JPH0777314B2 - Electronic component automatic mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention is designed to detect the ejection nozzle by a nozzle rotation device based on the angular position data of the chip-shaped electronic component held by the ejection nozzle recognized by the recognition device. The present invention relates to an electronic component automatic mounting apparatus having a function of mounting the component on a printed circuit board after rotating and correcting the component to an appropriate angular position.

(B) Conventional Technology Generally, the following technology is disclosed in Japanese Patent Application Laid-Open No. 62-55998 as a conventional technology of this type of electronic component automatic mounting apparatus. That is, the turn holder is arranged and held on the outer periphery of the intermittent rotation support body in correspondence with the intermittent rotation pitch, and a plurality of types of suction nozzles are automatically arranged and held in each of the turn holders. Nozzle selecting means for selecting the suction nozzle to be used by rotationally driving the turn holder in correspondence with each stop position on the movement path by the intermittent rotation support body, and supplying a component to the selected suction nozzle and suctioning. The component supply means for holding the component, the position detecting means for detecting the angular position of the component held by the suction nozzle, and the suction nozzle for sucking the component are rotationally driven to determine the angular position of the component as the angular position detection data. Nozzle rotating means for setting or correcting based on the above is sequentially arranged in the rotation direction of the intermittent rotation support body to mount the component on the substrate.

However, in the component mounting by this device, if the angular position of the component held by the suction nozzle is detected and there is a deviation between the position data and the set position data, the nozzle rotating means causes the nozzle to rotate. Although the components are mounted after the components are rotated by adjusting the angular position of the component, even if it is necessary to improve the angular position accuracy depending on the component or the mounting pattern on the board, Since it has not been confirmed that the angular alignment has been completed, it may be mounted at a position deviated from the set position on the substrate. In addition, it could not be corrected again.

(C) Problems to be Solved by the Invention Therefore, when it is necessary to improve the angular position accuracy, it is necessary to switch to a correction operation program that repeats rotation correction.

(D) Means for Solving the Problem Therefore, according to the present invention, based on the angular position data of the chip-shaped electronic component held by the take-out nozzle recognized by the recognition device, the take-out nozzle is rotated by the nozzle rotating device to be appropriate. In an automatic electronic component mounting apparatus having a function of mounting the component on the printed circuit board after the correction so that the angular position is achieved, an open position correction is performed only once after the recognition.
A storage device for storing a loop correction operation program and a closed loop correction operation program for keeping a difference between an angular position recognized as repeatable rotation correction and the proper angular position within a certain allowable range, and the storage device A selection device for selecting any one of the programs stored in, and a control device for controlling the correction operation according to the program selected by the selection device are provided.

Further, according to the present invention, based on the angular position data of the chip-shaped electronic component held by the pick-up nozzle recognized by the recognition device, the pick-up nozzle is rotated by the nozzle rotating device to correct it so as to obtain an appropriate angular position, and then printing is performed. In an electronic component automatic mounting apparatus having a function of mounting the component on the board, an open-circuit that performs rotation correction only once after the recognition is performed.
A storage device for storing a loop correction operation program and a closed loop correction operation program for keeping a difference between an angular position recognized as repeatable rotation correction and the proper angular position within a certain allowable range, and the storage device A selection device for selecting any one of the programs stored in the above for each type of parts to be mounted on the board, and a control device for controlling the correction operation according to the program selected by the selection device are provided. It is a thing.

Further, according to the present invention, based on the angular position data of the chip-shaped electronic component held by the pick-up nozzle recognized by the recognition device, the pick-up nozzle is rotated by the nozzle rotating device to correct it so as to obtain an appropriate angular position, and then printing is performed. In an electronic component automatic mounting apparatus having a function of mounting the component on the board, an open-circuit that performs rotation correction only once after the recognition is performed.
A storage device for storing a loop correction operation program and a closed loop correction operation program for keeping a difference between an angular position recognized as repeatable rotation correction and the proper angular position within a certain allowable range, and the storage device A selection device for selecting any of the programs stored in the above for each mounting on the board on which the component is mounted; and a control device for controlling the correction operation according to the program selected by the selection device. It is provided.

