JPH0535713B2 - - Google Patents

Info

Publication number
JPH0535713B2
JPH0535713B2 JP4384688A JP4384688A JPH0535713B2 JP H0535713 B2 JPH0535713 B2 JP H0535713B2 JP 4384688 A JP4384688 A JP 4384688A JP 4384688 A JP4384688 A JP 4384688A JP H0535713 B2 JPH0535713 B2 JP H0535713B2
Authority
JP
Japan
Prior art keywords
heating element
treated
ceramic
metallized
metallized material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4384688A
Other languages
Japanese (ja)
Other versions
JPH01219089A (en
Inventor
Yoshihiro Ehata
Takamichi Kawamoto
Isao Kondo
Koji Okuda
Tokuzo Nishi
Natsumi Myake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daihen Corp
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Daihen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Daihen Corp filed Critical Agency of Industrial Science and Technology
Priority to JP4384688A priority Critical patent/JPH01219089A/en
Publication of JPH01219089A publication Critical patent/JPH01219089A/en
Publication of JPH0535713B2 publication Critical patent/JPH0535713B2/ja
Granted legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ジユール熱を用いてセラミツクスの
表面を金属化するセラミツクスの表面処理方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for surface treatment of ceramics, which metallizes the surface of ceramics using Joule heat.

〔従来の技術と発明が解決しようとする問題点〕[Problems to be solved by conventional technology and invention]

セラミツクスの表面を金属化する表面面処理方
法として、Mo，Mnの混合物またはMo，Mn，
CaO，SiO2の混合物をセラミツクス上に塗布し、
加湿水素中で1300〜1700℃加熱処理するMn−
Mo法、また銅化物とSiO2の混合物をセラミツク
ス上に塗布し、1100〜1400℃の大気中で加熱処理
した後、アルコールにより表面を還元金属化する
銅メタライズ法などが提案されている。これらの
方法は、いずれも反応を促進するために、高温に
加熱処理する工程が必要である。そこで従来は、
セラミツクス全体を高温炉の中に入れ、高温炉の
ヒーターからの幅射や対流によりセラミツクス全
体を所定の温度まで加熱している。 As a surface treatment method for metallizing the surface of ceramics, a mixture of Mo, Mn or a mixture of Mo, Mn,
Apply a mixture of CaO and SiO 2 onto ceramics,
Mn− heat treated at 1300-1700℃ in humidified hydrogen
Proposed methods include the Mo method, and the copper metallization method, in which a mixture of copperides and SiO 2 is applied onto ceramics, heat treated in the air at 1100 to 1400°C, and then the surface is reduced to metal using alcohol. All of these methods require a step of heat treatment at a high temperature in order to accelerate the reaction. Therefore, conventionally,
The entire ceramic is placed in a high-temperature furnace, and the entire ceramic is heated to a predetermined temperature by radiation and convection from the heater in the high-temperature furnace.

しかし、処理温度が高くなると、セラミツクス
の表面酸化及び母材の劣化が全体に及ぶ虞れがあ
るという重大な問題がある。またセラミツクスが
大型化すれば、それに伴い高温炉の設備が高価に
なり、炉が大きくなれば、所定の温度まで加熱す
る時間及び冷却時間も長くなり、ランニングコス
トも高価となる問題があつた。 However, when the processing temperature becomes high, there is a serious problem in that there is a risk that the surface of the ceramics will be oxidized and the base material will be degraded throughout. Furthermore, as ceramics become larger, high-temperature furnace equipment becomes more expensive, and larger furnaces require longer heating times and cooling times to a predetermined temperature, leading to higher running costs.

〔問題点を解決するための手段〕[Means for solving problems]

上記の問題点を解決するために、請求項１にお
いては、セラミツクスの表面処理をする面に、一
層以上のメタライズ材を挿入して発熱体を接触さ
せ、発熱体の通電によるジユール熱によつて、メ
タライズ材及び表面処理をする面を加熱して表面
処理をする面を金属化することを特徴としてい
る。 In order to solve the above-mentioned problems, in claim 1, one or more layers of metallized material are inserted into the surface of the ceramic to be surface-treated and a heating element is brought into contact with the surface, and the heating element is heated by energizing the heating element. The method is characterized in that the surface to be surface treated is metallized by heating the metallizing material and the surface to be surface treated.

