JPH054227A - Manufacture of prepreg - Google Patents
Manufacture of prepregInfo
- Publication number
- JPH054227A JPH054227A JP29027791A JP29027791A JPH054227A JP H054227 A JPH054227 A JP H054227A JP 29027791 A JP29027791 A JP 29027791A JP 29027791 A JP29027791 A JP 29027791A JP H054227 A JPH054227 A JP H054227A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- impregnated
- base material
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000002966 varnish Substances 0.000 claims abstract description 12
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000001955 cumulated effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂粉飛散が少なく取
扱に優れ、接着性にも優れたプリプレグの製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a prepreg which has less resin powder scattering, is easy to handle, and has excellent adhesiveness.
【０００２】[0002]
【従来の技術】積層板用プリプレグは、例えばガラスク
ロスのような繊維基材に、樹脂ワニスを含浸し、加熱し
て揮発成分を蒸発させるとともに、含浸した樹脂をＢス
テージ状態に半硬化させたものである。このプリプレグ
を所定枚数重ね、外側に銅箔などの金属箔を配置し、加
熱、加圧して金属箔張り積層板とする。2. Description of the Related Art A prepreg for a laminated plate is obtained by impregnating a fiber varnish such as glass cloth with a resin varnish and heating it to evaporate volatile components and semi-curing the impregnated resin into a B-stage state. It is a thing. A predetermined number of these prepregs are stacked, a metal foil such as a copper foil is arranged on the outside, and heated and pressed to form a metal foil-clad laminate.
【０００３】また、内層回路板と外層回路板又は外層回
路用銅箔との接着フィルムとしても使用される。回路形
成した内層回路板の両側にプリプレグを１枚又は複数枚
配置し、更にその両外層に銅箔を配置し、プレスで加
熱、加圧成形し、次にこの銅箔に回路形成すると多層配
線板になる。プレスする際に、内層回路板とプリプレグ
とがずれないようにするためにピンを使用するピンラミ
ネーションと、ピンを使用しないマスラミネーションと
がある。It is also used as an adhesive film between an inner layer circuit board and an outer layer circuit board or a copper foil for an outer layer circuit. One or more prepregs are placed on both sides of the circuit-formed inner layer circuit board, copper foil is placed on both outer layers of the prepreg, and heat and pressure molding is performed with a press, and then circuits are formed on this copper foil to form a multilayer wiring. Become a board. When pressing, there are a pin lamination that uses a pin and a mass lamination that does not use a pin so that the inner layer circuit board and the prepreg do not shift from each other.
【０００４】プリプレグの接着性を向上させるために、
上記加熱工程で樹脂のＢステージ状態を変えたり、また
上記プレス成形における加熱、加圧条件を変えたりし
て、最適接着条件を決定している。前記接着性の評価
は、例えばＪＩＳ６４８１、ＪＩＳ６４８６等に定めら
れている半田耐熱試験によっている。この試験では、一
定時間吸湿させ、半田（２６０℃）にディップし、基材
のふくれ、ミーズリングを評価する。In order to improve the adhesiveness of the prepreg,
The optimum bonding conditions are determined by changing the B-stage state of the resin in the heating step and changing the heating and pressing conditions in the press molding. The evaluation of the adhesiveness is based on, for example, a solder heat resistance test defined in JIS6481 and JIS6486. In this test, moisture is absorbed for a certain period of time, and the substrate is dipped in solder (260 ° C.) to evaluate swelling and measling of the base material.
【０００５】[0005]
【発明が解決しようとする課題】従来のプリプレグを用
いた積層板は、耐熱性試験（例えばＪＩＳ６４８１）に
より一定時間吸湿させた後、半田にディップするとプリ
プレグ間の接着面が剥がれるといった問題点を有してい
る。A conventional laminated board using a prepreg has a problem that the adhesive surface between the prepregs is peeled off when it is dipped in solder after being absorbed by a heat resistance test (for example, JIS6481) for a certain period of time. is doing.
