (2) and the Y-axis servo motor (3). A printed circuit board (5) on which a component (4) is mounted is placed.

(6) is a parts supply table in which a large number of parts supply devices (7) are installed in parallel, and is moved in the X and Y directions by driving the X axis servo motor (8) and the Y axis servo motor (9). It

A plurality of suction head parts (12) provided with a plurality of suction nozzles (11) for picking up and carrying the chip component (4) from the component supply device (7) are installed on the lower surface (10). The rotary disk is rotated intermittently by the rotation of the rotary disk servo motor (13).

Further, a fitting groove (11A) into which a nozzle rotation fitting portion (30) described later is fitted is provided on the suction nozzle (11).

Reference numeral (100) is an acrylic diffuser plate that is mounted over all the suction nozzles (11).

Reference numeral () is a suction station for taking out the chip component (4) from the component supply device (7).

Reference numeral () is a component presence / absence detection station for detecting whether or not the chip component (4) is suction-held by the suction nozzle (11) by the component presence / absence detection device (18).

Reference numeral () is a recognition station for recognizing the state of the chip component (4) sucked by the suction nozzle (11) by the recognition device (14).

Reference numeral () is a nozzle rotation correction station for correcting the rotation of the chip component (4) by the nozzle rotation positioning device (22) based on the recognition result by the recognition device (14).

Reference numeral () is a mounting station for mounting the chip component (4) on the printed circuit board (5) after the work at the nozzle rotation correction station ().

Reference numeral () denotes an ejection station for ejecting a chip component (4) which should not be mounted, for example, as a result of recognition by the recognition device (14), for example, the adsorbed chip component (4) is different.

Reference numeral () is a nozzle selection station for selecting the suction nozzle (11) corresponding to the chip component (4) to be sucked at the suction station (), and a gear provided on the outer diameter portion of the suction head portion (12). A drive gear serving as a nozzle selection unit by rotation of a drive gear servomotor (15) (see FIG. 1) that is moved by a drive system (not shown) and is rotated after meshing with the gear. The desired suction nozzle (11) is selected by the rotation of (16).

The turntable (10) will be described below with reference to FIG.

Reference numeral (50) is a hollow cylindrical shape that is suspended and fixed to the mounting base (52A) of the index unit (52) so as to surround the upper portion of the cylindrical portion (51) formed on the upper portion of the turntable (10). It is a cylindrical cam member for guiding the rotating disk. A cam (53) is formed on the lower end peripheral side of the cam member (50) over substantially the entire circumference, and a spring (54) is formed on the upper surface of the cam (53) so that each suction head part (12). A roller (55) as a sliding part provided at the upper end rotates while being pressed, and each suction head part (12) rotates up and down together with the turntable (10) according to the shape of the cam (53). That is, a pair of guide rods (56) is erected in each suction head portion (12) so as to vertically pass through the rotary disc (10), and a roller (55) is provided at an upper end of the rod (56). A mounting member (57) rotatably provided is fixed. Therefore, each suction head part (12) is supported by the turntable (10) so as to be vertically movable. When the suction head (12) moves downward, the chip station () sucks the chip component (4) and the mounting station () mounts the chip component (4) on the printed circuit board (5). Is regulated by a downward movement stopper (81) provided on a main body base (80) of the electronic component automatic mounting apparatus so that only a plurality of desired suction nozzles (11) are lowered.

Reference numeral (58) is a hose as a connecting body that communicates with a vacuum pump (not shown). The other end of each hose (58) is connected to a connecting hose (59) which is embedded through the rotary disk (10), and the connecting hose (59) is a switching valve (60) and a horizontally long intake passage (61). , Vacuum communication via the central intake passage (62).

Reference numeral (63) is a suction-type suction clutch solenoid that restricts the lowering of the suction head portion (12) at the suction station () to stop the suction operation, if necessary, and is of a cam mechanism (64). It has an abutment lever (66) that abuts against the suction head part vertical movement lever (65) so as not to be lowered by driving. That is, when the clutch solenoid (63) is demagnetized, the contact lever (66) is brought into contact with the vertical movement lever (65) so that the vertical movement lever (65) is not lowered. Incidentally, the same structure is also provided in the mounting station ().

