JPH0540002Y2 - - Google Patents

Description

[Detailed Description of the Invention] A. Field of Industrial Application The present invention relates to a plate-shaped object transfer device, and is used, for example, to transfer a semiconductor wafer contained in a basket to a cartridge, or vice versa. The present invention relates to a plate-shaped object transfer device suitable for.

B. Prior art CVD equipment is commonly used to form deposited films such as silicon oxide films on the surfaces of semiconductor wafers, but recently vertical furnaces have been used to process a large number of semiconductor wafers stacked one above the other. A device called . This vertical furnace differs from the conventional horizontal furnace in that it is easy to insert and remove semiconductor wafers and requires less space for operation.

In various processing apparatuses including such CVD apparatuses, it is advantageous to store a large number of semiconductor wafers in a cylindrical cartridge and to process each cartridge at once.

A semiconductor wafer (hereinafter simply referred to as a wafer) is
A thinly cut ingot of semiconductor crystal such as silicon or germanium, for example, about 0.6 mm thick.
They have a disc shape with a diameter of about 150 mm, and a large number of them are usually housed at intervals in a container called a basket.

In conventional horizontal furnaces, the wafers are stored vertically and lined up horizontally in a basket, and the wafers are pulled out from the basket by being sandwiched between two levers from the radial direction without changing their orientation. I was switching to a cartridge.

In the case of a vertical furnace, a large number of wafers are stored horizontally in a cartridge at intervals from each other in the vertical direction, and the wafers are inserted into the furnace all at once, so the basket also stores the wafers in the same condition as the cartridge. It is convenient to do so.

When processing wafers in a furnace, it is desirable that the contact area between the cartridge and the wafer be as small as possible in order to improve the circulation of atmospheric gas. Furthermore, in order to transfer wafers to and from the basket, vertical furnace cartridges must have an opening (space) on at least one side in the lateral direction through which the wafers can pass, and the cartridge must have an opening (space) through which the wafers can pass. The wafer will be supported at a position that is avoided. Therefore, as shown in FIG. 19, the cartridge 3 has two main pillars 3a that horizontally support wafers (not shown) and an auxiliary pillar 3b that stabilizes the horizontal support. It is preferable that each groove 3b is provided with a groove 3e for supporting a wafer. In the figure, 3c is a canopy, 3d is a bottom plate, 3f is a space for taking in and taking out wafers, and 3g
is the space part and 3h is the brim. Furthermore, since the cartridge is heated together with the wafer in the furnace, quartz glass is preferably used as the material for the cartridge.

FIG. 20 is a front view showing a state in which the wafer 16 is accommodated in the cartridge 3. The wafer 16 is inserted into the groove 3e of the main pillar 3a and the auxiliary pillar 3b, and is supported by the two main pillars 3a and the two auxiliary pillars 3b.

FIG. 21 is a perspective view of the basket. The basket 4 is made of plastic, and the inside of its side wall has
A collar 4b is provided so that wafers (not shown) can be accommodated in water while being separated from each other, and openings 4c and 4d are provided on the front and rear surfaces.

FIG. 22 is a cross-sectional view taken along the - line in FIG. 21, showing the state in which the wafers 16 are accommodated in the basket.

The wafer 16 is placed in the recess 4 inside the side wall of the basket.
a, supported by the collar 4b, and housed in the basket.

C. Process leading to the invention As a wafer take-out device for taking out and transferring semiconductor wafers between the above-mentioned cartridge and basket, the applicant previously developed a device as shown in the partial cross-sectional views of FIGS. 18a to 18c. (Patent Application No. 103250-1981)

FIG. 18a shows a state in which wafers 16 are accommodated in the basket 4. As shown in FIG.

From this state, as shown in FIG. 18b, the support part 40 having horizontal support surfaces 40b and 140b
A wafer take-out tool 4 provided with a large number of wafers a and 140a, respectively.
0 and 140 are moved into the basket 4 so that the support parts 40a and 140a of the wafer take-out tools 40 and 140 (hereinafter sometimes referred to as take-out tools) are located in the gap between the edges of the wafers 16.

