JPH0534155Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention is for efficiently cooling heat-generating electronic components mounted on a board module housed in a chassis having a ventilation duct for cooling air, for example. It is.

[Conventional technology]

FIG. 7 is a perspective view showing a conventional electronic device,
FIG. 8 is a perspective view taken in the direction of A in FIG. 7, FIG. 9 is a perspective view taken in the direction of B in FIG. 8, and FIG. 11 is a view seen in the direction of D in FIG. 10, FIG. 12 is a view seen in the direction of E in FIG. 10, and FIG. 13 shows the board module. FIG. 14 is a view seen in the F direction in FIG. 13.

In the figure, 1 is a chassis. A cover 2 is fixed to the chassis 1 with screws 3.
Reference numeral 4 denotes a back panel having a connector seat 5, which is fixed inside the chassis 1 with screws 6.
A circular cooling air intake port 8 is provided in the center of the first surface 7 of the chassis 1.
Two cooling air exhaust ports 10 are provided on the second surface 9 facing the. Reference numeral 11 denotes a ventilation duct a provided inside the chassis 1 with the first surface 7 as a part of the wall surface. 12.1 and 12.2 are a third surface 13 and a fourth surface perpendicular to the first surface 7.
Grooves 15.1 to 15.1 are provided inside the chassis 1 and are continuous with the ventilation duct a11, with grooves 15.1 to 15. formed on the outer wall having surfaces 14 as part of the wall surfaces, respectively. n, and inside there are heat dissipation fins a16.1-1 along the cooling air flow path.
6. The ventilation duct b has n. 17.1~
17. n denotes electronic components 18.1 to 18.n that are located parallel to the first surface 7 and generate heat. n is heat sink 1
The heat sink 19 has wedge-shaped clamps 21 on both end surfaces, and a printed circuit board connector 22 is fitted to the lower surface of the printed circuit board 20. It is a board module.

Further, the cooling air supplied from the cooling air intake port 8 flows from the ventilation ducts a and 11 to the ventilation ducts b, 12.1 and 12.2, and from the cooling air exhaust ports 10.1 and 10.2. It is exhausted (arrow A in Figure 9). At this time, the electronic components 18.1 to 18. The heat generated by n is transmitted to the heat sink 19, and further to the heat sink 1.
9 to the grooves 15.11 to 15.9 on both ends. The above-mentioned heat dissipation fins a, 16.1 to 16. transmit to n. The above heat dissipation fin a, 16.1-1
6. n is cooled by cooling air and the above electronic component 1
8.1-18. n is indirectly cooled.

[Problem that the invention attempts to solve]

Conventional electronic devices such as those described above have the following problems.

When the width of the chassis 1 (G in FIG. 7) becomes smaller, the board modules 17.1 to 17.1 are housed inside. The width of n also becomes smaller. Therefore, the above board modules 17.1 to 17. As the area n becomes narrower, the mounting density of the electronic components 12 decreases. In addition, the board modules 17.1 to 17. The number of signal lines between n increases, resulting in an electrically complex circuit.

This invention was made to solve these problems, and aims to increase the mounting area of the board module and to obtain the ability to cool the board module with a high mounting density.

[Means for solving problems]

The electronic device according to this invention has a circular cooling air inlet in the center of the first surface of the box-shaped chassis, and a rectangular cooling air inlet at either the left or right end of the second surface facing the first surface. A cooling air exhaust port having a shape is provided, the first surface is a part of a wall surface, and a first wall surface facing the first surface has a shape that guides cooling air to the entire wall surface excluding the cooling air intake port. a first ventilation duct with a rectangular cross section located on the inner surface of the chassis; One of the two opposing surfaces excluding the board module insertion surface among the four perpendicular surfaces adjacent to the surface and the second surface, and opposite to the cooling air exhaust port on the second surface. The third surface is a part of the wall surface, and a second ventilation duct with a rectangular cross section is provided, which is located on the inner surface of the chassis and continuous with the first ventilation duct, and the second surface is a part of the wall surface. A second wall surface facing the second surface has a plurality of heat radiation fins along the cooling air flow path over the entire wall surface, and has a rectangular cross section located on the inner surface of the chassis and continuous with the second ventilation duct. a third ventilation duct located parallel to the third surface, having a connector on a first side, forming a right angle to the first side, and supporting the first holding part and the second holding part; A plurality of rectangular plate-shaped board modules each having a fixing structure on a second side and a third side and mounting electronic components respectively held on the first side and the second side are housed. and a back panel having a connector seat that is perpendicular to the surface and the third surface and that mates with the connector.

[Effect]

In the electronic device according to this invention, the board module is arranged in the longitudinal direction of the chassis, and the ventilation duct on the back side of the holding part that holds the board module is provided with heat dissipation fins shaped to guide cooling air over the entire wall surface. This increases the mounting density of board modules and provides sufficient cooling effects.

〔Example〕

Fig. 1 is a perspective view showing an electronic device according to this invention, Fig. 2 is a perspective view seen in the direction H in Fig. 1, Fig. 3 is a view seen in the direction I in Fig. 1,
4 is a diagram showing the cross section JJ in FIG. 3, FIG. 5 is a diagram seen in the direction K in FIG. 4, and FIG. 6 is a diagram seen in the direction L in FIG. 4.