Next, the component presence / absence detection device (18) provided in the component presence / absence detection station () will be described with reference to FIG.

The component presence / absence detection device (18) detects whether or not the light emitted from the light emitting element (19) is received by the light receiving element (20). That is, if the light emitted from the light emitting element (19) is blocked by the chip component (4) and is not received by the light receiving element (20), it is "part present", and if it is received, "no component".

Next, the recognition device (14) provided in the recognition station () will be described with reference to FIG.

Reference numeral (71) is a CCD camera for recognizing the state where the chip component (4) is sucked by the suction nozzle (11), and is located below the chip component (4) conveyed to above the recognition device (14). The image obtained by utilizing the reflection of the two mirrors (73) and (74) mounted in the parked box (72) is recognized through the lens (75). That is, light from a light source (not shown) is applied to the chip component (4) through the diffuser plate (100), the CCD camera (71) captures a silhouette image, and the recognition device (14) recognizes it.

Next, the nozzle rotation positioning device (22) of the nozzle rotation correction station () will be described with reference to FIGS. 6 and 7.

Reference numeral (22A) is a nozzle rotation motor as a drive source for rotating the suction nozzle (11) by θ, which is fitted into the bearing body (27) through the coupling (26) on the output shaft (25). A nozzle rotating rod (29) described later is attached to the rotating body (28) so as to be vertically movable.

Reference numeral (29) is a nozzle rotating rod fitted in the nozzle rotating body (28) and having a nozzle rotating fitting portion (30) at the lower end, and is a vertically long member provided on the nozzle rotating body (28). A pin (32) protruding from the hole (31) is provided. The fitting portion (30) for rotating the nozzle is formed so as to become narrower toward the lower end so as to fit into the fitted groove (11A). Further, the nozzle rotating rod (29) is provided with a locking portion (34) for locking a spring (33) as cushion means between the nozzle rotating rod (29) and the bottom surface of the nozzle rotating body (28). 34), a swing lever (37) attached via a rod end (36) to a vertical movement lever (35) that is vertically moved by a cam as a drive source (not shown) is locked. As the swing lever (37) swings up and down in accordance with the vertical movement of the moving lever (35), the nozzle rotating rod (29) moves up and down while being biased by the spring (33).

Reference numeral (38) in FIG. 1 denotes an interface, which is connected to the XY table (1), the component supply table (6), the turntable (10), the drive gear (16) and the nozzle rotation positioning device (22). On the other hand, each of these control elements is program-controlled by the CPU (39) as a control device.

Reference numeral (40) is a RAM serving as a storage device, and the rotation center position data of each of the suction nozzles (11), the recognition position data of the chip component (4) by the recognition device (14), and FIG. NC data (X direction, Y direction, θ direction) indicating the mounting position of each chip component (4) on the printed circuit board (5) and the like are stored in each predetermined area. Further, (41) is a ROM as a storage device for storing the operation program.

Since the set position of the rotation sensor of the suction nozzle (11) may be displaced due to temperature change, aging change, etc., if the set temperature is exceeded or a certain time passes, the chip part (4) Even if the recognition device (14) recognizes each suction nozzle (11) in a state in which the suction nozzle is not sucked, the shift amount of the rotation center of the suction nozzle (11) is calculated, and the shift amount is stored in the RAM (40) again. The deviation amount may be added to the rotation center position data of the suction nozzle (11).

A drive circuit (42) is connected to the CPU (39), and the drive circuit (42) is connected to the X-axis servomotors (2) and (8) and the Y-axis servomotor (3). And (9), the turntable servomotor (13), the drive gear servomotor (15), and the nozzle rotation motor (22A) are connected.

The operation will be described below.

First, before the mounting operation, the recognition device (14) recognizes the rotation center position of each suction nozzle (11) (based on a reference point such as the image center of the CCD camera (71)). The rotation center position data is stored in the RAM (40).

