JPH0538544U - Temperature sensor structure - Google Patents
Temperature sensor structureInfo
- Publication number
- JPH0538544U JPH0538544U JP9573191U JP9573191U JPH0538544U JP H0538544 U JPH0538544 U JP H0538544U JP 9573191 U JP9573191 U JP 9573191U JP 9573191 U JP9573191 U JP 9573191U JP H0538544 U JPH0538544 U JP H0538544U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- filling
- filler
- case
- filling space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000945 filler Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims description 3
- 230000004043 responsiveness Effects 0.000 abstract description 4
- 239000000565 sealant Substances 0.000 abstract 1
- 230000004044 response Effects 0.000 description 15
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005457 ice water Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
(57)【要約】
【目的】 温度センサのケースの充填空間に充填する充
填剤の充填率を１０〔％〕から９０〔％〕の範囲内にす
ることにより、温度センサの応答性を向上させると共
に、充填剤が充填空間から外部に漏れることを防止す
る。
【構成】 温度感知素子２に、端子３を半田付けする。
固定部５に、端子３をインサート成形する。温度感知素
子２の周囲に、シール材４をコーティングする。ケース
１内に、充填空間１ｄの容積の１０〔％〕から９０
〔％〕の充填量の充填剤６を注入する。充填剤６の中
に、温度感知素子２を植設すると同時に、固定部５をケ
ース１内に固着する。
(57) [Abstract] [Purpose] Improving the responsiveness of the temperature sensor by setting the filling rate of the filler filled in the filling space of the case of the temperature sensor within the range of 10% to 90%. At the same time, the filler is prevented from leaking outside from the filling space. [Structure] The terminal 3 is soldered to the temperature sensing element 2.
The terminal 3 is insert-molded on the fixed portion 5. A sealant 4 is coated around the temperature sensing element 2. 90% of the volume of the filling space 1d in the case 1 to 90%
The filler 6 having a filling amount of [%] is injected. At the same time as the temperature sensing element 2 is implanted in the filler 6, the fixing portion 5 is fixed in the case 1.
Description
【０００１】[0001]
本考案は、温度感知素子をケースの充填空間に充填剤で埋設する温度センサの 構造に関する。 The present invention relates to a structure of a temperature sensor in which a temperature sensing element is embedded in a filling space of a case with a filler.
【０００２】[0002]
従来からこの種の温度センサとしては、例えば、実開昭５２―４９６７６号公 報に開示された技術がある。該温度センサは、筒体内に温度感知素子を挿入し、 樹脂を該筒体内に充填し、温度感知素子を筒体内に固定している。 As a conventional temperature sensor of this type, for example, there is a technique disclosed in Japanese Utility Model Publication No. 52-49676. In the temperature sensor, a temperature sensing element is inserted in the cylinder, resin is filled in the cylinder, and the temperature sensing element is fixed in the cylinder.
【０００３】[0003]
前述した従来の温度センサは、樹脂を筒体内に完全に満充填するので、樹脂量 が所定量より多く充填した場合、該樹脂がコネクタ内に流れて端子に付着する。 このため、該温度センサのコネクタ部が相手側コネクタと嵌合しないという問題 点があった。 Since the conventional temperature sensor described above completely fills the inside of the cylinder with resin, when the amount of resin exceeds a predetermined amount, the resin flows into the connector and adheres to the terminals. Therefore, there is a problem that the connector portion of the temperature sensor does not fit with the mating connector.
【０００４】 また、前述した従来の温度センサは、図２に示すように、温度センサの応答時 間が長く、検出する温度の応答性が悪いという問題点がある。Further, the conventional temperature sensor described above has a problem that the response time of the temperature sensor is long as shown in FIG. 2 and the responsiveness of the detected temperature is poor.