Next, as shown in FIG. 18c, the wafer take-out tools 40 and 140 are raised by, for example, a cam mechanism (not shown), and the wafer 16 is placed on the support parts 40a and 140a of the take-out tools 40 and 140. At this time, the collar 4b of the basket 4 separates from the wafer 16. Thereafter, the wafer 16 may be supported by the take-out tools 40 and 140 and transferred to the cartridge. (The procedure for storing the wafer in the cartridge will be omitted.) As a result of further study, the inventor of the present invention found that the following problems still remain with the above-mentioned extractor.

That is, when the above-mentioned wafer pick-up tool is used, not only the reciprocating mechanism for inserting the pick-up tool into the basket or cartridge or for transferring the wafer, but also the upper and lower parts of the pick-up tool as shown in FIG. 18c, for example. It is necessary to provide a separate moving mechanism. This inevitably increases the size of the entire device, complicates the mechanism, complicates control procedures, and increases the risk of dimensional deviations and malfunctions of the device.

As a result of research, the present inventor developed a wafer removal tool that solved the above-mentioned problems and completed the present invention.

D. Purpose of the invention The present invention has been made in view of the above circumstances, and is designed to automatically move the plate-shaped body only by a reciprocating mechanism without providing a separate mechanism for guiding the plate-shaped body to a predetermined support position. It is an object of the present invention to provide a plate-shaped object transfer device that can guide a shaped object to a predetermined support position.

E. Structure of the invention The present invention provides for, when transferring a plurality of plate-like bodies between first and second plate-like body support devices each having a space for inserting or taking out a plurality of plate-like bodies, After the plurality of plate-shaped bodies supported at the peripheral portions of the first plate-shaped body supporting device substantially horizontally at predetermined intervals in the vertical direction are taken out by the plate-shaped body extractor, the plurality of plate-shaped bodies are removed. A plate-like object transfer device that causes the second plate-like object supporting device to support the plurality of plate-like objects substantially horizontally at the peripheral portion at the predetermined intervals in the vertical direction by moving the plurality of plate-like objects substantially horizontally, The shaped object extractor includes first and second extractors facing each other and capable of reciprocating substantially horizontally with respect to the plate-shaped object support device, the first extractor and the second extractor. and driving means for moving the first and second extractors substantially horizontally relative to the plurality of plate-like bodies to positions where peripheral portions of the plate-like bodies are simultaneously supported at opposing positions; An inclined surface is provided on the plate-shaped body support part, and during the forward movement, the plurality of plate-shaped bodies run over this slope from below to upward while contacting the inclined plane in the peripheral part, thereby causing It is separated from one plate-like object supporting device and supported between the first and second pick-up tools, and while in this supported state, the first and second pick-up tools are simultaneously moved substantially horizontally, and the The present invention relates to a plate-like object transfer device having a drive means for moving the plurality of plate-like objects substantially horizontally from the first plate-like object support device to the second plate-like object support device.

F. Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

1 to 17 show an embodiment of the present invention, FIG. 18 shows a comparative example, and FIGS. 19 to 22 show a cartridge and a basket for a vertical CVD apparatus.

Example 1 FIGS. 1 to 6 show this example.

First, the operation of transferring wafers between the basket and the cartridge will be explained.

FIG. 4 is a flowchart showing the procedure for transferring wafers 16 in basket 4 to cartridge 3 using wafer take-out tools 1 and 101 facing each other.

As shown in FIG. 4a, a pair of wafer extractors 1 and 10 are integrated with support parts 13 and 113, respectively.
1 facing each other and aligning the axes with them.
Basket 4 containing 6 and empty cartridge 3
and position it. Next, as shown in Figure b, the extractors 1 and 101 are advanced so that the wafer 16 is supported by their tip edges, and as shown in Figure c, the extractors 1 and 101 are moved forward. The wafer 16 is moved to the right in the figure to accommodate the wafer 16 in the cartridge 3, and finally the extractor 1, 101 is retreated as shown in d of the figure.

