JPH0537734Y2 - - Google Patents
Info
- Publication number
- JPH0537734Y2 JPH0537734Y2 JP8756186U JP8756186U JPH0537734Y2 JP H0537734 Y2 JPH0537734 Y2 JP H0537734Y2 JP 8756186 U JP8756186 U JP 8756186U JP 8756186 U JP8756186 U JP 8756186U JP H0537734 Y2 JPH0537734 Y2 JP H0537734Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- led
- light
- board
- led mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 230000000630 rising effect Effects 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 8
- 239000003086 colorant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Train Traffic Observation, Control, And Security (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本案は信号機、警報機、標識、表示器などに用
いる信号灯に関する。[Detailed description of the invention] [Industrial application field] This invention relates to a signal light used for traffic lights, alarms, signs, indicators, etc.
従来より鉄道信号機、警報機、標識などの灯器
の光源には専らフイラメント電球が用いられてき
た。
Conventionally, filament light bulbs have been used exclusively as light sources for lighting devices such as railway signals, alarms, and signs.
例えば信号電球ではその形式としてF形、G
形、I形ほかに区別され、用途目的によつて使い
分けられている。フイラメント電球は光源の分類
上点光源であり、通常段付レンズと組合せ、レン
ズの焦点を合わせるため特別に電球ベースに凸起
のあるカラーを被せ、凸起とフイラメントとのな
す角度および相互距離を厳重に規定している。電
球の後に反射鏡を置くことによつて光力を27倍に
も増幅することができるが、日光の直射を受ける
と、灯色を現示して幻影を生ずるため、用途によ
つては反射鏡を置くことができない場合がある。 For example, the format of signal light bulbs is F type, G type.
It is divided into two types, I-type, I-type, etc., and is used depending on the purpose of use. Filament light bulbs are classified as point light sources, and are usually combined with a stepped lens.In order to focus the lens, a special convex collar is placed on the bulb base, and the angle and mutual distance between the convex and filament are adjusted. It is strictly regulated. By placing a reflector after the light bulb, the light power can be amplified by 27 times, but when exposed to direct sunlight, the light color appears and creates an illusion, so depending on the purpose, a reflector may be used. It may not be possible to place the
ところで、信号灯器の光源にフイラメント電球
を用いたときには以下にのべるような問題点があ
る。すなわち、その第1はフイラメントの断芯に
より比較的短期間で寿命が尽き、その交換や保守
管理が厄介であるという点である。
By the way, when a filament light bulb is used as a light source for a signal lamp, there are problems as described below. The first problem is that the life of the filament ends in a relatively short period of time due to breakage of the filament, and its replacement and maintenance are troublesome.
例えば多灯形信号機には形式G形、信号電球が
用いられ、その寿命は5000時間と定められている
が、通常定格電圧の80〜90%の電圧で使用して寿
命を延ばしている。しかし、使用期間は2年を超
えないようにし、さらに重要な停止信号灯の電球
は7ケ月に定め、取替えの際には停止灯に新品を
用い、進行灯、注意灯の順に使用するという取扱
いがなされている。 For example, type G signal bulbs are used in multi-light traffic lights, and their lifespan is set at 5,000 hours, but they are usually used at 80 to 90% of the rated voltage to extend their lifespan. However, the usage period should not exceed two years, and more importantly, the bulbs of stop signal lights should be used for seven months, and when replacing stop lights, new ones should be used, followed by proceeding lights and caution lights. being done.
第2に消費電力が大きいという点である。前述
の多灯形信号機に用いるG形電球は定格30V,
40Wである。信号灯へは信号用電源装置から給電
される。信号用電源は無停電電源を原則とし、列
車運転のための重要な設備であるから、他の用途
への流用を厳しく制限している。したがつて、消
費電力を可及的少なくすることは単なる節電以上
に重要な問題である。その他点光源のため、光束
の利用効率が悪いという点がある。そこで、
LED(発光ダイオード)の利用者に着目されるよ
うになつてきた。LEDを信号発光源に用いれば、
電球使用による上記欠点のかなりの部分を解消す
ることができる。もつとも、現用のLEDは、1
個当りの光量が少ないため、信号光源に利用する
には、所要の光量が得られるように複数のLED
を組込まなければならない。 The second point is that power consumption is large. The G-type light bulb used in the multi-light traffic light mentioned above has a rating of 30V.