また、請求項２においては、セラミツクスの表
面処理をする面に、発熱体を兼用したメタライズ
材を接触させ、メタライズ材の通電によるジユー
ル熱によつて、メタライズ材及び表面処理をする
面を加熱して表面処理をする面を金属化すること
を特徴としている。 Further, in claim 2, a metallized material that also serves as a heating element is brought into contact with the surface of the ceramic to be surface-treated, and the metallized material and the surface to be surface-treated are heated by Joule heat generated by energization of the metallized material. The feature is that the surface to be surface treated is metallized.

さらに、請求項３においては、セラミツクスの
表面処理をする面と発熱体を兼用したメタライズ
材との間に、接合材を挿入して表面処理をする面
を金属化することを特徴としている。 Furthermore, a third aspect of the present invention is characterized in that the surface to be surface treated is metallized by inserting a bonding material between the surface of the ceramic to be surface treated and the metallized material which also serves as a heating element.

〔作用及び実施例〕[Function and Examples]

実施例 １ 第１図は、本発明の方法を適用した第１の実施
例を示す要部断面図であつて、例えば角柱状のセ
ラミツクスの表面処理をする面を一層のメタライ
ズ材で表面処理する場合を示している。まず、セ
ラミツクス１の処理をする面にメタライズ材２を
挿入して発熱体３を接触させた後、この上に絶縁
及び断熱効果を有する支持体４に載置して、セラ
ミツクス１の処理をする面と垂直方向に圧力を加
えて固定する。つぎに、図示しない電源装置に接
続された電極５ａ，５ｂを発熱体３の両端に取り
付ける。また、セラミツクス１の処理をする面と
メタライズ材２とを所定の処理温度に加熱するた
めに、温度センサ８を発熱体３の上部に位置する
箇所の支持体４内に埋込む。 Example 1 FIG. 1 is a sectional view of a main part showing a first example in which the method of the present invention is applied. For example, the surface of a prismatic ceramic to be surface-treated is treated with a layer of metallizing material. It shows the case. First, the metallized material 2 is inserted into the surface of the ceramic 1 to be treated and the heating element 3 is brought into contact with it, and then the metallized material 2 is placed on a support 4 having an insulating and heat-insulating effect, and the ceramic 1 is treated. Fix by applying pressure perpendicular to the surface. Next, electrodes 5a and 5b connected to a power supply device (not shown) are attached to both ends of the heating element 3. Further, in order to heat the surface of the ceramic 1 to be treated and the metallized material 2 to a predetermined treatment temperature, a temperature sensor 8 is embedded in the support body 4 at a location above the heating element 3.

このような構成において、セラミツクス１を例
えばAl2O3とし、メタライズ材２を例えば
Cu2O／SiO2／Al2O3の混合物とし、これをペー
スト状にしてセラミツクス１上に約200μm塗布す
る。発熱体３としては、処理温度でメタライズ材
２と殆んど反応しないか、また反応しても容易に
分離できるものが選定され、例えばカーボン単体
またはBNなどの離型剤をコーテイングした金属
体もしくは導電性セラミツクスが使用できる。 In such a configuration, the ceramic 1 is made of Al 2 O 3 , for example, and the metallized material 2 is made of, for example, Al 2 O 3.
A mixture of Cu 2 O/SiO 2 /Al 2 O 3 is prepared, and this is made into a paste and applied onto the ceramic 1 to a thickness of about 200 μm. The heating element 3 is selected from one that hardly reacts with the metallized material 2 at the processing temperature, or that can be easily separated even if it does, such as carbon alone, a metal body coated with a release agent such as BN, or a metal body coated with a release agent such as BN. Conductive ceramics can be used.