The positional relationship between the basket 4, the cartridge 3, and the extractors 1 and 101 in the state shown in FIG. 4a is as shown in a perspective view in FIG.

As mentioned above, there are no walls on the front and back sides of the basket 4, and the take-out tools 1, 101 are not provided with walls.
Openings 4c and 4d are formed so that the openings 4c and 4d can be penetrated therethrough. In addition, the main pillar 3 is attached to both the front and rear of the cartridge 3.
a and the auxiliary pillar 3b are provided with a sufficient interval to allow the extraction tool 1, 101 to pass through, and the opening 3
f, 3g are formed. Therefore, the extractor 1, 101 can remove the basket 4 and the cartridge 3.
Insertion and removal are possible through openings 4c, 4d, 3f, and 3g, and reciprocating movement is possible from the state shown in Fig. 4a to the states shown in Fig. 4b, c, and d. be.

FIG. 1a is a perspective view showing the wafer take-out tool 1, 101, and FIG. 1b is a cross-sectional view taken along line bb--b.
The extractor 1, 101 is fixed and integrated with the end of the support portion 13, 113, and is capable of reciprocating movement by a mechanism described later.

The take-out tool has an arcuate column shape that matches the shape of the wafer, and a large number of ribs 1a having an inclined surface 1b for supporting and transferring the wafer are provided on the front surface thereof in the vertical direction.

Next, the wafer transfer apparatus in the state shown in FIG. 4b is shown in a plan view in FIG. 5 and in a front view (partly in cross section) in FIG.

A take-out tool 1 is attached to the slider 5 on which the female thread is screwed.
A support part 13 for supporting a take-out tool 101 is provided on the slider 6 having a female thread.
13 are fixed horizontally, respectively, and the take-out tools 1, 1
01 are located opposite each other.

Feed screws 9 and 10 pass through the frames 11 and 111 in parallel, and the feed screw 9 has a slider 5.
However, the sliders 6 are respectively screwed into the feed screws 10,
The feed screw 9 passes through the slider 6, and the feed screw 10 passes through the slider 5 without contacting them, and the rotation of the feed screws 9 and 10 causes the sliders 5 and 6 to move along the feed screws 9 and 10 separately. It is designed so that it can move back and forth. 7 and 8 are guide shafts of the sliders 5 and 6.

5 and 6 show the state shown in FIG. 4b by rotating the feed screws 9 and 10 to advance the sliders 5 and 6 toward the wafer 16 from the state shown in FIG. 4a. There is.

The movement of the wafer extractor leading to the transfer of the wafers contained in the basket to the cartridge is shown in FIG. 2 in partial cross-section.

FIG. 2a shows a state in which a wafer 16 is accommodated in the basket 4. The wafer 16 is placed on the collar 4b of the basket 4, and is transferred to a pair of opposing take-out tools 1, 101 by a transport means (not shown). (state shown in Fig. 4a).

From this state, as shown in FIG. 2B, the take-out tool 101 is moved into the basket 4 so that the support portion 101a at the edge of the take-out tool 101 is positioned in the gap between the edges of the wafers 16. On the other hand, the extraction tool 1
moves so that the edge support portion 1a is located in the edge gap of the wafer 16 protruding from the basket 4 (state shown in FIG. 4b). The removal tools 1, 101 are moved by rotating the feed screws 9, 10 shown in FIG.

The support parts 1a, 101a of the pick-up tool 1, 101 are provided with inclined surfaces 1b, 101b that move downward toward the front as described above. As the take-out tools 1 and 101 move, the wafer 1
6 rises on the inclined support surfaces 1b, 101b while being supported by the support parts 1a, 101a, and leaves the collar 4b of the basket 4. At this time, Fig. 2c
When the pick-up tool 1, 101 is stopped at a predetermined position as shown in FIG. 1, the wafer 16 is automatically guided to a predetermined support position and becomes stationary.