(E) Operation With the above configuration, the open loop correction operation stored in the storage device is selected from the program by the selection device, and one of the closed loop correction operation programs is selected, and the control device rotates according to the selected program. The correction operation is performed. Further, either the open loop correction operation program or the closed loop correction operation program stored in the storage device is selected by the selection device for each type of component, and the rotation correction operation is performed by the control device in accordance with the selected program. Done.

In addition, the open device stored in the storage device by the selection device
Either the loop correction operation program or the closed loop correction operation program is selected for each mounting on the board,
The rotation correction operation is performed by the control device according to the selected program.

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

(1) is an XY table that is moved in the X and Y directions by driving the X-axis servo motor (2) and the Y-axis servo motor (3), and is a chip-shaped electronic component (4) (hereinafter referred to as chip component (4)). The printed circuit board (5) on which the (.) Is mounted is placed.

(6) is a component supply table in which a large number of component supply devices (7) are arranged side by side, and the ball screw (8A) is rotated by the drive of the component supply section servomotor (8) to be guided by the guide (9) and X. Direction (left and right direction in FIG. 1).

Reference numeral (10) is a suction head portion (12) as a pickup head portion provided with a plurality of suction nozzles (11) as pickup nozzles for picking up and carrying the chip component (4) from the component supply device (7) on the lower surface. Is installed in a large number, and is intermittently rotated by the rotation of the rotary disk servomotor (13).

In addition, a fitting groove (11A) into which a fitting portion (30) (30A) described later is fitted is provided in the upper portion of the suction nozzle (11), and a contact rod (52) described later contacts. The contacted part (11B) is provided.

(I) is a suction station for taking out the chip component (4) from the component supply device (7).

(II) recognizes the state of the chip component (4) sucked by the suction nozzle (11) by the recognition device (14) and corrects the rotation of the chip component (4) based on the recognition result. It is a nozzle rotation correction station. In the first nozzle rotation correction station (II), correction is performed on the chip component (4) having leads such as SOP and QFP, or the chip component (4) having many leads among those having leads. That is,
The chip component (4) that must be mounted on the pattern of the printed circuit board (5) with high accuracy is handled, and when the correction is completed, the recognition device (14) re-recognizes it. If the correction is not completed, correct it again. , The above operation is repeated until the correction is completed (until the error is within a certain range) (hereinafter, referred to as closed loop correction).

(III) is a second nozzle rotation correction station that performs rotation correction on a chip component (4) without lead such as LCC or a chip component (4) with lead but few leads.
The correction is performed only once based on the recognition result of the recognition device (14) (hereinafter referred to as open loop correction).

(IV) is the first nozzle rotation correction station (II)
Alternatively, the chip component (4) after completion of the work at the second nozzle rotation correction station (III) is printed on the printed board (5).
It is a mounting station that is mounted on top.

As a result of the recognition by the recognition device (14), (V) is a chip component (such as the chip component (4) that is standing and adsorbed, or the adsorbed chip component (4) is different, which must not be mounted (V). This is a discharge station for discharging 4).

(VI) is a nozzle selection station for selecting the suction nozzle (11) corresponding to the chip component (4) to be sucked at the suction station (I), and a gear (provided on the outer diameter portion of the suction head portion (12) ( (Not shown) is driven by a drive system (not shown) and is rotated after meshing with the gear and then rotated by a drive gear servomotor (15) which rotates a drive gear (16) as a nozzle selecting means. A desired suction nozzle (11) is selected.

(VII) is a rotation direction of the suction nozzle (11) according to the orientation of the chip component (4) at the standby position when the chip component (4) is taken out by the suction nozzle (11) in the suction station (I). It is an origin position adjustment station that adjusts the origin position of.

The recognizing device (14) will be described below with reference to FIG.

(17) is a CCD camera that recognizes the state where the chip component (4) is sucked by the suction nozzle (11), and is a box waiting below the chip component (4) that has been conveyed to above the recognition device (14). Two mirrors (19) mounted inside (18)
The image obtained by utilizing the reflection of (20) is recognized away from the lens (21).

Next, the first and second nozzle rotation correction stations (I
I) (III) first and second nozzle rotation positioning device (22)
(23) will be described in detail. Since the devices (22) and (23) have the same structure, the first nozzle rotation positioning device (22) will be described with reference to FIG.