It is 40W. Power is supplied to the signal light from the signal power supply device. Signal power supplies are, in principle, uninterruptible power supplies, and as they are important equipment for train operation, their use for other purposes is strictly restricted. Therefore, reducing power consumption as much as possible is a more important issue than simple power saving. Another problem is that because it is a point light source, the efficiency of using the luminous flux is low. Therefore,
LED (light emitting diode) users are starting to pay attention to this technology. If LED is used as a signal light source,
A considerable part of the disadvantages mentioned above due to the use of light bulbs can be eliminated. However, the current LED is 1
Since the amount of light per individual is small, it is necessary to use multiple LEDs to obtain the required amount of light when using it as a signal light source.
must be incorporated.
従来より、基板上にLEDを縦横に配列して灯
器に組み込んだ信号灯は知られている。 Signal lights have been known in the past, in which LEDs are arranged vertically and horizontally on a board and incorporated into a lamp device.
ところが、市販のLEDの構造は、LEDチツプ
を透明樹脂でモールドしたものであるため、発光
素子の周囲にモールド樹脂が張り出し、基板上に
LEDを密に配列したとしてもその数は限られ、
現用のLEDを用いて信号灯に必要な光量を得る
ためには、基板を大型化せざるを得ない。 However, the structure of commercially available LEDs is that the LED chip is molded with transparent resin, so the molding resin protrudes around the light-emitting element and is exposed to the substrate.
Even if LEDs are arranged densely, the number is limited,
In order to obtain the amount of light required for signal lights using current LEDs, the board must be made larger.
また、混色例えば、アンバー(橙色)に発光さ
せるときには、赤色発色のLEDと緑色発色の
LEDとを基板上に分散させて配列するが、配列
が密でないと、所望の混色が得られないという問
題がある。 In addition, when mixing colors, for example, to emit amber (orange), it is necessary to use a red LED and a green LED.
The LEDs are distributed and arranged on the substrate, but if the arrangement is not dense, there is a problem that the desired color mixture cannot be obtained.
さらに、LEDの発熱は僅かであるが、全体と
しての発熱量は大きく、個々のLEDチツプが個
別に樹脂モールドされていると、放熱性が悪いと
いう問題を生ずる。 Furthermore, although LEDs generate only a small amount of heat, the overall amount of heat generated is large, and when each LED chip is individually molded in resin, there is a problem of poor heat dissipation.
本考案の目的は、基板上にLEDを密に配列し
て一定面積内での発光量を増大させたLED使用
による信号灯を提供することにある。 An object of the present invention is to provide a signal light using LEDs in which LEDs are arranged densely on a substrate to increase the amount of light emitted within a certain area.
上記目的を達成するため、本案による信号灯に
おいては、LED取付基板2と、ブロツク本体1
と、透明樹脂槽9とを灯器内に有する信号灯であ
つて、
LED取付基板2は、プリント配線に多数の
LEDチツプCを結線して板面に配列した信号灯
の発光面であり、
ブロツク本体1は、LED取付基板2を保持し
て信号灯の灯器内に設置するものであり、放熱フ
イン4と嵌合座5と傾斜状立上り部6とを有し、
放熱フイン4は、LEDチツプCの発光による
発熱を放熱するものであり、
嵌合座5は、LED取付基板2を嵌合保持する
ものであり、
傾斜状立上り部6は、LED取付基板2を保持
した嵌合座5の外周縁から上傾して立上がらせた
部分であり、
透明樹脂槽9は、LED取付基板2上の各LED
チツプCを埋設して傾斜状立上り部6に充填して
硬化させた透明な表面保護層であり、
ブロツク本体1を灯器13内に設置し、LED
取付基板2の発光面を灯器13のレンズ14と向
き合わせに配置したものである。
In order to achieve the above purpose, the signal light according to the present invention includes an LED mounting board 2 and a block body 1.
The signal light has a transparent resin tank 9 and a transparent resin tank 9 in the lamp unit, and the LED mounting board 2 has many printed wirings.
This is the light emitting surface of a signal light in which LED chips C are connected and arranged on a board surface, and the block body 1 holds an LED mounting board 2 and is installed in the signal light device, and is fitted with a heat dissipation fin 4. It has a seat 5 and an inclined rising part 6, the heat radiation fin 4 is for dissipating the heat generated by the light emission of the LED chip C, and the fitting seat 5 is for fitting and holding the LED mounting board 2. The slanted rising portion 6 is a portion that is tilted upward from the outer peripheral edge of the fitting seat 5 that holds the LED mounting board 2, and the transparent resin tank 9 is a part that is tilted upward from the outer peripheral edge of the fitting seat 5 that holds the LED mounting board 2.
