JPH0535568B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to an apparatus for manufacturing semiconductor devices such as LSI and VLSI, and in particular, to a method for easily, quickly and reliably operating the apparatus when starting a semiconductor device manufacturing operation. The present invention relates to a semiconductor manufacturing apparatus that can perform the following steps.

[Background of the Invention] As the degree of integration of semiconductor integrated circuits increases, efforts are being made to improve the functionality and performance of semiconductor manufacturing equipment.
As these devices become more sophisticated and performant, the parameters for operating these types of devices have also increased.
For example, in a step-and-repeat projection exposure apparatus, the number of such parameters may range from tens to even hundreds.

On the other hand, in conventional semiconductor manufacturing equipment, when an operator inputs an operation start command by operating a start switch or keyboard, the equipment immediately starts operating. Even if you realize that something was wrong or that you should have set a parameter,
Work has already begun on some wafers, and there have been inconveniences such as some of them being defective or having to take the trouble of peeling off and recoating the resist.

Also, when changing the microphone process or lot, etc.
In order to check the parameter setting status, it is necessary to check a huge number of parameters as described above, and this is no longer the case for semiconductor manufacturing equipment, which is mainly used to start and stop daily operations. This may even be impossible for some operators. For this reason, an apparatus has been proposed in which, for example, optimal values of parameters are stored for each masking process, and once the masking process is determined, the stored parameter values are set all at once. However, even in this case, the focus position, exposure time, etc. are likely to change depending on the atmosphere, time, etc., and there are cases where they must be changed. In a conventional device, if you want to change some of the parameters, you have to search for the desired one from among the hundreds of parameters mentioned above using a list, etc., and key in the code name of that parameter. After identifying it, I changed the parameters and ended up missearching or inputting the code name incorrectly. That is, the task of changing parameters is extremely difficult for the operator, and there is a high risk of erroneous operation and defective semiconductor products.

[Object of the Invention] In view of the problems of the conventional type described above, the present invention prevents erroneous operations due to incorrect parameters at the start of main operation, and allows an operator to easily, quickly and reliably check and change parameters. The purpose is to provide semiconductor manufacturing equipment.

[Description of Examples] Examples of the present invention will be described below with reference to the drawings.

FIG. 1 shows the appearance of a projection exposure apparatus according to an embodiment of the present invention. In the figure, 1 is a mask provided with an integrated circuit pattern, and also includes mask alignment marks and mask-wafer alignment marks. 2 is the mask stage, mask 1
While holding the mask 1, move the mask 1 in the plane (XY direction) and in the rotational direction (θ direction). 3 is a reduction projection lens; 4 is a wafer provided with a photosensitive layer, and is provided with a mask/wafer alignment mark and a television/wafer alignment mark. 5 is a wafer stage. The wafer stage 5 holds the wafer 4 and moves it in a plane and rotationally, and also moves between the wafer printing position (within the projection field) and the television/wafer alignment position. Reference numeral 6 denotes an objective lens of a television/wafer alignment detection device, 7 an image pickup tube or solid-state imaging device, and 9 a binocular unit, which serves to observe the surface of the wafer 4 through the projection lens 3. 10 is an upper unit housing an illumination optical system and a detection device for mask-wafer alignment. Reference numeral 11 denotes a console monitor receiver (console CRT) for giving commands to the photographing and exposure apparatus main body, and 12 a keyboard for giving commands to the apparatus and inputting parameters.

FIG. 2 is a block diagram showing the electrical circuit configuration of the projection exposure apparatus of FIG. 1. In the same figure, 21
is the main CPU that controls the entire device and consists of a central processing unit such as a microcomputer or minicomputer. 22 is a wafer stage drive device, 23 is an alignment detection system, 24 is a reticle stage drive device, 25 is an illumination system, 26 is a shutter drive device, 27 is a focus detection system, and 28 is a Z drive device, which are controlled by the main CPU 21. controlled. 29 is a conveyance system.

30 is the console unit, and the main CPU 21
This is for giving various commands and parameters related to the operation of this exposure apparatus. 31 is a console CPU, and 32 is an external memory for storing parameters and the like. Note that the CRT 11 and keyboard 12 are the same as those shown in FIG.

Next, the operation of the apparatus shown in FIGS. 1 and 2 will be explained with reference to the flowchart shown in FIG. 3 and the display screen example shown in FIG. 4.

First, when an operator etc. turns on the power of this device, the console CPU 31 and main body CPU 21
perform initialization processing (step
S1), the console unit 30 enters a state of waiting for command input (step S2). In this state, the display screen of the CRT 11 becomes as shown in the fourth screen D1. The screen D1 has a command input area at the top so that various commands input from the keyboard 12 to the main body of the apparatus can be monitored. The console CPU 31 determines whether or not the command input by the operator or the like from the keyboard 12 is a start (main operation start) command (step S3), and if not, processes each input command. After that (step S4), the process returns to waiting for command input (step S2). When a start command is input, only the predetermined parameters are selected among the many parameters stored in the external storage device.
Display on CRT 11 (step S5). The screen display in this state is as shown in screen D2 in FIG. 4. "ST" at the top of screen D2 is the start command entered in the command input area. Predetermined parameters are displayed in the middle row.