In the figure, 1 to 10 and 13 to 22 are the same as the conventional equipment, so their explanation will be omitted. 23, the first surface 7 is a part of the wall surface, and grooves 15.1 to 15.23 are provided inside the chassis 1 and formed on the outer wall. There are heat dissipation fins b, 2 inside which are shaped to guide cooling air over the entire wall surface except for the cooling air intake port 18.
4.1-24. The ventilation duct c has n.
Reference numeral 25 designates a ventilation duct d, which has the fourth surface 14 as a part of the wall surface, is provided inside the chassis 1, and is continuous with the ventilation duct c. 26 is provided inside the chassis 1 with the second surface 9 part of the wall surface, and a groove 15.26 is provided in the outer wall.
1-15. n, and inside there are heat dissipation fins a, 16.1 to 16.n along the cooling air flow path. The ventilation duct e is continuous with the ventilation duct d. Board module 17.1-17. n is located parallel to the third surface. Note that the third surface is one of the two opposing surfaces excluding the board module insertion surface (corresponding to the upper and lower surfaces in Figure 1) among the four perpendicular surfaces adjacent to the first and second surfaces. and is located at a position opposite to the cooling air exhaust port on the second surface.

Here, the cooling air supplied from the cooling air intake port 8 is transferred from the ventilation duct c23 to the ventilation duct d25.
and from ventilation duct d25 to ventilation duct e2
6 and is exhausted from the cooling air exhaust port 10. (Arrow B in FIG. 3) At this time, electronic components 18.1 to 18. The heat generated by the heat sink 19 is transmitted to the heat sink 19, and further from the heat sink 19 to the grooves 15.1 to 15.n. n to the heat dissipation fin a16.
1-16. n and heat dissipation fins b24.1 to 24.
transmit to n.

Heat dissipation fin a, 16.1-16. n and heat radiation fins b, 24.1 to 24. n are electronic components 18.1 to 18.n cooled by cooling air. n is indirectly cooled.

[Effect of idea]

As explained above, in the above electronic device, the board module is arranged in the longitudinal direction of the chassis, and the ventilation duct on the back side of the holding part that holds the board module has a heat dissipation shape that guides cooling air over the entire wall surface. By providing the fins, the area of the board module becomes larger, allowing high-density mounting of electronic components. Therefore, the number of signal lines between board modules is also reduced, resulting in an electrically simple circuit configuration.

In addition, since the entire back surface of the holding portion of the board module has heat dissipation fins, sufficient cooling capacity can be obtained even for a board module that generates a high amount of heat.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an electronic device showing an embodiment of this invention, Fig. 2 is a perspective view taken in the direction H in Fig. 1, and Fig. 3 is a view taken in the direction I in Fig. 1. , FIG. 4 is a diagram showing the cross section J-J in FIG. 3, FIG. 5 is a diagram seen in the direction of K in FIG. 4,
Figure 6 is a view seen in the direction of L in Figure 4;
The figure is a perspective view showing a conventional electronic device.
A perspective view seen in the direction of A in the figure, FIG.
10 is a view showing the cross section C-C in FIG. 9, and FIG. 11 is a view taken in the direction of B.
The view seen in the direction of D in the figure, Figure 12 is the 10th
13 is a view showing the board module, and FIG. 14 is a view seen in the direction F in FIG. 13. In the figure, 1 is the chassis, 2 is the cover, 3 is the screw, 4 is the back panel, 5 is the connector seat, 6 is the screw, 7 is the first surface, 8 is the cooling air intake port, 9 is the second surface, and 10 is the Cooling air exhaust port, 11 is ventilation duct a, 12.1, 12.2 is ventilation duct b, 13
is the third surface, 14 is the fourth surface, 15.1 to 15.
n is groove, 16.1-16. n is heat dissipation fin a, 1
7.1-17. n is board module, 18.1
~18. n is an electronic component, 19 is a heat sink, 2
0 is a printed circuit board, 21 is a wedge-shaped clamp, 22 is a connector for the printed circuit board, 23 is a ventilation duct c,
24 is a heat radiation fin b, 25 is a ventilation duct d, 26
is the ventilation duct e. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] A cooling air intake port is provided in the center of the first surface;
A rectangular parallelepiped chassis having a cooling air exhaust port provided on either the left or right end is provided on a second surface opposite to the first surface, and the first surface is a part of a wall surface. A first wall surface facing the above has a plurality of heat dissipation fins shaped to guide cooling air over the entire wall surface except the cooling air intake port, and a first holding section is provided on the back surface of the first wall surface. a first ventilation duct located on the inner surface of the chassis, and two opposing surfaces excluding the board module insertion surface among the four perpendicular surfaces adjacent to the first and second surfaces. a second ventilation duct which is located on the inner surface of the chassis and is continuous with the first ventilation duct, the third surface of which is opposite to the cooling air exhaust port of the second surface part of the wall; and the second wall surface is a part of the wall surface, and the second wall surface facing the second surface has a plurality of heat dissipation fins along the cooling air flow path over the entire wall surface, a third ventilation duct having a second holding part on the back surface of the wall, located on the inner surface of the chassis and continuous with the second ventilation duct, and located parallel to the third surface; 1st
an electronic device having a connector on a side thereof, and a fixing structure on a second side and a third side that are perpendicular to the first side and held by the first holding part and the second holding part; A plurality of rectangular plate-shaped board modules on which components are mounted, and a connector seat that is perpendicular to each of the first surface, the second surface, and the third surface and that mates with the connector. An electronic device comprising a back panel.