Next, the take-out tool 1, 101 is moved toward the cartridge 3 supporting the wafer 16, and the second
As shown in FIG. 4D, the edge of the wafer 16 is inserted into the grooves 3e of the main pillar 3a and the auxiliary pillar 3b (state shown in FIG. 4C).

Next, when the extractor 1, 101 is slightly retreated, the wafer 16 descends on the inclined support surfaces 1b, 101b, as shown in FIG. 2e.
The extractor 1, 101 is automatically guided and placed in a predetermined position on the groove 3e of the main column 3a and the auxiliary column 3b.
The supporting parts 1a and 101a are separated from the wafer 16.

Subsequently, the extractor 1, 101 is moved back, and the second
As shown in Figure f, these are removed from the cartridge 3 and basket 4 (the state shown in Figure 4D).

In this way, the wafers 16 are transferred all at once from the basket 4 to the cartridge 3, and the wafers 16 accommodated in the cartridge 3 are transferred together with the cartridge 3 by a transfer device (not shown) to a processing device (not shown), where they are processed. Ru.

The processed wafer is transferred to a transfer device together with the cartridge, transferred to a basket in the reverse order of the steps shown in FIGS. 2a to 2f, and transferred by a transfer means (not shown).

Example 2 FIGS. 7 and 8 show this example.

FIG. 7a is a perspective view of the wafer removal tool, and FIG. 7b is a sectional view taken along the line bb--b of FIG. 7a.

The extractor 2, 102 has the same shape as the extractor 1 of the first embodiment, except that the collar 2a has a lower inclined surface 2b on the front surface and an upper inclined surface 2c facing the lower inclined surface 2b with a groove 2e in between. A large number of wafers are provided in the vertical direction, and wafers are placed and transferred on the sloped surface 2b of the collar 2a.

The extractor 2, 102 is the extractor 1 of Example 1.
Similarly, it can be used in the manner previously described with reference to FIGS. 2-6. At that time, the wafer removal, transfer, transfer procedures, etc. may be the same as those described above. It goes without saying that the inclined surface 2b functions similarly to the inclined surface 1b of the extractor 1.

The wafer extractor 2, 102 of this embodiment has yet another effect. This will be explained below using partial cross-sectional views of FIGS. 8a to 8c.

FIG. 8a shows a state in which wafers 16 are accommodated in the cartridge, but some of the wafers 16a are tilted out of the groove 3e of the auxiliary column 3b.

At this time, when the pick-up tool 2, 102 is moved into the cartridge, the upper inclined surface 102c provided on the support part 102a of the pick-up tool 102 is tilted upwards from the other wafers, as shown in FIG. 8b. The edge of the wafer 16a slightly protrudes toward the wafer 16a. When the extractor 2, 102 moves from this state, the peripheral surface of the edge of the wafer 16a moves toward the back of the groove 2e while sliding on the upper inclined surface 102c, so that the wafer 16a
The slope of becomes smaller.

When the pick-up tools 2 and 102 move further, the wafer 16a is moved to the pick-up tools 2 and 1, as shown in FIG. 8c.
Inclined surfaces 2b, 102 of collars 2a, 102a of 02
b, and the support of the main pillar 3a is released.

In this way, if the wafer ejector of this embodiment is used, since the upper inclined surface is provided, even if some of the wafers in the cartridge are tilted away from the grooves, the wafers can be ejected without being damaged. Is possible.

Example 3 FIGS. 9 to 14 show this example.

FIG. 9a is a perspective view showing the wafer take-out tool of this embodiment, and FIG. 9b is a sectional view taken along line bb in FIG. 9a.

The extractor 20, 120 is also the extractor 1,
2, 101, and 102, but the front surface thereof has a large number of inclined surfaces 20b, 20c, 120b, and 120c in the vertical direction similar to those in the second embodiment, and these have a wedge-shaped cross section. Groove 2
0e, 120e and collars 20a, 120a are formed. Furthermore, from the innermost part of the wedge-shaped grooves 20e and 120e, a wafer support groove 2 whose upper and lower surfaces are horizontal is formed.
0f is extended.