This is a transparent surface protective layer made by embedding chips C and filling them into the inclined rising portion 6 and hardening them.
The light emitting surface of the mounting board 2 is arranged to face the lens 14 of the lamp device 13.
基板上に配列した各LEDチツプは、一括して
透明樹脂層でモールドされ、樹脂モールドに妨げ
られることなく、LEDチツプは、相互間の間隔
を詰めて基板上に密に配列され、発光量が増大
し、混色のときにもむらなく発光する。また、各
LEDチツプに生じた熱は、基板を通じてブロツ
ク本体に放熱される。
Each LED chip arranged on the substrate is molded all at once with a transparent resin layer, and without being obstructed by the resin mold, the LED chips are arranged densely on the substrate with close spacing between them, increasing the amount of light emitted. The color increases and the light is emitted evenly even when mixed colors. Also, each
The heat generated in the LED chip is radiated to the block body through the board.
以下に本案の信号灯を出発信号機の灯器に適用
した場合の実施例を図によつて説明する。
An embodiment in which the signal light of the present invention is applied to a departure signal light device will be described below with reference to the drawings.
出発信号機は停車場の出発線に設ける信号機で
あり、停車場から出発する列車に対し、その信号
機の前途が開通しているかどうかを指示するため
のものである。しかし本考案を適用する灯器は出
発信号機に限られるものではない。いずれの種類
の信号機に適用する場合も全く同じである。 A departure signal is a signal installed on the departure line of a stop, and is used to indicate to trains departing from the stop whether or not the road ahead of the signal is open. However, the lighting equipment to which the present invention is applied is not limited to departure signals. The same applies to any type of traffic light.
本案の信号灯は第1図、第2図に示すように円
板状のブロツク本体1と該ブロツク本体1に組み
込んだLED取付基板2とからなつている。ブロ
ツク本体1は放熱性に優れたアルミニウム材から
なり、中央に貫通孔3が開口され、背面に放熱フ
イン4が突設されている。第3図において、ブロ
ツク本体1の正面に開口された貫通孔3の口縁に
はLED取付基板2の嵌合座5を段状に設け、さ
らに嵌合座5の口縁より外周に向けて上傾する傾
斜状立上り部6を形成する。一方、LED取付基
板2は、プリント配線に多数のLEDチツプC,
C…を結線して板面に配列したものである。 As shown in FIGS. 1 and 2, the signal light of the present invention consists of a disk-shaped block body 1 and an LED mounting board 2 incorporated into the block body 1. The block body 1 is made of an aluminum material with excellent heat dissipation properties, has a through hole 3 opened in the center, and has heat dissipation fins 4 protruding from the back surface. In FIG. 3, a fitting seat 5 for the LED mounting board 2 is provided in a stepped manner on the edge of the through hole 3 opened on the front side of the block body 1, and a fitting seat 5 for the LED mounting board 2 is provided in a stepped manner from the edge of the fitting seat 5 toward the outer periphery. An upwardly sloping slanted rising portion 6 is formed. On the other hand, the LED mounting board 2 has a large number of LED chips C,
C... are connected and arranged on the board surface.
このLED取付基板2をブロツク本体1に設け
た嵌合座5上に嵌合保持させて基板面に取付けら
れたLEDチツプCの配列を正面に向けて設置し、
立上り部6の傾斜面に開口した小孔7を通して
LED取付基板2の配線に結線されたリード線8
を後方へ引き出し、次に透明のエポキシ樹脂液を
基板2上に供給し、立上り部6内に透明樹脂を受
け入れ、硬化によつて形成された透明樹脂層9中
に基板2上のLEDチツプC,C…を埋設させる。
この透明樹脂層9はLEDチツプCの表面保護層
となるものであるが、樹脂は空気と半導体との中
間の屈折率を有し、表面における全反射を少なく
して外部量子効率を高める機能を有し、さらに
LED取付基板2をブロツク本体1に定着させる
接着剤をも兼ねている。 This LED mounting board 2 is fitted and held on a fitting seat 5 provided on the block body 1, and installed with the array of LED chips C attached to the board surface facing the front.
Through the small hole 7 opened on the slope of the rising part 6
Lead wire 8 connected to the wiring of LED mounting board 2
is pulled out backward, and then a transparent epoxy resin liquid is supplied onto the substrate 2, the transparent resin is received in the rising part 6, and the LED chips C on the substrate 2 are placed in the transparent resin layer 9 formed by curing. , C... are buried.