今、発熱体３の上に支持体４を載置し約
0.2MPaの圧力を加えて、電極５ａ，５ｂ間に電
圧を印加すると、発熱体３にジユール熱が発生
し、その結果メタライズ材２を含むセラミツクス
１の処理面全体が高温に加熱される。この場合、
雰囲気は大気として、1100〜1200℃の処理温度で
Cu2O／SiO2／Al2O3の混合物が溶融し、約５分
保持した後に冷却すると、セラミツクス１とメタ
ライズ材２とが強固に結合される。なお、発熱体
３を分離した後のセラミツクスの表面処理層は金
属化していないので、還元液中に浸すことにより
簡単に金属化される。 Now, place the support 4 on top of the heating element 3 and
When a pressure of 0.2 MPa is applied and a voltage is applied between the electrodes 5a and 5b, Joule heat is generated in the heating element 3, and as a result, the entire treated surface of the ceramic 1 including the metallized material 2 is heated to a high temperature. in this case,
The atmosphere is air, and the processing temperature is 1100-1200℃.
When the mixture of Cu 2 O/SiO 2 /Al 2 O 3 is melted, held for about 5 minutes, and then cooled, the ceramic 1 and the metallized material 2 are firmly bonded. Note that, since the surface treatment layer of the ceramic after separating the heating element 3 is not metalized, it can be easily metalized by immersing it in a reducing solution.

実施例 ２ 第２図は、本発明の方法を適用した第２の実施
例を示す要部断面図であつて、実施例１とは異な
る種類のメタライズ材で表面処理するために、セ
ラミツクスの表面処理をする面を複数層、例えば
２層のメタライズ材で段階的に表面処理する場合
を示している。まず、セラミツクス１の処理をす
る面に２種類のメタライズ材２Ａ，２Ｂを挿入し
て発熱体３を接触させた後、この上に支持体４を
載置しセラミツクス１に圧力を加えて固定する。
つぎに、電極５ａ，５ｂ及び温度センサ８を実施
例１と同様に設置する。Example 2 FIG. 2 is a cross-sectional view of a main part showing a second example in which the method of the present invention is applied. This figure shows a case in which the surface to be treated is treated in stages with multiple layers, for example, two layers of metallizing material. First, two types of metallized materials 2A and 2B are inserted into the surface of the ceramic 1 to be treated and the heating element 3 is brought into contact with the metallized materials 2A and 2B.The support 4 is then placed on top of the metallized materials 2A and 2B and fixed by applying pressure to the ceramic 1. .
Next, electrodes 5a, 5b and temperature sensor 8 are installed in the same manner as in Example 1.

このような構成において、セラミツクス１を
Al2O3とし、メタライズ材２Ａを例えばCaO／
Al2O3／MgO／SiO2の混合物とし、これをペー
スト状にしてセラミツクス１上に約200μm塗布す
る。また、メタライズ材２Ｂを例えばMo箔と
し、発熱体３としては実施例１と同様に表面処理
後、メタライズ材２Ｂと容易に分離できるものが
選定される。 In such a configuration, ceramics 1
Al 2 O 3 and the metallized material 2A is, for example, CaO/
A mixture of Al 2 O 3 /MgO/SiO 2 is prepared, and this is made into a paste and applied onto the ceramics 1 to a thickness of about 200 μm. Further, the metallized material 2B is, for example, Mo foil, and the heating element 3 is selected from one that can be easily separated from the metallized material 2B after surface treatment as in Example 1.

今、発熱体３の上に支持体４を載置し約
0.2MPaの圧力を加えて電圧を印加すると、メタ
ライズ材２Ａ，２Ｂを含むセラミツクス１の処理
面全体が加熱される。この場合、雰囲気は
10-5Torrの真空として、約1600℃の処理温度で
CaO／Al2O3／MgO／SiO2の混合物のみが溶融
し、メタライズ材２Ａがセラミツクス１とメタラ
イズ材２Ｂとに反応してそれぞれ強固に結合され
る。 Now, place the support 4 on top of the heating element 3 and
When a voltage of 0.2 MPa is applied, the entire treated surface of the ceramic 1 including the metallized materials 2A and 2B is heated. In this case, the atmosphere is
As a vacuum of 10 -5 Torr, at a processing temperature of approximately 1600°C.
Only the mixture of CaO/Al 2 O 3 /MgO/SiO 2 is melted, and the metallized material 2A reacts with the ceramic 1 and the metallized material 2B to be firmly bonded to each other.

