JPH05347323A - Method and apparatus of cutting resin off electronic part - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a resin cutting method and device capable of skillfully removing a resin film excessively attached on a lead wire of an electronic component by a resin dipping method. [Structure] A cutting step of cutting a resin film adhered to a lead wire of an electronic component at a fixed position on the lead wire, and a peeling step of axially treating the resin film of the other side from the cutting point to separate the resin film from the lead wire, After the crushing process of separating the resin film peeled off on the lead wire in the axial direction and removing it from the lead, and the finishing process of removing the remaining pieces of the separated resin film from the lead wire, the excess sticking out and adhering to the lead wire Cut and remove the resin film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin cutting method and apparatus for removing excess resin film excessively protruding on a lead wire for a radial lead type resin-sealed electronic component such as a ceramic capacitor and a ceramic surge absorber. Regarding

[0002]

2. Description of the Related Art First, FIG. 3 shows the structure of a resin-sealed type electronic component to which the present invention is applied. In the figure, 1 is a disk-shaped electronic component body, 2 is a lead wire which is soldered on both sides of the body 1 and is drawn out in a radial direction, 3 is a resin film which covers the body 1 and the root of the lead wire 2. is there. here,
The resin film 3 is formed by soldering the lead wire 2 to the main body 1 and then applying the resin wire 3 by a resin dipping method.

[0003]

By the way, in the above-mentioned resin-sealed type electronic component, the resin film 3 needs to have a certain thickness or more from the viewpoint of product quality assurance, but the resin film 3 is formed by the resin dipping method. In many cases, the resin film 3 is excessively applied to the leads 2 due to the dip depth, time, etc. That is, in FIG. 3, in terms of the specification of the product, even if the coating length of the resin film 3 adhered to the root of the lead wire 2 is set to A, the actual coating dimension formed by dipping is B (A> B), and the dimension B is not constant, and there are variations between the left and right leads.

However, when a product having such an excessive resin film is mounted on a printed wiring board (the lead wire 2 is inserted into a through hole of the printed wiring board and soldered), the product is attached to the lead wire 2. The excessive resin film 3 interferes with the soldering, and the lead wire cannot be correctly connected to the printed wiring board. Therefore, conventionally, for a product in which the lead wire 2 is excessively covered with the resin film 3, the root length of the lead wire is locally curved and bent to correct the lead length. However, this lead bending process is troublesome.

The present invention has been made in view of the above points, and an object of the present invention is to solve the above problems and to provide a resin cutting method and apparatus capable of skillfully removing a resin film excessively attached on a lead wire. is there.

[0006]

In order to achieve the above object, a resin cutting method of the present invention comprises a cutting step of cutting a resin film adhered to a lead wire of an electronic component at a fixed position on the lead wire, A peeling process that treats the resin film from the cutting point in the axial direction to separate it from the lead wire, a crush process that breaks the resin film peeled on the lead wire and removes it from the lead, and a residual piece of the broken resin film on the lead wire. It should be carried out through the finishing process that is excluded from.

Further, the resin cutting apparatus of the present invention which uses the above method is an extra resin which is adhered to the lead wires of the electronic parts along the conveyance path of the electronic parts which are taped side by side at regular pitches. A peeling unit that cuts the film in a fixed position on the lead wire with a cutting blade and handles it in the axial direction, a crush unit that cuts the peeled resin film from both sides in the axial direction with the cutting blade to remove it from the lead wire, and a split resin film The finishing unit that removes the remaining pieces from the lead wire by brushing and air blowing shall be arranged in this order.

The peeling unit in the above-mentioned apparatus cuts the resin by clamping the electronic component at a fixed position and moving it in the axial direction of the lead wire, and by sandwiching the lead wire from both sides at the clamp position of the electronic component. The resin cutting blade with a pair of grooves is provided.

[0009]

The resin film adhered to the lead wire of the electronic component during the resin dipping method is left with a predetermined length dimension on the root side of the lead wire by performing the resin cut by using the apparatus having the above-mentioned structure. Excess resin film deposited on the front side is cut and removed from the lead wire. Further, since the series of resin cutting steps are performed while continuously feeding the electronic parts between the process units in a state where the electronic parts are being typed, it is possible to deal with the mass production process.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. First, as described with reference to FIG. 3, the electronic components manufactured by applying the resin film 3 to the roots of the component body 1 and the lead wire 2 by the dipping method are arranged at regular pitches and are taped. At the same time, the excess resin film attached to the lead wires is resin-cut by sending it to the resin cutting step shown in FIG. Here, a series of resin cutting processes consist of a cutting process, a peeling process, a crushing process, and a finishing process in this order, and along the tape transport path of electronic parts, a peeling unit corresponding to each of the above processes, a crushing process. A resin cutting device is configured by deploying units and finishing units.