Here, the mounting operation is performed based on the NC data of the mounting step shown in FIG. First, based on the step number "1", the component supply table (6) is moved to the suction station () by driving the component supply section servomotor (8), and the chip component (4) of the component data "R ₁ " is moved to the component removal position. ) Is stored in the parts supply device (7). Then, the suction nozzle (11) is moved above the chip component (4) housed in the standby component supply device (7) and sucks the chip component (4) as shown in FIGS. 5 and 6. The lower end of the nozzle (11) is suction-held. In the station (), the lower end of the suction nozzle (11) of the suction head portion (12) must be lowered to the position of the chip component (4) housed in the component supply device (7), which is a cam member (50). ), The roller (55) at the upper end of the head portion (12) is placed on the vertically movable upper and lower rails (not shown) arranged at the discontinuous portion of the cam (53), and the upper and lower rails are lowered. It is done by doing.

The presence / absence detection operation of the chip component (4) in the component presence / absence detection station () will be described below.

The suction nozzle (11) sucking the chip component (4) by the rotation of the turntable (10) passes between the light emitting element (19) and the light receiving element (20) of the component presence / absence detection device (18). It At this time, if the chip component (4) is adsorbed by the adsorption nozzle (11), the light emitted from the light emitting element (19) is blocked by the chip component (4) and is received by the light receiving element (20). Accordingly, the device (18) sends a signal "part present" to the CPU (39), and if not adsorbed, the light emitted from the light emitting element (19) is received by the light receiving element (20), Therefore, the device (18) sends a signal "no component" to the CPU (39).

Here, the subsequent operation in the case of “parts exist” will be described.

At this time, the suction operation of the chip component (4) of the component data “R ₂ ” is being performed in the suction station ().

The operation of recognizing the attitude of the chip part (4) at the next recognition station () will be described.

Here, the position of the chip part (4) is based on two mutually perpendicular lines passing through the image centers of the CCD cameras (71) that are adsorbed by the adsorption nozzle (11) by the recognition device (14). Is recognized and the recognition data (X1, Y1, θ1) is stored in the RAM (40).

At this time, at the suction station (), the suction operation of the chip component (4) of the component data “R ₃ ” is being performed.

A rotation correction operation of the chip part (4) in the θ direction in the nozzle rotation correction station () will be described below.

The recognition angle data (θ1) is, for example, an angle formed by an intersecting line formed by extending one of the two lines passing through the image center and the reference end face of the chip component (4).

A comparison device (not shown) compares the mounting angle data (θ ₁ ) of the NC data indicating the mounting position and the like stored in the RAM (40) and the recognition angle data (θ ₁ ) with each other, and there is a deviation amount. In such a case, the amount of deviation (Δθ) is calculated by a calculation device (not shown), stored in RAM (40), and rotation correction is performed. That is, the vertical movement lever (35) is lowered by the driving of the cam, the swing lever (37) is swung downward, and the nose rotation fitting portion (30) is biased by the spring (33). The nozzle rotation motor (22A) is rotated by a deviation amount (Δθ) after coming into contact with the tapered portion of the fitted groove (11A) provided on the suction head portion (12), and thus the suction nozzle ( 11) is rotated and the chip component (4) is aligned.

At this time, the suction operation of the chip component (4) of the component data “R ₄ ” is being performed in the suction station ().

Then, in the mounting station (), the printed board (5) is moved in the XY direction by the XY table (1) in consideration of the deviation amounts (ΔX, ΔY) in the X and Y directions, and the chip component (4). Are mounted in place.

At this time, the suction operation of the chip component (4) of the component data “R ₅ ” is performed in the suction station ().

If the recognition device (14) determines that the chip component (4) should not be mounted, the turntable (10) continues to rotate and is moved to the discharge station (). To be done. For example, when the chip components (4) attracted are different, they are discharged without performing the mounting work at the mounting station ().

The suction nozzle (11) used next in the next nozzle selection station () is rotated after the drive gear (16) meshes with the gear provided in the suction head section (12). Accordingly, it is selected by rotating the suction head portion (12).