なお、この実施例は実施例１と異なり、メタラ
イズ材がセラミツクスと簡単に反応しないため
に、強い結合が得られない場合に有効であつて、
この実施例の他の目的としては、熱応力緩和を考
慮する場合がある。すなわち、セラミツクスの熱
膨張係数をαcとし、このセラミツクスの金属化
された面と結合される金属の熱膨張係数をαdと
し、またメタライズ材２Ａ，２Ｂの熱膨張係数を
それぞれαa，αbとすれば、αc≦αa≦αb≦αdな
る関係を満足するように各材料が選定される。例
えば、その一つ例を示すと、セラミツクス１が
Si3N4、メタライズ材２ＡがTi／Ni合全箔、メタ
ライズ材２ＢがNi箔、発熱体３がBNコーテイン
グしたタングステン、接合金属がCuの組み合せ
がある。この場合の処理条件は、雰囲気が
10-5Torrの真空、処理温度が約1000℃、圧力が
約0.2MPaである。 Note that this example is different from Example 1, and is effective when a strong bond cannot be obtained because the metallized material does not easily react with ceramics.
Another purpose of this embodiment is to consider thermal stress relaxation. That is, if the coefficient of thermal expansion of the ceramic is αc, the coefficient of thermal expansion of the metal bonded to the metallized surface of the ceramic is αd, and the coefficients of thermal expansion of the metallized materials 2A and 2B are αa and αb, respectively, then , each material is selected so as to satisfy the relationship αc≦αa≦αb≦αd. For example, to give one example, ceramics 1
There is a combination of Si 3 N 4 , the metallized material 2A is a Ti/Ni composite foil, the metallized material 2B is a Ni foil, the heating element 3 is BN-coated tungsten, and the bonding metal is Cu. In this case, the processing conditions are such that the atmosphere is
The vacuum is 10 -5 Torr, the processing temperature is about 1000℃, and the pressure is about 0.2MPa.

実施例 ３ 第３図は、本発明の方法を適用した第３の実施
例を示す要部断面図であつて、セラミツクスの処
理をする面に発熱体を兼用したメタライズ材を直
接接合して表面処理する場合を示している。ま
ず、セラミツクス１の処理をする面に発熱体を兼
用したメタライズ材６を接触させた後、この上に
支持体４を載置する。つぎに、電極５ａ，５ｂ及
び温度センサ８を実施例１と同様に設置する。Example 3 FIG. 3 is a cross-sectional view of a main part showing a third example in which the method of the present invention is applied, in which a metallized material that also serves as a heating element is directly bonded to the surface of the ceramic to be treated. The case of processing is shown. First, the metallized material 6, which also serves as a heating element, is brought into contact with the surface of the ceramic 1 to be treated, and then the support 4 is placed thereon. Next, electrodes 5a, 5b and temperature sensor 8 are installed in the same manner as in Example 1.

このような構成において、セラミツクス１を
Al2O3とし、発熱体を兼用したメタライズ材６と
しては大きな圧力を加えて固相拡散を起こさせる
ものが選定され、例えばCuの薄板が使用できる。 In such a configuration, ceramics 1
The metallized material 6, which is made of Al 2 O 3 and also serves as a heating element, is selected to cause solid phase diffusion by applying a large pressure, and for example, a thin plate of Cu can be used.