【０００６】また、多層配線板としたとき、耐熱試験
（例えばＪＩＳ６４８６）により一定時間吸湿させた
後、半田ディップすると、やはりプリプレグ間の接着界
面の剥がれ、ミーズリングが発生するといった問題点を
有している。さらに、プリプレグを所定サイズに断裁機
により切断した場合、切断粉が発生し、プリプレグ表面
に付着し取扱いしずらいといった問題点を有している。
このほか、加熱初期に樹脂が低温で溶融して流れるた
め、マスラミネーションで多層回路板を製造するとき
に、内層回路板の位置がずれることもあった。本発明
は、接着性、耐熱性に優れ樹脂粉飛散が少なく、取扱い
性に優れた銅張積層板、多層配線板の材料となるプリプ
レグを提供することを目的とする。Further, when a multilayer wiring board is used, if it is subjected to a heat resistance test (for example, JIS6486) to absorb moisture for a certain period of time and then subjected to solder dipping, the adhesive interface between the prepregs is peeled off and a measling occurs. ing. Further, when the prepreg is cut into a predetermined size by a cutting machine, cutting powder is generated and adheres to the surface of the prepreg, which makes it difficult to handle.
In addition, since the resin melts and flows at a low temperature in the initial stage of heating, the position of the inner layer circuit board may shift when the multilayer circuit board is manufactured by mass lamination. It is an object of the present invention to provide a prepreg which is a material for a copper clad laminate and a multilayer wiring board, which has excellent adhesiveness and heat resistance, less scattering of resin powder, and excellent handleability.
【０００７】[0007]
【課題を解決するための手段】本発明者らは前記問題点
を解決するために鋭意検討した結果、プリプレグ製造の
乾燥工程後に、プリプレグの片面又は両面に紫外線の照
射を行うことで、前記問題点を解決できることを見出
し、この知見に基づいて本初明を完成するに至った。す
なわち、本発明は、ガラス繊維基材に樹脂ワニスを含浸
し、次いで樹脂ワニス含浸基材を乾燥した後、得られた
樹脂含浸基材の片面又は両面に、紫外線の照射を行うこ
とを特徴とするプリプレグの製造方法である。Means for Solving the Problems As a result of intensive studies for solving the above-mentioned problems, the present inventors have found that after the drying step for producing the prepreg, one or both surfaces of the prepreg are irradiated with ultraviolet rays to thereby solve the above-mentioned problems. We found that we could solve the problems, and based on this knowledge, we completed this premiere. That is, the present invention is characterized in that a glass fiber substrate is impregnated with a resin varnish, and then the resin varnish-impregnated substrate is dried, and then one or both surfaces of the obtained resin-impregnated substrate is irradiated with ultraviolet rays. It is a method of manufacturing a prepreg.
【０００８】すなわち、本発明は、ガラス布基材に樹脂
ワニスわ含浸させ、次いで樹脂ワニス含浸基材を乾燥さ
せた後、得られた樹脂含浸基材の片面又は両面に紫外線
の照射を行うことを特徴とするプリプレグの製造方法を
提供するものである。プリプレグが厚い場合、両面に照
射しなければ効果がないが、薄い場合は片面のみ照射す
るだけでよい。片面のみの照射でよいか両面照射しなけ
ればならないかは、プリプレグの厚みの外、繊維基材や
マトリックス樹脂の透過性によっても異なるので、必要
に応じて適宜定めればよい。ガラス−エポキシの場合は
厚みが０．２ｍｍ以下であれば片面照射で充分である。That is, according to the present invention, a glass cloth substrate is impregnated with a resin varnish, and then the resin varnish-impregnated substrate is dried, and then one or both surfaces of the obtained resin-impregnated substrate are irradiated with ultraviolet rays. A method for producing a prepreg characterized by the above. If the prepreg is thick, there is no effect unless it is irradiated on both sides, but if it is thin, only one side needs to be irradiated. Whether irradiation on only one side or irradiation on both sides is necessary depends on not only the thickness of the prepreg but also the permeability of the fiber base material and the matrix resin, and therefore may be appropriately determined as necessary. In the case of glass-epoxy, one-side irradiation is sufficient if the thickness is 0.2 mm or less.