Here, the predetermined parameters displayed in the middle of the screen are likely to be changed by the operator when starting the main operation. Therefore, by automatically displaying predetermined parameters as shown in screen D2 after inputting a start command for the device,
The operator can reliably check the main parameters at the start of processing, and can prevent erroneous operations such as starting the main operation with incorrect parameters. In addition, these display parameters are originally the only ones that are likely to be changed by the operator.
It does not contain anything that does not need to be referenced. Therefore, the number is not that large,
Confirmation can be performed easily and quickly. Additionally, by displaying the parameters used in the previous exposure operation, parameter changes can be made only when it is necessary to change exposure conditions such as process changes, which can simplify the work. can.

A prompt message prompting the next input is displayed at the bottom of screen D2. When "Y" is input in step S6 and screen D2, the main operation, that is, in the case of this embodiment, the exposure execution process is started in accordance with the displayed parameters.
When "N" is input, the process returns to waiting for command input (step S2). Furthermore, if "C" is input, parameter changing processing (step S7) can be performed.

In the parameter change process, first, a prompt message to specify the change item number is displayed. The screen display at this time is the screen shown in Figure 4.
It is as shown in D3. Parameter number 3 indicates exposure time (EXPOSURE TIME) and its value is 200 mS. The display "CHANGE NO. OR END?" at the bottom of screen D3 is a prompt message. Here, if you key in "3" as the change data number (step S7),
The display screen becomes as shown in screen D4 in FIG.
"EXPOSURE TIME 200mS" at the bottom of D4 is
This shows the current value of the operating parameter number 3, indicating that this item is currently being changed. This value was stored in the external memory 32. To change this 200mS, change data is input (step S8). Here, we keyed in 150 to change the exposure time to 150mS. As a result, the exposure time of number 3 is changed and the display screen becomes something like D5 (however, without "E"). If there are further items to be changed, the above parameter changing operation may be repeated from step S7. In addition, if you want to end the parameter change operation, enter "E" as the end code as shown in screen D5, and the sequence will continue to the next step.
Return to S6, and at the same time the display screen becomes D2.

As described above, in the projection exposure apparatus of this embodiment, the operating parameters that are automatically displayed after turning on the power are predetermined parameters that are likely to be changed by the operator before starting the main operation. Therefore, although the operator can easily check these parameters on the display screen,
When changing these parameters, there is no need to search among all parameters as in the conventional case, and the operating parameters can be changed easily and quickly. Furthermore, since the number of displayed parameters is not so large, erroneous operations are reduced and changing operations are made more reliable.

In the above example, the parameters that can be displayed and changed are the main operation type (JOB NAME), focus position (FOCUS), and exposure time (EXPOSURE).
TIME). This is based on the fact that in a projection exposure apparatus, the above three parameters are checked and changed by the operator on a daily basis. Currently, in projection exposure apparatuses, operators hardly need to check or change any parameters other than these. However, the parameters that can be displayed and changed can be changed as appropriate depending on various conditions such as the type of device. For example, the above embodiment can be easily modified by changing the program executed by the console CPU.

[Effects of the Invention] As explained above, according to the present invention, in semiconductor manufacturing equipment, when a main operation start command is input, a predetermined operation that is likely to be used by a person operating the equipment, such as an operator, is performed. Since the parameters are displayed and a confirmation signal is input, it is possible to prevent erroneous operations such as starting the main operation with incorrect operating parameters, and to easily, quickly and reliably confirm the main parameters. I can do it. Further, when changing the operating parameters, there is no need to search all parameters, and it is possible to simply, quickly and reliably change only the operating parameters that are likely to be used by the person operating the device.

[Brief explanation of the drawing]

FIG. 1 is an external view of a projection exposure apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a control circuit of the projection exposure apparatus of the above embodiment, and FIG. 3 is an operation of the above embodiment. A flowchart for explaining the operation and FIG. 4 is an example of a display screen. 11... CRT for monitor, 12... Keyboard,
21...Main CPU, 30...Console, 31
...Console CPU, 32...External memory.

Claims (1)

[Scope of Claims] 1. A main operation start command input means, a means for displaying only predetermined parameters among a large number of operation parameters in the main operation, and a confirmation signal input means, the apparatus comprising: In the semiconductor manufacturing apparatus, the predetermined parameters are first displayed on the display means, and after the confirmation signal is input, the main operation is started. 2. The semiconductor according to claim 1, wherein the main operation is classified into a plurality of types according to the setting contents of the operation parameter, and the type of the main operation is displayed on the display means together with the predetermined parameter. Manufacturing equipment. 3. The semiconductor manufacturing apparatus according to claim 2, wherein the input means is a keyboard, and the displayed data can be rewritten based on key input from the keyboard. 4. The semiconductor manufacturing apparatus according to claim 3, wherein when the main operation type data is rewritten, operation parameters corresponding to the rewritten main operation type are displayed. 5. The semiconductor manufacturing apparatus according to claim 2, wherein when the confirmation signal is input, the main operation is started in accordance with the displayed operation parameters regardless of whether display data is rewritten or not. 6. The semiconductor manufacturing apparatus according to claim 1, wherein the main operation is an exposure operation. 7. The semiconductor manufacturing apparatus according to claim 6, wherein the display data is a focus position and an exposure time parameter.