The movement of the arm to transfer the wafers contained in the basket to the cartridge using this wafer extractor is as shown in FIG. 10 in a partial cross-sectional view.

FIG. 10a shows a state in which the wafer 16 is accommodated in the basket 4. The wafer 16 is placed on the collar 4b of the basket 4, and is transferred to a pair of opposing take-out tools 20, 120 by a transport means (not shown).
(state shown in Fig. 4a).

From this state, as shown in FIG. 10b, the pick-up tool 120 is moved into the basket 4 so that the collar 120a of the pick-up tool 120 is located in the gap between the edges of the wafers 16. On the other hand, the extractor 20 moves so that the collar 20a is located in the gap between the edges of the wafers 16 protruding from the basket 4 (the fourth
Figure b). The movement of the wafer pick-up tool has already been described in detail.

Collar 20a, 120a of extraction tool 20, 120
There are inclined surfaces 20b and 12 that descend toward the front.
0b is provided, and after these slopes 20b and 120b contact the wafer 16, the wafer 16 is
The wafers rise on the slopes 20b, 120b while being supported by the flanges 20a, 120a, leave the flanges 4b of the basket 4, and are finally guided to the wafer support grooves 20f, 120f, as shown in FIG. 10c. , the peripheral edge portions thereof are placed on horizontal wafer support surfaces 20d and 120d.

Next, the extractor 20, 120 is moved toward the cartridge 3 supporting the wafer 16, and as shown in FIG.
The edge of the wafer 16 is inserted into the groove 3e.
(Situation shown in Figure 2c).

Next, when the take-out tools 20, 120 are slightly retreated, as shown in FIG. It is placed on the groove 3e of the auxiliary column 3b, and the extraction tool 20,1
20 collars 20a, 120a are separated from the wafer 16.

Subsequently, the ejecting tools 20 and 120 are moved back and removed from the cartridge 3 as shown in FIG. 10f.
and remove it from the basket 4 (state shown in Figure 4d).

In this way, the wafers 16 are transferred all at once from the basket 4 to the cartridge 3, and the wafers 16 accommodated in the cartridge 3 are transferred together with the cartridge 3 by a transfer device (not shown) to a processing device (not shown), where they are processed. Ru.

The processed wafer is transferred together with the cartridge to the transfer device, transferred to a basket in the reverse order of the procedure shown in Figs. 10a to 10f, and transported by a transport means (not shown).

The advantage of the wafer take-out tools 20, 120 of this embodiment is that by providing the wafer storage portions 20f, 120f and the wafer support surfaces 20d, 120d, even wafers that are misaligned in the basket or cartridge can be reliably leveled without being tilted. This is something I can support.

Below, the above advantages are explained in Figures 10 to 14.
This will be explained using figures.

Here, FIGS. 11a to 13c and 13a to 13c are schematic plan views showing the procedure for taking out a semiconductor wafer that has shifted in position, FIG. 12a is a cross-sectional view taken along the line a-a in FIG. Fig. 12 b is b- of Fig. 11 c.
FIG. 14a is a cross-sectional view taken along line a-a in FIG. 13a, and FIG. 14b is a cross-sectional view taken along line b-b in FIG. 13b. 11th
In Figures 1 to 14, only the wafer and wafer removal tool are shown, and the cartridge or basket is omitted.

For example, as shown in FIG. 11, some of the wafers 16b may be laterally displaced from the center line indicated by the dashed-dotted line along which the pick-up tool reciprocates in a basket or cartridge (not shown).
O in the figure is the center point of the wafer 6b.

In this case, when the pick-up tools 20, 120 are moved toward the wafer 16b as shown in FIG. The left side in the figure contacts the surface 20b first, and this contact portion rises along the inclined surface 20b. As a result, wafer 16
In b, the periphery on the side indicated by A is high and the periphery on the side indicated by B is sloped low. If the wafer 16 is taken out from the basket or cartridge in this state, transferred, and inserted into the cartridge or basket, there is a risk that the wafer will collide with the brim of the main pillar, the auxiliary pillar, or the brim of the basket, and be damaged.