Reference numeral (22A) is a first nozzle rotation servomotor as a drive source for rotating the suction nozzle (11) by θ, and a bearing body (2) is attached to the output shaft (25) via a coupling (26).
A vertical moving means (60) consisting of a nozzle rotating body (28) fitted in 7) and a nozzle rotating rod (29) described later is attached.

Reference numeral (29) is a nozzle rotation rod fitted in the nozzle rotation body (28) and having a nozzle rotation fitting portion (30) at its lower end, and a vertically elongated hole (31) provided in the nozzle rotation body (28). A pin (32) protruding further outward is provided. The nozzle rotation fitting part (30) is notched diagonally from both sides toward the lower end so as to fit with the fitted groove (11A). In addition, a locking portion (3) that locks a spring (33) as cushion means with the bottom surface of the nozzle rotating body (28).
4) is provided, and a rocking lever (37) is attached to the engaging portion (34) via a rod end (36) to a vertical movement lever (35) that is vertically moved by a cam as a drive source (not shown). ) Is locked and the swing lever (37) is swung up and down in accordance with the vertical movement of the vertical movement lever (35), so that the nozzle rotation rod (29) is pushed up and down by the spring (33). Be moved.

Also, a ball spline may be used as the vertical movement means (60).

Next, the third nozzle rotation positioning device (24) of the nozzle origin alignment station (VII) will be described.
The same structure as that of the first nozzle rotation positioning device (22) described above has the same drawing number, and the description thereof will be omitted.

As shown in FIG. 5, the inside of the nozzle rotation fitting portion (30A) provided on the nozzle rotation rod (29) is the first cavity (5
0) and a second cavity (51) connected to the first cavity (50) having a diameter smaller than that of the first cavity (50).

The spring (55) is provided at the stepped portion (53) between the first cavity (50) and the second cavity (51) by the engagement portion (54) of the (52).
The rotation of the fitting portion (30A) together with the urging force of the contact rod is a contact rod as a brake means that is locked in a free state, and the contact rod extends below the lower end of the fitting portion (30A). (Five
The tip of 2) contacts the fitted groove (11A) to regulate the rotation of the suction nozzle (11) before fitting. The contact rod (52) is designed to idle without following the rotation when the fitting portion (30A) is rotated. To assist this, the upper surface of the first cavity (50), that is, A thrust bearing (61) is provided on the spring (55) receiving side of the nozzle rotating rod (29) as a receiver for the spring (55).
The rotation of the spring (55) prevents the rotational force from being transmitted to the contact rod (52).

The interface (38) in FIG. 6 is the rotary disk (1
0), recognition device (14), drive gear (16), first, second, third
While the nozzle rotation positioning device (22) (23) (24), the counter (62), the notification device (63), etc. are connected,
Each of these control elements is a CPU (39) as a control device.
It is controlled by the program.

(40) is a RAM as a storage device, and each suction nozzle (1
Rotation center position data of 1), recognition position data of the chip component (4) by the recognition device (14), and mounting position data (X) of each chip component (4) on the printed circuit board (5).
Direction, Y direction, θ direction) and the like are stored in each predetermined area.

Reference numeral (64) is a ROM as a storage device for storing the open loop correction operation program data and the closed loop correction operation program data. In addition to this, a program relating to the mounting operation of the chip component (4) is also stored.

Since the setting position of the rotation center of the suction nozzle (11) may shift due to temperature change, aging change, etc.,
Each suction nozzle (11) that does not suck the chip component (4) when it exceeds a certain set temperature or after a certain time
May be recognized by the recognition device (14) to calculate the displacement amount of the rotation center of the suction nozzle (11) and the displacement amount may be stored in the RAM (40) again, or the displacement amount may be stored in the suction nozzle. It may be added to the rotation center position data of (11).

A drive circuit (41) is connected to the CPU (39),
The drive circuit (41) includes the rotary disk servomotor (13),
The drive gear servomotor (15) and the first, second and third nozzle rotation servomotors (22A) (23A) (24A) and the like are connected.