【０００９】ここで、本発明で用いられるガラス布基材
の種類としては、ガラス布、ガラス不織布等があり、特
に制限はない。樹脂ワニス用の樹脂としては、エポキシ
樹脂、エポキシ樹脂組成物、ポリイミド樹脂、ポリイミ
ド樹脂組成物等の熱硬化性樹脂がある。The glass cloth substrate used in the present invention includes glass cloth, glass nonwoven cloth and the like, and is not particularly limited. Examples of the resin for the resin varnish include thermosetting resins such as epoxy resin, epoxy resin composition, polyimide resin, and polyimide resin composition.
【００１０】紫外線は、累積照射量が２０００ｍＪ／ｃ
ｍ2 以下となるように照射する。好ましくは、１００〜
１０００ｍＪ／ｃｍ2 の間が、初期特性が変わらないの
で好ましい。これらの紫外線の照射は、プリプレグ製造
工程で、乾燥工程の後に行うことが必要である。さら
に、断裁機により、必要大きさに切断した後に照射を行
うとより好ましい。照射する紫外線の波長には特に制限
がない。市販の紫外線ランプによって得られる２００〜
４００ｎｍ程度のものでよい。紫外線照射と加熱とを併
用しても良い。この場合加熱温度は５０〜１５０℃がよ
い。５０〜１３０℃の間の温度で加熱するとプリプレグ
の初期特性の変化が少ないので好ましい。加熱時間は、
６０秒以下がよい。２〜１０秒とするのが、プリプレグ
の初期特性の変化が少ないので好ましい。加熱と紫外線
照射は同時でも別々でも何れでもよい。別々に行う場合
その順序は問わない。The cumulative dose of ultraviolet rays is 2000 mJ / c
Irradiation is performed so as to be m 2 or less. Preferably 100-
The range of 1000 mJ / cm 2 is preferable because the initial characteristics do not change. It is necessary to perform the irradiation of these ultraviolet rays in the prepreg manufacturing process after the drying process. Furthermore, it is more preferable to perform irradiation after cutting into a required size with a cutting machine. There is no particular limitation on the wavelength of the ultraviolet rays to be applied. 200 ~ obtained by commercially available UV lamp
It may be about 400 nm. Ultraviolet irradiation and heating may be used together. In this case, the heating temperature is preferably 50 to 150 ° C. It is preferable to heat at a temperature between 50 and 130 ° C. because the change in the initial characteristics of the prepreg is small. The heating time is
60 seconds or less is good. It is preferable to set the time to 2 to 10 seconds since the change in the initial characteristics of the prepreg is small. The heating and ultraviolet irradiation may be performed simultaneously or separately. If performed separately, the order does not matter.
【００１１】[0011]
【作用】紫外線の照射によって本プリプレグ表面の樹脂
の電子状態が不安定となり、空気中の水分、炭酸ガス、
酸素と反応して−ＯＨ、−ＣＯＯＨのような極性基がで
きるものと推定される。このため、成形時にプリプレグ
間の樹脂の反応が活発となり接着性が向上するものと思
われる。またこの反応と紫外線のエネルギーによってプ
リプレグ表面の温度が上昇し部分的に溶融するため、切
断部及び表面からの樹脂粉発生を抑えることが出来る。[Operation] The electronic state of the resin on the surface of this prepreg becomes unstable due to the irradiation of ultraviolet rays, and the moisture in the air, carbon dioxide gas,
It is presumed that polar groups such as —OH and —COOH are formed by reacting with oxygen. For this reason, it is considered that the reaction of the resin between the prepregs becomes active during molding and the adhesiveness is improved. In addition, the temperature of the prepreg surface rises due to this reaction and the energy of the ultraviolet rays, and the prepreg surface is partially melted, so that generation of resin powder from the cut portion and the surface can be suppressed.
