JPH0541480A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPH0541480A JPH0541480A JP19636491A JP19636491A JPH0541480A JP H0541480 A JPH0541480 A JP H0541480A JP 19636491 A JP19636491 A JP 19636491A JP 19636491 A JP19636491 A JP 19636491A JP H0541480 A JPH0541480 A JP H0541480A
- Authority
- JP
- Japan
- Prior art keywords
- potential difference
- transistor
- power supply
- line
- gnd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 230000006378 damage Effects 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体集積回路装置に関
し、特にMOSトランジスタを含む半導体集積回路装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to a semiconductor integrated circuit device including a MOS transistor.
【0002】[0002]
【従来の技術】従来のMOSトランジスタで構成された
半導体集積回路装置では、その電源,GND端子に供給
された電圧差が、そのまま半導体チップ上のMOSトラ
ンジスタのゲート間に供給された。2. Description of the Related Art In a conventional semiconductor integrated circuit device composed of MOS transistors, the voltage difference supplied to its power supply and GND terminal is directly supplied between the gates of the MOS transistors on the semiconductor chip.
【0003】[0003]
【発明が解決しようとする課題】このような従来の半導
体集積回路装置は、電源,GND端子間に供給された電
位差が、そのままチップ上のMOSトランジスタのゲー
ト間に供給されているため、使用上誤って絶対定格以上
の電位を電源端子に供給された場合には、内部トランジ
スタのゲート破壊が発生していた。In such a conventional semiconductor integrated circuit device, the potential difference supplied between the power source and the GND terminal is directly supplied between the gates of the MOS transistors on the chip. When a potential higher than the absolute rating was erroneously supplied to the power supply terminal, the gate of the internal transistor was destroyed.
【0004】近年、LSIの大規模化に伴い、MOSト
ランジスタのゲート幅が狭くなってきており、このケー
スによるトラブルが多発することが予想される。In recent years, the gate width of MOS transistors has become narrower with the increase in the scale of LSIs, and it is expected that troubles due to this case will frequently occur.
【0005】本発明の目的は、電源電圧によるゲート破
壊が発生しないようにした半導体集積回路装置を提供す
ることにある。An object of the present invention is to provide a semiconductor integrated circuit device in which gate breakdown due to a power supply voltage does not occur.
【0006】[0006]
【課題を解決するための手段】本発明の構成は、半導体
チップ上に、電源ライン,GNDラインが配線され、M
OSトランジスタで構成された半導体集積回路装置にお
いて、前記電源ライン,GNDライン間に規定電位差以
上の電位差が発生した場合に電源の電圧を低下させると
共に前記規定電位差に近づける手段を設けたことを特徴
とする。According to the structure of the present invention, a power source line and a GND line are wired on a semiconductor chip, and M
In a semiconductor integrated circuit device composed of OS transistors, a means for lowering the voltage of the power supply and bringing the voltage closer to the specified potential difference when a potential difference greater than the specified potential difference occurs between the power supply line and the GND line is provided. To do.
【0007】[0007]
【実施例】図1は本発明の一実施例の半導体集積回路装
置を示す回路図である。1 is a circuit diagram showing a semiconductor integrated circuit device according to an embodiment of the present invention.
【0008】図1において、本実施例では、LSIチッ
プ上の電源ライン1は信号線6を介してNPN型トラン
ジスタ3のコレクタ端子に接続される。In FIG. 1, in this embodiment, the power supply line 1 on the LSI chip is connected to the collector terminal of the NPN transistor 3 via the signal line 6.
【0009】GNDライン2は、信号線7を介してこの
トランジスタ3のエミッタ端子へ接続されている。ま
た、そのトランジスタ3のベース端子は、NチャネルM
OSトランジスタ4を5個直列に接続した電位差設定回
路5に接続されている。The GND line 2 is connected to the emitter terminal of the transistor 3 via the signal line 7. The base terminal of the transistor 3 has an N channel M
It is connected to a potential difference setting circuit 5 in which five OS transistors 4 are connected in series.
【0010】本実施例に於いて、チップの電源ライン1
とGNDライン2との間に正常な電位差が供給されてい
る場合、NPN型トランジスタ3のベース電位は、電源
ライン1よりNチャネル型トランジスタの1個につき、
そのしきい値電圧分だけ電圧降下した電位が供給されて
いる。In this embodiment, the power supply line 1 of the chip
When a normal potential difference is supplied between the power supply line 1 and the GND line 2, the base potential of the NPN transistor 3 from the power supply line 1 is one N-channel transistor.
The potential that is dropped by the threshold voltage is supplied.