The setting operation of whether the rotation correction of the suction nozzle (11) is performed by the closed loop correction or the open loop correction (hereinafter referred to as closed / open switching) will be described below. The operator completes the closed / open switching NC data for each type of chip part (4) displayed on the screen of a monitor television (not shown) shown in FIG. 7 according to the procedure described later and stores it in the RAM (40).

That is, since the chip component (4) with the component number "R ₁ " has leads, the number of leads is large, and the pitch between the leads is relatively narrow, it must be accurately mounted on the pattern of the printed circuit board (5). , Rotation correction accuracy is required to some extent, so the symbol "1" should be used to perform closed loop correction.
Error tolerance is ± 1 degree (± 10 in the data.
And setting).

Next, the chip part (4) with the part number “R ₂ ” has no lead and does not require much accuracy, so the symbol “0” is set to perform open loop correction. It is ± 2 degrees (± 20 is set in the data).

Thereafter, similarly, the closed / open switching setting is performed for each type of chip component (4).

Then, the CPU (39) discriminates the symbols "0" and "1" and causes the respective correction operations to be performed.

The operation will be described in detail below with reference to the drawings.

First, before the mounting operation, the rotation center position (CCD) of each suction nozzle (11) camera (1) is recognized by the recognition device (14).
7) is used as a reference, and the rotation center position data is stored in the RAM (40).

For the center position recognition work of the suction nozzle (11), a jig is sucked by the suction nozzle (11), and this jig is rotated with the rotation of the suction nozzle (11). The hole provided may be recognized by the recognition device (14) at the rotation angle position of the suction nozzle (11), and the rotation center of the suction nozzle (11) may be calculated from the recognition result by a calculation device (not shown).

Furthermore, a trial shot of the chip component (4) is actually performed while changing the mounting angle, the displacement amount between the mounting position and the rotation center of each suction nozzle (11) is measured, and the value is input to the RAM (40 ) May be entered.

The component supply table (6) is moved to the suction station (I) by driving the component supply unit servomotor (8), and the desired component supply device (7) is on standby at the component removal position.

Then, the chip component (4 of the suction nozzle (11) is part number stored in the component supply device (7) in step "1" indicated by mounting NC data displayed on the monitor television shown in FIG. 8, "R _1" ) As it is moved upward, the suction nozzle (11) sucks the chip component (4).

Next, the CC in the state of being adsorbed by the adsorption nozzle (11) by the recognition device (14) of the nozzle rotation correction station (II) in FIG.
Chip parts (4) from the image center of the D camera (17)
Position is recognized and the recognized position data (X1, Y1, θ1)
Store in RAM (40). Among them, the correction operation for the angle data (θ) will be described.

The recognition angle data (θ1) is, for example, an angle formed by a line of intersection formed by extending one side of the image center and a reference end surface of the chip component (4).

The mounting angle data (θ ₁ ) of the mounting position data stored in the RAM (40) and the recognized angle data (θ ₁ ) are compared by a comparison device (not shown). The amount of deviation (θ ₁ −θ ₁ ) is calculated and RAM (4
0) and the rotation is corrected. here,
The tolerance of the chip component (4) of "R ₁ " (4) is ± 1 degree from the NC data shown in Fig. 7 (the data is set to ± 10).
Closed loop correction is performed within the range.

Hereinafter, the rotation correction operation in the θ direction of the suction nozzle (11) in the first nozzle rotation correction station (II) will be described based on the rotation correction operation flowchart of FIG. 9.

First, after the rotation of the turntable (10) is stopped, the vertical movement lever (35) is lowered by the driving of the cam, the swing lever (37) is swung downward, and the nozzle rotation fitting portion (30) is moved. ) Contacts the taper part of the fitted groove (11A) provided in the upper part of the suction nozzle (11) while being biased by the spring (33), the first nozzle rotation motor (22A) shifts. (Θ ₁
-Suction nozzle (11) by being rotated by -θ1)
Is rotated to align the chip component (4). After the completion of this alignment correction, the recognition device (14) recognizes the suction state of the chip component (4) again, and the deviation amount (θ ₁ −
Recognizing that it has been rotated by θ1), the corrected error is RA
When the error is within the allowable error range stored in M (40), the turntable (10) is rotated again and the suction head section (12) is moved to the next station.