Thereafter, the mounting work is sequentially performed in the same manner, and the deviation amount is stored in the RAM (40) for each component supply device (7). When the recognition frequency counter (not shown) in the CPU (39) recognizes the chip component (4) supplied from the same component supply device (7) N times, the calculation device calculates the average of the N deviation amounts. And stores it in the RAM (40). Based on the average displacement amount, the component displacement amount in the X direction and the Y direction is corrected in the subsequent suction operation. That is, when the component is supplied from the component supply device (7) which has been recognized N times, the chip component (4) is aligned so that the center of the suction nozzle (11) and the center of the chip component (4) are aligned. Adjust the supply position of in the X and Y directions. At this time, the correction movement of the average deviation amount in the X direction and the Y direction is performed by the movement of the component supply table (6) by driving the X axis and Y axis servo motors (8) and (9).

When a plurality of suction nozzles (11) are provided in the suction head part (12), whichever nozzle (11) is used, the center of the nozzle (11) and the chip part (4) are It must be matched with the center. In this case, this can be done by storing the deviation amount of each nozzle (11) with respect to each component (4).

The correction in the X direction and the Y direction as in the present embodiment is performed not only in the subsequent suction operation based on the above-mentioned initially recognized average deviation amount of N times, but for example, N times at the beginning. The deviation amount is stored in the RAM (40), the average deviation amount is calculated by a calculation device based on the deviation amount, and the average deviation amount is stored in the RAM (40). The supply position of () is a position corrected by the average deviation amount. Then, when the supply of the chip component (4) for N times accompanied by the correction operation is completed, the deviation amount for the next N times is obtained again, the average thereof is calculated, and the supply of the chip component (4) is performed thereafter. , And the new average deviation amount may be used.

Further, in this embodiment, the recognition operation is performed N times while performing the mounting operation to obtain the average deviation amount, and the component supply table (6) is moved to XY in consideration of the average deviation amount in the subsequent suction operation. Although it is moved, the component is recognized N times in advance for each component supply device (7) before the actual mounting operation, and the chip component (4) is not mounted on the printed circuit board (5) and only the displacement amount is RAM. The average shift amount may be used from the beginning of the component mounting operation by storing it in (40).

Further, the XY correction may be performed based on the data once instead of taking the average of N times.

Further, as in the present invention, since the component supply table (6) can be moved in XY according to the position of the suction nozzle (11), for example, the nozzle (11) is not selectively rotated at the nozzle selection station (). In addition, the component supply table (6) may be moved in XY according to the position of the nozzle (11).

Further, it is not necessary to provide a plurality of suction nozzles (11) concentrically with the suction head section (12), and the head section (12) can be made smaller.

[0060]

[Effect of the device]

 As described above, according to the present invention, since the component supply table can be moved in the Y direction, the ejector center and the component center can be aligned with each other, and a suction error can be prevented.

[Brief description of drawings]

FIG. 1 is a schematic circuit diagram of an electronic component automatic mounting apparatus of the present invention.

FIG. 2 is a plan view of the mounting device.

FIG. 3 is a side sectional view of a main part of a turntable.

FIG. 4 is a component presence / absence detection device.

FIG. 5 is a side view of the recognition device.

FIG. 6 is a diagram showing a nozzle rotation correction station.

FIG. 7 is a perspective view of a nozzle rotation positioning device.

FIG. 8 is a diagram showing NC data relating to component mounting.

[Explanation of symbols]

 (6) Parts supply stand (7) Parts supply device (8) X-axis servo motor (9) Y-axis servo motor (11) Suction nozzle (take-out tool) (14) Recognition device (39) CPU (control device) (40) ) RAM (storage device)

Claims (1)

[Scope of utility model registration request] 1. A chip-shaped electronic component supplied to a component extraction position by a component supply device is taken out by a take-out tool of a take-out head section, the take-out state is recognized by a recognition device, and the positional deviation between the take-out tool and the part is taken. In an electronic component automatic mounting apparatus that corrects the temperature and mounts it on a printed circuit board, a plurality of the component supply devices are mounted and movable in XY directions, and the supply device for each component supply device. A storage device that stores the amount of deviation between the center of the parts to be supplied and the center of the take-out tool, and the XY movement of the parts supply table in consideration of the amount of deviation stored in the storage device when the parts are taken out. An electronic component automatic mounting device comprising a control device for controlling.