Then, in the cutting step, the lead wire 2 is gripped by the later-described clamp mechanism, and in this state, the resin film 3 covering the base side of the lead wire has a predetermined length A shown in FIG. At the point (XX), the resin film 3 is cut by a resin cutting blade described later. In the subsequent peeling step, the excess resin film 3a ahead of the cut point XX is removed by 1-2 on the axis of the lead wire 2.
Handle about mm and separate from the lead wire. It should be noted that the cutting and peeling steps are preferably performed separately for each of the two left and right lead wires 2. In the next crushing step, the resin film 3a remaining on the lead is clamped from both sides by gear-shaped cutting blades, and the cutting blades are axially divided while reversing the cutting blades on the left and right, and the resin fragments 3b are separated from the lead wire 2.
Drop from. The subsequent finishing process is divided into a brushing process and an air blow process. In the brushing process, the brush 4 rubs the lead wire 2 to scrape off the remaining pieces of the resin shards 3b, and in the air blow process, the lead wire 2 is pressed by the air nozzle 5. Finish by blowing air to blow off the resin powder.

FIG. 2 shows a resin cutting blade and a clamping mechanism incorporated in the above-mentioned peeling unit. The resin cutting blade 6 is composed of two vertically movable blades 6a and 6b. A semicircular relief groove 6c corresponding to the thickness of the lead 2 is formed. Further, the clamp mechanism 7 is composed of two-divided clampers 7a and 7b which are operated to move in the left-right direction and the front-back direction.

With such a structure, when the electronic component is conveyed to the peeling unit, first, the divided clampers 7a and 7b of the clamp mechanism 7 clamp the lead 2 from both sides as shown in FIG. And hold it in place. Subsequently, the split blades 6a, 6b move from the upper and lower sides to sandwich the lead wire 2 and cut the resin film 3 at the XX point in FIG. 1. Then, the clamp mechanism 7 holds the lead wire and holds the lead wire 1-2 mm. It moves backward and handles the excess resin film 3a ahead of the cutting point on the axis of the lead wire 2. As a result, the excess resin film 3a is detached from the lead wire 2 and released.

[0014]

As described above, by adopting the resin cutting method and apparatus of the present invention, even when the resin film coated on the electronic component by the resin dipping method sticks out on the lead wire and adheres excessively, Excess resin can be cut at a predetermined point and removed from the lead wire without damaging the electronic component body and the lead wire. This enables accurate lead wire insertion and soldering when mounting on a printed wiring board. Electronic components are obtained.

[Brief description of drawings]

FIG. 1 is a process diagram of a resin cutting method according to an embodiment of the present invention.

2A and 2B are main mechanism diagrams of a peeling unit used in the cutting and peeling process of FIG. 1, in which FIG. 2A is a standby state diagram immediately before a resin cut, and FIG. 2B is a resin cut operation state diagram.

FIG. 3 is a configuration diagram of a resin-sealed electronic component that is an object of the present invention.

[Explanation of symbols]

 1 Component Main Body 2 Lead Wire 3 Resin Film 3a Cutting Part of Resin Film 3b Resin Film Fragment 4 Brush 5 Air Nozzle 6 Resin Cutting Blade 6a Dividing Blade 6b Dividing Blade 7 Clamping Mechanism

Claims (3)

[Claims] 1. A resin cut method for removing an excess resin film protruding from a main body of a resin-sealed electronic component onto a lead wire, wherein a resin film adhered on the lead wire of the electronic component is fixed on the lead wire. Cutting process to cut at a position, peeling process to treat the resin film of the other side from the cutting point in the axial direction to separate it from the lead wire, crush process to break the resin film peeled on the lead wire and remove it from the lead, and rupture A resin cutting method for an electronic component, which comprises a finishing step of removing the remaining pieces of the resin film from the lead wire. 2. An extra resin film adhered to a lead wire of an electronic component is cut at a fixed position on the lead wire by a cutting blade along a conveyance path of the electronic component taped side by side at regular pitches. A peeling unit that handles in the axial direction, a crush unit that divides the peeled resin film from both sides in the axial direction with cutting blades to remove it from the lead wire, and a finishing unit that removes residual resin film from the lead by brushing and air blowing. 2. A resin cutting device for electronic parts used for carrying out the resin cutting method according to claim 1, wherein the resin cutting device is arranged in order. 3. The resin cutting device according to claim 2, wherein the peeling unit holds the electronic component at a fixed position and moves it in the axial direction of the lead wire, and both sides of the lead wire at the clamp position of the electronic component. A resin cutting device for electronic parts, comprising a pair of resin cutting blades with a groove for sandwiching the resin film and cutting the resin film.