Then, at the mounting station (IV), the XY table (1)
Thus, the printed circuit board (5) is moved in the XY direction, and the chip component (4) is mounted on the predetermined position coordinates (X ₁ , Y ₁ ).

Further, the correction work is continued until the error after the correction is within the allowable range. Of course, there is a possibility that the error will not fall within the allowable range no matter how many times it is repeated, so it is set how many times to repeat, and the counter (62) counts the number of corrections and sets it as the set number (N times). It will be possible to make repeated corrections until that time.

If the error is not within the allowable range even after the correction is repeated up to N times, the device is abnormally stopped and the operator is notified by the notification device (63), or the error is not within the above range. The discharge station (V) without abnormally stopping the device for the chip part (4)
It may be discharged at.

The suction nozzle (11) used next in the next nozzle selection station (VI) rotates after the drive gear (16) meshes with the gear (not shown) provided in the suction head section (12). It is selected by rotating the suction head section (12) accordingly.

At the next nozzle origin alignment station (VII), the origin of the selected suction nozzle (11) is aligned. That is, since the suction nozzle (11) is rotationally corrected in accordance with the amount of misalignment at the first or second nozzle rotation correction station (II) (III), the suction becomes a reference when the chip component (4) is sucked. The origin of the nozzle (11) in the direction of rotation becomes different, and the origin positions must be matched before adsorption.

Therefore, the rotation stop position of the third nozzle rotation servomotor (24A) is set, and the nozzle rotation positioning device (24) is driven to align the origin position of the suction nozzle (11) in the rotation direction. That is, for example, even if the fitting portion (30A) and the fitted groove (11A) intersect each other, first, the fitting portion (30A)
A) comes down while rotating, and spring (55)
The abutting rod (52) biased downward by the abutment abuts the abutted portion (11B) (see FIG. 10). Then, the contact rod (5
The contact rod (52) does not rotate together with the fitting portion (30A) because the 2) pushes the contacted portion (11B) downward by the urging force of the spring (55), that is, the fitting The part (30A) becomes idle with respect to the contact rod (52), and the suction nozzle (11) until the fitting part (30A) and the fitted groove (11A) are fitted by the contact rod (52). Will not be rotated together with the rotation of the fitting part (30A). That is, the rotational force of the nozzle rotating rod (29) is transmitted to the upper portion (61A) of the thrust bearing (61), but the lower portion (61C) is caused by the rolling action of the ball (61B).
Is not transmitted to the fitting part (30A)
Is rotated up to 180 degrees and stops until it stops (3
0A) and the fitted groove (11A) are in the same direction. Therefore,
Spring (55) between the mating part (30A) and the mating groove (11A)
The suction nozzle (11) is rotated by the rotation of the fitting part (30A), and the fitting part (30A) and the fitted groove (11A) are in the same direction at the rotation stop position. The suction nozzles (11) can be aligned and stopped (see FIG. 11), and the suction nozzle (11) is always prepared at the origin position after the rotation is stopped.

The origin position is stored in the RAM (40), and the value and the amount rotated at the time of correction are calculated by a calculator and the value is subtracted from 180 degrees, and the nozzle rotation is performed by that value. The suction nozzle (11) may be aligned with the origin position by rotating the use servo motor (24A) so that the direction of the fitted groove (11A) coincides with the direction of the origin position.

Furthermore, the suction nozzle (11) may be aligned with the origin position by rotating the nozzle rotation servomotor (24A) in the reverse direction by the amount of rotation during the correction.

Next, according to the program data, the chip component (4) with the component number "R ₂ " is adsorbed in step "2", the chip component (4) is recognized by the recognition device (14), and the recognition result and mounting angle data Based on (θ ₂ ), the suction nozzle (11) is subjected to open loop correction in the second nozzle rotation correction station (III). The allowable error range at this time is ± 2 degrees.

First, if it is necessary to recognize the sucked state of the chip component (4) by the recognition device (14) and make a correction, the second nozzle rotation positioning of the next second nozzle rotation correction station (III) This is done by the device (23). The correction work is performed in the same manner as the first nozzle rotation positioning device (22).
Incidentally, here, the second nozzle rotation correction station (III)
The reason why the correction is performed in step 1 is that it takes a long time to perform a plurality of operations (recognition and correction operations) in one station (first nozzle rotation correction station (II)). Rotation correction station (II)
The correction work may be performed in.