However, when the wafer pick-up tool of this embodiment is used, it is not necessary to support the wafer 16b in an inclined state and transfer it as is, but to move the wafer pick-up tool further as shown in FIG. 10c to remove the wafer 16b. The wafer may be fed into the wafer support groove 20f to create the state shown in FIGS. 11c and 12b. In this state, the wafer 16b is supported horizontally by the wafer support surface 20d of the wafer support groove 20f.
Problems such as those mentioned above are avoided.

Note that when the wafer is supported by the pick-up tools 20 and 120, the inclined surfaces 20b and 120b of the pick-up tools 20 and 120 are in contact with the A-side circumferential surface of the wafer 16b while the opposing pick-up tools move forward to support the wafer. Since the wafer 16b has the effect of coming into contact with the B-side circumferential surface first and pushing it away while sliding, the misalignment of the wafer 16b is corrected accordingly.

Further, as shown in FIG. 13a, for example, in a basket (not shown), some wafers 16c are displaced with the center point O shifted from the center line indicated by the dashed line toward one of the pick-up tools 120. There are times when I am.

In this case, when the pick-up tools 20 and 120 are moved toward the wafer 16c as shown in FIG. 10b, the displaced wafer 16c is placed on the inclined surface as shown in FIGS. 13b and 14a. It contacts the inclined surface 120b before the contact surface 20b. As a result, the C-side periphery of the wafer 16c becomes high and the D-side periphery becomes low, in the same manner as described above. If the wafer 16c is taken out of the basket, transferred, and inserted into the cartridge in this state, the wafer may collide with the brim of the main pillar or the auxiliary pillar and be damaged, as in the case described above.

However, in this case as well, there is no need to support the wafer 16c in an inclined state and transfer it as is, as shown in FIG.
As shown in Figure 13c and Figure 14b, the wafer take-out tool may be further advanced to feed the wafer 16c into the wafer accommodating portion 20f, resulting in the states shown in Figures 13c and 14b.
In this state, the wafer 16c is held in the wafer support groove 20.
Since the wafer is supported horizontally by the wafer support surface 20d of f, the above-mentioned problem can be avoided.

Note that when the wafer is supported by the pick-up tools 20 and 120, the inclined surface 120b of the pick-up tool 120 touches the wafer 1 in the process of movement of the pick-up tools 20 and 120.
The inclined surface 2b of the take-out tool 20 comes into contact with the C-side periphery of the wafer 6c before it contacts the D-side periphery of the wafer 16c, while the inclined surface 120b is sliding on the C-side periphery of the wafer 16c. Since it has the effect of pushing the wafer 16c, the wafer 16c
The positional deviation of is also corrected.

In addition, in the wafer removal tool of this example,
An upper inclined surface 20c is provided, and this functions similarly to the upper inclined surface 2c of the wafer take-out tool 2 of the second embodiment, so that, like the second embodiment, some wafers may fall into the groove in the cartridge, for example. Even if it comes off and is tilted, it can be taken out without damaging it.

FIGS. 15 to 17 are sectional views showing other embodiments of this embodiment.

The wafer take-out tool 21 in FIG.
Slanted surfaces 21b and 21c facing each other with e in between
A wafer periphery accommodating groove 21f is provided at the back of the wedge-shaped groove 21e, and an inclined surface 21b is provided at the boundary between the wedge-shaped groove 21e and the wafer periphery accommodating groove 21f. A wafer support protrusion 21g is provided on an extension of the wafer support protrusion 21g.
When taking out the wafer, the wafer is first placed on the inclined surface 21.
b, rises on the inclined surface 21b as the take-out tool 21 moves, is guided to the wafer support protrusion 21g, and is finally placed on the wafer support protrusion 21d,
The peripheral edge of the wafer is accommodated in the wafer peripheral edge accommodation groove 21f.

In this wafer take-out tool 21, Example 1
There are the effects already mentioned in 3 to 3, and since the wafer support protrusion 21g and the wafer do not come into surface contact, friction due to sliding is reduced.