【０００５】[0005]
本考案に係る温度センサの構造は、温度センサのケースの充填空間に１０〜９ ０〔％〕の範囲内の充填率とすべく充填剤を充填したことにより、温度センサの 応答性を良好にすると共に、充填剤がケースの充填空間外部に流出することを防 止するものである。 The structure of the temperature sensor according to the present invention improves the responsiveness of the temperature sensor by filling the filling space of the case of the temperature sensor with the filling agent so that the filling rate is within the range of 10 to 90%. In addition, it prevents the filler from flowing out of the filling space of the case.
【０００６】[0006]
以下、図１及び図２に基づき本考案に係る温度センサの構造の一実施例を詳述 する。 An embodiment of the structure of the temperature sensor according to the present invention will be described in detail below with reference to FIGS. 1 and 2.
【０００７】 １は、例えば、自動車のエンジンの吸気温度、あるいはエアコンディショナー の外気温度等を検出する温度センサのケースである。該ケース１は、樹脂などに より成形している。尚、温度センサは、ケース１を金属などで形成した液温セン サに使用してもよい。ケース１は、開口端側にコネクタ部１ａを有する略円筒状 に形成する。１ｂは、ブラケット（図示せず）に係止するグリップ部である。１ ｃは、ブラケットに嵌合するボス部である。１ｄは、筒状のケース１と固定部５ とで形成した充填空間である。Reference numeral 1 is a case of a temperature sensor that detects, for example, an intake air temperature of an automobile engine or an outside air temperature of an air conditioner. The case 1 is made of resin or the like. The temperature sensor may be used in a liquid temperature sensor in which the case 1 is made of metal or the like. The case 1 is formed in a substantially cylindrical shape having a connector portion 1a on the open end side. Reference numeral 1b is a grip portion that is locked to a bracket (not shown). 1c is a boss that fits into the bracket. 1d is a filling space formed by the cylindrical case 1 and the fixing portion 5.
【０００８】 ２は、サーミスタなどの温度感知素子であり、接続部２ａにて端子３に半田付 けしている。該温度感知素子２、及び接続部２ａは、ガラスなどのシール材４で コーティングしている。端子３は、固定部５にインサート成形して固定している 。該固定部５は、ケース１の充填空間１ｄを閉塞し、端子３を保持する。Reference numeral 2 denotes a temperature sensing element such as a thermistor, which is soldered to the terminal 3 at the connecting portion 2a. The temperature sensing element 2 and the connecting portion 2a are coated with a sealing material 4 such as glass. The terminal 3 is insert-molded and fixed to the fixing portion 5. The fixing portion 5 closes the filling space 1d of the case 1 and holds the terminal 3.
【０００９】 ６は、ケース１の充填空間１ｄの中央部に温度感知素子２を固定するための充 填剤であり、例えば、エポキシ樹脂等である。該充填剤６の充填量は、筒状のケ ース１と固定部５とで形成した充填空間１ｄの容積に対して１０〔％〕から９０ 〔％〕が好適である。該充填剤６は、ケース１の内に凝固する。７は、相手コネ クタ（図示せず）が嵌合するコネクタ部１ａの内に嵌着した防水ゴムである。Reference numeral 6 denotes a filler for fixing the temperature sensing element 2 in the central portion of the filling space 1d of the case 1, which is, for example, an epoxy resin or the like. The filling amount of the filler 6 is preferably 10% to 90% with respect to the volume of the filling space 1d formed by the cylindrical case 1 and the fixing portion 5. The filler 6 solidifies in the case 1. Reference numeral 7 is a waterproof rubber fitted in the connector portion 1a with which a mating connector (not shown) is fitted.
【００１０】 本考案に係る温度センサの構造は、以上のような構造であり、次に図１に基づ き組付手順を詳述する。The structure of the temperature sensor according to the present invention is as described above. Next, the assembling procedure will be described in detail with reference to FIG.