Then, the chip component (4) is mounted on the printed circuit board (5) at predetermined position coordinates (X ₂ , Y ₂ ).

Thereafter, the mounting work of the chip component (4) is successively continued in the same manner.

In the description of the rotation correction, as shown in FIG. 2, since the nozzle rotation fitting portion (30) and the fitted groove (11A) are in the same direction, the fitting portion (30) is Although it has been described that the mating groove (11A) is fitted only by descending, if the mating part (30) and the mating groove (11A) are eccentric (12th
(See the figure), if the mating part (30) and one of the tapered surfaces of the mating groove (11A) are also in contact, the mating part (30) will rotate when the mating part (30) is rotated. Since the fitted groove (11A) can be rotated in a direction coinciding with the direction of the tapered surface of (1), the suction nozzle (11) can be rotated in the desired direction. Therefore, the directional suction nozzle (11D) having the V-shaped groove (11C) for sucking the cylindrical chip component (4A) as shown in FIG. By setting the groove (11A) and the V-shaped groove (11C) in the same direction, the axial center of the component (4A) can be adjusted according to the packing shape of the cylindrical chip component (4A) of the component supply device (7). The direction and the V-shaped groove (11C) can be matched, and the stopped direction of the fitted groove (11A) becomes the stopped direction of the V-shaped groove (11C), so that reliable component suction can be performed.

Next, another embodiment of the nozzle rotation positioning device will be described with reference to FIG.

Reference numerals (42) and (43) are an X-direction linear guide and a Y-direction linear guide provided on the upper portion of the nozzle rotation fitting portion (30), and a linear guide locking portion provided on the lower end of the nozzle rotation rod (29). The rail (42A) of the X-direction linear guide (42) is fixed to the (44), and the rail (4) of the Y-direction linear guide (43) is attached to the movable block (42B) of the linear guide (42).
3A) is fixed, and the fitting portion (30) is fixed to the movable block (43B) of the linear guide (43). Further, the linear guides (42) (43) have stoppers (45A) (45B) (46) that restrict the swing of the linear guides (42) (43) within the fitted groove (11A).
A) (other not shown) are provided respectively.

As a result, when the fitting portion (30) is fitted into the fitted groove (11A) and there is eccentricity between the springs (33)
By the urging force of, the X-direction and Y-direction linear guides (42) and (43) are flexibly moved to eliminate the eccentricity between the fitting portion (30) and the fitting groove (11A). Thus, the load in the radial direction applied to the suction nozzle (11) is reduced.

Further, the linear guide may be provided only in one direction, and in this case as well, the load in the radial direction applied to the suction nozzle (11) is reduced.

Although the spring (33) as the cushion means is provided on the side of the fitting portion (30) in the above-described embodiment, the fitting groove (11) is provided.
It may be provided on the A) side, that is, on the suction nozzle (11) side. In this case, for example, the spring is attached to the lower surface of the upper portion of the suction nozzle (11) in which the fitted groove (11A) is formed and the suction head portion (12).
It may be provided between the upper surface and the upper surface.

Further, the above-mentioned braking means may be provided on the suction head portion (12) side and brought into contact with the upper portion of the suction nozzle (11) to restrict the rotation of the suction nozzle (11).

In the above embodiment, the closed / open switching data is provided for each type of chip component (4).
Another embodiment in which closed / open switching data is provided for each mounting data will be described below with reference to FIGS. 15 and 16.

Figure 15 shows the chip parts displayed on the monitor TV (4).
It is parts data showing each type.

FIG. 16 shows NC-data in which closed / open switching data is set for each mounting data.

Based on these data, at the stops "1" and "2", the error tolerances are ± 2 degrees and ± 1 degrees, respectively.
Loop correction, error tolerance within step “3” ± 1 degree 10
Min become as closed loop corrected chip component (4) respectively printed circuit board (5) on a predetermined position coordinates _{(X 1, Y 1),} (X 2, Y 2), (X 3, Y 3) Attach to.

Thereafter, the mounting operation is continued in the same manner.

In this embodiment, the allowable error range is set for each chip component (4) (see FIGS. 7 and 15), but the allowable error range may be set uniformly (for example, ± 1 degree).