This transparent resin layer 9 serves as a surface protective layer for the LED chip C. The resin has a refractive index between that of air and a semiconductor, and has the function of reducing total reflection on the surface and increasing external quantum efficiency. have and further
It also serves as an adhesive for fixing the LED mounting board 2 to the block body 1.
第2図において、放熱フイン4の端面一部に
は、スペーサ10を介して抵抗器、コンデンサな
どの電気部品11を搭載したプリント基板12を
取付け、LED取付基板2より引き出されたリー
ド線8をプリント基板12の電気部品11の配線
に結線する。 In FIG. 2, a printed circuit board 12 on which electrical components 11 such as resistors and capacitors are mounted is attached to a part of the end surface of the heat dissipation fin 4 via a spacer 10, and a lead wire 8 drawn out from the LED mounting board 2 is attached. Connect to the wiring of the electrical component 11 on the printed circuit board 12.
第4図は本案の信号灯を灯器内にセツトした状
態を示している。図において、灯器13は正面に
レンズ14を備え、その上部前方にフード15が
一体成形されたものである。ブロツク本体1の両
側にブラケツト16を跨らせて取付け、これを灯
器13内に収容し、LED取付基板2の発光面を
レンズ14の焦点位置に合わせてブラケツト16
を灯器13に固定する。このブラケツト16には
端子盤17が取付けられており、プリント基板1
2の電気部品11と端子盤17に引き込んだ外線
とを結線して基板2上のLEDチツプC,C…を
電源回路に接続する。 Figure 4 shows the signal light of the present invention set in the lamp unit. In the figure, a lamp 13 has a lens 14 on the front, and a hood 15 is integrally molded in front of the upper part thereof. Attach the brackets 16 to both sides of the block body 1, house them in the lamp unit 13, align the light emitting surface of the LED mounting board 2 with the focus position of the lens 14, and then attach the brackets 16 to both sides of the block body 1.
is fixed to the lamp 13. A terminal board 17 is attached to this bracket 16, and the printed circuit board 1
The electric components 11 of 2 and the external wires drawn into the terminal board 17 are connected to connect the LED chips C, C, . . . on the board 2 to the power circuit.
LEDチツプCへの通電により、各チツプCは
個有の色に発光し、これがレンズ14を通し平行
光線となつて正面前方に照射される。各LEDチ
ツプCの発光により発した熱はブロツク本体1に
吸収され、フイン4を通じて大気中に放熱され
る。 When the LED chips C are energized, each chip C emits light of a unique color, which passes through the lens 14 and becomes a parallel beam of light that is irradiated to the front. The heat generated by each LED chip C is absorbed by the block body 1 and radiated into the atmosphere through the fins 4.
本案において、LEDチツプCの各々は点光源
であるが、LEDは指向性に優れ、同一基板上に
多数個を配列することによつて実質的に面光源と
して正面に照射でき、さらにLEDチツプの表面
を被覆する透明樹脂内を通して発光効率を高める
ことができる。 In this case, each of the LED chips C is a point light source, but LEDs have excellent directivity, and by arranging a large number of them on the same substrate, they can be effectively illuminated in front as a surface light source. Luminous efficiency can be increased through the transparent resin covering the surface.
本案は以上のように基板上に配列した複数の
LEDチツプを一括して透明樹脂層でコートした
ため、各々のLEDは、樹脂コートに妨げられる
ことなく、相互の間隔を詰めて密に配列すること
が可能となり、LEDチツプ毎に樹脂コートした
一般のLEDを基板上に配列する場合に比して、
同一の大きさの基板上に多数のLEDチツプを組
付けることが可能となり、この結果、比較的小さ
な基板を用いて信号光源として必要な光量を得る
ことができる。
This proposal consists of multiple devices arranged on the board as described above.
Since the LED chips are coated all at once with a transparent resin layer, each LED can be closely arranged with close spacing between each other without being hindered by the resin coating. Compared to arranging LEDs on a board,
It becomes possible to assemble a large number of LED chips on a board of the same size, and as a result, it is possible to obtain the necessary amount of light as a signal light source using a relatively small board.
また、異なる発色のLEDを組合せたときには
鮮明な混色を発光させることができる。 Furthermore, when LEDs of different colors are combined, a clear mixed color can be emitted.
さらに本案においては、各LEDチツプを基板
に取付け、各LEDチツプを一括して透明合成樹
脂層でコートするため、各々のLEDチツプに発
した熱は、基板を通してブロツク本体に放熱でき
る。 Furthermore, in this proposal, each LED chip is attached to a board and each LED chip is coated all at once with a layer of transparent synthetic resin, so the heat generated by each LED chip can be radiated to the block body through the board.