【００１１】 ケース１を金型成形する。温度感知素子２に、端子３を半田付けする。該端子 ３を固定部５にインサート成形する。前記温度感知素子２に、シール材４をコー ティングする。ケース１のコネクタ部１ａの開口１ｂを上に向ける。該ケース１ の内底に、充填空間１ｄの容積の１０〔％〕から９０〔％〕の充填量の充填剤６ を注入する。該充填剤６に、前記温度感知素子２を植設する。これと同時に前記 固定部５をコネクタ部１ａに挿入して、該固定部５で充填空間１ｄを閉塞する。 このとき、充填剤６は、充填量が充填空間１ｄの容積より少ないので、充填剤６ の充填量が所定の量、すなわち、１０〔％〕〜９０〔％〕の範囲を越えても、該 充填剤６が充填空間１ｄから外部に漏れることがない。而して、充填剤が該コネ クタ部１ａ内に漏れることにより惹起する不具合、すなわち、該コネクタ部１ａ と相手コネクタが嵌合できない点は防止することができる。The case 1 is mold-molded. The terminal 3 is soldered to the temperature sensing element 2. The terminal 3 is insert-molded on the fixed portion 5. A sealing material 4 is coated on the temperature sensing element 2. The opening 1b of the connector portion 1a of the case 1 faces upward. The filler 6 having a filling amount of 10% to 90% of the volume of the filling space 1d is injected into the inner bottom of the case 1. The temperature sensing element 2 is implanted in the filler 6. At the same time, the fixing portion 5 is inserted into the connector portion 1a, and the filling space 1d is closed by the fixing portion 5. At this time, since the filling amount of the filler 6 is smaller than the volume of the filling space 1d, even if the filling amount of the filler 6 exceeds a predetermined amount, that is, the range of 10% to 90%, The filler 6 does not leak from the filling space 1d to the outside. Thus, it is possible to prevent the trouble caused by the leakage of the filler into the connector portion 1a, that is, the fact that the connector portion 1a and the mating connector cannot be fitted.
【００１２】 次に図２に基づき本考案に係る温度センサの構造における充填空間１ｄ内の充 填剤６の充填率δ〔％〕に対する温度センサの応答時間ｔ〔秒〕との関係につい て詳述する。Next, referring to FIG. 2, the relationship between the filling rate δ [%] of the filling material 6 in the filling space 1d and the response time t [sec] of the temperature sensor in the structure of the temperature sensor according to the present invention will be described in detail. I will describe.
【００１３】 図２に示すグラフは、温度センサを２５〔℃〕のシリコンオイル恒温槽に浸し て、該温度センサの抵抗値が安定した後、０〔℃〕の氷水恒温槽に温度センサ全 体を浸して冷却し、該温度センサが時定数である６３．２〔％〕の温度分まで冷 却したとき、すなわち、９．２〔℃〕を指示しするまでに要した応答時間ｔ〔秒 〕を計測した実験データである。時定数は、物理・計測分野で一般に使用してい る定数である。時定数とは、一般に、ある物理量が時間変化するとき、初期値か ら最終値までの変化量の内の６３．２〔％〕までに変化するのに要する時間であ る。The graph shown in FIG. 2 shows that the temperature sensor is immersed in a 25 ° C. silicon oil thermostatic bath to stabilize the resistance of the temperature sensor, and then the temperature sensor is placed in a 0 ° C. ice water thermostatic bath. When the temperature sensor cools down to the temperature constant of 63.2 [%], which is the time constant, that is, the response time t [sec. ] It is the experimental data which measured. The time constant is a constant generally used in the field of physics and measurement. The time constant is generally the time required for a certain physical quantity to change within 63.2% of the change from the initial value to the final value when it changes with time.