Further, as shown by the dotted line in FIG. 6, a closed / open changeover switch (65) may be provided to allow the operator to collectively select the rotation correction for all the chip components (4). .

(G) Effect of the Invention As described above, the present invention is optimal under any condition by selecting either the open loop correction operation program or the closed loop correction operation program during rotation correction. Rotation correction can be performed. Moreover, in the closed loop correction operation program, angular positioning can be performed with appropriate accuracy because the allowable range is met.

[Brief description of drawings]

1 and 6 are a plan view and a circuit diagram of an electronic component automatic mounting apparatus to which the present invention is applied, FIG. 2 is a side view of a first nozzle rotation correction station, and FIG. 3 is a first nozzle rotation. FIG. 4 is a perspective view of the positioning device, FIG. 4 is a perspective view of the third nozzle rotation positioning device, FIG. 5 is a partially enlarged view of FIG. 4, and FIG. 7 is a type of parts displayed on the screen of the monitor TV. FIG. 8 is a view showing NC data for closed / open switching, FIG. 8 is a view showing mounting program data similarly displayed on the screen of the monitor TV, FIG. 9 is a view showing a flow chart of rotation correction operation, and FIGS. 10 and 11 are FIG. 12 is a view showing fitting between the fitting portion and the fitted groove, FIG. 12 is a view showing an eccentric state of the fitting portion and the fitted groove,
FIG. 13 is a view showing a directional suction nozzle that sucks a cylindrical chip component, FIG. 14 is a perspective view of a nozzle rotation positioning device of another embodiment, and FIGS. 15 and 16 are closed /
It is a figure which shows the display screen of the monitor television which shows another Example of open switching setting data. (11) (11D) …… Suction nozzle, (14) …… Recognition device,
(22) (23) (24) ... 1st, 2nd, 3rd nozzle rotation positioning device, (22A) (23A) (24A) ... 1st, 2nd, 3rd nozzle rotation servomotor , (39) …… CPU, (40)…
… RAM, (62) …… Counter, (65) …… Closed /
Open changeover switch.

Claims (3)

[Claims] 1. A printing apparatus after correcting the ejection nozzle to a proper angular position by rotating the ejection nozzle by a nozzle rotating device based on angular position data of the chip-shaped electronic component held in the ejection nozzle recognized by the recognition device. In an electronic component automatic mounting device having a function of mounting the component on the board,
An open loop correction operation program for performing rotation correction only once after the recognition, and a closed loop correction operation for keeping the difference between the angular position recognized as repeatable rotation correction and the appropriate angular position within an allowable range. A storage device that stores a program, a selection device that selects one of the programs stored in the storage device, and a control device that controls to perform a correction operation according to the program selected by the selection device. An electronic component automatic mounting device characterized by being provided with. 2. A printing is performed after the ejection nozzle is rotated by a nozzle rotating device based on the angular position data of the chip-shaped electronic component held by the ejection nozzle recognized by the recognition device to be corrected to an appropriate angular position. In an electronic component automatic mounting device having a function of mounting the component on the board,
An open loop correction operation program for performing rotation correction only once after the recognition, and a closed loop correction operation for keeping the difference between the angular position recognized as repeatable rotation correction and the appropriate angular position within an allowable range. A storage device that stores a program, a selection device that selects any one of the programs stored in the storage device for each type of components mounted on a board, and a correction according to the program selected by the selection device An electronic component automatic mounting device, characterized in that a control device for controlling the operation is provided. 3. A nozzle rotating device rotates the take-out nozzle based on angular position data of the chip-shaped electronic component held by the take-out nozzle recognized by the recognition device, and corrects the print to obtain an appropriate angular position for printing. In an electronic component automatic mounting device having a function of mounting the component on the board,
An open loop correction operation program for performing rotation correction only once after the recognition, and a closed loop correction operation for keeping the difference between the angular position recognized as repeatable rotation correction and the appropriate angular position within an allowable range. A storage device for storing a program, a selection device for selecting any one of the programs stored in the storage device for each mounting on a board on which a component is mounted, and a program selected by the selection device An electronic component automatic mounting apparatus comprising: a control device that controls to perform a correction operation.