特に本案では放熱器を兼ねたブロツク本体に
LED取付基板の嵌合座と、その口縁に傾斜状立
上り部を設けたため、立上り部内面をLEDチツ
プによる光源の反射面と、透明樹脂の受入れ部と
に有効に利用でき、LED取付基板とブロツク本
体をユニツト化して鉄道信号機、交通信号機その
他各種の信号機の灯器に広く適用することができ
る効果を有するものである。 In particular, in this proposal, the block body that also serves as a heat sink
Since the fitting seat of the LED mounting board and the slanted rising part are provided on its mouth edge, the inner surface of the rising part can be effectively used as a reflection surface for the light source of the LED chip and a receiving part for the transparent resin. This has the effect that the block body can be made into a unit and can be widely applied to railway signals, traffic signals, and other various types of signal lamps.
第1図は本案の一実施例を示す正面図、第2図
は縦断面図、第3図はLED取付基板の装着部分
を示す拡大断面図、第4図は本案の信号灯を装備
した灯器の断面図である。
1……ブロツク本体、2……LED取付基板、
3……貫通孔、4……放熱フイン、5……嵌合
座、6……立上り部、9……透明樹脂層、C……
LEDチツプ。
Fig. 1 is a front view showing an embodiment of the present invention, Fig. 2 is a longitudinal sectional view, Fig. 3 is an enlarged sectional view showing the mounting part of the LED mounting board, and Fig. 4 is a lamp equipment equipped with the signal light of the present invention. FIG. 1...Block body, 2...LED mounting board,
3... Through hole, 4... Heat dissipation fin, 5... Fitting seat, 6... Rising part, 9... Transparent resin layer, C...
LED chip.
Claims (1)
樹脂層9とを灯器内に有する信号灯であつて、 LED取付基板2は、プリント配線に多数の
LEDチツプCを結線して板面に配列した信号灯
の発光面であり、 ブロツク本体1は、LED取付基板2を保持し
て信号灯の灯器内に設置するものであり、放熱フ
イン4と嵌合座5と傾斜状立上り部6とを有し、 放熱フイン4は、LEDチツプCの発光による
発熱を放熱するものであり、 嵌合座5は、LED取付基板2を嵌合保持する
ものであり、 傾斜状立上り部6は、LED取付基板2を保持
した嵌合座5の外周縁から上傾して立上がらせた
部分であり、 透明樹脂層9は、LED取付基板2上の各LED
チツプCを埋設して傾斜状立上り部6に充填して
硬化させた透明な表面保護層であり、 ブロツク本体1を灯器13内に設置し、LED
取付基板2の発光面を灯器13のレンズ14と向
き合わせに配置したものであることを特徴とする
信号灯。[Claims for Utility Model Registration] A signal light having an LED mounting board 2, a block body 1, and a transparent resin layer 9 in the lamp unit.
This is the light emitting surface of a signal light in which LED chips C are connected and arranged on a board surface, and the block body 1 holds the LED mounting board 2 and is installed in the lamp unit of the signal light, and is fitted with the heat dissipation fin 4. It has a seat 5 and an inclined rising part 6, the heat dissipation fin 4 is for dissipating the heat generated by the light emission of the LED chip C, and the fitting seat 5 is for fitting and holding the LED mounting board 2. The slanted rising portion 6 is a portion that is tilted upward from the outer periphery of the fitting seat 5 holding the LED mounting board 2, and the transparent resin layer 9 is a portion that extends upward from the outer periphery of the fitting seat 5 that holds the LED mounting board 2.
This is a transparent surface protective layer made by burying chips C and filling them into the inclined rising portion 6 and hardening them.
A signal light characterized in that the light emitting surface of the mounting board 2 is arranged to face the lens 14 of the lamp device 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8756186U JPH0537734Y2 (en) | 1986-06-09 | 1986-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8756186U JPH0537734Y2 (en) | 1986-06-09 | 1986-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62198167U JPS62198167U (en) | 1987-12-16 |
| JPH0537734Y2 true JPH0537734Y2 (en) | 1993-09-24 |
Family
ID=30944888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8756186U Expired - Lifetime JPH0537734Y2 (en) | 1986-06-09 | 1986-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537734Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH076055Y2 (en) * | 1988-09-21 | 1995-02-15 | 株式会社光波 | Signal light |
-
1986
- 1986-06-09 JP JP8756186U patent/JPH0537734Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62198167U (en) | 1987-12-16 |
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