【００１４】 前記シリコンオイル恒温槽の温度は、自動車用外気温度センサの常用範囲内の 最高温度に相当する２５〔℃〕とした。氷水恒温槽の温度は、自動車用外気温度 センサの常用範囲内の最低気温に相当する０〔℃〕とした。温度センサの応答時 間ｔ〔秒〕は、温度センサの指示値温度が２５〔℃〕より１５．８〔℃〕低い、 すなわち、９．２〔℃〕を示すまでに要した多数個の温度センサの平均時間〔秒 〕である。The temperature of the silicon oil constant temperature bath was set to 25 [° C.], which is the maximum temperature within the normal range of the outside air temperature sensor for automobiles. The temperature of the ice water constant temperature bath was set to 0 [° C], which corresponds to the lowest temperature within the normal range of the outside air temperature sensor for automobiles. The response time t [seconds] of the temperature sensor is 15.8 [° C.] lower than the indicated value temperature of the temperature sensor 25 [° C.], that is, a large number of temperatures required to show 9.2 [° C.]. It is the average time [seconds] of the sensor.
【００１５】 充填率δ〔％〕は、ケース１の充填空間１ｄの容積Ｖ〔ｍｍ3 〕と、該充填空 間１ｄ内に充填した充填剤６の充填量Ｑ〔ｍｍ3 〕との比を百分率で示したもの ある。すなわち、充填率δ〔％〕は δ＝Ｑ／Ｖ×１００〔％〕 である。 尚、充填剤６は、エポキシ樹脂である。The filling rate δ [%] is the ratio of the volume V [mm 3 ] of the filling space 1d of the case 1 to the filling amount Q [mm 3 ] of the filler 6 filled in the filling space 1d. It is shown as a percentage. That is, the filling rate δ [%] is δ = Q / V × 100 [%]. The filler 6 is an epoxy resin.
【００１６】 充填空間１ｄ内の充填剤６の充填率δ〔％〕が０〔％〕のときの温度センサの 応答時間ｔ〔秒〕は、１４３〔秒〕である。充填空間１ｄ内の充填剤６の充填率 δ〔％〕が２５〔％〕のときの温度センサの応答時間ｔ〔秒〕は、１３４〔秒〕 である。充填空間１ｄ内の充填剤６の充填率δ〔％〕が５０〔％〕のときの温度 センサの応答時間ｔ〔秒〕は、１２３〔秒〕である。このときの温度センサの応 答時間ｔ ｍｉｎ〔秒〕は、実験中、最も応答時間ｔ〔秒〕が短かく、最も良好 である。充填時間１ｄ内の充填剤６の充填率δ〔％〕が７５〔％〕のときの温度 センサの応答時間ｔ〔秒〕は、１３１〔秒〕である。充填空間１ｄ内の充填剤６ の充填率δ〔％〕が１００〔％〕のときの温度センサの応答時間ｔ ｍａｘ〔秒 〕は、１４４〔秒〕であり、実験中、最も応答時間ｔ〔秒〕が長い。The response time t [seconds] of the temperature sensor when the filling rate δ [%] of the filler 6 in the filling space 1d is 0 [%] is 143 [seconds]. The response time t [sec] of the temperature sensor when the filling rate δ [%] of the filler 6 in the filling space 1d is 25 [%] is 134 [sec]. The response time t [sec] of the temperature sensor when the filling rate δ [%] of the filler 6 in the filling space 1d is 50 [%] is 123 [sec]. The response time t min [sec] of the temperature sensor at this time is the shortest in response time t [sec] during the experiment and is the best. The response time t [sec] of the temperature sensor when the filling rate δ [%] of the filler 6 within the filling time 1d is 75 [%] is 131 [sec]. The response time t max [sec] of the temperature sensor when the filling rate δ [%] of the filler 6 in the filling space 1 d is 100 [%] is 144 [sec], which is the most response time t [in the experiment. Second] is long.