今、発熱体を兼用したメタライズ材６の上に支
持体４を載置し約10MPaの圧力を加えて電圧を
印加すると、セラミツクス１の処理面全体が加熱
される。この場合、雰囲気は10-5Torrの真空と
し、約1000℃の処理温度でメタライズ材６のCu
がセラミツクス１のAl2O3中に拡散し、セラミツ
クス１とメタライズ材６とが強固に結合される。 Now, when the support 4 is placed on the metallized material 6 which also serves as a heating element and a voltage of about 10 MPa is applied, the entire treated surface of the ceramic 1 is heated. In this case, the atmosphere is a vacuum of 10 -5 Torr, and the Cu of the metallized material 6 is heated at a processing temperature of approximately 1000°C.
is diffused into the Al 2 O 3 of the ceramics 1, and the ceramics 1 and the metallized material 6 are firmly bonded.

なお、この実施例では、発熱体を兼用したメタ
ライズ材が結合されたままであるので、そのはみ
出し部分を除去する必要がある。 In this example, since the metallized material that also serves as a heating element remains bonded, it is necessary to remove the protruding portion.

実施例 ４ 第４図は、本発明の方法を適用した第４の実施
例を示す要部断面図を示す図であつて、セラミツ
クスの処理をする面に発熱体を兼用したメタライ
ズ材を結合材により接合して表面処理する場合を
示している。まず、セラミツクス１の処理をする
面に接合材７を挿入して発熱体を兼用したメタラ
イズ材６を接触させた後、この上に支持体４を載
置する。つぎに、電極５ａ，５ｂ及び温度センサ
８を実施例１と同様に設置する。Example 4 FIG. 4 is a cross-sectional view of a main part showing a fourth example to which the method of the present invention is applied, in which a metallized material that also serves as a heating element is attached to the surface of the ceramic to be treated as a binder. This shows the case where the surfaces are bonded and surface treated. First, the bonding material 7 is inserted into the surface of the ceramic 1 to be treated and the metallized material 6, which also serves as a heating element, is brought into contact with it, and then the support 4 is placed thereon. Next, electrodes 5a, 5b and temperature sensor 8 are installed in the same manner as in Example 1.

このような構成において、セラミツクス１を
Al2O3とし、接合材７を例えばCaO／Al3O3／
MgO／SiO2の混合物とし、これをペースト状に
してセラミツクス１上に約200μm塗布する。ま
た、発熱体を兼用したメタライズ材６としては
Moの薄板が例示できる。 In such a configuration, ceramics 1
Al 2 O 3 and the bonding material 7 is, for example, CaO/Al 3 O 3 /
A mixture of MgO/SiO 2 is prepared, and this is made into a paste and applied onto ceramics 1 to a thickness of approximately 200 μm. In addition, as a metallized material 6 that also serves as a heating element,
An example is a thin Mo plate.

今、発熱体を兼用したメタライズ材６の上に支
持体４を載置し約0.2MPaの圧力を加えて電圧を
印加すると、接合材７を含むセラミツクスの処理
面全体が加熱される。この場合、雰囲気は
10-5Torrの真空とし、約1600℃の処理温度で
CaO／Al2O3／MgO／SiO2の混合物が溶融し、
接合材７がセラミツクス１と発熱体を兼用したメ
タライズ材６とに反応してそれぞれ強固に結合さ
れる。 Now, when the support 4 is placed on the metallized material 6 which also serves as a heating element and a voltage of about 0.2 MPa is applied, the entire treated surface of the ceramic including the bonding material 7 is heated. In this case, the atmosphere is
At a vacuum of 10 -5 Torr and a processing temperature of approximately 1600°C.
A mixture of CaO/Al 2 O 3 /MgO/SiO 2 is melted,
The bonding material 7 reacts with the ceramics 1 and the metallized material 6, which also serves as a heating element, and is firmly bonded to each other.

なお、この実施例においても実施例３と同様
に、発熱体を兼用したメタライズ材のはみ出し部
分を除去する必要がある。 Note that in this example as well, as in Example 3, it is necessary to remove the protruding portion of the metallized material that also serves as a heating element.