The wafer take-out tool 22 shown in FIG.
It has a shape in which a large number of a are provided in the vertical direction. this is,
It may be used in the same manner as the wafer take-out tool of the third embodiment, and has the effects already described in the first and third embodiments.

The wafer take-out tool 23 shown in FIG. 17 has a shape in which a large number of ribs 23a having inclined surfaces 22b, 22c and a wafer support surface 22d are provided in the vertical direction.
It may be used in the same manner as the wafer removal tool of the third embodiment, and the effects described in the first to third embodiments can be obtained.

In the wafer extractor based on this invention, the inclined surface for guiding the wafer from the position where it is placed in the cartridge or basket to the support position of the extractor can be given a mirror finish by applying a Teflon coating or the like. In this case, friction can be reduced when the peripheral surface of the wafer slides against the inclined surface of the extractor. Moreover, since the peripheral surface of the wafer and the inclined surface make line contact, there is no slippage caused by atmospheric pressure, as occurs when mirror surfaces make surface contact, and the wafer slides smoothly against the inclined surface. Therefore, there is no risk of damage to the wafer.

Although the present invention has been illustrated above, the embodiments of the present invention are not limited to those described above.

For example, the shape of the brim, the angle of the inclined surface, etc. of the wafer extractor based on the present invention can be changed in various ways.

Furthermore, the plate-shaped object removal tool based on the present invention is similarly applicable to taking out other plate-shaped objects, such as plate-shaped glass products and other plate-shaped articles, in addition to semiconductor wafers.

In addition, as a method for supporting a plate-like object using a plate-like object removal tool, in addition to supporting the plate-like object on an inclined surface or a horizontal support surface as in the above example, After guiding it to the supporting position by means of a roller, it may be supported by suction or other methods.

Further, when the plate-like body is made of a ferromagnetic material such as iron, cobalt, or nickel, the plate-like body can be supported by being attracted to a certain direction (for example, upward) using a permanent magnet, an electromagnet, or the like. In this case, the slope that guides the plate-shaped body to a predetermined support position may be provided so as to guide the plate-shaped body in the above-mentioned specific direction to which the plate-shaped body is attracted. Furthermore, compared to the above example, a relatively weak magnet can be used and the load can be increased or decreased so that the plate-shaped body can be taken out most smoothly.

G. Effects of the Invention As explained above, the plate-like object transfer device based on the present invention has a device for guiding the plate-like object from the initial insertion position of the plate-like object to the supporting position on the support surface for the plate-like object. Since the slopes are connected, the plate-like body can be automatically guided to the predetermined support position using only the reciprocating mechanism without requiring a separate mechanism for guiding the plate-like body to the support position. . Therefore,
The device is small, has a simple mechanism, and is easy to control, and there is no risk of dimensional deviation or malfunction of the movement of each part of the device.

[Brief explanation of the drawing]