【００１７】 すなわち、温度センサの応答時間ｔ〔秒〕は、充填空間１ｄに充填剤６を充満 させた充填率δ〔％〕が１００〔％〕のときより、充填剤６の量が少ない状態の 方が応答性が良好である。実験によれば、充填剤６は、ケース１内に温度感知素 子２を固定するために少なくとも充填空間１ｄ内の充填剤６の充填率δ〔％〕を 約１０〔％〕以上にする必要がある。また一方、充填剤６は、前述したように充 填剤６が充填空間１ｄからコネクタ部１ａに漏れることを防止するために、充填 空間１ｄ内の充填剤６の充填率δ〔％〕を９０〔％〕以下にすることが望ましい 。That is, the response time t [seconds] of the temperature sensor is such that the amount of the filler 6 is smaller than when the filling rate δ [%] in which the filling space 1d is filled with the filler 6 is 100 [%]. Has better responsiveness. According to the experiment, in order to fix the temperature sensing element 2 in the case 1, it is necessary that the filling rate δ [%] of the filling agent 6 in the filling space 1d is at least about 10 [%] or more. There is. On the other hand, the filling agent 6 has a filling rate δ [%] of the filling agent 6 in the filling space 1d of 90% in order to prevent the filling agent 6 from leaking from the filling space 1d to the connector portion 1a as described above. It is desirable to set it to [%] or less.
【００１８】[0018]
本考案に係る温度センサの構造は、温度センサの充填空間内の充填剤の充填率 δ〔％〕を１０〔％〕から９０〔％〕の範囲内にしたことにより、充填剤が充填 空間の外部に漏れることを防止すると共に、温度センサの応答時間ｔ〔秒〕を短 かくすることができる。 The structure of the temperature sensor according to the present invention is such that the filling rate of the filling agent in the filling space of the temperature sensor is set within the range of 10% to 90% by the filling rate δ [%] of the filling agent. It is possible to prevent leakage to the outside and shorten the response time t [seconds] of the temperature sensor.
【図１】本考案の一実施例を示す中央縦断面図である。FIG. 1 is a central longitudinal sectional view showing an embodiment of the present invention.
【図２】本考案における充填空間内の充填剤の充填率δ
〔％〕と温度センサの応答時間ｔ〔秒〕との関係を示す
グラフである。FIG. 2 is a packing ratio δ of the packing material in the packing space according to the present invention.
It is a graph which shows the relationship between [%] and response time t [second] of a temperature sensor.
１ ケース １ｄ 充填空間 ２ 温度感知素子 ５ 固定部 ６ 充填剤 1 Case 1d Filling space 2 Temperature sensing element 5 Fixing part 6 Filling agent
Claims (1)
充填空間に挿入したした温度感知素子と、該温度感知素
子を前記ケースの充填空間に埋設するための充填材料と
を具備した温度センサにおいて、前記ケースの充填空間
に１０〜９０〔％〕の範囲内の充填率とすべく充填剤を
充填したことを特徴とする温度センサの構造。1. A temperature sensor comprising: a case having a filling space; a temperature sensing element inserted into the filling space of the case; and a filling material for embedding the temperature sensing element in the filling space of the case. A structure of a temperature sensor characterized in that a filling agent is filled in the filling space of the case so as to have a filling rate within a range of 10 to 90%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991095731U JP2556819Y2 (en) | 1991-10-25 | 1991-10-25 | Temperature sensor structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991095731U JP2556819Y2 (en) | 1991-10-25 | 1991-10-25 | Temperature sensor structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0538544U true JPH0538544U (en) | 1993-05-25 |
| JP2556819Y2 JP2556819Y2 (en) | 1997-12-08 |
Family
ID=14145626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991095731U Expired - Lifetime JP2556819Y2 (en) | 1991-10-25 | 1991-10-25 | Temperature sensor structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2556819Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002541472A (en) * | 1999-03-26 | 2002-12-03 | センシット エーエス | Devices and systems for monitoring the temperature of inaccessible or moving parts |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267237U (en) * | 1988-11-09 | 1990-05-22 |
-
1991
- 1991-10-25 JP JP1991095731U patent/JP2556819Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267237U (en) * | 1988-11-09 | 1990-05-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002541472A (en) * | 1999-03-26 | 2002-12-03 | センシット エーエス | Devices and systems for monitoring the temperature of inaccessible or moving parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2556819Y2 (en) | 1997-12-08 |
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