【0011】ここでは、トランジスタ5個分のしきい値
電圧の総和値と推奨動作電圧値が同じであるとすると、
NPN型トランジスタ3のベース電位はほぼGNDレベ
ル2と同じであり、トランジスタ3のコレクタ,エミッ
タ間電流は発生せず、電源,GNDライン1,2の電位
差に影響を与えない。Here, assuming that the total value of the threshold voltages of five transistors and the recommended operating voltage value are the same,
The base potential of the NPN transistor 3 is almost the same as the GND level 2, so that the collector-emitter current of the transistor 3 is not generated and does not affect the potential difference between the power supply and the GND lines 1 and 2.
【0012】しかし、電源ライン1,GNDライン2間
に推奨動作電圧以上の電位差が発生した場合、Nチャネ
ルトランジスタ4の5個分のしきい電圧を越えてしまう
為に、NPN型トランジスタ3のベース端子にGNDラ
イン2より高い電位が供給され、トランジスタのコレク
タ,エミッタ間に電源が発生し、これによる電源ライン
1の電圧降下が期待できる為、電源,GNDライン1,
2間の電位差を低減することができる。However, when a potential difference of more than the recommended operating voltage occurs between the power supply line 1 and the GND line 2, the threshold voltage of five N-channel transistors 4 is exceeded, and therefore the base of the NPN transistor 3 is exceeded. A potential higher than that of the GND line 2 is supplied to the terminal, a power source is generated between the collector and the emitter of the transistor, and a voltage drop in the power source line 1 due to this is expected, so that the power source, the GND line 1,
The potential difference between the two can be reduced.
【0013】このように、本実施例の半導体集積回路装
置では、チップの電源,GNDライン間に、規定電位差
以上の電位差が発生した場合、その電位差を低下させる
回路を備えている。As described above, the semiconductor integrated circuit device of this embodiment is provided with a circuit for reducing the potential difference between the power supply of the chip and the GND line when the potential difference of the specified potential difference or more occurs.
【0014】[0014]
【発明の効果】以上説明したように、本発明では、チッ
プの電源ラインと、GNDライン間に規定電位差以上の
電位差が発生した場合、その電位差を低下させる手段を
備えている為に、LSIの使用時に誤って絶対定格以上
の電位差をチップの電源,GND端子に供給しても、チ
ップ上でその電位差の低下を計ることができ、内部トラ
ンジスタのゲート破壊現象を防止できるという効果があ
る。As described above, according to the present invention, when a potential difference more than the specified potential difference occurs between the power supply line of the chip and the GND line, the means for reducing the potential difference is provided. Even if a potential difference above the absolute rating is erroneously supplied to the power supply and GND terminal of the chip during use, the potential difference can be reduced on the chip, and the gate breakdown phenomenon of the internal transistor can be prevented.
【図1】本発明の一実施例の半導体集積回路装置を示す
回路図である。FIG. 1 is a circuit diagram showing a semiconductor integrated circuit device according to an embodiment of the present invention.
1 電源ライン 2 GNDライン 3 NPN型トランジスタ 4 Nチャネル型MOSトランジスタ 5 電位差設定回路 6,7 信号線 1 power supply line 2 GND line 3 NPN type transistor 4 N channel type MOS transistor 5 potential difference setting circuit 6, 7 signal line
Claims (1)
ラインが配線され、MOSトランジスタで構成された半
導体集積回路装置において、前記電源ライン,GNDラ
イン間に規定電位差以上の電位差が発生した場合に電源
の電圧を低下させると共に前記規定電位差に近づける手
段を設けたことを特徴とする半導体集積回路装置。1. A power supply line and a GND on a semiconductor chip.
In a semiconductor integrated circuit device in which lines are wired and configured by MOS transistors, means for lowering the voltage of the power supply and bringing the voltage closer to the specified potential difference when a potential difference greater than the specified potential difference occurs between the power supply line and the GND line A semiconductor integrated circuit device characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19636491A JPH0541480A (en) | 1991-08-06 | 1991-08-06 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19636491A JPH0541480A (en) | 1991-08-06 | 1991-08-06 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0541480A true JPH0541480A (en) | 1993-02-19 |
Family
ID=16356625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19636491A Pending JPH0541480A (en) | 1991-08-06 | 1991-08-06 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541480A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360456A (en) * | 2022-01-20 | 2022-04-15 | 集璞(上海)科技有限公司 | Driver circuit, LED driver chip, display panel and electronic equipment |
-
1991
- 1991-08-06 JP JP19636491A patent/JPH0541480A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360456A (en) * | 2022-01-20 | 2022-04-15 | 集璞(上海)科技有限公司 | Driver circuit, LED driver chip, display panel and electronic equipment |
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