【００１２】また、プリプレグ表面の硬化度が内部より
も高いので、マスラミネーション法によっても内層回路
板のずれを抑えることができる。なお、紫外線照射によ
りプリプレグの受ける熱量は、プリプレグ内部の樹脂硬
化度を高めるまでにはいたらないので、プリプレグ全体
のの樹脂溶融粘度、他の特性は変化しない。Further, since the degree of curing of the prepreg surface is higher than that of the inside, the displacement of the inner layer circuit board can be suppressed also by the mass lamination method. Since the amount of heat received by the prepreg due to the irradiation of ultraviolet rays does not reach the degree of hardening of the resin inside the prepreg, the resin melt viscosity and other characteristics of the entire prepreg do not change.
【００１３】[0013]
実施例１
ブロム化ビスフェノールＡ系エポキシ樹脂９０重量部に
クレゾールノボラック系エポキシ樹脂１０重量部、ジシ
アンジアミド１．５重量部、２−エチル−４−メチルイ
ミダゾール０．０５重量部をメチルエチルケトンに溶解
してエポキシ樹脂ワニスとした。このワニスを含浸槽に
入れ、厚み０．１５ｍｍのガラスクロスに含浸、乾燥さ
せプリプレグとした。Example 1 90 parts by weight of brominated bisphenol A-based epoxy resin, 10 parts by weight of cresol novolac-based epoxy resin, 1.5 parts by weight of dicyandiamide, and 0.05 parts by weight of 2-ethyl-4-methylimidazole were dissolved in methyl ethyl ketone to prepare an epoxy resin. It was a resin varnish. This varnish was placed in an impregnation tank, impregnated with a glass cloth having a thickness of 0.15 mm, and dried to obtain a prepreg.
【００１４】このプリプレグを、縦３４０ｍｍ、横５１
０ｍｍに切断した。そして、ベルトコンベアーに載せ、
ベルトコンベアーの移動速度７ｍ／分で紫外線照射装置
（８０Ｗ紫外線ランプ３本点灯）の中を通過させ、紫外
線を照射した。紫外線照射量は８００ｍＪ／ｃｍ2 であ
った。この時プリプレグ表面温度は、７０±５℃であっ
た。This prepreg is 340 mm long and 51 mm wide.
It was cut to 0 mm. And put it on the belt conveyor,
It was passed through an ultraviolet irradiation device (three 80W ultraviolet lamps were turned on) at a moving speed of a belt conveyor of 7 m / min to irradiate ultraviolet rays. The ultraviolet irradiation amount was 800 mJ / cm 2 . At this time, the prepreg surface temperature was 70 ± 5 ° C.
【００１５】実施例２
実施例１と同じ材料を、ベルトコンベアーに載せ、ベル
トコンベアーの移動速度５ｍ／分で紫外線照射装置の中
を通過させ紫外線を照射し、同時に１００±５℃で加熱
した。紫外線照射量は８５５ｍＪ／ｃｍ2 であった。得
られたプリプレグの表面はほぼ透明となった。Example 2 The same material as in Example 1 was placed on a belt conveyor, passed through an ultraviolet irradiation device at a moving speed of the belt conveyor of 5 m / min, irradiated with ultraviolet rays, and simultaneously heated at 100 ± 5 ° C. The ultraviolet irradiation amount was 855 mJ / cm 2 . The surface of the obtained prepreg became almost transparent.
【００１６】比較例
プリプレグ乾燥工程後に紫外線照射を行わなかった以
外、実施例１と同様の製造方法でプリプレグを得た。Comparative Example Prepreg A prepreg was obtained by the same manufacturing method as in Example 1 except that the ultraviolet irradiation was not performed after the prepreg drying step.