実施例 ５ 第５図は、本発明の方法を適用した第５の実施
例を示す要部断面図であつて、実施例１の発熱体
を境にして上下部材を入れ替えて表面処理する場
合を示している。まず、セラミツクス１の処理を
する面にメタライズ材２を挿入して発熱体３を接
触させた後、これらを絶縁及び断熱効果を有する
支持体４に載置して、セラミツクス１の処理をす
る面と垂直方向に圧力を加えて固定する。つぎ
に、電極５ａ，５ｂを発熱体３の両端に取り付
け、またセラミツクス１の処理をする面とメタラ
イズ材２とを所定の処理温度に加熱するために、
温度センサ８を発熱体３の下部に位置する箇所の
支持体４４内に埋込む。Example 5 FIG. 5 is a cross-sectional view of a main part showing a fifth example to which the method of the present invention is applied, and shows a case in which the upper and lower members are replaced with the heating element in Example 1 and surface treatment is performed. It shows. First, the metallized material 2 is inserted into the surface of the ceramic 1 to be treated and the heating element 3 is brought into contact therewith, and then these are placed on a support 4 having an insulating and heat-insulating effect to form the surface of the ceramic 1 to be treated. and apply vertical pressure to fix it. Next, electrodes 5a and 5b are attached to both ends of the heating element 3, and in order to heat the surface of the ceramic 1 to be treated and the metallized material 2 to a predetermined treatment temperature,
The temperature sensor 8 is embedded in the support body 44 at a location below the heating element 3.

このような構成において、セラミツクス１，メ
タライズ材２及び発熱体３を実施例１と同様にし
て、セラミツクス１，メタライズ材２２及び発熱
体３を支持体４に載置し約0.2MPaの圧力を加え
て、電極５ａ，５ｂ間に電圧を印加する。 In this configuration, the ceramic 1, the metallized material 2, and the heating element 3 were placed on the support 4 in the same manner as in Example 1, and a pressure of about 0.2 MPa was applied. Then, a voltage is applied between the electrodes 5a and 5b.

以下、実施例１と同様であるので省略する。 The following description is omitted since it is the same as in Example 1.

なお、前述した実施例２についても発熱体を境
にして上下部材を入れ替えて表面処理してもよ
く、また実施例３，４についても発熱体を兼用し
たメタライズ材を境にして上下部材を入れ替えて
表面処理してもよい。 In addition, in the above-mentioned Example 2, the upper and lower members may be replaced with the heating element as the boundary and the surface treatment may be performed, and in Examples 3 and 4, the upper and lower members may also be replaced with the metallized material that also serves as the heating element as the boundary. Surface treatment may be performed.

以上の実施例において、表面処理面積が大きい
場合、実施例１，２及び５では発熱体をセラミツ
クス及びメタライズ材に対して相対移動できる移
動手段を設け、実施例３，４では電極をセラミツ
クスまたはセラミツクス及び接合材に対して相対
移動できる移動手段を設ける。また、実施例１乃
至５では複数対の電極を設けるか、帯状の電極を
設ければよい。 In the above examples, when the surface treatment area is large, in Examples 1, 2 and 5, a moving means that can move the heating element relative to the ceramic and metallized material is provided, and in Examples 3 and 4, the electrode is made of ceramic or ceramic. and a moving means that can move relative to the bonding material. Further, in Examples 1 to 5, a plurality of pairs of electrodes or a band-shaped electrode may be provided.

なお、実施例１，２及び５は本発明の請求項１
に対応し、実施例３は本発明の請求項２に対応
し、実施例４は本発明の請求項３に対応する。 Note that Examples 1, 2, and 5 constitute Claim 1 of the present invention.
Accordingly, the third embodiment corresponds to claim 2 of the present invention, and the fourth embodiment corresponds to claim 3 of the present invention.