1 to 17 show an embodiment of the present invention, in which FIG. 1 shows a plate-shaped object (semiconductor wafer) removal tool, FIG. Cross-sectional view taken along the line bb, Fig. 2 a, b, c,
d, e, and f are partial cross-sectional views showing the procedure for transferring semiconductor wafers; FIG. 3 is a perspective view showing the relationship between the semiconductor wafer takeout tool, the basket, and the cartridge;
Figures 4a, b, c, and d are schematic plan views showing the steps of semiconductor wafer transfer, Figure 5 is a plan view of the main parts of the semiconductor wafer transfer apparatus, and Figure 6 is the main parts of the semiconductor wafer transfer apparatus. A front view, FIG. 7 shows another semiconductor wafer removal tool, FIG. 7a shows a perspective view, FIG. FIG. 9 is a partial sectional view showing the procedure for supporting the semiconductor wafer inside with the semiconductor wafer take-out tool shown in FIG. 7, and FIG. 9 shows another semiconductor wafer take-out tool; FIG. b of a
-b line arrow sectional view, Figure 10 a, b, c, d,
e and f are partial cross-sectional views showing the procedure for transferring semiconductors using the semiconductor wafer pick-up tool shown in FIG. 12 is a sectional view of FIG. 11, FIG. 12a is a sectional view taken along the line a-a of FIG. 11b, and FIG. 12b is a sectional view of FIG. 11c. 13a, b and c are a schematic plan view showing another procedure for supporting a misaligned semiconductor wafer using the semiconductor wafer pick-up tool of FIG. 9, and FIG. 14 is a sectional view of FIG. 13, and FIG. 14a is a cross-sectional view of the first
3b is a cross-sectional view taken along the line a-a, FIG. 14b is a cross-sectional view taken along the line b-b of FIG. 13c,
FIGS. 15, 16, and 17 are sectional views of still other semiconductor wafer take-out tools. FIGS. 18a, b, and 18c are partial sectional views showing a procedure for supporting a semiconductor wafer in a basket using a comparative semiconductor wafer take-out tool. FIG. 19 is a perspective view of the cartridge, FIG. 20 is a sectional view of the cartridge containing semiconductor wafers, FIG. 21 is a partial perspective view of the basket, and FIG. It is an arrow sectional view. In addition, in the symbols shown in the drawings, 1, 10
1, 2, 102, 20, 120, 21, 22, 2
3... Plate-shaped object (semiconductor wafer) removal tool, 1a,
101a, 2a, 102a, 20a, 120a,
21a, 22a, 23a...Brim, 1b, 101
b, 2b, 102b, 20b, 120b, 21
b, 22b, 23b...lower inclined surface, 2c, 10
2c, 20c, 120c, 21c, 23c... Upper inclined surface, 3... Cartridge, 4... Basket, 5, 6... Slider, 7, 8... Guide shaft,
9, 10... Feed screw, 11, 111... Frame, 13, 113... Plate-shaped object (semiconductor wafer) extractor support part, 16, 16a, 16b, 16c...
...Semiconductor wafer, 20d, 120d, 22d, 2
3d...Plate-shaped body (semiconductor wafer) support surface, 20
e, 120e... wedge-shaped groove, 20f, 120f...
Plate-shaped body (semiconductor wafer) peripheral edge accommodation groove, 21g...
...This is a plate-shaped object (semiconductor wafer) supporting protrusion.

Claims (1)

[Claims for Utility Model Registration] 1. Transferring the plurality of plate-shaped bodies between first and second plate-shaped body support devices each having a space for inserting or taking out the plurality of plate-shaped bodies. On this occasion,
After the plurality of plate-shaped bodies supported at the peripheral portions of the first plate-shaped body supporting device substantially horizontally at predetermined intervals in the vertical direction are taken out by the plate-shaped body extractor, the plurality of plate-shaped bodies are removed. A plate-like object transfer device that causes the second plate-like object supporting device to support the plurality of plate-like objects substantially horizontally at the peripheral portion at the predetermined intervals in the vertical direction by moving the plurality of plate-like objects substantially horizontally, The shaped object extractor includes first and second extractors facing each other and capable of reciprocating substantially horizontally with respect to the plate-shaped object support device, the first extractor and the second extractor. and driving means for moving the first and second extractors substantially horizontally relative to the plurality of plate-like bodies to positions where peripheral portions of the plate-like bodies are simultaneously supported at opposing positions; An inclined surface is provided on the plate-shaped body support part, and during the forward movement, the plurality of plate-shaped bodies run over this slope from below to upward while contacting the inclined plane in the peripheral part, thereby causing away from the first plate support device,
The device is configured to be supported between the first and second ejecting tools, and while in this supported state, the first and second ejecting tools are simultaneously moved substantially horizontally and removed from the first plate-like object supporting device. A plate-shaped object transfer device having a drive means for moving the plurality of plate-shaped bodies substantially horizontally to the second plate-shaped object support device. 2. The plate-like object relocation according to claim 1 of the utility model registration claim, which is configured such that the plate-like object rides on an inclined surface from below to above, and the supporting surface is formed substantially horizontally from this raised position. Device.