【００１７】得られたプリプレグを図１に示す構成
（１：銅箔、２：プリプレグ２枚、３：内層回路板、
２：プリプレグ２枚、１：銅箔）とし温度１７５℃、圧
力３ＭＰａで９０分間加熱し、４層板を製造した。本発
明法法によって製造したプリプレグを用いた場合、内層
回路板の位置ずれが認められなかったが、比較例による
プリプレグを用いた場合は。内層回路板に位置ずれした
ものがあった。次に、得られた４層板について、耐熱試
験を行った。その結果を表１に示す。The prepreg obtained is constructed as shown in FIG. 1 (1: copper foil, 2: two prepregs, 3: inner layer circuit board,
2: 2 prepregs, 1: copper foil) and heated at a temperature of 175 ° C. and a pressure of 3 MPa for 90 minutes to produce a four-layer board. When the prepreg manufactured by the method of the present invention was used, no displacement of the inner layer circuit board was observed, but when the prepreg according to the comparative example was used. Some of the inner circuit boards were misaligned. Next, a heat resistance test was conducted on the obtained four-layer board. The results are shown in Table 1.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表中の記号の意味は次の通りである。
Ｄ−２／１００：煮沸２時間
Ｄ−４／１００：煮沸４時間
Ｄ−５／１００：煮沸５時間
Ｄ−６／１００：煮沸６時間
Ｓ4：半田（２６０℃）２０秒ディップ
ＰＣＴ：１２１℃、０．２ＭＰａ、１００％ＲＨの条件
下で処理
また、所定サイズに切断する際に発生する樹脂粉の飛散
量は、実施例１及び実施例２のプリプレグが比較例１の
プリプレグの１／３〜１／５となった。The meanings of the symbols in the table are as follows. D-2 / 100: Boiling 2 hours D-4 / 100: Boiling 4 hours D-5 / 100: Boiling 5 hours D-6 / 100: Boiling 6 hours S 4 : Solder (260 ° C.) 20 seconds Dip PCT: 121 The prepregs of Example 1 and Example 2 were 1/100 times less than the prepreg of Comparative Example 1 when treated under the conditions of ° C, 0.2 MPa, and 100% RH. It became 3 to 1/5.
【００２０】[0020]
【発明の効果】本発明により得られたプリプレグは接着
性、耐熱性に優れ、また、プリプレグ表面樹脂のクラッ
クがなくなり透明に近く、商品価値が高まる。更にま
た、切断部及び表面からの樹脂粉発生を抑えられる。EFFECTS OF THE INVENTION The prepreg obtained by the present invention has excellent adhesiveness and heat resistance, and the prepreg surface resin is free from cracks and is almost transparent, thus increasing the commercial value. Furthermore, generation of resin powder from the cut portion and the surface can be suppressed.
【図１】 ４層板の構成を示す説明図である。FIG. 1 is an explanatory diagram showing the structure of a four-layer board.
１ 銅箔 ２ プリプレグ ３ 内層回路板 1 copper foil 2 prepreg 3 inner layer circuit board
Claims (2)
次いで樹脂ワニス含浸基材を乾燥した後、得られた樹脂
含浸基材の片面又は両面に、紫外線の照射を行うことを
特徴とするプリプレグの製造方法。1. A glass fiber base material is impregnated with a resin varnish,
Next, after drying the resin varnish-impregnated base material, one or both surfaces of the obtained resin-impregnated base material are irradiated with ultraviolet rays, which is a method for producing a prepreg.
次いで樹脂ワニス含浸基材を乾燥した後、得られた樹脂
含浸基材の片面又は両面に、加熱と紫外線の照射を行う
ことを特徴とするプリプレグの製造方法。2. A glass fiber base material is impregnated with a resin varnish,
Then, after drying the resin varnish-impregnated base material, one or both surfaces of the obtained resin-impregnated base material are heated and irradiated with ultraviolet rays, thereby producing a prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29027791A JPH054227A (en) | 1990-11-09 | 1991-11-07 | Manufacture of prepreg |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2-302604 | 1990-11-09 | ||
| JP30260490 | 1990-11-09 | ||
| JP29027791A JPH054227A (en) | 1990-11-09 | 1991-11-07 | Manufacture of prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH054227A true JPH054227A (en) | 1993-01-14 |
Family
ID=26557977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29027791A Pending JPH054227A (en) | 1990-11-09 | 1991-11-07 | Manufacture of prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054227A (en) |
-
1991
- 1991-11-07 JP JP29027791A patent/JPH054227A/en active Pending
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