〔発明の効果〕 以上のように、本発明によれば、セラミツクス
の表面処理をする面をジユール熱によつて、直接
加熱して処理するようにしたので、セラミツクス
全体の表面酸化及び母材劣化を最小限にとどめる
ことができ、かつ短時間表面処理、設備費の低
減、ランニングコストの低減が可能であるという
実用上の価値が大である。[Effects of the Invention] As described above, according to the present invention, since the surface of the ceramic to be surface-treated is directly heated with Joule heat, surface oxidation of the entire ceramic and deterioration of the base material are prevented. It has great practical value in that it can minimize the amount of damage caused by surface treatment, short-time surface treatment, reduce equipment costs, and reduce running costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明の方法を適用した第１の実施
例を示す要部断面図、第２図は本発明の方法を適
用した第２の実施例を示す要部断面図、第３図は
本発明の方法を適用した第３の実施例を示す要部
断面図、第４図は本発明の方法を適用した第４の
実施例を示す要部断面図、第５図は本発明の方法
を適用した第５の実施例を示す要部断面図であ
る。 １…セラミツクス、２，２Ａ，２Ｂ…メタライ
ズ材、３…発熱体、５ａ，５ｂ…電極、６…発熱
体を兼用したメタライズ材、７…接合材。 FIG. 1 is a cross-sectional view of a main part showing a first embodiment to which the method of the present invention is applied, FIG. 2 is a cross-sectional view of a main part showing a second embodiment to which the method of the present invention is applied, and FIG. 4 is a cross-sectional view of a main part showing a third embodiment to which the method of the present invention is applied, FIG. 4 is a cross-sectional view of a main part showing a fourth embodiment to which the method of the present invention is applied, and FIG. FIG. 7 is a cross-sectional view of main parts showing a fifth example to which the method is applied. DESCRIPTION OF SYMBOLS 1... Ceramics, 2, 2A, 2B... Metallized material, 3... Heating element, 5a, 5b... Electrode, 6... Metallized material that also serves as a heating element, 7... Bonding material.

Claims (1)

【特許請求の範囲】 １ セラミツクスの表面処理をする面に、一層以
上のメタライズ材を挿入して発熱体を接触させ、
前記発熱体の通電によるジユール熱によつて、前
記メタライズ材及び表面処理をする面を加熱して
表面処理をする面を金属化するセラミツクスの表
面処理方法。 ２ セラミツクスの表面処理をする面に、発熱体
を兼用したメタライズ材を接触させ、前記メタラ
イズ材の通電によるジユール熱によつて、前記メ
タライズ材及び表面処理をする面を加熱して表面
処理をする面を金属化するセラミツクスの表面処
理方法。 ３ セラミツクスの表面処理をする面と発熱体を
兼用したメタライズ材との間に、接合材を挿入し
た請求項２記載のセラミツクスの表面処理方法。[Claims] 1. One or more layers of metallized material are inserted into the surface of the ceramic to be surface-treated and a heating element is brought into contact with the surface,
A method for surface treatment of ceramics, in which the metallizing material and the surface to be surface treated are heated by Joule heat generated by energization of the heating element to metallize the surface to be surface treated. 2. A metallized material that also serves as a heating element is brought into contact with the surface of the ceramic to be surface-treated, and surface treatment is performed by heating the metallized material and the surface to be surface-treated using Joule heat generated by energizing the metallized material. A method of surface treatment of ceramics that metalizes the surface. 3. The method for surface treatment of ceramics according to claim 2, wherein a bonding material is inserted between the surface of the ceramic to be surface treated and the metallized material which also serves as a heating element.
JP4384688A 1988-02-25 1988-02-25 Surface treatment of ceramic Granted JPH01219089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4384688A JPH01219089A (en) 1988-02-25 1988-02-25 Surface treatment of ceramic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4384688A JPH01219089A (en) 1988-02-25 1988-02-25 Surface treatment of ceramic

Publications (2)

Publication Number Publication Date
JPH01219089A JPH01219089A (en) 1989-09-01
JPH0535713B2 true JPH0535713B2 (en) 1993-05-27

Family

ID=12675093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4384688A Granted JPH01219089A (en) 1988-02-25 1988-02-25 Surface treatment of ceramic

Country Status (1)

Country Link
JP (1) JPH01219089A (en)

Also Published As

Publication number Publication date
JPH01219089A (en) 1989-09-01

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